Laurent Gremillard
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- laurent-gremillard
- 0000-0001-7258-6483
- Google Scholar : https://scholar.google.fr/citations?user=XbNPcn4AAAAJ&hl=fr
- IdRef : 069266085
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Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applicationsMicroelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.001⟩
Article dans une revue
hal-01541230v1
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