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ambroise schellmanns
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- ambroise-schellmanns
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Lifetime Prediction Modeling of Non-Insulated TO-220AB Packages with Lead-Based Solder Joints during Power CyclingMicroelectronics Reliability, 2012, 52 (1), pp.212-216. ⟨10.1016/j.microrel.2011.08.017⟩
Article dans une revue
hal-01810917v1
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