Céline COMBETTES

Publications

Article dans une revue (9)

Low-Power System for Spatial Tactile Detection Using a Self-Sensing Nanocomposite With On-Device Adaptive Regularization Julio Heredia-Lozano,Abraham Balam,Javier Vázquez-Castillo,Johan Jair Estrada-López,Zarel Valdez-Navaet al. IEEE Transactions on Instrumentation and Measurement, 2026, 75, pp.1-10. ⟨10.1109/TIM.2025.3648090⟩ Article dans une revue hal-05468576v1
Innovative ceramic-matrix composite substrates with tunable electrical conductivity for high-power applications Driss Kenfaui,Zarel Valdez-Nava,Lionel Laudebat,Marie-Laure Locatelli,Céline Combetteset al. Science and Technology of Advanced Materials, 2022, 23 (1), pp.735 - 751. ⟨10.1080/14686996.2022.2137695⟩ Article dans une revue hal-03851417v2
Fast cut-off, low I 2 T and high temperature monolithic on-chip fuse on silicon substrate for new fail-safe embedded power switch Amirouche Oumaziz,Emmanuel Sarraute,Frédéric Richardeau,Abdelhakim Bourennane,Céline Combetteset al. Microelectronics Reliability, 2021, pp.114240. ⟨10.1016/j.microrel.2021.114240⟩ Article dans une revue hal-03381413v1
New local electrical diagnostic tool for dielectric barrier discharge (DBD) Clémence Tyl,Stéphane Martin,Céline Combettes,Gilles Brillat,Vincent Bleyet al. Review of Scientific Instruments, 2021, 92 (5), pp.053552. ⟨10.1063/5.0045654⟩ Article dans une revue hal-04777974v2
Soft ferrite cores characterization for integrated micro- inductors Yen Mai Nguyen,David Bourrier,Samuel Charlot,Zarel Valdez Nava,Vincent Bleyet al. Journal of Micromechanics and Microengineering, 2014, 24 (10), ⟨10.1088/0960-1317/24/10/104003⟩ Article dans une revue hal-01443220v1
Soft ferrite cores characterization for integrated micro-inductors Yen Mai Nguyen,Thomas Lopez,Jean-Pierre Laur,David Bourrier,Samuel Charlotet al. Journal of Physics: Conference Series, 2013, 476, pp.012139. ⟨10.1088/1742-6596/476/1/012139⟩ Article dans une revue hal-05381885v1
CaCu3Ti4O12 ceramics from co-precipitation method: Dielectric properties of pellets and thick films B. Barbier,Céline Combettes,S. Guillemet-Fritsch,Thierry Chartier,Fabrice Rossignolet al. Journal of the European Ceramic Society, 2009, 29, pp.731-735. ⟨10.1016/j.jeurceramsoc.2008.07.042⟩ Article dans une revue istex hal-00352732v1
Electrical and Physical Characterization of Bulk Ceramics and Thick Layers of Barium Titanate Manufactured Using Nanopowders Dinh Quang Nguyen,Thierry Lebey,Philippe Castelan,Vincent Bley,Madona Bouloset al. Journal of Materials Engineering and Performance, 2007, vol. 16, pp. 626-634. ⟨10.1007/s11665-007-9110-7⟩ Article dans une revue istex hal-00806095v1
Caractérisation de céramiques massives et de couches épaisses préparées à partir des nanopoudres de BaTiO3. Dinh Quang Nguyen,Thierry Lebey,Vincent Bley,Madona Boulos,Sophie Guillemet-Fritschet al. European Journal of Electrical Engineering, 2006, 9 (4 - 5), pp.433-448. ⟨10.3166/rige.9.433-448⟩ Article dans une revue istex hal-03481662v1

Communication dans un congrès (17)

Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly Moisés Ferber,Paul Bruyère,Nicolas Botter,Alejandro Can,Souhila Bouzerdet al. CIPS 2024, Mar 2024, Dusseldorf, Germany. pp.333-340 Communication dans un congrès hal-04521931v1
An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules Amin Salim Obaid Al-Hinaai,Till Huesgen,Cyril Buttay,Eric Vagnon,Ildiko Ettingeret al. Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩ Communication dans un congrès hal-04240225v1
Substrat céramique intégrant une poche nanocomposite résistive pour la montée en tension des modules de puissance Marie-Laure Locatelli,Driss Kenfaui,Lionel Laudebat,Zarel Valdez Nava,Céline Combetteset al. Symposium de Génie Electrique, Institut de Recherche en Energie Electrique de Nantes Atlantique (IREENA), Jul 2021, NANTES, France Communication dans un congrès hal-03326680v1
Fast cut-off, low I 2 T and high temperature monolithic on-chip fuse on silicon substrate for new fail-safe embedded power switch Amirouche Oumaziz,Emmanuel Sarraute,Frédéric Richardeau,Abdelhakim Bourennane,Céline Combetteset al. 32th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 2021, Oct 2021, Bordeaux, France Communication dans un congrès hal-03372248v1
Local electrical diagnostics of a homogeneous Dielectric Barrier Discharge at atmospheric pressure Clémence Tyl,M. Kettlitz,H. Höft,Xi Lin,Céline Combetteset al. 16th International Symposium on High Pressure Low Temperature Plasma Chemistry (HaKone XVI), Sept. 2-7, 2018, Beijing (CHINA), 2018, Beijing, China Communication dans un congrès hal-03964762v1
Local electrical diagnostics of a homogeneous Dielectric Barrier Discharge at atmospheric pressure Clémence Tyl,M. Kettlitz,H. Höft,Xi Lin,Céline Combetteset al. 24th E‌urophysics Conference on the Atomic and Molecular Physics of Ionized Gases (ESCAMPIG XXIV), July 17-21, 2018, Glasgow (UK), 2018, Glasgow, United Kingdom Communication dans un congrès hal-03964763v1
CuO nanostructured sensors for enhanced CO detection Justyna Jońca,R Lai-Cheong,Myrtil L. Kahn,Katia Fajerwerg,Céline Combetteset al. EUROSENSORS 2017, Sep 2017, Paris, France Communication dans un congrès hal-02046330v1
High power PCB-embedded inductors based on ferrite powder Rémy Caillaud,Cyril Buttay,Johan Le Lesle,Florent Morel,Roberto Mradet al. 5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France Communication dans un congrès hal-01535727v1
EDT for Power Devices Cyril Buttay,Chenjiang Yu,Eric Labouré,Vincent Bley,Céline Combettes Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom Communication dans un congrès hal-01373062v1
Embedded Device Technology for Power Devices C. Buttay,C. Yu,E. Labouré,Vincent Bley,Céline Combettes Embedded Device Technology : "Disappearing Die – Embed your Chips", IMAPS conference, Sept. 22, 2016, Caldicot (UK), 2016, Caldicot, United Kingdom Communication dans un congrès hal-03964759v1
Comparison of topside contact layouts for power dies embedded in PCB Chenjiang Yu,Cyril Buttay,Eric Labouré,Vincent Bley,Céline Combetteset al. ESTC, IMAPS, Sep 2016, Grenoble, France. ⟨10.1109/ESTC.2016.7764707⟩ Communication dans un congrès hal-01373042v1
Selective GAS sensor based on screen-printed ZNO nanorods Audrey Chapelle,Samuel Charlot,Véronique Conédéra,Justyna Jońca,Myrtil L. Kahnet al. SENSORS, ENERGY HARVESTING, WIRELESS NETWORK &SMART OBJECTS CONFERENCE 2015 (SENSO2015), Oct 2015, Gardanne, France Communication dans un congrès hal-02048003v1
Highly integrated power electronic converters using active devices embedded in printed-circuit board Chenjiang Yu,Cyril Buttay,Eric Labouré,Vincent Bley,Céline Combettes 4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France Communication dans un congrès hal-01197043v1
Low-profile small-size ferrite cores for powerSiP integrated inductors Y. M. Nguyen,Magali Brunet,J.P. Laur,David Bourrier,Samuel Charlotet al. 15th European Conference on Power Electronics and Applications, Sep 2013, Lille, France. ⟨10.1109/EPE.2013.6634455⟩ Communication dans un congrès hal-03964664v1
Elaboration and Characterization of Multilayer Ceramic Capacitors Based on High Permittivity CaCu3Ti4O12 B. Barbier,Céline Combettes,S. Guillemet-Fritsch,T. Chartier,F. Rossignolet al. CICMT 2008: Ceramic Interconnect and Ceramic Microsystems Technologies, Munich, GERMANY, 2008, Munich, Germany Communication dans un congrès hal-03966020v1
Caractérisation de céramiques CaCu3Ti4O12 : comparaison entre échantillons massifs et films épais B. Barbier,Céline Combettes,S. Guillemet-Fritsch,Thierry Chartier,Fabrice Rossignol Journées Annuelles du GFC, Mar 2008, Tarbes, France Communication dans un congrès hal-00363169v1
Electrical modeling of a CaCu3Ti4O12 ceramic for capacitor applications Axel Rumeau,Pierre Bidan,Thierry Lebey,B. Barbier,Céline Combetteset al. CEIDP 2007 : Conference on Electrical Insulation and Dielectric Phenomena, Vancouver, Canada, 2007, Vancouver, Canada. pp.508-511 Communication dans un congrès hal-03964527v1

Poster de conférence (1)

Pre-packaging of power components using photosensitive resin Emilie Loupias,Cyril Buttay,Andrei Sabac,Vincent Bley,Céline Combettes Journées Nationales sur les Technologies Emergentes en micro-nanofabrication (JNTE), Nov 2024, Saint-Etienne, France. Poster de conférence hal-04905499v1