Cyril Buttay

Identifiants chercheurs

IdHAL :

cyril-buttay

ORCID :

0000-0001-7140-5804

IdRef :

087539705

ResearcherID :

http://www.researcherid.com/rid/B-7968-2008

Publications

Article dans une revue (56)

Experimental Demonstration of an IGCT/SiC PiN Diode Switching Cell Operating Without Any Turn-On Snubber Arthur Boutry,Cyril Buttay,Luong-Viet Phung,Mohamed Elhamidi,Besar Asllaniet al. IEEE Transactions on Power Electronics, In press, ⟨10.1109/TPEL.2025.3637105⟩ Article dans une revue hal-05482980v1
Stress and doping analysis of low n-doped GaN layers on various substrates by micro-Raman mapping Ndembi Ignoumba-Ignoumba,Camille Sonneville,Thomas Kaltsounis,Vishwajeet Maurya,Hala El Rammouzet al. Applied Physics Letters, 2026, 128 (12), ⟨10.1063/5.0325369⟩ Article dans une revue hal-05577908v1
Physical and electrical characterizations of low n-doped MOCVD GaN-on-sapphire layers for power electronics applications Ndembi Ignoumba-Ignoumba,Camille Sonneville,Adrien Bidaud,Pierre Brosselard,Eric Frayssinetet al. Power Electronic Devices and Components, 2025, 11, pp.100100. ⟨10.1016/j.pedc.2025.100100⟩ Article dans une revue hal-05099383v1
Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective Yuan Qin,Benjamin Albano,Joseph Spencer,James Spencer Lundh,Boyan Wanget al. Journal of Physics D: Applied Physics, 2023, 56 (9), pp.093001. ⟨10.1088/1361-6463/acb4ff⟩ Article dans une revue hal-04029608v1
Phase-Shifted Full Bridge DC–DC Converter for Photovoltaic MVDC Power Collection Networks Pierre Le Metayer,Quentin Loeuillet,Francois Wallart,Cyril Buttay,Drazen Dujicet al. IEEE Access, 2023, 11, pp.19039-19048. ⟨10.1109/ACCESS.2023.3247952⟩ Article dans une revue hal-04029587v1
Surge Current Interruption Capability of Discrete IGBT Devices in DC Hybrid Circuit Breakers Lakshmi Ravi,Jian Liu,Jingcun Liu,Yuhao Zhang,Cyril Buttayet al. IEEE Journal of Emerging and Selected Topics in Power Electronics, In press, ⟨10.1109/JESTPE.2023.3264933⟩ Article dans une revue hal-04065646v1
Physics-based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs O. Aviñó-Salvadó,Cyril Buttay,F. Bonet,C. Raynaud,P. Bevilacquaet al. IEEE Transactions on Industrial Electronics, In press, ⟨10.1109/TIE.2023.3281705⟩ Article dans une revue hal-04147050v1
Le projet Vertigo promet de &quot;verticaliser&quot; les transistors de puissance en GaN pour atteindre 1200 volts Frédéric Monflier,Cyril Buttay,Julien Buckley L'Usine Nouvelle, 2023, N2116331 Article dans une revue hal-04867426v1
Improved Measurement Accuracy for Junction-to-Case Thermal Resistance of GaN HEMT Packages by Gate-to-Gate Electrical Resistance and Stacking Thermal Interface Materials Shengchang Lu,Zichen Zhang,Cyril Buttay,Khai Ngo,Guo-Quan Lu IEEE Transactions on Power Electronics, In press, ⟨10.1109/TPEL.2022.3142273⟩ Article dans une revue hal-03543281v1
12 kV 1 kA Breaking Capable Modular Power Electronic Interrupter with Staged Turn-off Strategy for Medium Voltage DC Hybrid Circuit Breaker Jian Liu,Lakshmi Ravi,Cyril Buttay,Rolando Burgos,Steve Schmalzet al. IEEE Transactions on Industry Applications, 2022, 58 (5), pp.6343 - 6356. ⟨10.1109/TIA.2022.3185570⟩ Article dans une revue hal-03782551v1
Optical Detection of Partial Discharges Under Fast Rising Square Voltages in Dielectric Liquids Somya Anand,Eric Vagnon,Martin Guillet,Cyril Buttay IEEE Access, 2022, 10, pp.89758-89768. ⟨10.1109/ACCESS.2022.3200748⟩ Article dans une revue hal-03768924v1
Modeling and test of a thermosyphon loop for the cooling of a megawatt-range power electronics converter Majededdine Moustaid,Vincent Platel,Martin Guillet,Hugo Reynes,Cyril Buttay International Journal of Thermofluids, 2022, 13, pp.100129. ⟨10.1016/j.ijft.2021.100129⟩ Article dans une revue hal-03526803v1
Packaged Ga2O3 Schottky Rectifiers with Over 60 A Surge Current Capability Ming Xiao,Boyan Wang,Jingcun Liu,Ruizhe Zhang,Zichen Zhanget al. IEEE Transactions on Power Electronics, In press, ⟨10.1109/TPEL.2021.3049966⟩ Article dans une revue hal-03186511v1
Low Thermal Resistance (0.5 K/W) Ga₂O₃ Schottky Rectifiers With Double-Side Packaging Boyan Wang,Ming Xiao,Jack Knoll,Cyril Buttay,Kohei Sasakiet al. IEEE Electron Device Letters, 2021, 42 (8), pp.1132-1135. ⟨10.1109/LED.2021.3089035⟩ Article dans une revue hal-03366175v1
(Invited) How to Achieve Low Thermal Resistance and High Electrothermal Ruggedness in Ga 2 O 3 Devices? Yuhao Zhang,Boyan Wang,Ming Xiao,Joseph Spencer,Ruizhe Zhanget al. ECS Transactions, 2021, 104 (5), pp.21-32. ⟨10.1149/10405.0021ecst⟩ Article dans une revue hal-03366208v1
New Definition of Critical Energy for SiC MOSFET Robustness under Short- Circuit Operations: the Repetitive Critical Energy C. Chen,Tien-Anh A Nguyen,D Labrousse,S Lefebvre,Cyril Buttayet al. Microelectronics Reliability, 2020, 114, pp.113839. ⟨10.1016/j.microrel.2020.113839⟩ Article dans une revue hal-02968998v1
Surge Current Capability of Ultra-Wide-Bandgap Ga2O3 Schottky Diodes Cyril Buttay,Hiu-Yung Wong,Boyan Wang,Ming Xiao,Christina Dimarinoet al. Microelectronics Reliability, In press, ⟨10.1016/j.microrel.2020.113743⟩ Article dans une revue hal-02968947v1
Thermal Considerations of a Power Converter with Components Embedded in Printed Circuit Boards Rémy Caillaud,Cyril Buttay,Roberto Mrad,Johan Le Lesle,Florent Morelet al. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 10 (2), ⟨10.1109/TCPMT.2019.2939969⟩ Article dans une revue hal-02291493v1
Analysis and modelling of the role of temperature in the static forward characteristics of an IGBT Layachi Boussouar,Hervé Morel,Bruno Allard,Cyril Buttay International Journal of Power Electronics, 2019, 10 (3), pp.187. ⟨10.1504/ijpelec.2019.099337⟩ Article dans une revue hal-02121811v1
Extraction of the 4H-SiC/SiO₂ Barrier Height Over Temperature Oriol Aviño Salvado,Besar Asllani,Cyril Buttay,Christophe Raynaud,Hervé Morel IEEE Transactions on Electron Devices, 2019, 67 (1), pp.63 - 68. ⟨10.1109/TED.2019.2955181⟩ Article dans une revue hal-02418097v1
SiC MOSFETs robustness for diode-less applications Oriol Aviño Salvado,C. Cheng,Cyril Buttay,Hervé Morel,D Labrousseet al. EPE Journal - European Power Electronics and Drives, 2018, pp.1 - 8. ⟨10.1080/09398368.2018.1456836⟩ Article dans une revue hal-01844980v1
Threshold voltage instability in SiC MOSFETs as a consequence of current conduction in their body diode Oriol Aviño Salvado,Hervé Morel,Cyril Buttay,Denis Labrousse,Stéphane Lefebvre Microelectronics Reliability, 2018, 88-90, pp.636-640. ⟨10.1016/j.microrel.2018.06.033⟩ Article dans une revue hal-01895791v1
SiC power devices packaging with a short-circuit failure mode capability Ilyas Dchar,Cyril Buttay,Hervé Morel Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.07.003⟩ Article dans une revue hal-01562547v1
Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling Wissam Sabbah,Faical Arabi,Oriol Aviño Salvado,Cyril Buttay,Loic Théolieret al. Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.091⟩ Article dans une revue hal-01562549v1
High temperature ageing of microelectronics assemblies with SAC solder joints Wissam Sabbah,Pierre Bondue,Oriol Aviño Salvado,Cyril Buttay,Héìène Frémontet al. Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.065⟩ Article dans une revue hal-01564755v1
Evaluation of printed-circuit boards materials for high temperature operation Oriol Aviño Salvado,Wissam Sabbah,Cyril Buttay,Hervé Morel,Pascal Bevilacqua Journal of Microelectronics and Electronic Packaging, 2017, 14 (4), ⟨10.4071/imaps.516313⟩ Article dans une revue hal-01674483v1
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications Aymen Ben Kabaar,Cyril Buttay,Olivier Dezellus,R Estevez,Anthony Gravouilet al. Microelectronics Reliability, 2017, ⟨10.1016/j.microrel.2017.06.001⟩ Article dans une revue hal-01541230v1
Thermal management and electromagnetic analysis for GaN devices packaging on DBC substrate Chenjiang Yu,Cyril Buttay,Eric Labouré IEEE Transactions on Power Electronics, 2016, 32 (2), pp. 906 - 910. ⟨10.1109/TPEL.2016.2585658⟩ Article dans une revue hal-01373065v1
Sintered-Silver Bonding of High-Temperature Piezoelectric Ceramic Sensors Justine Billore,Stanislas Hascoët,Rémi Robutel,Cyril Buttay,Jianfeng Li IEEE Transactions on Components and Packaging Technologies, 2016, pp.1-7. ⟨10.1109/TCPMT.2016.2628874⟩ Article dans une revue hal-01419042v1
Avalanche robustness of SiC Schottky diode Ilyas Dchar,Cyril Buttay,Hervé Morel Microelectronics Reliability, 2016, ⟨10.1016/j.microrel.2016.07.086⟩ Article dans une revue hal-01373039v1
Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3D Concept Jean-Louis Marchesini,Pierre-Olivier Jeannin,Yvan Avenas,Johan Delaine,Cyril Buttayet al. IEEE Transactions on Industry Applications, 2016, PP (99), ⟨10.1109/TIA.2016.2604379⟩ Article dans une revue hal-01373011v1
Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs Cheng Chen,Denis Labrousse,Stéphane Lefebvre,Mickael Petit,Cyril Buttayet al. Microelectronics Reliability, 2015, pp.6. ⟨10.1016/j.microrel.2015.06.097⟩ Article dans une revue hal-01198584v1
Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test Bassem Mouawad,Benoit Thollin,Cyril Buttay,Laurent Dupont,Vincent Bleyet al. IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, 2015, 5 (1), pp.143-150. ⟨10.1109/TCPMT.2014.2376882⟩ Article dans une revue hal-01207014v1
Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles Jianfeng Li,Mark Johnson,Cyril Buttay,Wissam Sabbah,Stephane Azzopardi Journal of Materials Processing Technology, 2015, pp.299-308. ⟨10.1016/j.jmatprotec.2014.08.002⟩ Article dans une revue hal-01065130v1
Measurement and numerical analysis of C-V characteristics for normally-on SiCED-JFET Sami Ghedira,Cyril Buttay,Hervé Morel,Kamel Besbes European Physical Journal: Applied Physics, 2014, 66 (2), pp.20103. ⟨10.1051/epjap/2014130533⟩ Article dans une revue istex hal-01005929v1
Fabrication and characterization of a planar interleaved micro-transformer with magnetic core Faouzi Kahlouche,Khamis Youssouf,Mahamat Hassan Béchir,Stéphane Capraro,A. Sibliniet al. Microelectronics Journal, 2014, 45 (7), pp.893-897. ⟨10.1016/j.mejo.2014.03.003⟩ Article dans une revue istex hal-01058212v1
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy Wissam Sabbah,Stephane Azzopardi,Cyril Buttay,Régis Meuret,Eric Woirgard Microelectronics Reliability, 2013, 53 (9-11), pp.1617-1621. ⟨10.1016/j.microrel.2013.07.101⟩ Article dans une revue istex hal-00881584v1
Die attach using silver sintering. Practical implementation and analysis Amandine Masson,Wissam Sabbah,Raphaël Riva,Cyril Buttay,Stephane Azzopardiet al. European Journal of Electrical Engineering, 2013, 16 (3-4), pp.293-305. ⟨10.3166/ejee.16.293-305⟩ Article dans une revue hal-00874465v1
Thermal Stability of Silicon Carbide Power JFETs Cyril Buttay,Rémy Ouaida,Hervé Morel,Dominique Bergogne,Christophe Raynaudet al. IEEE Transactions on Electron Devices, 2013, 60 (12), pp.4191 - 4198. ⟨10.1109/TED.2013.2287714⟩ Article dans une revue hal-00881667v1
Design and Implementation of Integrated Common Mode Capacitors for SiC JFET Inverters Rémi Robutel,Christian Martin,Cyril Buttay,Hervé Morel,Paulo Mattavelliet al. IEEE Transactions on Power Electronics, 2013, PP (99), pp.1. ⟨10.1109/TPEL.2013.2279772⟩ Article dans une revue hal-00874455v1
Migration issues in sintered-silver die attaches operating at high temperature Raphaël Riva,Cyril Buttay,Bruno Allard,Pascal Bevilacqua Microelectronics Reliability, 2013, 53 (9-11), pp.1592-1596. ⟨10.1016/j.microrel.2013.07.103⟩ Article dans une revue hal-00874458v1
Electro-Thermal Behaviour of a SiC JFET Stressed by Lightning Induced Over-Voltages Dominique Bergogne,Cyril Buttay,Rémi Robutel,Fabien Dubois,Rémy Ouaidaet al. EPE Journal - European Power Electronics and Drives, 2013, 23 (3), pp.5--12 Article dans une revue hal-00997389v1
Thermal Runaway Robustness of SiC VJFETs Rémy Ouaida,Cyril Buttay,Anh Dung Hoang,Raphaël Riva,Dominique Bergogneet al. Materials Science Forum, 2013, 740-742, pp.929-933. ⟨10.4028/www.scientific.net/MSF.740-742.929⟩ Article dans une revue hal-00799884v1
Normally-On SIC JFETs: Active Protections Fabien Dubois,Dominique Bergogne,Cyril Buttay,Hervé Morel,Régis Meuret EPE Journal - European Power Electronics and Drives, 2012, 22 (3), pp.6-13 Article dans une revue hal-00821756v1
Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding Bassem Mouawad,Maher Soueidan,D. Fabregue,Cyril Buttay,Bruno Allardet al. IEEE Transactions on Components and Packaging Technologies, 2012, 2 (4), pp.553 - 560. ⟨10.1109/TCPMT.2012.2186453⟩ Article dans une revue hal-00672244v1
Thermal stability of silicon-carbide power diodes Cyril Buttay,Christophe Raynaud,Hervé Morel,Gabriel Civrac,Marie-Laure Locatelliet al. IEEE Transactions on Electron Devices, 2012, 59 (3), pp.761-769. ⟨10.1109/TED.2011.2181390⟩ Article dans une revue hal-00672440v1
Full densification of Molybdenum powders using Spark Plasma Sintering Bassem Mouawad,Maher Soueidan,D. Fabregue,Cyril Buttay,Vincent Bleyet al. Metallurgical and Materials Transactions A, 2012, pp.1-8. ⟨10.1007/s11661-012-1144-2⟩ Article dans une revue hal-00707782v1
Pressureless Silver Sintering Die-Attach for SiC Power Devices Stanislas Hascoët,Cyril Buttay,Dominique Planson,Rodica Chiriac,Amandine Masson Materials Science Forum, 2012, 740 - 742, pp.851-854. ⟨10.4028/www.scientific.net/MSF.740-742.851⟩ Article dans une revue hal-00799893v1
State of the art of high temperature power electronics Cyril Buttay,Dominique Planson,Bruno Allard,Dominique Bergogne,Pascal Bevilacquaet al. Materials Science and Engineering: B, 2011, 176 (4), pp.283-288. ⟨10.1016/j.mseb.2010.10.003⟩ Article dans une revue istex hal-00597432v1
Design of a High Temperature EMI Input Filter for a 2 kW HVDC-Fed Inverter Rémi Robutel,Christian Martin,Hervé Morel,Cyril Buttay,Nicolas Gazelet al. Journal of Microelectronics and Electronic Packaging, 2011, 8 (1), pp.23-30 Article dans une revue hal-00729066v1
Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process Bassem Mouawad,Maher Soueidan,D. Fabregue,Cyril Buttay,Vincent Bleyet al. Advanced Materials Research, 2011, 324, pp.177-180. ⟨10.4028/www.scientific.net/AMR.324.177⟩ Article dans une revue hal-00799899v1
Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates Elias Haddad,Christian Martin,Charles Joubert,Bruno Allard,Maher Soueidanet al. Advanced Materials Research, 2011, 324, pp.294-297. ⟨10.4028/www.scientific.net/AMR.324.294⟩ Article dans une revue hal-00672240v1
A Comparative Study of Predictive Current Control Schemes for a Permanent Magnet Synchronous Machine Drive Florent Morel,Xuefang Lin-Shi,Jean-Marie Rétif,Bruno Allard,Cyril Buttay IEEE Transactions on Industrial Electronics, 2009, 56 (7), pp.2715 - 2728. ⟨10.1109/TIE.2009.2018429⟩ Article dans une revue hal-00386480v1
Experimental Analysis of Punch-Through Conditions in Power P-I-N Diodes Tarek Ben Salah,Cyril Buttay,Bruno Allard,Hervé Morel,Sami Ghediraet al. IEEE Transactions on Power Electronics, 2007, 22 (1), pp.13-20. ⟨10.1109/TPEL.2006.886648⟩ Article dans une revue hal-00135198v1
Model Requirements for Simulation of Low-Voltage MOSFET in Automotive Applications Cyril Buttay,Hervé Morel,Bruno Allard,Pierre Lefranc,Olivier Brevet IEEE Transactions on Power Electronics, 2006, 21 (3), pp.613-624. ⟨10.1109/TPEL.2006.872383⟩ Article dans une revue hal-00138878v1
Avalanche Behavior of Low-Voltage Power MOSFETs Cyril Buttay,Tarek Ben Salah,Dominique Bergogne,Bruno Allard,Hervé Morelet al. IEEE Power Electronics Letters, 2004, 2 (3), pp.104-107. ⟨10.1109/LPEL.2004.839638⟩ Article dans une revue hal-00138863v1

Communication dans un congrès (137)

Development of Microbial Fuel Cell-Based Sensor for In-Situ Water Monitoring Emna Hentati,Cyril Buttay,Naoufel Haddour International MEEP Symposium (Microbial/Enzymatic Electrochemistry Platform), Jul 2025, Lucerne, Switzerland Communication dans un congrès hal-05525502v1
Comparison of 2-Level and Quasi-2-Level Topologies in a Bidirectional Isolated DC-DC Converter for MVDC Networks José Andrés Aguilar Croston,Jean-Yves Gauthier,Cyril Buttay,Maryam Saeedifard,Besar Asllaniet al. IEEE Applied Power Electronics Conference and Exposition (APEC 2025), Mar 2025, Atlanta, GA, United States. pp.2051-2058, ⟨10.1109/APEC48143.2025.10977191⟩ Communication dans un congrès hal-05239813v1
Power Losses Measurement Method for High Efficiency MV Oil-Insulated DC-DC Converter Pierre Le Métayer,Cyril Buttay,Piotr Dworakowski,Drazen Dujic PCIM 2025, May 2025, Nuremberg, Germany Communication dans un congrès hal-05129054v1
Stress and doping analysis of low n-doped GaN layers grown on GaN, silicon and sapphire substrates by micro-Raman 2. Physics and characterization Ndembi Ignoumba-Ignoumba,Camille Sonneville,Adrien Bidaud,Mohammed El Amrani,Thibaud Guilleminet al. ICNS-15 - the 15th International Conference on Nitride Semiconductors, Jul 2025, Malmö, Sweden Communication dans un congrès hal-05097968v1
Dielectric cooling of a medium-voltage power module Cyril Buttay,Amin Salim Obaid Al-Hinaai,Till Huesgen,Hugo Reynes,Eric Vagnonet al. Thermal 2025, IMAPS France, Mar 2025, La Rochelle, France Communication dans un congrès hal-05499560v1
Design Guidelines for a DAB Converter Incorporating a Multilevel Bridge with Quasi-2-Level Operation José Andrés Aguilar Croston,Jean-Yves Gauthier,Cyril Buttay,Maryam Saeedifard,Besar Asllaniet al. The 26th European Conference on Power Electronics and Applications, GDR SEEDS France & EPE Association, Mar 2025, Paris, France. ⟨10.34746/epe2025-0186⟩ Communication dans un congrès hal-05105964v1
Automatic Generation of Thermal Models for PCB-based Power Electronics Bahaeddine Ben Hamed,Ahmed Sabry Eltaher Ahmed,Guillaume Lefevre,Rémi Perrin,Guillaume Regnatet al. Conference on Integrated Power Systems (CIPS 2024), VDE, Mar 2024, Dusseldorf, Germany Communication dans un congrès hal-04534359v1
Automatic Model Generation of Power Printed Circuit Boards Based on Open Standards Cyril Buttay,Othman Abbou,Ke Li,Bahaeddine Ben Hamed,Angel Pena Quintal Design Methodologies Conference 2024, Nov 2024, Grenoble, France. ⟨10.1109/DMC62632.2024.10812161⟩ Communication dans un congrès hal-04885555v1
Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader Ahmed Sabry Eltaher Ahmed,Bahaeddine Ben Hamed,Rémi Perrin,Guillaume Regnat,Guillaume Lefevreet al. Conference on Integrated Power Systems (CIPS 2024), VDE, Mar 2024, Dusseldorf, Germany Communication dans un congrès hal-04534372v1
Analysis of GaN-HEMT switching current overshoot in a half-bridge circuit Ke Li,Cyril Buttay,Angel Pena Quintal,Paul Evans 2024 IEEE 9th Southern Power Electronics Conference (SPEC), IEEE, Dec 2024, Brisbane, Australia Communication dans un congrès hal-04885644v1
Characterization and modeling protocol for GaN-on-Si power transistors Salim Dahmani,Adama Seck Elhadji,Cyril Buttay,Bruno Allard,Hassan Maheret al. The 11th IEEE Workshop on Wide Bandgap Power Devices & Applications (WIPDA), IEEE, Nov 2024, Dayton, OH, United States. pp.1-6, ⟨10.1109/WiPDA62103.2024.10773354⟩ Communication dans un congrès hal-04885692v1
Carrier density analysis in stressed n-doped GaN layers on sapphire Ndembi Ignoumba-Ignoumba,Camille Sonneville,Éric Frayssinet,Adrien Bidaud,Florian Bartoliet al. GaN Marathon, Jun 2024, Vérone, Italy Communication dans un congrès hal-04639487v1
Investigation of mutual inductance on GaN-HEMT switching in a half-bridge circuit Ke Li,Cyril Buttay,Paul Evans,Angel Pena Quintal Design Methodologies Conference 2024, Nov 2024, Grenoble, France. ⟨10.1109/DMC62632.2024.10812133⟩ Communication dans un congrès hal-04885492v1
Improvement of the thermal performance of printed circuit boards by embedding of graphite heat spreaders Ahmed Sabry Eltaher Ahmed,Rémi Perrin,Guillaume Lefebvre,Cyril Buttay,Jacques Jay 16th European Advanced Technology Workshop on Micropackaging and Thermal management (THERMAL 2023), IMAPS, Mar 2023, Poitiers, France Communication dans un congrès hal-04147426v1
Modelling and Simulation of PCB Embedded Power Electronic Layouts Cyril Buttay,Bahaeddine Ben Hamed,Ahmed Sabry Eltaher Ahmed,Guillaume Regnat,Rémi Perrin ECPE Workshop "Embedding and Advanced Integration Technologies in Power Electronics", ECPE - European Center for Power Electronics, Nov 2022, Graz, Austria Communication dans un congrès hal-04147105v1
Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET Switches Cédric Mathieu de Vienne,Besar Asllani,Hugo Reynes,Martin Guillet,Amin Salim Obaid Al-Hinaaiet al. Power Electronics, Intelligent Motion, Renewable Energy and Energy Management ( PCIM ) Europe, May 2023, Nuremberg, Germany Communication dans un congrès hal-04147021v1
Fault Ride Through of DC Solid State Transformer in Medium Voltage DC Systems Pierre Le Métayer,Drazen Dujic,Cyril Buttay,Piotr Dworakowski International Conference & Exhibition on Electricity Distribution (CIRED 2023), Jun 2023, Rome, Italy. ⟨10.1049/icp.2023.0443⟩ Communication dans un congrès hal-04154265v1
Graphite Heat Spreader Embedded in a PCB Package for Improved SiC Die RthJC Ahmed Sabry Eltaher Ahmed,Rémi Perrin,Guillaume Lefevre,Cyril Buttay,Jacques Jay 2023 IEEE Energy Conversion Congress and Exposition (ECCE), Oct 2023, Nashville, United States. pp.5543-5550, ⟨10.1109/ECCE53617.2023.10362229⟩ Communication dans un congrès hal-04567191v1
Design of Oil Insulated SiC Diode Rectifier for an MVDC SST Pierre Le Métayer,Hugo Reynes,Piotr Dworakowski,Cyril Buttay,Drazen Dujic International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe 2023 ), May 2023, Nuremberg, Germany. pp.566091039, ⟨10.30420/566091039⟩ Communication dans un congrès hal-04153731v1
An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules Amin Salim Obaid Al-Hinaai,Till Huesgen,Cyril Buttay,Eric Vagnon,Ildiko Ettingeret al. Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩ Communication dans un congrès hal-04240225v1
Design of a test package for high voltage SiC diodes Arthur Boutry,Bruno Lefebvre,Cyril Buttay,Eric Vagnon,Dominique Plansonet al. Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩ Communication dans un congrès hal-03772006v1
Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil Somya Anand,Eric Vagnon,Martin Guillet,Cyril Buttay 2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩ Communication dans un congrès hal-03803771v1
A novel integrated cooling packaging for high power density semiconductors Amin Salim Obaid Al-Hinaai,Till Huesgen,Cyril Buttay,Richard Zeitler,Daniela Mayer 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2022), Sep 2022, Dublin, Ireland. ⟨10.1109/THERMINIC57263.2022.9950643⟩ Communication dans un congrès hal-03803773v1
Automatic Model Generation for PCB-based Power Electronics Bahaeddine Ben Hamed,Guillaume Regnat,Guillaume Lefèvre,Cyril Buttay Conference on Integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany Communication dans un congrès hal-03641121v1
Enhancing voltage rating of standard power modules for harsh environment applications Hugo Reynes,Eric Vagnon,Cyril Buttay,Martin Guillet Proceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩ Communication dans un congrès hal-03760089v1
Graphite heat spreader for power component embedded in printed circuit boards (PCB) Ahmed Sabry Eltaher Ahmed,Rémi Perrin,Guillaume Lefebvre,Cyril Buttay,Jacques Jay Journée technique IEEE Electronics Packaging Society France, Chapitre français de l'IEEE Electronics Packaging Society, Dec 2022, Palaiseau, France Communication dans un congrès hal-04159893v1
Medium Voltage Diode Rectifier Design for High Step-Up DC-DC Converter Pierre Le Métayer,Cyril Buttay,Drazen Dujic,Piotr Dworakowski European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany Communication dans un congrès hal-03790420v1
Intégration hybride en électronique de puissance Mickaël Petit,Cyril Buttay Journée Electronique de Puissance, Mar 2022, Grenoble, France Communication dans un congrès hal-03712244v1
A Guide for Accurate and Repeatable Measurement of the R TH,JC of SiC Packages Jack Knoll,Christina Dimarino,Cyril Buttay 2022 IEEE Energy Conversion Congress and Exposition (ECCE), Oct 2022, Detroit, United States. pp.1-7, ⟨10.1109/ECCE50734.2022.9947814⟩ Communication dans un congrès hal-04030134v1
A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics Amin Salim Obaid Al-Hinaai,Till Huesgen,Cyril Buttay,Eric Vagnon,Richard Zeitleret al. Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩ Communication dans un congrès hal-03772005v1
Unidirectional step-up isolated DC-DC converter for MVDC electrical networks Piotr Dworakowski,Pierre Le Métayer,Drazen Dujic,Cyril Buttay CIGRE Session 2022, Aug 2022, Paris, France Communication dans un congrès hal-03771023v1
Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes Arthur Boutry,Cyril Buttay,Besar Asllani,Bruno Lefebvre,Eric Vagnonet al. Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany Communication dans un congrès hal-03775977v1
Break-even distance for MVDC electricity networks according to power loss criteria Pierre Le Métayer,Juan Paez,Sellé Touré,Cyril Buttay,Drazen Dujicet al. EPE'21 ECCE Europe, Sep 2021, Ghent, Belgium. https://ieeexplore.ieee.org/document/9570416, ⟨10.23919/EPE21ECCEEurope50061.2021.9570416⟩ Communication dans un congrès hal-03366134v1
High Power Density Design of Power Electronic Interrupter in Hybrid DC Circuit Breaker Jian Liu,Lakshmi Ravi,Dong Dong,Rolando Burgos,Cyril Buttayet al. APEC, Jun 2021, Phoenix, United States. pp.33-38, ⟨10.1109/APEC42165.2021.9487241⟩ Communication dans un congrès hal-03361482v1
Characterization of 4 kV Charge-Balanced SiC MOSFETs Jack Knoll,Mina Shawky,Sheng-Hung Yen,Ibrahim Eshera,Christina Dimarinoet al. APEC, Jun 2021, Phoenix, AZ, United States. ⟨10.1109/APEC42165.2021.9487454⟩ Communication dans un congrès hal-03360838v1
Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester Somya Anand,Eric Vagnon,Ayyoub Zouaghi,Martin Guillet,Cyril Buttayet al. EIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩ Communication dans un congrès hal-03515576v1
Surge Current Capability of IGBT Based Power Electronic Interrupter Modules for Hybrid DC Circuit Breaker Applications Lakshmi Ravi,Jian Liu,Dong Dong,Rolando Burgos,Cyril Buttayet al. IEEE Applied Power Electronics Conference and Exposition (APEC 2021), Jun 2021, Phoenix, AZ, United States. pp.395-400, ⟨10.1109/APEC42165.2021.9487086⟩ Communication dans un congrès hal-03361517v1
Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters Nicolas Mary,Rémi Perrin,Stefan Mollov,Cyril Buttay CIPS 2020, Mar 2020, Berlin, Germany Communication dans un congrès hal-02968788v1
Experimental validation and comparison of a SiC MOSFET based 100 kW 1.2 kV 20 kHz three-phase dual active bridge converter using two vector groups Thomas Lagier,Piotr Dworakowski,Cyril Buttay,Philippe Ladoux,Andrzej Wilket al. EPE’20 ECCE Europe, Sep 2020, Lyon ( virtual ), France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215631⟩ Communication dans un congrès hal-02973471v1
How Good are the Design Tools in Power Electronics? Thomas Lagier,Piotr Dworakowski,Laurent Chédot,François Wallart,Bruno Lefebvreet al. EPE’20 ECCE Europe, Sep 2020, Lyon (Virtual conference), France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215942⟩ Communication dans un congrès hal-02968867v1
Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters Arthur Boutry,Cyril Buttay,Dong Dong,Rolando Burgos,Bruno Lefebvreet al. EPE’20 ECCE Europe, Sep 2020, Lyon, France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215711⟩ Communication dans un congrès hal-02968851v1
Surge Current Capability of Ga2O3 Schottky Diodes Cyril Buttay,Hiu-Yung Wong,Boyan Wang,Ming Xiao,Christina Dimarinoet al. CPES Annual Conference, Aug 2020, Blacksburg, VA, United States Communication dans un congrès hal-02968817v1
Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters Arthur Boutry,Cyril Buttay,Dong Dong,Rolando Burgos,Bruno Lefebvreet al. 2020 CPES Annual conference, Center for Power Electronic Systems, Aug 2020, Blacksburg, VA, United States Communication dans un congrès hal-04525165v1
Thermosiphon for passive cooling of a MVDC converter iMaps-ATW on Micropackaging and Thermal Management Majed Eddine Moustaid,Vincent Platel,Cyril Buttay,Bruno Lefebvre 15th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2020, La Rochelle, France Communication dans un congrès hal-02968778v1
Application of the PCB-Embedding Technology to a 3.3 kW Power Factor Corrector Rémy Caillaud,Johan Le Lesle,Cyril Buttay,Florent Morel,Roberto Mradet al. APEC, Mar 2019, Anaheim, Californie, United States Communication dans un congrès hal-02076184v1
Benefits of GaN transistors and embedding in PCB laminates Cyril Buttay,Christian Martin,Charles Joubert,Hervé Morel,Bruno Allardet al. SIA Power Train & Electronics, Jun 2019, Paris, France Communication dans un congrès hal-02291496v1
Packaging Solution for SiC Power Modules with a Fail-to-Short Capability Ilyas Dchar,Cyril Buttay,Hervé Morel APEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722126⟩ Communication dans un congrès hal-02076181v1
Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter Pierre Demumieux,Oriol Avino-Salvado,Cyril Buttay,Christian Martin,Fabien Sixdenieret al. APEC, Mar 2019, Anaheim, Californie, United States. pp.18720757, ⟨10.1109/APEC.2019.8722279⟩ Communication dans un congrès hal-02076183v1
An investigation of current distribution over four GaN HEMTs in parallel configurations Thilini Wickramasinghe,Cyril Buttay,Christian Martin,Hervé Morel,Pascal Bevilacquaet al. The 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2019), Oct 2019, Raleigh, United States. ⟨10.1109/WiPDA46397.2019.8998816⟩ Communication dans un congrès hal-02405882v1
A 3D Folded Power Inductor with PCB based technology for applications in the kW range Johan Le Lesle,Corentin Darbas,Florent Morel,Nicolas Degrenne,Rémy Caillaudet al. APEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722295⟩ Communication dans un congrès hal-02076182v1
Evaluation of the PCB-embedding technology for a 3.3 kW converter Rémy Caillaud,Johan Le Lesle,Cyril Buttay,Florent Morel,Roberto Mradet al. IEEE IWIPP, Apr 2019, Toulouse, France. ⟨10.1109/IWIPP.2019.8799080⟩ Communication dans un congrès hal-02291502v1
Die Interconnection for Power Module 3.0 Vincent Bley,Cyril Buttay,Denis Labrousse,Mickael Petit,Bojan Djuricet al. ECPE Workshop "Power Module 2.0", Oct 2019, Hambourg, Germany Communication dans un congrès hal-02405800v1
A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices Thilini Wickramasinghe,Bruno Allard,Cyril Buttay,Charles Joubert,Christian Martinet al. 45th IEEE IECON, Oct 2019, Lisbonne, Portugal. ⟨10.1109/IECON.2019.8927490⟩ Communication dans un congrès hal-02405883v1
Study of convective condensation in a thermosiphon loop Majed Eddine Moustaid,Vincent Platel,Cyril Buttay 14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019), Jul 2019, Wicklow, Ireland Communication dans un congrès hal-02417004v1
Design, manufacturing and characterization of printed circuit board embedded inductors for power applications Rémy Caillaud,Cyril Buttay,Roberto Mrad,Johan Le Lesle,Florent Morelet al. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352262⟩ Communication dans un congrès hal-01736336v1
Design of a 3kW power converter using PCB-embedding technology Rémy Caillaud,Johan Le Lesle,Cyril Buttay,Florent Morel,Roberto Mradet al. From Nano to Micro Power Electronics And Packaging Workshop (IMAPS), Nov 2018, Tours, France Communication dans un congrès hal-01935157v1
Design considerations for the 2-phase cooling system of a 5 MW MVDC converter Majededdine Moustaid,Cyril Buttay,Vincent Platel Troisième ATW Européen Micropackaging et management thermique, Jan 2018, La Rochelle, France Communication dans un congrès hal-01895892v1
Packaging of 10 kV SiC MOSFETs: Trade-Off Between Electrical and Thermal Performances Cyril Buttay,Hugo Reynes International Forum on Wide Bandgap Semiconductors China (IFWS), Oct 2018, Shenzhen, China Communication dans un congrès hal-01895875v1
Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics Applications Aymen Ben Kabaar,Cyril Buttay,Olivier Dezellus,Rafael Estevez,Anthony Gravouilet al. ECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany Communication dans un congrès hal-01935060v1
Optimisation of an Integrated Bidirectional Interleaved Single-Phase Power Factor Corrector Johan Le Lesle,Rémy Caillaud,Florent Morel,Nicolas Degrenne,Cyril Buttayet al. PCIM Europe 2018, Jun 2018, Nuremberg, Germany Communication dans un congrès hal-01844988v1
Procédé de microfabrication de transformateurs intégrés Maxime Semard,Christian Martin,Cyril Buttay,Charles Joubert Symposium de Génie Electrique (SGE'18), Université de Lorraine [UL], Jul 2018, Nancy, France Communication dans un congrès hal-01844983v1
A 100 kW 1.2 kV 20 kHz DC-DC converter prototype based on the Dual Active Bridge topology Thomas Lagier,Laurent Chédot,François Wallart,Layal Ghossein,Bruno Lefebvreet al. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352238⟩ Communication dans un congrès hal-01747437v1
Packaging with double-side cooling capability for SiC devices, based on silver sintering Cyril Buttay,Raphaël Riva,Bruno Allard,Marie-Laure Locatelli,Vincent Bley 44th IEEE IECON, IEEE, Oct 2018, Washington DC, United States. ⟨10.1109/IECON.2018.8591117⟩ Communication dans un congrès hal-01895805v1
High-Temperature Coplanar Transformer Maxime Semard,Christian Martin,Cyril Buttay,Charles Joubert 2018 IEEE ICIT, A. Sari, Laboratoire Ampère, Feb 2018, Lyon, France. pp.730 - 735, ⟨10.1109/ICIT.2018.8352268⟩ Communication dans un congrès hal-01736329v1
Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development Cyril Buttay,Christian Martin,Florent Morel,Rémy Caillaud,Johan Le Lesléet al. 3D-PEIM, Jun 2018, College Park, Maryland, United States. ⟨10.1109/3DPEIM.2018.8525236⟩ Communication dans un congrès hal-01844981v1
Design of a 1200 V, 100 kW Power Converter: How Good are the Design and Modelling Tools? Thomas Lagier,Cyril Buttay,Piotr Dworakowski,Benhur Zolett ECPE Workshop "The Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany Communication dans un congrès hal-01939745v1
Optimum Design of a Single-Phase Power Pulsating Buffer (PPB) with PCB-integrated Inductor Technologies Johan Le Lesle,Rémy Caillaud,Cyril Buttay,Florent Morel,Nicolas Degrenneet al. 2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352277⟩ Communication dans un congrès hal-01736332v1
Thermal Management Optimization of a 5 MW Power Electronic Converter Hugo Reynes,Jose Maneiro,Cyril Buttay,Piotr Dworakowski 12th european advanced technology workshop on micropackaging and thermal management (iMaps), IMAPS, Feb 2017, La Rochelle, France Communication dans un congrès hal-01473614v1
Protruding Ceramic Substrates for High Voltage Packaging Of Wide Bandgap Semiconductors Hugo Reynes,Cyril Buttay,Hervé Morel WiPDA, Oct 2017, Albuquerque, United States. ⟨10.1109/WiPDA.2017.8170581⟩ Communication dans un congrès hal-01645029v1
Etat de l’art de l’intégration en électronique de puissance et axes de recherches associés Vincent Bley,Cyril Buttay,Mickael Petit ISP3D, Mar 2017, Toulouse, France Communication dans un congrès hal-01802078v1
Evaluation of printed-circuit boards materials for high temperature operation Oriol Aviño Salvado,Wissam Sabbah,Cyril Buttay,Hervé Morel,Pascal Bevilacqua HiTEN, IMAPS, Jul 2017, Cambridge, United Kingdom Communication dans un congrès hal-01565131v1
High power PCB-embedded inductors based on ferrite powder Rémy Caillaud,Cyril Buttay,Johan Le Lesle,Florent Morel,Roberto Mradet al. 5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France Communication dans un congrès hal-01535727v1
Robustness of SiC MOSFET under avalanche conditions Ilyas Dchar,Marion Zolkos,Cyril Buttay,Hervé Morel APEC, Mar 2017, Tampa, FL, United States. pp.2263-2268, ⟨10.1109/APEC.2017.7931015⟩ Communication dans un congrès hal-01535735v1
Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC Rémy Caillaud,Cyril Buttay,Roberto Mrad,Johan Le Lesle,Florent Morelet al. 2017 IEEE IWIPP, Apr 2017, Delft, Netherlands. ⟨10.1109/IWIPP.2017.7936757⟩ Communication dans un congrès hal-01535721v1
Étude de la robustesse de l’oxyde de grille pour des applications aéronautiques Oriol Aviño Salvado,Hervé Morel,Cyril Buttay JCGE, May 2017, Arras, France. pp.146345 Communication dans un congrès hal-01534712v1
Design of a SiC based triple active bridge ceil for a multi-megawatt DC-DC converter Jose Maneiro,Roland Ryndzionek,Thomas Lagier,Piotr Dworakowski,Cyril Buttay EPE'17 ECCE Europe, Sep 2017, Warsaw, Poland. ⟨10.23919/EPE17ECCEEurope.2017.8099005⟩ Communication dans un congrès hal-01646807v1
Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principles Johan Le Lesle,Rémy Caillaud,Florent Morel,Nicolas Degrenne,Cyril Buttayet al. ECCE, Oct 2017, Cincinnati, OH, United States. ⟨10.1109/ECCE.2017.8096889⟩ Communication dans un congrès hal-01644174v1
Integrated High-Temperature Isolation barrier with Coreless Transformer Rémi Perrin,Bruno Allard,Christian Martin,Cyril Buttay 9th CIPS, Mar 2016, Nuremberg, Germany Communication dans un congrès hal-01372145v1
2 MHz high-density integrated power supply for gate driver in high-temperature applications Remi Perrin,Bruno Allard,Cyril Buttay,Nicolas Quentin,Wenli Zhanget al. APEC, Mar 2016, Long Beach, CA, United States. ⟨10.1109/APEC.2016.7467922⟩ Communication dans un congrès hal-01372141v1
EDT for Power Devices Cyril Buttay,Chenjiang Yu,Eric Labouré,Vincent Bley,Céline Combettes Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom Communication dans un congrès hal-01373062v1
Two Comparison-Alternative High Temperature PCB-Embedded Transformer Designs for a 2 W Gate Driver Power Supply Bingyao Sun,Rolando Burgos,Dushan Boroyevich,Remi Perrin,Cyril Buttayet al. ECCE, IEEE, Sep 2016, Milwaukee, WI, United States. ⟨10.1109/ECCE.2016.7855537⟩ Communication dans un congrès hal-01373036v1
Utilisation d’un modèle CEM pour l’estimation des pertes dans un module de puissance Anne-Sophie Podlejski,Arnaud Bréard,Christian Vollaire,Cyril Buttay CEM, Jul 2016, Rennes, France Communication dans un congrès hal-02161822v1
GaN Active-Clamp Flyback Converter with Resonant Operation Over a Wide Input Voltage Range Nicolas Quentin,Rémi Perrin,Christian Martin,Charles Joubert,Bertrand Lacombeet al. PCIM Europe 2016, May 2016, Nuremberg, Germany. pp.CD Communication dans un congrès hal-01387590v1
Analyse de la robustesse des MOSFET SiC pour les applications diode-less Oriol Aviño Salvado,Cheng Chen,Cyril Buttay,Hervé Morel,Denis Labrousseet al. Symposium de Génie Electrique (SGE'16), Jun 2016, Grenoble, France Communication dans un congrès hal-01361711v1
Comparison of topside contact layouts for power dies embedded in PCB Chenjiang Yu,Cyril Buttay,Eric Labouré,Vincent Bley,Céline Combetteset al. ESTC, IMAPS, Sep 2016, Grenoble, France. ⟨10.1109/ESTC.2016.7764707⟩ Communication dans un congrès hal-01373042v1
Thermal management of lateral GaN power devices Chenjiang Yu,Éric Labouré,Cyril Buttay 2015 IEEE IWIPP, May 2015, Chicago, IL, United States. ⟨10.1109/IWIPP.2015.7295973⟩ Communication dans un congrès hal-01196527v1
Silver sintering for power electronics integration Cyril Buttay,Bruno Allard,Raphaël Riva ICEP- IAAC, IMAPS, Apr 2015, Kyoto, Japan. ⟨10.1109/ICEP-IAAC.2015.7111076⟩ Communication dans un congrès hal-01196525v1
Robustness of SiC MOSFETs in short-circuit mode Cheng Chen,Denis Labrousse,Stéphane Lefebvre,Mickaël Petit,Cyril Buttayet al. PCIM Europe 2015, May 2015, Nuremberg, Germany Communication dans un congrès hal-01196528v1
Layout modelling to predict compliance with EMC standards of power electronic converters Anne-Sophie Podlejski,Arnaud Bréard,Cyril Buttay,Eliana Rondon,Florent Morelet al. EMC, Aug 2015, Dresden, Germany. pp.779-784, ⟨10.1109/ISEMC.2015.7256262⟩ Communication dans un congrès hal-01188561v1
Highly integrated power electronic converters using active devices embedded in printed-circuit board Chenjiang Yu,Cyril Buttay,Eric Labouré,Vincent Bley,Céline Combettes 4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France Communication dans un congrès hal-01197043v1
Considerations for High Temperature Power Electronics Bruno Allard,Cyril Buttay,Christian Martin,Hervé Morel 18th International Symposium on Power Electronics Ee2015, Oct 2015, Novi Sad, Serbia Communication dans un congrès hal-01372146v1
High temperature operation of SiC transistors Cyril Buttay,Marwan Ali,Oriol Aviño Salvado,Hervé Morel,Bruno Allard Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2015, Los Gatos, CA, United States Communication dans un congrès hal-01373030v1
Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs Cheng Chen,Denis Labrousse,Stéphane Lefebvre,Mickael Petit,Cyril Buttayet al. ESREF, Oct 2015, Toulouse, France. pp.1708-1713 Communication dans un congrès hal-01700463v1
Improving the thermal management of power GaN devices Chenjiang Yu,Cyril Buttay,Eric Labouré Advanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2016, Los Gatos, CA, United States Communication dans un congrès hal-01373027v1
Integrated packaging allows for improvement in switching characteristics of silicon carbide devices Cyril Buttay,Khalil El Falahi,Rémi Robutel,Stanislas Hascoët,Christian Martinet al. PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p Communication dans un congrès hal-00997355v1
Estimation des pertes dans les transistors bipolaires SiC Cheng Chen,Denis Labrousse,Stéphane Lefebvre,Cyril Buttay,Hervé Morel Symposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France Communication dans un congrès hal-01065220v1
Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg Raphaël Riva,Cyril Buttay,Marie-Laure Locatelli,Vincent Bley,Bruno Allard HiTEC 2014, May 2014, Albuquerque, United States. pp.THA27 Communication dans un congrès hal-00997365v1
Planar, Double-Layer Magnetic Inductors for Low Power, High Frequency DC-DC Converters Elias Haddad,Christian Martin,Charles Joubert,Bruno Allard,Cyril Buttayet al. 8th CIPS, Feb 2014, Nuremberg, Germany. CD (5 p.) Communication dans un congrès hal-00739037v1
3D Packaging Structure for High Temperature Power electronics Raphaël Riva,Cyril Buttay,Rémi Perrin,Marie-Laure Locatelli,Vincent Bleyet al. From Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France Communication dans un congrès hal-01081697v1
Mesure précise des pertes dans un module d'électronique de puissance par une méthode calorimétrique Anne-Sophie Podlejski,Cyril Buttay,Dominique Bergogne,Julien Morand,Christian Vollaireet al. Symposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France Communication dans un congrès hal-01065267v1
Power Loss Estimation in SiC Power BJTs Chen Cheng,Denis Labrousse,Stéphane Lefebvre,Hervé Morel,Cyril Buttayet al. PCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p Communication dans un congrès hal-00997718v1
Realization and Characterization of an IGBT Module Based on the Power Chip-on-Chip 3D Concept Jean-Louis Marchesini,Pierre-Olivier Jeannin,Yvan Avenas,Leonardo Ruffeil de Oliveira,Cyril Buttayet al. ECCE, Sep 2014, Pittsburgh, PA, United States. ⟨10.1109/ECCE.2014.6954043⟩ Communication dans un congrès hal-01067144v1
Predicting Static Losses in an Inverter-Leg built with SiC Normally-Off JFETs and SiC diodes Xavier Fonteneau,Florent Morel,Cyril Buttay,Hervé Morel,Philippe Lahaye APEC, Mar 2013, Long Beach, CA, United States. pp.2636-2642, ⟨10.1109/APEC.2013.6520668⟩ Communication dans un congrès hal-00829353v1
High Temperature Operation of SiC Converters Cyril Buttay ECPE SiC and GaN user forum, May 2013, Munich, Germany Communication dans un congrès hal-00874751v1
Thermal stability of SiC JFETs in conduction mode Rémy Ouaida,Cyril Buttay,Raphaël Riva,Dominique Bergogne,Christophe Raynaudet al. EPE, Sep 2013, Lille, France. paper 223, ⟨10.1109/EPE.2013.6631881⟩ Communication dans un congrès hal-00874471v1
High Temperature, High Frequency Micro-Inductors for Low Power DC-DC Converters Elias Haddad,Christian Martin,Cyril Buttay,Charles Joubert,Bruno Allardet al. EPE, Sep 2013, Lille, France. paper 390, ⟨10.1109/EPE.2013.6631994⟩ Communication dans un congrès hal-00874475v1
Full densification of molybdenum powders and multilayer materials obtained by Spark Plasma Sintering Bassem Mouawad,D. Fabregue,Cyril Buttay,Maher Soueidan ISIEM 2013, Society of Inorganic Materials, Japan (SIMJ) et Université Rennes 1, France (UR1)., Oct 2013, Rennes, France Communication dans un congrès hal-01081684v1
High temperature, Smart Power Module for aircraft actuators Khalil El Falahi,Stanislas Hascoët,Cyril Buttay,Pascal Bevilacqua,Luong Viet Phunget al. HiTEN'13, Jul 2013, Oxford, United Kingdom Communication dans un congrès hal-00874666v1
Analysis of the SiC VJFET gate punch-through and its dependence with the temperature Fabien Dubois,Dominique Bergogne,Dominique Tournier,Cyril Buttay,Régis Meuretet al. EPE, Sep 2013, Lille, France. Paper 344, ⟨10.1109/EPE.2013.6631963⟩ Communication dans un congrès hal-00874655v1
High Temperature Ageing of Fe-based Nanocrystalline Ribbons Christian Martin,Rémi Robutel,Cyril Buttay,Fabien Sixdenier,Pascal Bevilacquaet al. HiTEC 2012, May 2012, Albuquerque, United States. 6p Communication dans un congrès hal-00760373v1
Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applications Bassem Mouawad,Cyril Buttay,Maher Soueidan,Hervé Morel,Vincent Bleyet al. ISPSD, Jun 2012, Bruges, Belgium. pp.295-298, ⟨10.1109/ISPSD.2012.6229081⟩ Communication dans un congrès hal-00707820v1
High temperature anti short circuit function for normally-on SiC JFET in an inverter leg configuration Khalil El Falahi,Fabien Dubois,Dominique Bergogne,Luong Viet Phung,Cyril Buttayet al. HiTEC 2012, May 2012, Albuquerque, United States. 6p Communication dans un congrès hal-00760372v1
Pressureless Silver Sintering Die-Attach for SiC Power Devices Stanislas Hascoët,Cyril Buttay,Dominique Planson,Rodica Chiriac,Amandine Masson CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p Communication dans un congrès hal-00759987v2
3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules Bassem Mouawad,Cyril Buttay,Maher Soueidan,Hervé Morel,Bruno Allardet al. 7th CIPS, Mar 2012, Nuremberg, Germany. pp.433-438 Communication dans un congrès hal-00707741v1
Elaboration of Architectured Materials by Spark Plasma Sintering D. Fabregue,Bassem Mouawad,Cyril Buttay,Maher Soueidan,Aude Lamontagneet al. THERMEC, Aug 2011, Québec, Canada. pp.1885-1892, ⟨10.4028/www.scientific.net/MSF.706-709.1885⟩ Communication dans un congrès hal-00687142v1
An Airborne High Temperature SiC Power Converter for Medium Power Smart Electro Mechanical Actuators Dominique Bergogne,Fabien Dubois,Christian Martin,Khalil El Falahi,Luong Viet Phunget al. HiTEC 2012, May 2012, Albuquerque, United States. 6p Communication dans un congrès hal-00760366v1
Evaluation of silver-sintering die attach Wissam Sabbah,Raphaël Riva,Stanislas Hascoët,Cyril Buttay,Stephane Azzopardiet al. 7th CIPS, Mar 2012, Nuremberg, Germany. pp.237-243 Communication dans un congrès hal-00707733v1
Report de puce par frittage d'argent - mise en oeuvre et analyse Amandine Masson,Wissam Sabbah,Raphaël Riva,Cyril Buttay,Stephane Azzopardiet al. 14ème EPF, Jul 2012, Bordeaux, France. pp.CD (ref 61) Communication dans un congrès hal-00729156v1
Thermal Runaway Robustness of SiC VJFETs Rémy Ouaida,Cyril Buttay,Anh Dung Hoang,Raphaël Riva,Dominique Bergogneet al. CSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p Communication dans un congrès hal-00759975v2
Active protections for normally-on SiC JFETs Fabien Dubois,Damien Risaletto,Dominique Bergogne,Hervé Morel,Cyril Buttayet al. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD Communication dans un congrès hal-00629227v1
Thermal requirements of SiC Power Devices Cyril Buttay,Christophe Raynaud,Hervé Morel,Gabriel Civrac,Marie-Laure Locatelliet al. 6th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2011, La Rochelle, France Communication dans un congrès hal-00672631v1
Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates Elias Haddad,Christian Martin,Charles Joubert,Bruno Allard,Maher Soueidanet al. CIMA, Mar 2011, Beyrouth, Lebanon. pp.Tu-P9 Communication dans un congrès hal-00787193v1
Higher temperature power electronics for larger-scale mechatronic integration Bruno Allard,Cyril Buttay,Dominique Tournier,Rémi Robutel,Jean-François Mogniotteet al. Automotive Power Electronics, Apr 2011, Paris, France. Actes sur CD (pas de pagination) Communication dans un congrès hal-00687139v1
High-temperature die-attaches for SiC power devices Amandine Masson,Cyril Buttay,Hervé Morel,Christophe Raynaud,Stanislas Hascoëtet al. EPE, Aug 2011, Birmingham, United Kingdom. pp.Article number 6020161 Communication dans un congrès hal-00672602v1
A multi-physics model of the VJFET with a lateral channel Hervé Morel,Youness Hamieh,Dominique Tournier,Rémi Robutel,Fabien Duboiset al. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD Communication dans un congrès hal-00629220v1
Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process Bassem Mouawad,Maher Soueidan,D. Fabregue,Cyril Buttay,Vincent Bleyet al. CIMA, Mar 2011, Beyrouth, Lebanon. pp.CD Communication dans un congrès hal-00687147v2
High-temperature behavior of SiC power diodes Cyril Buttay,Christophe Raynaud,Hervé Morel,Mihai Lazar,Gabriel Civracet al. EPE, Aug 2011, Birmingham, United Kingdom. pp.CD Communication dans un congrès hal-00629225v1
Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization Cyril Buttay,Amandine Masson,Jianfeng Li,Mark C. Johnson,Mihai Lazaret al. HiTEN 2011, Jul 2011, Oxford, United Kingdom. pp.1-7 Communication dans un congrès hal-00672619v1
Caractérisation des non-linéarités dans les condensateurs céramiques haute température Rémi Robutel,Christian Martin,Cyril Buttay,Hervé Morel,Régis Meuret 13ème EPF, Jun 2010, Saint-Nazaire, France Communication dans un congrès hal-00618657v1
Design of High Temperature EMI Input Filter for a 2 kW HVDC-Fed Inverter Rémi Robutel,Christian Martin,Hervé Morel,Cyril Buttay,Dominique Bergogneet al. HiTEC 2010, May 2010, Albuquerque, United States. pp.000236 Communication dans un congrès hal-00485284v1
Effect of High Temperature Ageing on Active and Passive Power Devices Cyril Buttay,Rémi Robutel,Christian Martin,Christophe Raynaud,Siméon Dampieniet al. HiTEC 2010, May 2010, Albuquerque, United States. pp.000228 Communication dans un congrès hal-00485273v1
Electro-thermal behaviour of a SiC JFET stressed by lightning-induced overvoltages Dominique Bergogne,Asif Hammoud,Dominique Tournier,Cyril Buttay,Youness Amiehet al. EPE, Sep 2009, Barcelone, France. pp.1--8 Communication dans un congrès hal-00446059v1
State of the art of High Temperature Power Electronics Cyril Buttay,Dominique Planson,Bruno Allard,Dominique Bergogne,Pascal Bevilacquaet al. Microtherm, Jun 2009, Lodz, Poland. pp.8-17 Communication dans un congrès hal-00413349v1
Bond Graph Modeling of Current Diffusion in Magnetic Cores Hervé Morel,Bruno Allard,Sabrine M'Rad,Cyril Buttay,Kaiçar Ammouset al. ICBGM, Jan 2005, New Orleans, LA, United States. pp 87-91 Communication dans un congrès hal-00412621v1
Paralleling of Low-Voltage MOSFETs Operating in Avalanche Conditions Cyril Buttay,Olivier Brevet,Bruno Allard,Dominique Bergogne,Hervé Morel EPE, Sep 2005, Dresden, Germany. ⟨10.1109/EPE.2005.219271⟩ Communication dans un congrès hal-00138894v1
Towards a Sensorless Current and Temperature Monitoring in MOSFET-Based H-Bridge Cyril Buttay,Dominique Bergogne,Hervé Morel,Bruno Allard,René Ehlingeret al. IEEE PESC, Jun 2003, Accapulco, Mexico. pp.901 - 906, ⟨10.1109/PESC.2003.1218175⟩ Communication dans un congrès hal-00413325v1
A Voltage-Measurement Based Estimator for Current and Temperature in MOSFET H-Bridge Cyril Buttay,Dominique Bergogne,Hervé Morel,Bruno Allard,René Ehlingeret al. EPE, Sep 2003, Toulouse, France. pp.1-10 Communication dans un congrès hal-00413309v1

Poster de conférence (3)

Pre-packaging of power components using photosensitive resin Emilie Loupias,Cyril Buttay,Andrei Sabac,Vincent Bley,Céline Combettes Journées Nationales sur les Technologies Emergentes en micro-nanofabrication (JNTE), Nov 2024, Saint-Etienne, France. Poster de conférence hal-04905499v1
Carrier density analysis in stressed n-doped GaN on sapphire layers Ndembi Ignoumba-Ignoumba,Camille Sonneville,Éric Frayssinet,Adrien Bidaud,Florian Bartoliet al. GaN Marathon 2024, Jun 2024, Verona, Italy. 2024 Poster de conférence hal-05054677v1
L’électronique pour la conversion - Projet ciblé VERTIGO: Vertical GaN for High Voltage Cyril Buttay,Julien Buckley Lancement et première journée scientifique annuelle du PEPR Électronique, Mar 2023, Poitier, France Poster de conférence hal-04388116v1

Brevet (3)

Module électronique de puissance comportant un support diélectrique Cyril Buttay France, N° de brevet: EP3577685B1. 2020 Brevet hal-03193210v1
Système incluant un module électrique de puissance et une gaine contre les arcs électriques Cyril Buttay,Hugo Reynes France, N° de brevet: WO2020109138A1. 2020 Brevet hal-03193213v1
Power electronic package having two substrates with multiple semiconductor chips and electronic components Cyril Buttay,C Mark Johnson,Rahesh Kumar Malhan,Jeremy Rashid,Florin Udrea United States, Patent n° : US8432030B2. 2013 Brevet hal-03193203v1

Autre publication scientifique (2)

Tour d'horizon des modules de puissance intelligents (Smart Power Modules) Webinaire IEEE EPS Cyril Buttay 2021 Autre publication scientifique hal-03375298v1
Review on Intelligent Power Modules Cyril Buttay 2021 Autre publication scientifique hal-03361526v1

Thèse (1)

Contribution à la conception par la simulation en électronique de puissance : application à l'onduleur basse tension Cyril Buttay Sciences de l'ingénieur [physics]. INSA de Lyon, 2004. Français. ⟨NNT : ⟩ Thèse tel-00327164v1

HDR (1)

Le Packaging en électronique de puissance Cyril Buttay Sciences de l'ingénieur [physics]. INSA de lyon, 2015 HDR tel-01267363v1

Cours (6)

Packaging and Integration Activities at Laboratoire Ampère -- CPES Seminar Cyril Buttay Doctoral. United States. 2019 Cours hal-02968805v1
Technologie des composants actifs et leur assemblage - Packaging - École Thématique CNRS 2019 Fiabilité et Sûreté de Fonctionnement Cyril Buttay Doctorat. France. 2019 Cours cel-02291508v1
Électronique haute température -- Contraintes sur la puce et le packaging Cyril Buttay Doctorat. France. 2018 Cours cel-02291510v1
Composants Actifs pour l'Électronique de puissance Master M1 Cyril Buttay Master. France. 2017 Cours cel-01539770v2
Introduction au packaging en électronique de puissance Cyril Buttay École d'ingénieur. France. 2017 Cours cel-01539750v2
Électronique de puissance embarquée et packaging Master M2 Cyril Buttay Master. France. 2016 Cours cel-01539759v1