Eric Vagnon Enseignant ChercheurEcole Centrale de LyonLaboratoire Ampère

Publications

Communication dans un congrès (31)

Thermal Characterization of Deformable Interfaces for More Easily Removable Power Assemblies Paul Bruyere,Yvan Avenas,Eric Vagnon International Conference on Integrated Power Electronics Systems (CIPS), Mar 2026, Dresden, Germany Communication dans un congrès hal-05576985v1
Dielectric cooling of a medium-voltage power module Cyril Buttay,Amin Salim Obaid Al-Hinaai,Till Huesgen,Hugo Reynes,Eric Vagnonet al. Thermal 2025, IMAPS France, Mar 2025, La Rochelle, France Communication dans un congrès hal-05499560v1
Solid insulation electrical endurance assessment under square voltage Mamadou Djan Balde,Eric Vagnon,Julien Huillery,Martin Guillet CEIDP-2025, IEEE Conference on Electrical Insulation and Dielectric Phenomena, Sep 2025, Manchester (UK), United Kingdom Communication dans un congrès hal-05308647v1
Caractérisation Électrique d'un Packaging Modulaire 3D Assemblé par Pression et Incluant des Mousses Métalliques Paul Bruyere,Yvan Avenas,Eric Vagnon Symposium de Génie Électrique SGE 2025, Jul 2025, Toulouse, France Communication dans un congrès hal-05169242v1
Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power Electronics Paul Bruyere,Eric Vagnon,Yvan Avenas,Mohamed El Khattabi Conference on Integrated Power Electronics Systems (CIPS), Mar 2024, Dusseldorf, Germany Communication dans un congrès hal-04515700v1
Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly Moisés Ferber,Paul Bruyère,Nicolas Botter,Alejandro Can,Souhila Bouzerdet al. CIPS 2024, Mar 2024, Dusseldorf, Germany. pp.333-340 Communication dans un congrès hal-04521931v1
Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on AC Breakdown Voltage and Partial Discharge Activity of Synthetic and Natural Esters H. Khelifa,E. Vagnon,A. Beroual 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2023, East Rutherford, United States. pp.1-4, ⟨10.1109/CEIDP51414.2023.10410487⟩ Communication dans un congrès hal-04578645v1
Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in Air Paul Bruyere,Eric Vagnon,Yvan Avenas Conference on Electrical Insulation and Dielectric Phenomena, Oct 2023, New Jersey, United States. ⟨10.1109/CEIDP51414.2023.10410485⟩ Communication dans un congrès hal-04281522v1
An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules Amin Salim Obaid Al-Hinaai,Till Huesgen,Cyril Buttay,Eric Vagnon,Ildiko Ettingeret al. Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩ Communication dans un congrès hal-04240225v1
AC Dielectric Strength and Partial Discharge Activity in Naturel Ester and Naturel Ester-Based Fullerene Nanofluids H. Khelifa,E. Vagnon,A. Beroual 2023 IEEE 22nd International Conference on Dielectric Liquids (ICDL), Jun 2023, Worcester, United States. pp.1-4, ⟨10.1109/ICDL59152.2023.10209333⟩ Communication dans un congrès hal-04578635v1
Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on Creeping Discharges Propagating Over Solid-Natural Ester FR3 Interface Under Lightning Impulse Voltage H. Khelifa,A. Beroual,E. Vagnon 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2023, East Rutherford, United States. pp.1-4, ⟨10.1109/CEIDP51414.2023.10410470⟩ Communication dans un congrès hal-04578649v1
Effect of Fullerene Nanoparticles on the Electrostatic Charging Tendency of Natural Ester FR3 H. Khelifa,A. Beroual,E. Vagnon 2023 IEEE 22nd International Conference on Dielectric Liquids (ICDL), Jun 2023, Worcester, United States. pp.1-4, ⟨10.1109/ICDL59152.2023.10209318⟩ Communication dans un congrès hal-04578639v1
Enhancing voltage rating of standard power modules for harsh environment applications Hugo Reynes,Eric Vagnon,Cyril Buttay,Martin Guillet Proceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩ Communication dans un congrès hal-03760089v1
Evidence of Partial Discharges in the Dielectric Liquid using Electro-Optic Probes Somya Anand,Eric Vagnon,Martin Guillet 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2022), Oct 2022, Denver, CO, United States. pp.206-209, ⟨10.1109/CEIDP55452.2022.9985328⟩ Communication dans un congrès hal-04080766v1
Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil Somya Anand,Eric Vagnon,Martin Guillet,Cyril Buttay 2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩ Communication dans un congrès hal-03803771v1
AC Breakdown Voltage and Partial Discharge Activity in Synthetic Ester and Synthetic Ester-Based Zirconia Nanofluid Hocine Khelifa,Eric Vagnon,Abderrahmane Beroual 2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), IEEE TDEI, May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830968⟩ Communication dans un congrès hal-04047638v1
Design of a test package for high voltage SiC diodes Arthur Boutry,Bruno Lefebvre,Cyril Buttay,Eric Vagnon,Dominique Plansonet al. Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩ Communication dans un congrès hal-03772006v1
Comparison of Partial Discharge Activity in Synthetic Ester and Synthetic Ester- Based Fullerene Nanofluid Under AC 50 Hz Hocine Khelifa,Somya Anand,Abderrahmane Beroual,Eric Vagnon 2022 IEEE Electrical Insulation Conference (EIC), IEEE TDEI, Jun 2022, Knoxville, United States. pp.102-105, ⟨10.1109/EIC51169.2022.9833211⟩ Communication dans un congrès hal-04047631v1
A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics Amin Salim Obaid Al-Hinaai,Till Huesgen,Cyril Buttay,Eric Vagnon,Richard Zeitleret al. Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩ Communication dans un congrès hal-03772005v1
Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes Arthur Boutry,Cyril Buttay,Besar Asllani,Bruno Lefebvre,Eric Vagnonet al. Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany Communication dans un congrès hal-03775977v1
TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges Wendpanga-Fadel Bikinga,Bachir Mezrag,Yvan Avenas,Jean-Luc Schanen,Jean-Michel Guichonet al. 3D-PEIM, Jun 2021, Osaka, Japan. pp.1-6, ⟨10.1109/3D-PEIM49630.2021.9497263⟩ Communication dans un congrès hal-03629431v1
Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester Somya Anand,Eric Vagnon,Ayyoub Zouaghi,Martin Guillet,Cyril Buttayet al. EIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩ Communication dans un congrès hal-03515576v1
Optical and Electrical Partial Discharge Measurement with A1N Dielectric Barrier in Mineral Oil Ayyoub Zouaghi,Ouassim Agri,Eric Vagnon,Jean-Louis Augé 2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.243-246, ⟨10.1109/CEIDP49254.2020.9437536⟩ Communication dans un congrès hal-03392233v1
Comparison of Different Insulating Liquids for PCB Embedded Power Modules Ouassim Agri,Eric Vagnon,Ayyoub Zouaghi,Jean-Louis Augé 2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.227-230, ⟨10.1109/CEIDP49254.2020.9437524⟩ Communication dans un congrès hal-03392227v1
Insulating Liquids, an Alternative to Silicone Gel for Power Electronic Devices Ouassim Agri,Jean-Louis Augé,Eric Vagnon,François Buret 2019 IEEE Electrical Insulation Conference (EIC), Jun 2019, Calgary, Canada. pp.299-303, ⟨10.1109/EIC43217.2019.9046577⟩ Communication dans un congrès hal-02532739v1
Packaging à l'échelle du wafer pour les convertisseurs multicellulaires Nicolas Clément, Jean-Paul Rouger,L. Benaissa,Jean-Christophe Crébier,Julie Widiez,J. Defonsecaet al. Electronique de Puissance du Futur 2012, Jul 2012, France Communication dans un congrès hal-00716747v1
Numerical Study of a Liquid Metal Heat Spreader for Power Semiconductor Devices Mansour Tawk,Yvan Avenas,Eric Vagnon,Aline Msaed ECCE2012, IEEE Energy Conversion Congress & Exposition, Sep 2012, Raleigh, United States Communication dans un congrès hal-00735322v1
Series connection of IGBT The Van Nguyen,Pierre-Olivier Jeannin,Eric Vagnon,David Frey,Jean-Christophe Crébier APEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244 Communication dans un congrès hal-00461367v1
Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM Jean-Christophe Crébier,Yvan Avenas,Kremena Vladimirova,Pierre-Olivier Jeannin,Christian Schaefferet al. Electronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France Communication dans un congrès hal-00514401v1
Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal Electrode Eric Vagnon,Yvan Avenas,Jean-Christophe Crébier,Pierre-Olivier Jeannin,I. Al Battaet al. I2MTC 2009, 2009, Singapour, Singapore Communication dans un congrès hal-00384063v1
Study and Realization of a Low Force 3D Press-Pack Power Module Eric Vagnon,Jean-Christophe Crébier,Yvan Avenas,Pierre-Olivier Jeannin Power Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054 Communication dans un congrès hal-00292635v1

HDR (1)

Nouveaux matériaux et contraintes d’isolation pour la montée en tension des dispositifs d’électronique de puissance Eric Vagnon Energie électrique. Université Claude Bernard Lyon 1, 2025 HDR tel-05289745v1

Article dans une revue (11)

Effect of MgO Nanoparticles on the AC Breakdown Voltage, Partial Discharge Activity, and Electrostatic Charging Tendency of Natural Ester H. Khelifa,Paweł Skotnicki,Abderrahmane Beroual,Eric Vagnon,Maciej Jaroszewski IEEE Transactions on Dielectrics and Electrical Insulation, 2024, 31 (3), pp.1350-1358. ⟨10.1109/TDEI.2024.3374244⟩ Article dans une revue hal-04835139v1
Effect of Zirconia Nanoparticles on the AC Breakdown Voltage of Mineral Oil, Synthetic, and Natural Esters H. Khelifa,Eric Vagnon,Abderrahmane Beroual IEEE Transactions on Dielectrics and Electrical Insulation, 2024, 31 (2), pp.731-737. ⟨10.1109/TDEI.2024.3364108⟩ Article dans une revue hal-04582524v1
Field Plate Integration for Mitigating Partial Discharge Activity in PCB-Embedded Power Electronic Modules Paul Bruyere,Eric Vagnon,Yvan Avenas Energies, 2024, 17 (9), pp.2035. ⟨10.3390/en17092035⟩ Article dans une revue hal-04611444v1
Effect of Conducting and Semiconducting Nanoparticles on the AC Breakdown Voltage and Electrostatic Charging Tendency of Synthetic Ester Hocine Khelifa,Abderrahmane Beroual,Eric Vagnon IEEE Transactions on Dielectrics and Electrical Insulation, 2023, 30 (4), pp.1414-1421. ⟨10.1109/TDEI.2023.3261825⟩ Article dans une revue hal-04293096v1
Effect of Fullerene and Graphene Nanoparticles on the AC Dielectric Strength of Natural Ester Hocine Khelifa,Eric Vagnon,Abderrahmane Beroual Energies, 2023, 16 (4), pp.1995. ⟨10.3390/en16041995⟩ Article dans une revue hal-04047619v1
Optical Detection of Partial Discharges Under Fast Rising Square Voltages in Dielectric Liquids Somya Anand,Eric Vagnon,Martin Guillet,Cyril Buttay IEEE Access, 2022, 10, pp.89758-89768. ⟨10.1109/ACCESS.2022.3200748⟩ Article dans une revue hal-03768924v1
Effect of Conducting, Semi-Conducting and Insulating Nanoparticles on AC Breakdown Voltage and Partial Discharge Activity of Synthetic Ester: A Statistical Analysis Hocine Khelifa,Abderrahmane Beroual,Eric Vagnon Nanomaterials, 2022, 12 (12), pp.2105. ⟨10.3390/nano12122105⟩ Article dans une revue hal-04047624v1
Packaging à l'échelle du wafer pour les convertisseurs multicellulaires Nicolas Clément, Jean-Paul Rouger,L. Benaissa,Jean-Christophe Crébier,Julie Widiez,J. Defonsecaet al. European Journal of Electrical Engineering, 2013, 16, pp.3-4 Article dans une revue hal-00988239v1
Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM Jean-Christophe Crébier,Yvan Avenas,Kremena Vladimirova,Pierre-Olivier Jeannin,Christian Schaefferet al. Revue Internanationale de Génie Electrique, 2011, pp.617-633. ⟨10.3166/ejee.14.617-633⟩ Article dans une revue istex hal-00790044v1
A Bus-Bar-Like Power Module Based on Three-Dimensional Power-Chip-on-Chip Hybrid Integration Eric Vagnon,Pierre-Olivier Jeannin,Jean-Christophe Crébier,Yvan Avenas IEEE Transactions on Industry Applications, 2010, 46 (5), pp.2046-2055. ⟨10.1109/tia.2010.2057401⟩ Article dans une revue hal-00608445v1
A Busbar Like Power Module Based on 3D Power Chip on Chip Hybrid Integration Eric Vagnon,Pierre-Olivier Jeannin,Jean-Christophe Crébier,Yvan Avenas IEEE Transactions on Industry Applications, 2010, 46 (5), pp.2046-2055 Article dans une revue hal-00608496v1

Proceedings/Recueil des communications (1)

Laboratory-scale characterization of lightning strikes: acoustical and electrical measurements synchronized with optical visualizations Edouard Salze,Eric Vagnon,Sébastien Ollivier,Mohamed El-Khattabi,Ayyoub Zouaghiet al. pp.045009, 2022, ⟨10.1121/2.0001656⟩ Proceedings/Recueil des communications hal-04060664v1

Thèse (1)

Solutions innovantes pour le packaging de convertisseurs statiques polyphasés Eric Vagnon Sciences de l'ingénieur [physics]. Institut National Polytechnique de Grenoble - INPG, 2010. Français. ⟨NNT : ⟩ Thèse tel-00494431v1

Pré-publication, Document de travail (2)

A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration Eric Vagnon,Pierre-Olivier Jeannin,Y. Avenas,J.-C. Crebier,Kevin Guépratte 2009 Pré-publication, Document de travail hal-00396884v1
Etudes de faisabilité d'un module de puissance 3D de type presspack pour des applications de faible et moyenne puissances Eric Vagnon,Jean-Christophe Crébier,Yvan Avenas,Pierre-Olivier Jeannin 2008 Pré-publication, Document de travail hal-00294246v1