
Jean-Christophe CREBIER
210
Documents
Publications
Publications
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WIP: Building an Education Ecosystem for Next Generation Microelectronics Experts in Green and Circular Economy with Digitally-Supported Teaching Methods for Sustainable Chips and Applications (EU Project GreenChips-EDU)2024 IEEE Frontiers in Education Conference (FIE), Oct 2024, Washington, France. pp.1-5, ⟨10.1109/FIE61694.2024.10893342⟩
Communication dans un congrès
hal-04974462
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Introduction of Ecodesign and circularity in Power Electronics: The vision of Univ. Grenoble AlpsECCE Europe 2024, Sep 2024, Darmstad, Germany
Communication dans un congrès
hal-04702346
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Circular Economy Management of Power Electronic ConvertersElectronics Goes Green 2024+, Jun 2024, Berlin, Germany
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hal-04957852
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État de l'art de la recherche vers une électronique de puissance soutenableSymposium de Génie Electrique (SGE2023), Jul 2023, Lille, France
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hal-04244521
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Évaluation de la démontabilité des convertisseurs électroniques de puissance pour une circularité amélioréeSYMPOSIUM DE GENIE ELECTRIQUE SGE, Jul 2023, Lille, France
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hal-04161305
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Eco-design implementation in Power Electronics: a litterature reviewInternational Symposium on Advances Technologies in Electrical Systems (SATES 23), Mar 2023, Arras, France
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hal-04074109
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Towards circular power electronics in the perspective of modularity30th CIRP Life Cycle Engineering Conference, May 2023, New Brunswick, United States. pp.588 - 593, ⟨10.1016/j.procir.2023.02.099⟩
Communication dans un congrès
hal-04210209
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Influence of DMC EMI Optimization on CMC EMI for DC-AC Isolated Power Converter ArrayPCIM Europe 2023, May 2023, Nuremberg, Germany
Communication dans un congrès
hal-04100408
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Analyse des perturbations CEM conduites de mode commun des convertisseurs multicellulaires DC/ACSYMPOSIUM DE GENIE ELECTRIQUE SGE, Jul 2023, Lille, France
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hal-04161262
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L'apport des normes et de la réglementation pour la soutenabilité en électronique de puissanceSYMPOSIUM DE GENIE ELECTRIQUE (SGE 2023), Jul 2023, Lille, France
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hal-04163240
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Design for Reuse: residual value monitoring of power electronics' components32nd CIRP Design Conference "Design in a changing world", Mar 2022, Paris, France. pp.140-145, ⟨10.1016/j.procir.2022.05.227⟩
Communication dans un congrès
hal-03820725
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Losses prediction in the frequency domain for voltage source invertersElectrimacs 2022: 14th International Conference of TC-Electrimacs Committee, May 2022, Nancy, France
Communication dans un congrès
hal-03684291
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VIVAE Project : innoVatIve life cycles to keep the VAlue of power ElectronicsJournées des électroniques de puissance, G2ELab, Mar 2022, Grenoble, France
Communication dans un congrès
hal-04104109
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Prediction and Optimization of Near Magnetic Field Produced by Interconnections of Multi-cell ConvertersPCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2021, Online, France. pp.895-902
Communication dans un congrès
hal-03352406
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Opportunités de la modularité pour l’écoconception de convertisseurs de puissance4ème SYMPOSIUM DE GENIE ELECTRIQUE (SGE 2021), Jul 2021, Nantes, France
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hal-03304646
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Analysis of Passive Power Components ReusePCIM Europe digital days (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management Proceedings), May 2021, berlin (on line), Germany. pp.956-963
Communication dans un congrès
hal-03347175
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Un algorithme simple pour la prédiction du champ magnétique proche et l'optimisation des interconnexions des réseaux de convertisseurs de puissanceSymposium de Génie Electrique 2021 (SGE 2021), Jul 2021, Nantes, France
Communication dans un congrès
hal-03352411
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Addressing Circularity to Product Designers: Application to a Multi-Cell Power Electronics ConverterCIRP 2020 - 30th CIRP Design Conference, May 2020, Skukuza, South Africa. pp.134-139, ⟨10.1016/j.procir.2020.02.158⟩
Communication dans un congrès
hal-02965023
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Modeling of a DAB under phase-shift modulation for design and DM input current filter optimization2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), Sep 2020, Lyon, France. pp.P.1-P.10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215851⟩
Communication dans un congrès
hal-03035109
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Generic thermal cooling design for multicell convertersCIPS 2020; 11th International Conference on Integrated Power Electronics Systems, Mar 2020, Berlin, Germany
Communication dans un congrès
hal-03051978
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Generic design and implementation of multi-cell multi-phase voltage source invertersPCIM Europe 2019; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2019, Nuremberg, Germany. pp.1--7
Communication dans un congrès
hal-03113770
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Bidirectional AC to DC Isolated Multi-Cell ConverterEPE 2019, Sep 2019, Gênes, Italy
Communication dans un congrès
hal-02281529
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Multi-cell DC-DC converters – Input differential mode filtering generic design rules and implementationPCIM 2019, May 2019, Nuremberg, Germany
Communication dans un congrès
hal-02136401
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A predictive model to investigate the effects of gate driver on dv/dt in series-connected SiC-MOSFETsPCIM 2019, May 2019, Nuremberg, Germany
Communication dans un congrès
hal-02125170
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Multi-Step Packaging Concept for Series-Connected SiC MOSFETsEPE'19 ECCE Europe Conference, Sep 2019, Gênes, Italy
Communication dans un congrès
hal-02281510
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Benchmarks of the gate driver supplies' architectures for the power devices in series connectionCIPS 2018 10th International Conference on Integrated Power Electronics Systems, 2018, Mar 2018, Stuttgart, Germany
Communication dans un congrès
hal-01743635
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Statistical Modelling Method for Active Power Components Based on Datasheet InformationPCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Jun 2018, Nuremberg, Germany. pp.1924-1930
Communication dans un congrès
hal-02092296
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Design Level Power Electronics Building Block : Industrial Framework for DC-DC ConversionICIT 2017, Feb 2018, Lyon, France
Communication dans un congrès
hal-01730696
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Characterization and modeling technique of low power air-cooled PEBBmodules2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe), Sep 2018, Riga, Latvia
Communication dans un congrès
hal-01884611
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Contribution à la conception d’une filière technologique pour convertisseurs modulairesSGE 2018, Jul 2018, Nancy, France
Communication dans un congrès
hal-01844246
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Gate Driver Architectures Impacts on Voltage Balancing of SiC MOSFETs in Series ConnectionEPE-2018 ECCE 2018, Sep 2018, Riga, Latvia
Communication dans un congrès
hal-01883779
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Double chips low side - high side configurable full gate driver circuits for a high speed inverter legCIPS 2018 10th International Conference on Integrated Power Electronics Systems, 2018, Mar 2018, Stuttgart, Germany
Communication dans un congrès
hal-01743621
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Characterization Platform for Modular Power ConvertersPCIM Europe. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management 2018, Jun 2018, Nuremberg, Germany
Communication dans un congrès
hal-01813284
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A High Efficiency and Power Density, High Step-Up, Non-isolated DC-DC Converter Based on Multicell ApproachCIPS 2018 - 10th International Conference on Integrated Power Electronics Systems, Mar 2018, Stuttgart, Germany
Communication dans un congrès
hal-01744905
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Quad Driver for GaN transistors based Dual Active Bridge with capacitive coupling2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352391⟩
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hal-01735199
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Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, France. pp.1251-1257, ⟨10.1109/ECTC.2018.00193⟩
Communication dans un congrès
cea-02185324
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Filière technologique pour la conception de convertisseurs DC-DC jusqu'à 400V/4kWSymposium de Génie Electrique, Université de Lorraine [UL], Jul 2018, Nancy, France
Communication dans un congrès
hal-02983359
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Contribution à la conception automatique de convertisseurs statiques modulairesSYMPOSIUM DE GENIE ELECTRIQUE (SGE 2018), Jul 2018, Nancy, France
Communication dans un congrès
hal-01838514
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Handling differential mode conducted EMC in modular convertersEPE 2018, Sep 2018, Riga, Latvia
Communication dans un congrès
hal-01886783
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Statistical Modelling Method for Active Power Components Based on Datasheet InformationPCIM Europe. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Jun 2018, Nuremberg, Germany
Communication dans un congrès
hal-01838577
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Analysis and prototyping of distributed series connected DC/AC convertersintegrated in PV panelsEPE 2017 ECCE Europe, Sep 2017, Varsovie, Poland
Communication dans un congrès
hal-01596249
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Higher switching speed of power devices in series connection achieved by modifying the gate driver architectureEPE 2017 19th European Conference on Power Electronics and Applications , Sep 2017, Varsovie, Poland
Communication dans un congrès
hal-01589321
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A New Step Towards the Power Electronics Design AutomationPCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of, 2017, Nuremberg, Germany. pp.1--8
Communication dans un congrès
hal-02330495
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Gate Driver Architectures for High Speed Power Devices in Series ConnectionPCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of, 2017, Nuremberg, Germany. pp.1--8
Communication dans un congrès
hal-02330506
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Generic Approach for Design, Configuration and Control of Modular ConvertersPCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of, 2017, Nuremberg, Germany. pp.1--8
Communication dans un congrès
hal-02330507
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Contributions aux circuits de commande gate driver dédiés à la haute température et aux très fortes vitesses de commutationSymposium de Génie Electrique (SGE'16), Jun 2016, Grenoble, France
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hal-01333015
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Contributions to dedicated gate driver circuitry for very high switching speed high temperature power devicesPower Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on, Jun 2016, Prague, Czech Republic
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hal-01362327
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Integrated converter network for active balancing structure of batteryCIPS 2016; 9th International Conference on Integrated Power Electronics Systems; Proceedings of, 2016, Nuremberg, Germany. pp.1--6
Communication dans un congrès
hal-02330364
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Vers une nouvelle approche de conception et de fabrication en Electr. de Puissance. Et si la microélectronique était un exemple à suivre ?Symposium de Genie Electrique, Jun 2016, Grenoble, France
Communication dans un congrès
hal-01361567
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Contributions aux circuits de « gate-driver » dédiés aux transistors de puissance à forte vitesse de commutation dans un environnement haute temperatureSymposium de Genie Electrique, Jun 2016, Grenoble, France
Communication dans un congrès
hal-01361602
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Characterization and analysis of an innovative gate driver and power supplies architecture for HF power devices in harsh environmentCIPS2016 (CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems), Mar 2016, Nuremberg, Germany
Communication dans un congrès
hal-01288477
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Instrumented chip dedicated to semiconductor temperature measurements in power electronic convertersECCE 2016 - IEEE Energy Conversion Congress and Exposition, Sep 2016, Milwaukee, United States. 11p, ⟨10.1109/ECCE.2016.7855208⟩
Communication dans un congrès
hal-01684165
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Instrumented Chip Dedicated to Semiconductor Temperature Measurements in Power Electronic Converters Energy Conversion Congress and Exposition (ECCE 2016), Oct 2016, Milwaukee, United States
Communication dans un congrès
hal-01377217
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CMOS SOI gate driver with integrated optical supply and optical driving for fast power transistors Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on, Jun 2016, Prague, Czech Republic
Communication dans un congrès
hal-01362313
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Mise en place d'un packaging 3D collectif de composants de puissance à structure verticaleSymposium de Genie Electrique, Jun 2016, Grenoble, France
Communication dans un congrès
hal-01361603
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Towards vertical power device 3D packaging on 8-inch wafer Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on, Jun 2016, Prague, Czech Republic
Communication dans un congrès
hal-01362296
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CMOS gate drivers with integrated optical interfaces for extremely fast power transistors ESARS-ITEC 2016, Nov 2016, Toulouse, France
Communication dans un congrès
hal-01413331
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Capacitive Coupling for High Voltage Ratio Power Transfer in Multi-Cell Converters Based on GaN HFETsCIPS 2016, Mar 2016, Nuremberg, Germany
Communication dans un congrès
hal-03860807
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Analysis of Gate-Driver Circuit requirements for H-Bridge Based Converters with GaN HFETsEPE'15 ECCE-Europe, Sep 2015, Genève, Switzerland. ⟨10.1109/EPE.2015.7309462⟩
Communication dans un congrès
hal-01199925
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Enabling high switching speed for diamond power transistors3rd French-Japanese workshop on Diamond Power Device, Jul 2015, France
Communication dans un congrès
hal-01176598
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CMOS Gate Driver with Integrated Optical receiver for Power Electronics applicationsECCE Europe 2015, Sep 2015, Genève, Switzerland
Communication dans un congrès
hal-01208262
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State of charge estimation at battery level from multiple cells management2015 Tenth International Conference on Ecological Vehicles and Renewable Energies (EVER), Mar 2015, Monaco, Monaco
Communication dans un congrès
hal-01139771
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Balancing control based on states of charge and states of health estimates at cell levelClean Electrical Power (ICCEP), 2015, Jun 2015, Taormina, Italy
Communication dans un congrès
hal-01233465
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Integrated gate driver circuits with an ultra-compact design and high level of galvanic isolation for power transistorsInternational Conference on Integrated Power Electronics Systems (CIPS 2014), Feb 2014, Nuremberg, Germany. ISBN 978-3-8007-3578-5, pp 348-353
Communication dans un congrès
hal-00957347
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Advanced Wafer Level Packaging Technology by Layer Transfer Engineering : Application to 3D Packaging for vertical power devicesFrom nano to macro power electronics and packaging international workshop, Oct 2014, Tours, France
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hal-01092423
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Méthodes spécifiques de caractérisation et de commande de composants grand gap en environnement variableSymposium de Génie Électrique 2014, Jul 2014, Cachan, France
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hal-01065402
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Introduction sur les composants GaN pour la gestion des énergies renouvelablesJCGE, Jun 2014, Saint-Louis, France
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hal-01007011
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Etude d'un disjoncteur hybride ultra- rapide pour le système de batterie de moyenne puissanceSymposium de Génie Électrique 2014, Jul 2014, Cachan, France
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hal-01065225
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Transfert isolé des signaux de commande dans le contexte de l'intégration pour les composants actifs d'électronique de puissanceSymposium de Génie Électrique 2014, Jul 2014, Cachan, France
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hal-01065361
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CMOS Integrated Optical Isolator for Power Transistor Gate DriverIECON 2014, Oct 2014, Dallas, United States
Communication dans un congrès
hal-01084058
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3D Packaging for vertical power devicesCIPS 2014, Feb 2014, Nuremberg, Germany
Communication dans un congrès
hal-00989640
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Diamond bipolar device simulationIEEE Workshop on Wide Bandgap Power Devices and Applications, Oct 2013, Columbus, United States
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hal-00911320
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Models and parameters study for diamond electronic devices simulations74th Japan Society of Applied Physics Autumn Meeting. (JSAP-MRS joint symposia), Sep 2013, Kyoto, Japan
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hal-00989536
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Performance Measurements of an Optical Detector Designed for Monolithic Integration with a Power VDMOSI2MTC 2013, May 2013, Minnéapolis, United States
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hal-00828612
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A Specific Switching Characterization Method for Evaluation of Operating Point and Temperature Impacts on Wide Bandgap DevicesIEEE WipDa 2013, Oct 2013, Columbus, United States. ⟨10.1109/WiPDA.2013.6695573⟩
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hal-00988288
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True 3D Packaging Solution for Stacked Vertical Power DevicesThe 25th International Symposium on Power Semiconductor Devices and ICs. (ISPSD 2013), May 2013, Kanazawa, Japan. pp.97-100
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hal-00843807
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Partial Thermal Impedance Measurement for Die Interconnection Characterization by a Microsecond 'Pulsed Heating Curve TechniqueEuropean Conference on Power Electronics and Applications, Sep 2013, France. 10p
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hal-01056909
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Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve TechniqueEPE'13 ECCE Europe, 2013, Lille, France
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hal-00988257
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Concept and design of hybrid interleaved and isolated micro-converter for low power applications15th European Conference on Power Electronics and Applications (EPE), Sep 2013, Lille, France. pp.1-10, ⟨10.1109/EPE.2013.6631871⟩
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hal-00988277
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An Adaptive Output Impedance Gate Drive for Safer and More Efficient Control of Wide Bandgap DevicesIEEE WipDa 2013, 2013, Columbus, United States. ⟨10.1109/WiPDA.2013.6695564⟩
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hal-00988293
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Parameter adjustement for diamond electronic devices simulationXVIIIth SBDD 2013, 2013, Hasselt, Belgium
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hal-00989542
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Integration of Dual Active Bridge DC/DC Converters for Converters Networks applicationsPCIM 2012, May 2012, Nuremberg, Germany
Communication dans un congrès
hal-00696167
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Analyse comparative des systèmes d'électronique de puissance embarqués dans les modules photovoltaïqueElectronique de puissance du Futur EPF 2012, Jul 2012, Bordeaux, France
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hal-00772094
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Design and control of a demagnetization circuit for permanent ON OFF operation in pulse transformer gate driverApplied Power Electronics Conference and Exposition APEC 2012, Feb 2012, Orlando, United States
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hal-00673365
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A vertical power device conductive assembly at wafer level using direct bonding technologyIn Power Semiconductor Devices and ICs (ISPSD), Jun 2012, France. pp.77-80
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hal-00820244
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Integrated Low Power Low Voltage Isolated Switch Mode Power SupplyIn Industrial Electronics CONference, IEEE IECON 2012, Oct 2012, France. pp.500-505
Communication dans un congrès
hal-00820246
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Vers une filière et un support de conception EDA (Electronic Design Automation) des fonctions de coupure spécifiquesElectronique de Puissance du Futur 2012, Jul 2012, Bordeaux, France. 4p
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hal-00716857
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Implementation of monolithic multiple vertical power diodes in a multiphase converterApplied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE, Feb 2012, Orlando, United States. pp.169-175
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hal-00706742
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An Integration of Dual Active Bridge DC/DC Converters Used in Micro Converters NetworksPower Electronics/Intelligent Motion/Power Quality PCIM Europe Conference 2012, May 2012, Nuremberg, Germany
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hal-00706753
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Etude expérimentale d'un étage intégré d'isolation par voie optique pour transistors de puissanceElectronique de Puissance du Futur 2012, Jul 2012, France
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hal-00716725
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Packaging à l'échelle du wafer pour les convertisseurs multicellulairesElectronique de Puissance du Futur 2012, Jul 2012, France
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hal-00716747
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Convertisseur intégré pour les applications réseaux de micro convertisseursElectronique de Puissance du Futur 2012, Jul 2012, France
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hal-00716729
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Innovative Heat Removal Structure for Power Devices - the Drift Region Integrated Microchannel CoolerISPSD 2011 (International Symposium on Power Semiconductor Devices and ICs), May 2011, San Diego, United States. pp.332-335
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hal-00596993
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Integrated Low Power and High Bandwidth Optical Isolator for Monolithic Power MOSFETs DriverProceedings of 23rd International Symposium on Power Semiconductor Devices & IC's, May 2011, San Diego, United States. pp.356-359
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hal-00599257
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A novel Power System in Package with 3D chip on chip interconnections of the power transistor and its gate driverProceedings of 23rd International Symposium on Power Semiconductor Devices & IC's, May 2011, San Diego, United States. pp.328-331
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hal-00599317
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MULTI-CELL BATTERY EMULATOR FOR ADVANCED BATTERY MANAGEMENT SYSTEM BENCHMARKINGISIE 2011, Jun 2011, Gdansk, Poland
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hal-00606377
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A new compact, isolated and integrated gate driver using high frequency transformer for interleaved Boost converterECCE 2011, Sep 2011, Phoenix, United States
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hal-00626992
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CASCADED INVERTERS FOR ELECTRICAL VEHICLES: TOWARDS A BETTER MANAGEMENT OF TRACTION CHAIN FROM THE BATTERY TO THE MOTOR?ISIE 2011, Jun 2011, Gdansk, Poland
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hal-00606381
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Towards reduced threshold voltages for vertical power Mosfet transistorsISIE 2011, Jun 2011, Gdansk, Poland
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hal-00607324
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Drift Region Integrated Microchannel Structure for Direct Cooling of Power ElectronicsECCE 2011, Sep 2011, Phoenix, United States
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hal-00627299
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Design and characterization of a signal insulation coreless transformer integrated in a CMOS gate driver chipDesign and characterization of a signal insulation coreless transformer integrated in a CMOS gate driver chip, May 2011, San Diego, United States. pp.360-363
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hal-00599260
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Modeling of Power Devices with Drift Region Integrated Microchannel CoolerTHERMINIC 2011, Sep 2011, Paris, France
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hal-00628592
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Optimized Structure for Next-to-Next Balancing of Series-Connected Lithium-ion CellsAPEC 2011, Mar 2011, United States
Communication dans un congrès
hal-00577029
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Compact, isolated and simple to implement gate driver using high frequency transformerAPEC 2011, Mar 2011, United States
Communication dans un congrès
hal-00577026
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Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)ECCE 2011 - IEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, Sep 2011, PHOENIX, United States. pp.60-67, ⟨10.1109/ECCE.2011.6063749⟩
Communication dans un congrès
hal-00881531
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The vertical voltage termination technique - characterizations of single die multiple 600V power devicesISPSD 2011 (International Symposium on Power Semiconductor Devices and ICs), May 2011, San Diego, United States. pp.204-207
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hal-00596983
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Series connection of IGBTAPEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244
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hal-00461367
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Conception, intégration 3D et caractérisation d'un circuit de commande CMOS pour transistors de puissanceÉlectronique de Puissance du Futur, Jun 2010, Saint-Nazaire, France
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hal-00498844
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Tension de seuil réduite pour composants de puissance à grille: Intérêts et conséquences.Électronique de Puissance du Futur, Jun 2010, Saint-Nazaire, France. 4p
Communication dans un congrès
hal-00498857
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Flexible Parameter Identification Tool for semiconductor Device DesignXI-th International Workshop on Optimization and Inverse Problems in Electromagnetism, Sep 2010, Sofia, Bulgaria. pp.ISBN 978-954-438-855-3
Communication dans un congrès
hal-00520042
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Implementation and operational investigations of bipolar gate driversAPEC 2010, Feb 2010, Palm Springs, United States. pp.248 à 255
Communication dans un congrès
hal-00461409
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Single die multiple 600V power diodes with vertical voltage terminations and isolationECCE (Energy Conversion Conference and Exposition) IEEE, Sep 2010, Atlanta, United States
Communication dans un congrès
hal-00520089
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3D hybrid integration and functional interconnection of a power transistor and its gate driverECCE (Energy Conversion Conference and Exposition) IEEE, Sep 2010, Atlanta, United States
Communication dans un congrès
hal-00520083
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optimization of a power MOSFET And Its Monolithically integrated self-powering CircuitsXI-th International Workshop on Optimization and Inverse Problems in Electromagnetism, Sep 2010, Sofia, Bulgaria. pp.ISBN 978-954-438-855-3
Communication dans un congrès
hal-00520051
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Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETMElectronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France
Communication dans un congrès
hal-00514401
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Design and characterization of an integrated CMOS gate driver for vertical power MOSFETsECCE (Energy Conversion Conference and Exposition) IEEE, Sep 2010, Atlanta, United States
Communication dans un congrès
hal-00520085
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Application of progressive quadratic response surface method for an oscillation problem optimizationXI-th International Workshop on Optimization and Inverse Problems in Electromagnetism, Sep 2010, Sofia, Bulgaria. pp.ISBN 978-954-438-855-3
Communication dans un congrès
hal-00520046
v1
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Quantification of benefits and drawbacks in power conversion based on complementary MOS structuresIEEE Energy Conversion Congress and Exposition, Sep 2009, San José, United States
Communication dans un congrès
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v1
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Complementary MOS structures for common mode EMI reductionEPE 09, Sep 2009, Barcelone, Spain
Communication dans un congrès
hal-00422524
v1
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Design and realization of highly integrated isolated DC/DC micro-converterIEEE Energy Conversion Congress and Exposition, Sep 2009, San José, United States
Communication dans un congrès
hal-00421722
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Design of modular converter : Survey and Introduction to Generic ApproachesTwenty-Fourth Annual IEEE Applied Power Electronics Conference and Expostion, Feb 2009, Washingon, United States. pp.IEEE Catalog: CFP09APE-CDR ISBN: 978-1-4244-2812-0
Communication dans un congrès
hal-00364000
v1
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Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal ElectrodeI2MTC 2009, 2009, Singapour, Singapore
Communication dans un congrès
hal-00384063
v1
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Design and Realization of Autonomous Power CMOS Single Phase Inverter and Rectifier for Low Power Conditioning ApplicationsEPE 09, Sep 2009, Barcelone, Spain
Communication dans un congrès
hal-00422518
v1
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Diode-clamped multilevel converters with integrable gate-driver power-supply circuitsEPE 09, Sep 2009, Barcelone, Spain
Communication dans un congrès
hal-00422539
v1
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Intégration Monolithique de l'Etage de Sortie de la Commande Rapprochée d'un Transistor VDMOSEPF 2008 XIIème colloque Electronique de Puissance du Futur, Jul 2008, Tours, France. pp.147-154
Communication dans un congrès
hal-00300426
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Modeling and analysis of lateral MOS integrated within power VDMOS for functional integration purposesPower Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 4215-4221
Communication dans un congrès
hal-00292630
v1
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Study and Realization of a Low Force 3D Press-Pack Power ModulePower Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054
Communication dans un congrès
hal-00292635
v1
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Integrated Photoreceiver For An Isolated Control Signal Transfert In Favour Of Power TransistorsIEEE 20th International Symposium on Power Semiconductor Devices and ICs (ISPSD'08), May 2008, Orlando, United States. pp. 213-216
Communication dans un congrès
hal-00282182
v1
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Intégration Monolithique d'un Récepteur Optique au sein de Transistors de Puissance : Enjeux et PossibilitésEPF 2008 XIIème colloque Electronique de Puissance du Futur, Jul 2008, Tours, France. pp.141-146
Communication dans un congrès
hal-00296716
v1
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Conception d'un onduleur CMOS avec commande intégrée pour micro-convertisseur DC/DCEPF 2008 XIIème colloque Electronique de Puissance du Futur, Jul 2008, Tours, France
Communication dans un congrès
hal-00293279
v1
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Toward Integrated Gate Driver Supplies : Practical and Analytical Analysis of High-Voltage CapabilitiesPower Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 873-879
Communication dans un congrès
hal-00292642
v1
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High Efficiency 3-Phase CMOS Rectifier with Step Up and Regulated Output Voltage – Design and System Issues for Micro Generator ApplicationsDTIP 2007, Apr 2007, Italy
Communication dans un congrès
hal-00288808
v1
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Autonomous, Low Voltage, High Efficiency, CMOS Rectifier for Three-Phase Micro GeneratorsIEEE International Conference on Solid-State Sensors, Actuators and Microsystems TRANSDUCERS'07, Jun 2007, Lyon, France
Communication dans un congrès
hal-00289189
v1
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Monolithic integrated over voltage protection circuits For Power MOSFET and IGBT – topology, validation and thermal analysisIEEE ISPSD'06, Jun 2006, Naples, Italy
Communication dans un congrès
hal-00193832
v1
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MOS controlled AC switches implemented with full driver power supplies and dead time management circuitsIEEE IECON'06, Nov 2006, Paris, France
Communication dans un congrès
hal-00199250
v1
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Toward generic fully integrated gate driver power suppliesIEEE IECON 2006, Nov 2006, Paris, France
Communication dans un congrès
hal-00199403
v1
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Integrated μ-rectifier for μ-sources8th International Seminar on Power Semiconductors, Sep 2006, Prague, Czech Republic
Communication dans un congrès
hal-00196780
v1
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Simulation, Design and Testing of Integrated Power Supply For Insulated Gate TransistorsIEEE ISPSD'06, Jun 2006, Naples, Italy
Communication dans un congrès
hal-00193829
v1
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High Efficiency and Fully Integrated Self Powering Technique For VIPer Based Flyback ConvertersIAS-IEEE Conference, Oct 2006, Tampa, Floride, United States
Communication dans un congrès
hal-00198345
v1
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JFET Transistor used for power devices integrated over voltage protectionIEEE ISPSD'06, Jun 2006, Naples, Italy
Communication dans un congrès
hal-00193826
v1
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AC switches with integrated gate driver suppliesEPE 2005, Sep 2005, Dresde, Germany
Communication dans un congrès
hal-00184234
v1
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Nouvelles fonctions de commutation de puissance intégrées sur SiliciumJournées GdR, Oct 2005, Lyon, France
Communication dans un congrès
hal-00188228
v1
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Gate Driver Supply Of Power Switches Without Galvanic InsulationIEEE IAS 2004, Oct 2004, Seattle, United States
Communication dans un congrès
hal-00185649
v1
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A new monolithic adjustable over-voltage protection circuitIEEE IAS 2004, Oct 2004, Seattle, United States
Communication dans un congrès
hal-00185654
v1
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Intégration d'un système de l'auto-alimentation de la commande rapprochée d'un interrupteur de puissanceEPF 2004, Sep 2004, Toulouse, France
Communication dans un congrès
hal-00186843
v1
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Circuits de protection contre surtensions intégrés et compatibles pour le MOSFET de puissanceEPF 2004, Sep 2004, Toulouse, France
Communication dans un congrès
hal-00186838
v1
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Dispositif électronique de puissance a structure d’interconnexion électrique planeFrance, N° de brevet: 16/54036. 2016
Brevet
hal-01518798
v1
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Dispositif électronique de puissance à cellule de commutation 3D verticaleFrance, N° de brevet: 14/60636. 2014
Brevet
hal-01518820
v1
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Système d'équilibrage en tension d'une association série d'éléments de génération ou de stockage d'énergie électriqueFrance, N° de brevet: 10/01613. 2010
Brevet
hal-00608576
v1
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Système d'équilibrage en tension d'une association série d'éléments de génération ou de stockage d'énergie électriqueFrance, N° de brevet: 10/00671. 2010
Brevet
hal-00608591
v1
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Puce électronique, composants électroniques et bras de commutation incorporant cette puce électroniqueFrance, N° de brevet: 10/54315. 2010
Brevet
hal-00608598
v1
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Système d'équilibrage d'une association série d'éléments de génération ou de stockage d'énergie électriqueFrance, N° de brevet: 10/01358. 2010
Brevet
hal-00608586
v1
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SOC Needs for optimal active or passive Li-ion balancing techniquesMEA2015 (More Electric Aircraft), Feb 2015, Toulouse, France
Poster de conférence
hal-01120994
v1
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Industrial and power electronicsintroducing to circuits andsystems, Unesco, 2012
Chapitre d'ouvrage
hal-00821040
v1
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Conversion de l'énergie et intégration en électronique de puissanceRevue Internationale de Génie Electrique - EPF, pp.volume 10, no 5, 2007
Chapitre d'ouvrage
hal-00281542
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Etudes de faisabilité d'un module de puissance 3D de type presspack pour des applications de faible et moyenne puissances2008
Pré-publication, Document de travail
hal-00294246
v1
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Micro redresseur intégré pour micro-sources triphasées2006
Autre publication scientifique
hal-00202673
v1
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Promotion d'une approche système dans l'intégration monolithique pour semi-conducteurs de puissance2006
Autre publication scientifique
hal-00202667
v1
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Intégration monolithique et composants de puissanceEnergie électrique. Institut National Polytechnique de Grenoble - INPG, 2006
HDR
tel-00163380
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CONTRIBUTION A L'ETUDE DES PERTURBATIONS CONDUITES DANS LES REDRESSEURS COMMANDESEnergie électrique. Institut National Polytechnique de Grenoble - INPG, 1999. Français. ⟨NNT : ⟩
Thèse
tel-00782571
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