Karim Inal

Présentation

Thèse Orsay-ENSAM, ATER ENSAM Paris, MCF ENSAM Metz puis Aix en Provence, Pr ENSMSE Gardanne, Pr MinesParisTech Sophia

Publications

Article dans une revue (26)

Structure and crystallization kinetics of PVDF/organoclay nanocomposites processed by twin-screw extrusion and electrical contact poling Nelly Pons,Bafétégué Ouattara,Séverine A.E. Boyer,Alain Burr,Lucien Laiarinandrasanaet al. Materials Today Communications, 2026, 50, pp.114535. ⟨10.1016/j.mtcomm.2025.114535⟩ Article dans une revue hal-05444205v1
Effect of crystal orientation on recrystallization occurrence in CMSX-4 E. Hazemann,Yancheng Zhang,K. Inal,M. Long,N.-T. Nianeet al. Materials & Design, 2025, pp.114122. ⟨10.1016/j.matdes.2025.114122⟩ Article dans une revue hal-05087671v1
Micro-Indentation of oxidized low carbon steel to evaluate properties of oxides Victor Claverie-Burgué,Pierre Montmitonnet,Karim Inal,Alain Burr,Alexis Nicolaÿet al. IOP Conference Series: Materials Science and Engineering, 2022, 1270 (1), pp.012106. ⟨10.1088/1757-899X/1270/1/012106⟩ Article dans une revue hal-03924281v1
Hypothetic impact of chemical bonding on the moisture resistance of amorphous SixNyHz by plasma-enhanced chemical vapor deposition Catheline Cazako,Karim Inal,Alain Burr,Frédéric Georgi,Rodolphe Cauro Metallurgical Research & Technology, 2018, 115 (4), pp.406. ⟨10.1051/metal/2018072⟩ Article dans une revue hal-02968666v1
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence Simon Gousseau,Stéphane Moreau,David Bouchu,Alexis Farcy,Pierre Montmitonnetet al. Microelectronics Reliability, 2015, 55 (8), pp.1205-1213. ⟨10.1016/j.microrel.2015.05.019⟩ Article dans une revue istex hal-01166314v1
Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices Kokou Adokanou,Karim Inal,Pierre Montmitonnet,Francis Pressecq,Barbara Bonnetet al. Microelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩ Article dans une revue istex hal-01180774v1
Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect Sebastian Orellana,Brice Arrazat,Pascal Fornara,Christian Rivero,Sylvain Blayacet al. Microelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1896-1900. ⟨10.1016/j.microrel.2015.06.032⟩ Article dans une revue istex hal-01180626v1
Investigations of Thermomechanical Stress Induced by TSV-Middle (Through-Silicon via) in 3-D ICs by Means of CMOS Sensors and Finite-Element Method Komi Atchou Ewuame,Vincent Fiori,Karim Inal,Pierre-Olivier Bouchard,Sebastien Gallois-Garreignotet al. IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, 2015, 5 (8), pp.1085-1092 - Article number 7164297. ⟨10.1109/TCPMT.2015.2445099⟩ Article dans une revue hal-01221158v1
From stress sensor towards back end of line embedded thermo-mechanical sensor Brice Arrazat,Sebastian Orellana,Christian Rivero,P. Fornara,Antonio Di Giacomoet al. Microelectronic Engineering, 2014, 120, pp.41-46. ⟨10.1016/j.mee.2013.12.013⟩ Article dans une revue istex hal-00932762v1
Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticles Romain Cauchois,Mohamed Saadaoui,Abdelwahhab Yakoub,Karim Inal,Béatrice Dubois-Bonvalotet al. Journal of Materials Science, 2012, 47 (20), pp.7110-7116. ⟨10.1007/s10853-012-6366-6⟩ Article dans une revue emse-00673215v1
A micromechanical interpretation of the temperature dependence of Beremin model parameters for french RPV steel Jean-Philippe Mathieu,Karim Inal,Sophie Berveiller,Olivier Diard Journal of Nuclear Materials, 2010, 406 (1), pp.97-112. ⟨10.1016/j.jnucmat.2010.02.025⟩ Article dans une revue istex hal-00833671v1
Selective image analysis for roughness characterisation Pierre-Yves Duvivier,Vincent Mandrillon,Karim Inal Tribology - Materials, Surfaces & Interfaces, 2010, 4 (3), pp.136-143 Article dans une revue emse-00533815v1
Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperatures Raphaël Pesci,Karim Inal,Renaud Masson Materials Science and Engineering: A, 2009, 527 (1-2), pp.376-386. ⟨10.1016/j.msea.2009.08.020⟩ Article dans une revue emse-00466384v1
Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications Mamadou Diobet Diop,Vincent Mandrillon,Hervé Boutry,Karim Inal,Roland Fortunier Microelectronic Engineering, 2009, 87 (3), pp.522-526. ⟨10.1016/j.mee.2009.07.020⟩ Article dans une revue istex emse-00450478v1
Modelling the behaviour of polycrystalline austenitic steel with twinning-induced plasticity effect N. Shiekhelsouk,V. Favier,Karim Inal,M. Cherkaoui International Journal of Plasticity, 2009, 25 (1), pp.105-133. ⟨10.1016/j.ijplas.2007.11.004⟩ Article dans une revue istex emse-00429576v1
Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperatures Raphaël Pesci,Karim Inal,Renaud Masson Materials Science and Engineering: A, 2009, 527 (1-2), pp.376-386. ⟨10.1016/j.msea.2009.08.020⟩ Article dans une revue hal-01166251v1
Residual stress estimation in damascene copper interconnects using embedded sensors Renaud Vayrette,C. Rivero,B. Gros,Sylvain Blayac,Karim Inal Microelectronic Engineering, 2009, 87 (3), pp.412-415. ⟨10.1016/j.mee.2009.05.017⟩ Article dans une revue istex emse-00450882v1
Modelling the behaviour of polycrystalline austenitic steel with twinning-induced plasticity effect N. Shiekhelsouk,V. Favier,K. Inal,M. Cherkaoui International Journal of Plasticity, 2008, vol. 141-143, pp. 659-664 Article dans une revue hal-00311872v1
Numerical investigations of smart card module: parametric analysis and design optimization Man Su,Xavier Boddaert,Karim Inal IEEE Transactions on Device and Materials Reliability, 2008, 8 (3), pp.464-470. ⟨10.1109/TDMR.2008.2002347⟩ Article dans une revue emse-00476018v1
Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope Raphaël Pesci,Karim Inal,Sophie Berveiller,Etienne Patoor,Jean Sébastien Lecomteet al. Materials Science Forum, 2006, 524-525, pp.109-114. ⟨10.4028/www.scientific.net/MSF.524-525.109⟩ Article dans une revue hal-03864532v1
Residual and internal stress states in duplex steel with twip effect N. Shiekhelsouk,V. Favier,K. Inal,S. Allain,O. Bouazizet al. Materials Science Forum, 2006, Vols. 524-525, pp. 833-838 Article dans une revue hal-00311875v1
Grain and phase stress criteria for behaviour and cleavage in duplex and bainitic steels Karim Inal,Raphaël Pesci,Jean-Lou Lebrun,Olivier Diard,Renaud Masson Fatigue and Fracture of Engineering Materials and Structures, 2006, 29 (9-10), pp.685-696. ⟨10.1111/j.1460-2695.2006.01056.x⟩ Article dans une revue hal-01203493v1
Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope Raphaël Pesci,Karim Inal,Sophie Berveiller,Etienne Patoor,Jean-Sébastien Lecomteet al. Materials Science Forum, 2006, 524-525, pp.109-114. ⟨10.4028/www.scientific.net/MSF.524-525.109⟩ Article dans une revue hal-01213863v1
Stress distribution and cleavage analysis in a 16MnNiMo5 bainitic steel X-ray diffraction and multiscale polycrystalline modelling Raphaël Pesci,Karim Inal,Renaud Masson Journal of Materials Science and Technology, 2004, 20 (Suppl. 1), pp.32-34 Article dans une revue hal-01187577v1
Distribution des contraintes dans l’acier bainitique 16MND5. Analyse expérimentale et modélisation polycristalline Raphaël Pesci,Karim Inal,Marcel Berveiller,Renaud Masson Mechanics & Industry, 2003, 4 (4), pp.457-465. ⟨10.1016/S1296-2139(03)00075-7⟩ Article dans une revue hal-01203593v1
Internal Stress Analysis for the Damage Study of a 16MND5 Bainitic Steel Raphaël Pesci,Karim Inal,Marcel Berveiller,Jean-Lu Lebrun Materials Science Forum, 2002, 404-407, pp.641-646. ⟨10.4028/www.scientific.net/MSF.404-407.641⟩ Article dans une revue hal-01245099v1

Communication dans un congrès (55)

A dual experimental / numerical approach to understand delamination of oxide scale during indentation test Victor Claverie--Burgué,Pierre Montmitonnet,Inal Karim,Alain Burr,Michel Picardet al. 25e Congrès Français de Mécanique, Aug 2022, Nantes, France Communication dans un congrès hal-04281711v1
Effect of crystal anisotropy on the deformation behavior of copper under scratching process Imène Lahouij,Larissa a Pinheiro De Brito,Karim Inal,Pierre Montmitonnet 7 th World Tribology Congress WTC 2022, Jul 2022, Lyon, France Communication dans un congrès hal-03940844v1
Anisotropic Mechanical Behaviour of Nickel Base Single Crystal Superalloy CMSX-4 for Prediction of Grain Recrystallization during Homogenization Heat-treatment Following Solidification Emile Hazemann,Yancheng Zhang,Karim Inal,Charles-André Gandin,Ming Longet al. 6th International Conference on Advances in Solidification Processes (ICASP6), Jun 2022, Le Bischenberg, France Communication dans un congrès hal-03877942v1
EXPERIMENTAL STUDY OF DEFORMATION BEHAVIOR OF SINGLE CRYSTAL COPPER (001) DURING SCRATCH PROCESS Imène Lahouij,Larissa Pinheiro De Brito,Karim Inal,Pierre Montmitonnet Indentation, Oct 2021, Lorient, France Communication dans un congrès hal-03940887v1
The impact of nitrogen plasma treatments on SixNyHz moisture sensitivity Catheline Cazako,Karim Inal,Alain Burr,Frédéric Georgi Conference on Plasma Based Ion Implantation & Deposition, Oct 2017, Shanghai, France Communication dans un congrès hal-01721379v1
Discharge frequency and reagents choice effects on robustness of silicon nitride (Si3N4) thin layers deposited by PECVD (Plasma-Enhanced Chemical Vapor Deposition) Catheline Cazako,Karim Inal,Alain Burr,Frédéric Georgi,Rodolphe Cauro European Conference on Heat Treatment and Surface Engineering, Jun 2017, Nice, France Communication dans un congrès hal-01721378v1
Etude XPS de la ré-oxydation de films de Nichrome dans la chambre d'analyse lors du profilage séquentiel par érosion Frédéric Georgi,Romain Macabies,Muriel Bouttemy,Damien Aureau,Karim Inal ELSPEC'16, 7eme conférence francophone sur les spectroscopies d’électrons, May 2016, Versailles_Meudon, France Communication dans un congrès hal-01444740v1
Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts Komi Atchou Ewuame,Pierre-Olivier Bouchard,Vincent Fiori,Sebastien Gallois-Garreignot,Karim Inalet al. 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, Singapore. pp.346-351, ⟨10.1109/EPTC.2015.7412333⟩ Communication dans un congrès hal-01354249v1
Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing Kokou Adokanou,Karim Inal,Pierre Montmitonnet,Frédéric Courtade,Barbara Bonnet 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p. - ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩ Communication dans un congrès hal-01247921v1
On the material depletion rate due to electromigration in a copper TSV structure Roberto Lacerda de Orio,Simon Gousseau,Stéphane Moreau,Hajdin Ceric,Siegfried Selberherret al. 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , IEEE, Oct 2014, S. Lake Tahoe, California, United States. pp.111-114 - ISBN 978-1-4799-7308-8 ⟨10.1109/IIRW.2014.7049523⟩ Communication dans un congrès hal-01298215v1
Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology Romain Cauchois,András Borbély,Patrice Gergaud,Mohamed Saadaoui,Karim Inal 9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.930-935, ⟨10.4028/www.scientific.net/AMR.996.930⟩ Communication dans un congrès hal-01063661v1
Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation Komi Atchou Ewuame,Vincent Fiori,Karim Inal,Pierre-Olivier Bouchard,Sébastien Gallois-Garreignotet al. 9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.975-981, ⟨10.4028/www.scientific.net/AMR.996.975⟩ Communication dans un congrès hal-01063670v1
Hemispherical curved monolithic cooled and uncooled infrared focal plane arrays for compact cameras Kévin Tekaya,Manuel Fendler,Delphine Dumas,Yann Gaeremynck,David Henryet al. Infrared Technology and Applications XL, May 2014, Baltimore, United States. art. no. 90702T - 8 p., ⟨10.1117/12.2049967⟩ Communication dans un congrès hal-01060488v1
CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon Komi Atchou Ewuame,Vincent Fiori,Karim Inal,Pierre-Olivier Bouchard,Sébastien Gallois-Garreignotet al. 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 8 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813808⟩ Communication dans un congrès hal-01024448v1
Determination of material properties and failure using in-situ thermo-mechanical probe Brice Arrazat,Sebastian Orellana,C. Rivero,P. Fornara,Antonio Di Giacomoet al. 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. pp.Article number 7056700 - ISBN 978-2-35500-028-7, ⟨10.1109/DTIP.2014.7056700⟩ Communication dans un congrès hal-01143767v1
Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers Sebastian Orellana,Brice Arrazat,P. Fornara,Christian Rivero,Antonio Di Giacomoet al. 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 6 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813834⟩ Communication dans un congrès hal-01024062v1
First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures Simon Gousseau,Stéphane Moreau,David Bouchu,Alexis Farcy,Pierre Montmitonnetet al. 39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4 Communication dans un congrès hal-01052908v1
INVESTIGATION OF BORON AND NITROGEN ION BEAM IMPLANTATION IN GOLD THIN FILMS FOR OHMIC MEMS SWITCH CONTACT IMPROVEMENT Brice Arrazat,Karim Inal,Patrice Gergaud Tansducers and Eurosensors XXVII, Jun 2013, Barcelona, Spain Communication dans un congrès emse-00840099v1
Mechanical behavior of flexible silicon devices curved in spherical configurations Kévin Tekaya,Manuel Fendler,Karim Inal,Elisabeth Massoni,Herve Ribot 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wroclaw, Poland. 7 p. - Article number 6529978, ⟨10.1109/EuroSimE.2013.6529978⟩ Communication dans un congrès hal-00857209v1
Selective Sintering of Inkjet-Printed Silver Inks Using Variable Frequency Microwave Romain Cauchois,Daniel Żymełka,Karim Inal,Mohamed Saadaoui Global Congress on Microwave Energy Applications, Jul 2012, Long Beach, California, United States Communication dans un congrès emse-00714123v1
Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages Romain Cauchois,Mohamed Saadaoui,Jacques Legeleux,Thierry Malia,Béatrice Dubois-Bonvalotet al. MiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01 Communication dans un congrès emse-00691806v1
Micro-mechanical modeling of brittle fracture of French RPV steel - A comprehensive study of stress triaxiality effect Jean-Philippe Mathieu,Karim Inal,Sophie Berveiller,Olivier Diard ASME 2008 Pressure Vessels and Piping Conference, Jul 2008, Chicago, United States. pp.Volume 6: Materials and Fabrication, Parts A and B, ⟨10.1115/PVP2008-61334⟩ Communication dans un congrès hal-00671909v1
Optimal sintering technologies applied to inkjet-printed silver nanoparticles for microelectronics applications Romain Cauchois,Mohamed Saadaoui,Abdelwahhab Yakoub,Karim Inal,Béatrice Dubois-Bonvalotet al. International Conference on Sintering 2011, Aug 2011, Jeju, South Korea Communication dans un congrès emse-00638031v1
Hétérogénéités de contraintes intragranulaires : détermination par approche couplée EBSD-Kossel Denis Bouscaud,Sophie Berveiller,Raphaël Pesci,C. Rivero,Karim Inalet al. CFM 2011 - 20ème Congrès Français de Mécanique, Aug 2011, Besançon, France Communication dans un congrès hal-03422537v1
Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics Romain Cauchois,Mohamed Saadaoui,Karim Inal,Béatrice Dubois-Bonvalot,Jean-Christophe Fidalgo Materials Research Society Spring Meeting, 2011, San Francisco, United States. pp.O8.10, ⟨10.1557/opl.2011.1264⟩ Communication dans un congrès emse-00576968v1
Printed Ag nanoparticles on Evaporated Au System: Impact of Microstructure on Mechanical and Electrical Properties Romain Cauchois,Mohamed Saadaoui,Karim Inal,Béatrice Dubois-Bonvalot,Jean-Christophe Fidalgo European Materials Research Society Spring Meeting, May 2011, Nice, France Communication dans un congrès emse-00594778v1
Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation François Le Texier,Jessica Mazuir,Man Su,Mohamed Saadaoui,Jean-Luc Liotardet al. International Interconnect Technology Conference and Materials for Advanced Metallization 2011, May 2011, Dresde, Germany. pp.1-3, ⟨10.1109/IITC.2011.5940351⟩ Communication dans un congrès emse-00638030v1
Analyse de déformations et contraintes locales par couplage EBSD et microdiffraction Kossel Denis Bouscaud,Sophie Berveiller,Raphael Pesci,Claire Maurice,Roland Fortunieret al. Matériaux 2010, Oct 2010, Nantes, France. pp.0461 Communication dans un congrès emse-00533744v1
Microstructure evolution of gold thin films under spherical indentation for micro switches contact applications Brice Arrazat,Vincent Mandrillon,Karim Inal,Maxime Vincent,Christophe Poulain European Materials Research Society 2010, Jun 2010, Strasbourg, France Communication dans un congrès emse-00554023v1
Nanoindentation de couches dures ultramines de ruthénium sur or Brice Arrazat,Vincent Mandrillon,Karim Inal Materiaux 2010, Oct 2010, Nantes, France. pp.0641 Communication dans un congrès emse-00533722v1
Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages Romain Cauchois,Mohamed Saadaoui,Jacques Legeleux,Thierry Malia,Béatrice Dubois-Bonvalotet al. ESTC 2010. Electronics System Integration Technology Conference, Sep 2010, Berlin, Germany. pp.AP-4, ⟨10.1109/ESTC.2010.5642997⟩ Communication dans un congrès emse-00530148v1
Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling Romuald Roucou,Vincent Fiori,Karim Inal,Hervé Jaouen Electronics System Integration Technology Conference ESTC 2010, Sep 2010, Berlin, Germany. pp.P0027, ⟨10.1109/ESTC.2010.5642863⟩ Communication dans un congrès emse-00533813v1
Time dependence investigation of the electrical resistance of Au / Au thin film micro contacts Pierre-Yves Duvivier,Vincent Mandrillon,Karim Inal 25th International Conference on Electrical Contacts & 56th IEEE Holm Conference on Electrical Contacts, Oct 2010, Charleston, United States. pp.58-64, ⟨10.1109/HOLM.2010.5619563⟩ Communication dans un congrès emse-00533805v1
Mechanical study of the probing effect on PAD structures Romuald Roucou,Florian Cacho,Vincent Fiori,Karim Inal,Xavier Boddaert ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France Communication dans un congrès emse-00470630v1
Direct-writing of conductive patterns based on printed and sintered silver nanoparticles Romain Cauchois,Mohamed Saadaoui,Karim Inal,Béatrice Dubois-Bonvalot,Jean-Cristophe Fidalgo ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France Communication dans un congrès emse-00470613v1
Contraintes résiduelles dans les interconnexions submicroniques. Prise en compte des dimensions des lignes de cuivre par microcapteurs embarqués Renaud Vayrette,Sylvain Blayac,Christian Rivero,Karim Inal CFM 2009 - 19ème Congrès Français de Mécanique, Aug 2009, Marseille, France. pp.1326 Communication dans un congrès hal-03391221v1
Effect of Packaging Design on Wire Bond Interconnection Reliability Man Su,Karim Inal,Xavier Boddaert ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France Communication dans un congrès emse-00470634v1
Étude de la résistance électrique d’un contact Au /Au en fonction de la force appliquée Pierre-Yves Duvivier,Vincent Mandrillon, jean-Philippe Polizzi,Karim Inal CFM 2009 - 19ème Congrès Français de Mécanique, Aug 2009, Marseille, France Communication dans un congrès hal-03391432v1
Hierarchical image analysis for roughness characterization Pierre-Yves Duvivier,Vincent Mandrillon,Jean-Philippe Polizzi,Karim Inal 5th International Colloquium Micro-Tribology '09, Sep 2009, Milowka, Poland Communication dans un congrès emse-00470605v1
Thermal optimization of silver nanoparticles sintering for low resistive printed applications Romain Cauchois,Mohamed Saadaoui,Karim Inal,Béatrice Dubois-Bonvalot,J.-C. Fidalgo MME 09. 20th MicroMechanics Europe Workshop, Sep 2009, Toulouse, France. pp.D07/ 1-4 Communication dans un congrès emse-00466405v1
Détermination de l'orientation cristalline et de l'état de contrainte intragranulaire par microdiffraction Kossel Raphaël Pesci,Sophie Berveiller,Etienne Patoor,Karim Inal,Jean-Sébastien Lecomteet al. CFM 2007 - 18ème Congrès Français de Mécanique, Aug 2007, Grenoble, France Communication dans un congrès hal-03362445v1
Analyse expérimentale et modélisation du comportement mécanique d'aciers duplex Fe-Mn-Al-C Mohamad Najeeb Shiekhelsouk,V. Favier,K. Inal,S. Migot,O. Bouazizet al. CFM 2007 - 18ème Congrès Français de Mécanique, Aug 2007, Grenoble, France Communication dans un congrès hal-03362451v1
Influence de l'orientation cristallographique sur l'hétérogénéité des contraintes dans un polycristal d'AMF au cours d'un chargement superélastique Sophie Berveiller,Belkhiri Kaouache,Karim Inal,Etienne Patoor CFM 2007 - 18ème Congrès Français de Mécanique, Aug 2007, Grenoble, France Communication dans un congrès hal-03362428v1
Experimental analysis and modelling Fe-Mn-Al-C Duplex steel mechanical behaviour N. Shiekhelsouk,V. Favier,K. Inal,O. Bouaziz,M. Cherkaoui 10th International Conference on Material Forming ESAFORM 2007, 2007, Zaragoza, Spain. available on web, pp. 76-81 Communication dans un congrès hal-00314073v1
Rupture différée dans l'acier austénitique 301LN Mohamed Reda Berrahmoune,Sophie Berveiller,K. Inal,E. Patoor CFM 2007 - 18ème Congrès Français de Mécanique, Aug 2007, Grenoble, France Communication dans un congrès hal-03362179v1
stress determination with Kossel microdiffraction in a scanning electron microscope Sophie Berveiller,Etienne Patoor,Jean-Sébastien Lecomte,Karim Inal,A. Eberhardt 7th European Conference on Residual Stresses (ECRS7, Berlin, Jan 2006, Germany Communication dans un congrès hal-00111936v1
Etude du comportement mécanique d'aciers duplex Fe-Mn-Al-C N. Shiekhelsouk,V. Favier,K. Inal,M. Cherkaoui Matériaux 2006, Nov 2006, Dijon, France. pp.CD-ROM N°1082 Communication dans un congrès hal-00314887v1
Modélisation et simulation du comportement thermomécanique des aciers austénitiques à effet TWIP (TWinning Induced Plasticity) N. Shiekhelsouk,V. Favier,K. Inal,M. Cherkaoui Colloque MECAMAT-AUSSOIS, "Approches multi-échelles en mécanique des matériaux ", Jan 2006, Aussois, France. pp.CD-ROM shiekhelsouk.doc Communication dans un congrès hal-00315006v1
Modeling and simulation of the thermomechanical austenitic steel behavior with TWIP effect (TWinning Induced Plasticity) N. Shiekhelsouk,V. Favier,K. Inal,S. Allain,O. Bouazizet al. Plasticity '06, Jul 2006, Halifax, Canada. pp Communication dans un congrès hal-00315029v1
Modeling and simulation of the thermomechanical austenitic steel behavior with TWIP effect (TWinning Induced Plasticity) N. Shiekhelsouk,V. Favier,K. Inal,S. Allain,O. Bouazizet al. 9th International Conference on Material Forming ESAFORM, 2006, Glasgow, United Kingdom. pp. 183-186 Communication dans un congrès hal-00314525v1
Residual internal stress states in duplex steel with TWIP effect N. Shiekhelsouk,V. Favier,K. Inal,M. Cherkaoui The 7th European Conference on Residual Stresses, 2006, Berlin, Germany. pp. 833-838 Communication dans un congrès hal-00314268v1
A crystallographic approach of brittle fracture in the 16MND5 bainitic steel. In-situ X-ray diffraction and scanning electron microscope measurements at low temperatures Raphaël Pesci,Karim Inal,Renaud Masson 9th European Mechanics of Materials Conference/ Euromech Mecamat 2006/ Local approach to fracture, May 2006, Moret-sur-Loing, France Communication dans un congrès hal-01342979v1
Experimental and numerical investigation of local stress and strain heterogeneities in a bainitic steel Olivier Diard,Jean-Philippe Mathieu,Vincent Studer,Raphaël Pesci,Karim Inal PLASTICITY 2005, 11th International Symposium on Plasticity and its Current Applications, Jan 2005, Hawaï, United States Communication dans un congrès hal-02541952v1
Modélisation et simulation du comportement thermomécanique des aciers austénitiques à effet TWIP (TWinning Induced Plasticity) Mohamad Najeeb Shiekhelsouk,Véronique Favier,Karim Inal,Mohamed Cherkaoui 17e Congrès Français de Mécanique, 2005, Troyes, France. pp.1-6 Communication dans un congrès hal-04275411v1
Modélisation de l’essai Charpy et analyse des contraintes résiduelles Johan Herman,Farid Abed-Meraim,Karim Inal,Renaud Masson Colloque du GFAC, Apr 2003, Metz, France Communication dans un congrès hal-05118351v1

Chapitre d'ouvrage (1)

Impression et recuit de nanoparticules métalliques pour l’électronique imprimée Romain Cauchois,Mohamed Saadaoui,Karim Inal Techniques de l'Ingénieur, Référence RE 222lab et Doc. RE 222, Editions T.I., 27 + 5 p., 2014 Chapitre d'ouvrage hal-01107859v1