Martin Humeau

Publications

Communication dans un congrès (3)

An Analytical Approach to Near-Field Coupling of Wires With Direct Termination on PCB Ground Plane Martin Humeau,Mohsen Koohestani,David Boudikian,Mohamed Ramdani 22ème Colloque International et Exposition sur la Compatibilité ÉlectroMagnétique (CEM 2026), Institut XLIM, Apr 2026, Limoges (France), France Communication dans un congrès hal-05548701v1
Modeling and Characterization of Near Field Coupling Between a Noise Source and a Wire Martin Humeau,Mohamed Congo,Mohsen Koohestani,David Boudikian,Richard Perdriauet al. 2025 International Symposium on Electromagnetic Compatibility – EMC Europe, Sep 2025, Paris, France. pp.704-709, ⟨10.1109/EMCEurope61644.2025.11176118⟩ Communication dans un congrès hal-05292556v1
A Comparative Study on the Equivalent Coupling Surface Determination of A Film Capacitor using Closed TEM, Open TEM, and GTEM Cells Mohamed Ghjiawad Congo,Martin Humeau,Mohsen Koohestani,Marine Stojanovic,Richard Perdriauet al. 2025 International Symposium on Electromagnetic Compatibility – EMC Europe, Sep 2025, Paris, France. pp.710-715, ⟨10.1109/EMCEurope61644.2025.11176287⟩ Communication dans un congrès hal-05292626v1

Article dans une revue (2)

Modeling and Characterization of Near-Field Coupling Between Components and Harnesses in Presence of Ground Planes: A Case Study Martin Humeau,Mohsen Koohestani,David Boudikian,Mohamed Ramdani IEEE Transactions on Electromagnetic Compatibility, 2025, 67 (5), pp.1605 - 1613. ⟨10.1109/TEMC.2025.3601209⟩ Article dans une revue hal-05292484v3
Characterization of Near-Field Interactions Between Multiple Noise Sources and a Conductive Wire Martin Humeau,Mohsen Koohestani,David Boudikian,Mohamed Ramdani IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2025, 7 (4), pp.123-128. ⟨10.1109/lemcpa.2025.3601614⟩ Article dans une revue hal-05292528v1