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Mounira Bouarroudj
Maître de conférences à l'UPEC et rattachée au laboratoire SATIE
60
Documents
Affiliations actuelles
- 1051130
Présentation
Publications
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Hybrid modeling for remaining useful life prediction in power module prognosis25th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, Catane (Italie), Italy
Communication dans un congrès
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Non-intrusive electro-mechanical reduced model of IGBT power modules24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EUROSIME 2023), 2023, Graz, Austria
Communication dans un congrès
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Prédiction de la durée de vie restante d'un module de puissance par inférence bayesienneJournée thématique de la F2M: Approches probabilistes en mécanique, 2023, Marne la Vallée, France
Communication dans un congrès
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Power Cycling Test of PCB-Embedded Power PackagingPCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2023, Nuremberg, Germany. ⟨10.30420/566091124⟩
Communication dans un congrès
hal-04364495v1
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A non-intrusive multi-physics PGD-based reduced model for the prediction of power electronic module lifetime6th International Workshop on Model Reduction Techniques, Nov 2023, Paris-Saclay, France
Communication dans un congrès
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Non-intrusive reduced order modelling for a coupled electro-thermo-mechanical problem10th International Conference on Computational Methods for Coupled Problems in Science and Engineering (COUPLED 2023), 2023, Chania, Greece
Communication dans un congrès
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Probabilistic and Physics-Informed Machine Learning for Predictive Maintenance with Time Series Data2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2023, Graz, France. pp.1-8, ⟨10.1109/EuroSimE56861.2023.10100781⟩
Communication dans un congrès
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Physicochemical-microstructural approach for modeling the crack passage at topside metallic parts in IGBT semiconductor power electronics2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, Malta. pp.1-6, ⟨10.1109/EuroSimE54907.2022.9758895⟩
Communication dans un congrès
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Non-intrusive multi-physics PGD-based reduced model for the modeling of power electronic modulesModel Reduction and Surrogate Modeling, 2022, Berlin, Germany
Communication dans un congrès
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Condition monitoring and evaluation of Ron degradation during power cycling of SiC-Mosfets power modulesInternational Conference on integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany
Communication dans un congrès
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Model reduction for sensitivity analysis of solder joint fracture in power electronic modulesInternational Conference on integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany
Communication dans un congrès
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Construction d'un modèle réduit PGD pour l'étude de la fissuration thermo-mécanique des modules de puissance15ème colloque national en calcul des structures, Université Polytechnique Hauts-de-France [UPHF], May 2022, 83400 Hyères-les-Palmiers, France
Communication dans un congrès
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Conducted Noise Investigation for IMS Based GaN HEMT Power Module by Black Box Model2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Sep 2020, Rome, Italy. pp.1-3, ⟨10.1109/EMCEUROPE48519.2020.9245757⟩
Communication dans un congrès
hal-03266493v1
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Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), Sep 2020, Lyon, France. pp.1-10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215758⟩
Communication dans un congrès
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Design And Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal FoamPCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Jul 2020, Nuremberg, Germany
Communication dans un congrès
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EMC “Black Box” model for unbalanced power electronic converters2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Sep 2019, Barcelona, France. pp.957-962, ⟨10.1109/EMCEurope.2019.8872075⟩
Communication dans un congrès
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Inductances enfouies au PCB pour l'électronique de puissanceCOMET, Elaboration de composants passifs magnétiques, CNES Toulouse, Apr 2018, Toulouse, France
Communication dans un congrès
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Analyse du vieillissement de la métallisation d'un MOSFET par la distribution du potentiel de sourceSymposium de Genie Electrique, Jun 2016, Grenoble, France
Communication dans un congrès
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Surface analysis of smart power top metal: IR thermal measurement and source potential mapping International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2016 28th, Jun 2016, Prague, Czech Republic. ⟨10.1109/ISPSD.2016.7520861⟩
Communication dans un congrès
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3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditionsESREF, 2014, Berlin, Germany
Communication dans un congrès
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Etude comparative de l'effet des contraintes électriques extrêmes - application aux composants " Smart Power "Symposium de Génie Électrique 2014, Jul 2014, Cachan, France
Communication dans un congrès
hal-01065246v1
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Robustness Study of SiC MOSFET Under Harsh Electrical and Thermal ConstraintsCENICS, 2014, Lisbonne, Portugal
Communication dans un congrès
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Robustness of 1.2 kV SiC MOSFET devicesESREF, 2013, Arcachon, France
Communication dans un congrès
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Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24 V battery system applicationsESREF, 2013, Arcachon, France
Communication dans un congrès
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Investigation of 1.2 kV investigation of SiC MOSFETs for aeronautics applicationsPower Electronics and Applications (EPE), 2013 15th European Conference on, Sep 2013, Lille, France. pp.1-9, ⟨10.1109/EPE.2013.6634665⟩
Communication dans un congrès
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Failure modes and robustness of SiC JFET transistors under current limiting operationsPower Electronics and Applications (EPE 2011),, Aug 2011, Birmingham, United Kingdom. pp.1-10
Communication dans un congrès
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Etude du vieillissement de la couche de métallisation de composants de puissance à semi-conducteurÉlectronique de Puissance du Futur, Jun 2010, Saint Nazaire, France. pp.1-10
Communication dans un congrès
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Investigations on ageing of IGBT transistors under repetitive short-circuits operationsInternational Conference & Exhibition on Power Electronics/Intelligent Motion/Power Quality, Jun 2009, Shanghai, China. pp.237-242
Communication dans un congrès
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Temperature Levels Effects on the Thermo-Mechanical Behaviour of Solder Attach During Thermal Cycling of Power Electronic ModulesPower Electronics Specialists Conference, 2008. PESC 2008. IEEE, Jun 2008, Rhodes, Greece
Communication dans un congrès
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Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modulesEPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p, ⟨10.1109/EPE.2007.4417457⟩
Communication dans un congrès
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Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2007, BORDEAUX, France. pp. 1719-1724, ⟨10.1016/j.microrel.2007.07.027⟩
Communication dans un congrès
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Ageing Test Results of low voltage MOSFET Modules for Electrical VehiclesEPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p
Communication dans un congrès
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Aluminum metallization and wire bonding aging in power MOSFET modules2017
Pré-publication, Document de travail
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Etude de la fatigue thermo-mécanique de modules électroniques de puissance en ambiance de températures élevées pour des applications de traction de véhicules électriques et hybridesSciences de l'ingénieur [physics]. École normale supérieure de Cachan - ENS Cachan, 2008. Français. ⟨NNT : ⟩
Thèse
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