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Mounira Bouarroudj

Maître de conférences à l'UPEC et rattachée au laboratoire SATIE
60
Documents
Affiliations actuelles
  • 1051130

Présentation

Publications

A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devices

Mustafa Shqair , Zoubir Khatir , Ali Ibrahim , Mounira Bouarroudj-Berkani , Ayda Halouani
Microelectronics Reliability, 2022, 132, pp.114516. ⟨10.1016/j.microrel.2022.114516⟩
Article dans une revue hal-03656143v1

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Bouarroudj-Berkani , Merouane Ouhab
Journal of Electronic Packaging, 2022, 144 (3), ⟨10.1115/1.4053767⟩
Article dans une revue hal-03695544v1
Image document

Microstructural evolution during the crack propagation at the bond-wire contact area of IGBT power modules upon power cycling

Mustafa Shqair , Zoubir Khatir , Ali Ibrahim , Ayda Halouani , Mounira Bouarroudj-Berkani
Microelectronics Reliability, 2022, ⟨10.1016/j.microrel.2022.114635⟩
Article dans une revue hal-03788643v1

Iterative PGD model reduction for the strongly-coupled thermomechanical analysis of crack propagation in power electronic modules

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Bouarroudj-Berkani , Merouane Ouhab
Computational Mechanics, 2022, 70, pp.407-424. ⟨10.1007/s00466-022-02173-y⟩
Article dans une revue hal-03656142v1
Image document

On-line temperature measurement during power cycle of PCB-embedded diode

Said Bensebaa , Mounira Bouarroudj-Berkani , Mickael Petit , Stéphane Lefebvre
Microelectronics Reliability, 2021, pp.114313. ⟨10.1016/j.microrel.2021.114313⟩
Article dans une revue hal-03380506v1
Image document

Reliability study of PCB-embedded power dies using solderless pressed metal foam

Said Bensebaa , Mounira Bouarroudj-Berkani , Stéphane Lefebvre , Mickael Petit , Nicolas Schmitt
Microelectronics Reliability, 2020, 114, pp.113904. ⟨10.1016/j.microrel.2020.113904⟩
Article dans une revue hal-03380480v1
Image document

Mechanisms of power module source metal degradation during electro-thermal aging

Roberta Ruffilli , Mounira Berkani , Philippe Dupuy , Stéphane Lefebvre , Yann Weber
Microelectronics Reliability, 2017, 76-77, pp.507 - 511. ⟨10.1016/j.microrel.2017.06.086⟩
Article dans une revue hal-01575130v1
Image document

In-depth investigation of metallization aging in power MOSFETs

Roberta Ruffilli , M Berkani , P Dupuy , Stéphane Lefebvre , Y Weber
Microelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, SI:Proceedings of ESREF 2015, 55 (9-10), pp.1966-1970. ⟨10.1016/j.microrel.2015.06.036⟩
Article dans une revue hal-01700466v2

3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions

Michele Riccio , Vincenzo D’alessandro , Andrea Irace , Gilles Rostaing , Mounira Berkani
Microelectronics Reliability, 2014, 54 (9-10), pp.1845 - 1850. ⟨10.1016/j.microrel.2014.08.011⟩
Article dans une revue hal-01700449v1

Distributed and coupled 2D electro-thermal model of power semiconductor devices

Ghania Belkacem , Stéphane Lefebvre , Pierre-Yves Joubert , Mounira Bouarroudj-Berkani , Denis Labrousse
European Physical Journal: Applied Physics, 2014, 66 (2), ⟨10.1051/epjap/2014130486⟩
Article dans une revue hal-01700451v1

Saturation Current and On-Resistance Correlation during Repetitive Short Circuit Conditions on SiC JFETs Transistors

Mounira Bouarroudj-Berkani , Stéphane Lefebvre , Zoubir Khatir
IEEE Transactions on Power Electronics, 2013, 28 (2), pp.621 - 624. ⟨10.1109/TPEL.2012.2215629⟩
Article dans une revue hal-00743649v1

Robustness of 1.2 kV SiC MOSFET devices

Dhouha Othman , Stéphane Lefebvre , Mounira Bouarroudj-Berkani , Zoubir Khatir , Ali Ibrahim
Microelectronics Reliability, 2013, 53 (9-11), pp.1735-1738. ⟨10.1016/j.microrel.2013.07.072⟩
Article dans une revue hal-00876938v1

Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24 V battery system applications

G Rostaing , M Berkani , D Mechouche , D Labrousse , S Lefebvre
Microelectronics Reliability, 2013, 53 (9), pp.1703-1706. ⟨10.1016/j.microrel.2013.07.120⟩
Article dans une revue hal-01056353v1

Comparison study on performances and robustness between SiC MOSFET & JFET devices - Abilities for aeronautics application

Dhouha Othman , Mounira Bouarroudj-Berkani , Stéphane Lefebvre , Zoubir Khatir , Ali Ibrahim
Microelectronics Reliability, 2012, 52 (9-10), pp.1859-1864
Article dans une revue hal-00739653v1

New Investigation Possibilities on Forward Biased Power Devices using Cross-Sections

Thierry Kociniewski , Jeff Moussodji , Zoubir Khatir , Mounira Berkani , Stéphane Lefebvre
IEEE Electron Device Letters, 2012, 33 (4), pp.576-578. ⟨10.1109/LED.2011.2182492⟩
Article dans une revue hal-00795342v1

Comparison Study on Performances and Reliability between MOSFET & JFET Silicon carbide technologies - Abilities for Aeronautics Application

D Othman , Mounira Berkani , S Lefebvre , Ali Ibrahim , Zoubir Khatir
Microelectronics Reliability, 2012, 52 (10), pp.1859-1864. ⟨10.1016/j.microrel.2012.06.078⟩
Article dans une revue hal-00868886v1

A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices

Sylvain Pietranico , Sylvie Pommier , Stéphane Lefebvre , Mounira Bouarroudj-Berkani , Serge Bontemps
Microelectronics Reliability, 2011, 51, pp.1824-1829
Article dans une revue hal-00869401v1

A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices

S. Pietranico , S. Lefebvre , S. Pommier , M. Berkani Bouaroudj , Sylvain Bontemps
Microelectronics Reliability, 2011, 51 (9-11), pp.1824 - 1829. ⟨10.1016/j.microrel.2011.06.009⟩
Article dans une revue hal-01636559v1

Ageing and Failure Modes of IGBT Modules in High Temperature Power Cycling

Vanessa Smet , François Forest , Jean-Jacques Huselstein , Frédéric Richardeau , Zoubir Khatir
IEEE Transactions on Industrial Electronics, 2011, 58 (10), pp.4931 - 4941. ⟨10.1109/TIE.2011.2114313⟩
Article dans une revue hal-00713206v1

Ageing defect detection on IGBT power modules by artificial training methods based on pattern recognition

Amrane Oukaour , B. Tala-Ighil , B. Pouderoux , M. Tounsi , Mounira Bouarroudj-Berkani
Microelectronics Reliability, 2011, 51, pp.386-391
Article dans une revue hal-00869410v1

Effect of die metallization layer ageing in the case of power semiconductor devices

Sylvie Pommier , Stéphane Lefebvre , Sylvain Pietranico , Mounira Berkani , Zoubir Khatir
European Journal of Electrical Engineering, 2011, 14 (5), pp.569-585. ⟨10.3166/Geo.19.11-38⟩
Article dans une revue hal-00861667v1

Ageing of SiC JFET transistors under repetitive current limitation conditions

Mounira Berkani , Dhouha Othman , Stéphane Lefebvre , Sabrine Moumen , Zoubir Khatir
Microelectronics Reliability, 2010, 50, pp.1532-1537
Article dans une revue hal-00538483v1

Estimation of SiC JFET temperature during short-circuit operations

Mounira Berkani , Stéphane Lefebvre , Narjes Boughrara , Zoubir Khatir , J.C. Faugières
Microelectronics Reliability, 2009, 49, pp.1358-1362
Article dans une revue hal-00538538v1

Temperature Levels Effect on Solder Lifetime During Thermal Cycling of Power Modules

Mounira Bouarroudj-Berkani , Zoubir Khatir , Jean-Pierre Ousten , Stéphane Lefebvre
IEEE Transactions on Device and Materials Reliability, 2008, 8, pp.471 - 477. ⟨10.1109/TDMR.2008.2002354⟩
Article dans une revue hal-00869423v1

Failure modes on low voltage power MOSFETs under high temperature application

Laurent Dupont , Stéphane Lefebvre , Mounira Bouarroudj , Zoubir Khatir , Jean-Claude Faugieres
Microelectronics Reliability, 2007, 47 (9), p1767-1772. ⟨10.1016/j.microrel.2007.07.066⟩
Article dans une revue hal-01704346v1

Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions

Mounira Bouarroudj-Berkani , Zoubir Khatir , Jean-Pierre Ousten , F. Badel , Laurent Dupont
Microelectronics Reliability, 2007, 47, pp.719-1724
Article dans une revue hal-00869421v1

Hybrid modeling for remaining useful life prediction in power module prognosis

Mehdi Ghrabli , Mounira Bouarroudj-Berkani , Ludovic Chamoin , Emanuel Aldea
25th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, Catane (Italie), Italy
Communication dans un congrès hal-04425579v1

Non-intrusive electro-mechanical reduced model of IGBT power modules

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Bouarroudj-Berkani , Merouane Ouhab
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EUROSIME 2023), 2023, Graz, Austria
Communication dans un congrès hal-04424575v1

Prédiction de la durée de vie restante d'un module de puissance par inférence bayesienne

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Bouarroudj-Berkani , Merouane Ouhab
Journée thématique de la F2M: Approches probabilistes en mécanique, 2023, Marne la Vallée, France
Communication dans un congrès hal-04425601v1

Power Cycling Test of PCB-Embedded Power Packaging

Mounira Bouarroudj , Said Bensebaa , Mickael Petit , Stéphane Lefebvre
PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2023, Nuremberg, Germany. ⟨10.30420/566091124⟩
Communication dans un congrès hal-04364495v1

A non-intrusive multi-physics PGD-based reduced model for the prediction of power electronic module lifetime

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Bouarroudj-Berkani , Merouane Ouhab
6th International Workshop on Model Reduction Techniques, Nov 2023, Paris-Saclay, France
Communication dans un congrès hal-04425570v1

Non-intrusive reduced order modelling for a coupled electro-thermo-mechanical problem

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Bouarroudj-Berkani , Merouane Ouhab
10th International Conference on Computational Methods for Coupled Problems in Science and Engineering (COUPLED 2023), 2023, Chania, Greece
Communication dans un congrès hal-04424592v1

Probabilistic and Physics-Informed Machine Learning for Predictive Maintenance with Time Series Data

Phan-Anh Vu , Emanuel Aldea , Mounira Bouarroudj , S. Le Hégarat-Mascle
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2023, Graz, France. pp.1-8, ⟨10.1109/EuroSimE56861.2023.10100781⟩
Communication dans un congrès hal-04364503v1

Physicochemical-microstructural approach for modeling the crack passage at topside metallic parts in IGBT semiconductor power electronics

Mustafa Shqair , Zoubir Khatir , Ali Ibrahim , Mounira Bouarroudj-Berkani , Ayda Halouani
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, Malta. pp.1-6, ⟨10.1109/EuroSimE54907.2022.9758895⟩
Communication dans un congrès hal-03656147v1

Non-intrusive multi-physics PGD-based reduced model for the modeling of power electronic modules

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Bouarroudj-Berkani , Merouane Ouhab
Model Reduction and Surrogate Modeling, 2022, Berlin, Germany
Communication dans un congrès hal-04424548v1

Condition monitoring and evaluation of Ron degradation during power cycling of SiC-Mosfets power modules

Ali Ibrahim , Zoubir Khatir , Mounira Bouarroudj-Berkani
International Conference on integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany
Communication dans un congrès hal-03656145v1

Model reduction for sensitivity analysis of solder joint fracture in power electronic modules

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Bouarroudj-Berkani
International Conference on integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany
Communication dans un congrès hal-03656148v1
Image document

Construction d'un modèle réduit PGD pour l'étude de la fissuration thermo-mécanique des modules de puissance

Louis Schuler , Ludovic Chamoin , Zoubir Khatir , Mounira Berkani , Merouane Ouhab
15ème colloque national en calcul des structures, Université Polytechnique Hauts-de-France [UPHF], May 2022, 83400 Hyères-les-Palmiers, France
Communication dans un congrès hal-03717595v1

Conducted Noise Investigation for IMS Based GaN HEMT Power Module by Black Box Model

Amina Gahfif , François Costa , Pierre-Etienne Lévy , Mounira Bouarroudj-Berkani , Bertrand Revol
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Sep 2020, Rome, Italy. pp.1-3, ⟨10.1109/EMCEUROPE48519.2020.9245757⟩
Communication dans un congrès hal-03266493v1

Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam

Said Bensebaa , Mounira Bouarroudj-Berkani , Stéphane Lefebvre , Mickael Petit , N. Schmitt
2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), Sep 2020, Lyon, France. pp.1-10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215758⟩
Communication dans un congrès hal-03380517v1

Design And Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam

Said Bensebaa , Mounira Bouarroudj-Berkani , Stéphane Lefebvre , Mickael Petit
PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Jul 2020, Nuremberg, Germany
Communication dans un congrès hal-03020871v1

EMC “Black Box” model for unbalanced power electronic converters

Amina Gahfif , Pierre-Etienne Lévy , Marwan Ali , Mounira Bouarroudj-Berkani , François Costa
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Sep 2019, Barcelona, France. pp.957-962, ⟨10.1109/EMCEurope.2019.8872075⟩
Communication dans un congrès hal-03852584v1

Inductances enfouies au PCB pour l'électronique de puissance

Mickael Petit , Denis Labrousse , Stéphane Lefebvre , François Costa , Mounira Berkani
COMET, Elaboration de composants passifs magnétiques, CNES Toulouse, Apr 2018, Toulouse, France
Communication dans un congrès hal-01802072v1
Image document

Analyse du vieillissement de la métallisation d'un MOSFET par la distribution du potentiel de source

Roberta Ruffilli , Mounira Berkani , Gilles Rostaing , Marc Legros , Stéphane Lefebvre
Symposium de Genie Electrique, Jun 2016, Grenoble, France
Communication dans un congrès hal-01361625v1

Surface analysis of smart power top metal: IR thermal measurement and source potential mapping

Mounira Berkani , Stéphane Lefebvre , Gilles Rostaing , Michel Riccio , Roberta Ruffilli
International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2016 28th, Jun 2016, Prague, Czech Republic. ⟨10.1109/ISPSD.2016.7520861⟩
Communication dans un congrès hal-01681518v1

3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions

Michele Riccio , Vincenzo d'Alessandro , Andrea Irace , Gilles Rostaing , Mounira Berkani
ESREF, 2014, Berlin, Germany
Communication dans un congrès hal-01700470v1
Image document

Etude comparative de l'effet des contraintes électriques extrêmes - application aux composants " Smart Power "

Gilles Rostaing , Mounira Berkani , Denis Labrousse , Stéphane Lefebvre , Philippe Dupuy
Symposium de Génie Électrique 2014, Jul 2014, Cachan, France
Communication dans un congrès hal-01065246v1

Robustness Study of SiC MOSFET Under Harsh Electrical and Thermal Constraints

Mbarek Safa , Pascal Dherbécourt , O. Latry , Francois Fouquet , Othman Dhouha
CENICS, 2014, Lisbonne, Portugal
Communication dans un congrès hal-01700474v1

Robustness of 1.2 kV SiC MOSFET devices

Othman Dhouha , Stéphane Lefebvre , Mounira Berkani , Zoubir Khatir , Ali Ibrahim
ESREF, 2013, Arcachon, France
Communication dans un congrès hal-01700475v1

Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24 V battery system applications

Gilles Rostaing , Mounira Berkani , Stéphane Lefebvre , Zoubir Khatir , Philippe Dupuy
ESREF, 2013, Arcachon, France
Communication dans un congrès hal-01700479v1

Investigation of 1.2 kV investigation of SiC MOSFETs for aeronautics applications

Dhouha Othman , Stéphane Lefebvre , Mounira Berkani , Zoubir Khatir , Ali Ibrahim
Power Electronics and Applications (EPE), 2013 15th European Conference on, Sep 2013, Lille, France. pp.1-9, ⟨10.1109/EPE.2013.6634665⟩
Communication dans un congrès hal-00881162v1

Failure modes and robustness of SiC JFET transistors under current limiting operations

Mounira Berkani , Stéphane Lefebvre , Othman Dhouha , Moumen Sabrine , Zoubir Khatir
Power Electronics and Applications (EPE 2011),, Aug 2011, Birmingham, United Kingdom. pp.1-10
Communication dans un congrès hal-00713076v1

Etude du vieillissement de la couche de métallisation de composants de puissance à semi-conducteur

Sylvain Pietranico , Sylvie Pommier , Stéphane Lefebvre , Mounira Berkani , Zoubir Khatir
Électronique de Puissance du Futur, Jun 2010, Saint Nazaire, France. pp.1-10
Communication dans un congrès hal-00713099v1

Investigations on ageing of IGBT transistors under repetitive short-circuits operations

Mounira Berkani , Stéphane Lefebvre , Zoubir Khatir , Serge Bontemps
International Conference & Exhibition on Power Electronics/Intelligent Motion/Power Quality, Jun 2009, Shanghai, China. pp.237-242
Communication dans un congrès hal-00538554v1

Temperature Levels Effects on the Thermo-Mechanical Behaviour of Solder Attach During Thermal Cycling of Power Electronic Modules

Mounira Bouarroudj-Berkani , Zoubir Khatir , Stéphane Lefebvre
Power Electronics Specialists Conference, 2008. PESC 2008. IEEE, Jun 2008, Rhodes, Greece
Communication dans un congrès hal-01677164v1

Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Mounira Bouarroudj , Zoubir Khatir , Jean Pierre Ousten , Laurent Dupont , Stéphane Lefebvre
EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p, ⟨10.1109/EPE.2007.4417457⟩
Communication dans un congrès hal-01702003v1
Image document

Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions

Mounira Bouarroudj , Zoubir Khatir , Jean Pierre Ousten , Frédéric Badel , Laurent Dupont
18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2007, BORDEAUX, France. pp. 1719-1724, ⟨10.1016/j.microrel.2007.07.027⟩
Communication dans un congrès hal-01702036v1

Ageing Test Results of low voltage MOSFET Modules for Electrical Vehicles

Laurent Dupont , Stéphane Lefebvre , Mounira Bouarroudj , Zoubir Khatir , Jean-Claude Faugieres
EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p
Communication dans un congrès hal-01701952v1