Nicolas DEGRENNE

Publications

Article dans une revue (1)

Analytical reliability performance maps for bond wire interfaces in power modules under cyclic thermomechanical loads Clément Chedozeau,Merouane Ouhab,Natasha Vermaak,Nicolas Degrenne,François Hild Microelectronics Reliability, 2026, 178, pp.116027. ⟨10.1016/j.microrel.2026.116027⟩ Article dans une revue hal-05490427v1

Cours (1)

Evaluating the environmental impacts of circularity senarios in power electronics using Life Cycle Assessment Pierre-Yves Pichon,Thomas Guillemet,Nicolas Degrenne,Briac Baudais Doctoral. SUSTAIN-E Summer School on Sustainable Electronics, Grenoble, France. 2025 Cours hal-05203771v1

Poster de conférence (1)

Optimal sizing based environmental criteria under stochastic reliability and replacement analysis applied to DC breakers Thomas Lesaulnier,Gurvan Jodin,Roman Le Goff Latimier,Nicolas Degrenne,Hamid Ben Ahmed Journées Scientifiques GDR DEFIE, Dec 2025, Toulouse, France. Poster de conférence hal-05399126v2

Communication dans un congrès (3)

PELCA : un outil collaboratif open-source pour l'analyse de cycle de vie en électronique Thomas Guillemet,Augustin Empeyrou,Briac Baudais,Tarak Ghersi,Nicolas Degrenne SGE 2025 (Symposium de Génie Electrique), Laboratoire LAPLACE; Laboratoire LAAS, Jul 2025, Toulouse, France Communication dans un congrès hal-05153919v1
How Life Cycle Assessment (LCA) Contributes to Sustainable Power Electronics ? Thomas Guillemet,Pierre-Yves Pichon,Briac Baudais,Nicolas Degrenne International Workshop on Integrated Power Packaging (IWIPP), The University of Alabama, Apr 2025, Tuscaloosa, AL, United States Communication dans un congrès hal-05169447v1
PELCA : an Open-Source Research Software for Power Electronics Life Cycle Assessment Considering Reliability and Repairability Briac Baudais,Nicolas Degrenne,Pierre-Yves Pichon,H. Ben Ahmed,Gurvan Jodinet al. Eco-Design Approaches of Power Electronics, ECPE, Nov 2024, Grenoble, France Communication dans un congrès hal-05176394v1