Raphaël Ramos

Documents

Publications

	Towards the industrialization of solid-state batteries: Impact of dry room exposure on sulfide-based solid electrolyte materials Xavier Randrema , Ivan Leteyi Mfiban , Marine Soler , Sébastien Launois , Sébastien Diry NordBatt 2022 - The 5th NordBatt conference, Oct 2022, Goteborg, Sweden Conference papers cea-04049568v1
	Etch process cleaning to improve wafer to wafer reproducibility T. Chevolleau , C. Petit-Etienne , Gilles Cunge , Erwine Pargon , L. Vallier ENRIS 2019 (European Nanofabrication Research Infrastructure Symposium), 2019, UNIVERSITY OF TWENTE, Netherlands Conference papers hal-02624143v1
	Progress on carbon nanotube BEOL interconnects Benjamin Uhlig , Jie Liang , Lee Jaehyun , Raphael Ramos , Abitha Dhavamani DATE 2018 - 21st Design, Automation and Test in Europe Conference and Exhibition, Mar 2018, Dresden, Germany. pp.937-942, ⟨10.23919/DATE.2018.8342144⟩ Conference papers lirmm-01880198v1
	Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects Benjamin Uhlig , Abitha Dhavamani , Nicole Nagy , Katharina Lilienthal , R. Liske IITC: International Interconnect Technology Conference, Jun 2018, Santa Clara, United States. pp.16-18, ⟨10.1109/IITC.2018.8430411⟩ Conference papers lirmm-01880138v1
	The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulations Jaehyun Lee , Salim Berrada , Jie Liang , Toufik Sadi , Vihar Georgiev SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.157-160, ⟨10.23919/SISPAD.2017.8085288⟩ Conference papers lirmm-01795799v1
	A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnects Jie Liang , Raphael Ramos , Jean Dijon , H. Okuno , D. Kalita IEDM: International Electron Devices Meeting, Dec 2017, San Francisco, United States. ⟨10.1109/IEDM.2017.8268502⟩ Conference papers lirmm-01795777v1
	On the origin of the line width roughness of photoresist patterns after plasma exposure R. Ramos , M. Brihoum , K. Menguelti , L. Azarnouche , M. Fouchier AVS 59th Symposium, Oct 2012, tampa, United States Conference papers hal-00808675v1
	Challenges related to linewidth roughness Erwine Pargon , Laurent Azarnouch , Kevin Menguelti , Marc Fouchier , Melisa Brihoum China Semiconductor Technology International Conference (CSTIC), Mar 2012, Shanghai, China Conference papers hal-02338405v1
	Challenges and future prospects in plasma etching processes O. Joubert , E. Pargon , G. Cunge , Maxime Darnon , L. Vallier 3rd International Conference on PLAsma NanoTechnology and Science, Mar 2010, Nagoya,, Japan Conference papers hal-00625378v1
	Absorption spectroscopy for plasma diagnostics G. Cunge , P. Bodart , D. Vempaire , R. Ramos , N. Sadeghi 3rd workshop on Plasma Etch and Strip in Microelectronics PESM2010, Mar 2010, Grenoble, France Conference papers hal-00944938v1
	Challenges and future prospects in plasma etching G. Cunge , E. Pargon , O. R. Joubert , L. Vallier , T. Chevolleau ISPlasma 2009, 2009, Nagoya, United States Conference papers hal-00397853v1
	Reaction mechanisms in industrial silicon plasma etch reactors G. Cunge , D. Vempaire , N. Sadeghi , R. Ramos , M. Touzeau XXIX International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2009, Cancun, Mexico Conference papers hal-00460996v1
	Laser and LED based optical diagnostic techniques applied in industrial plasma etch reactors N. Sadeghi , G. Cunge , D. Vempaire , M. Touzeau , R. Ramos 56th International AVS Symposium & Topical Conferences, 2009, San Jose, United States Conference papers hal-00461002v1
	Velocity distribution of Al sputtered atoms in an ICP reactor by laser absorption and Laser Induced Fluorescence R. Ramos , M. Touzeau , G. Cunge , N. Sadeghi 9th Asia-Pacific Conference on Plasma Science and Technology (APCPST) and 21st Symposium on Plasma Science for Materials (SPSM), 2008, China Conference papers hal-00398880v1
	Physical and chemical reactions in Cl2 based etching plasmas: influence of plasma-surface interactions G. Cunge , N. Sadeghi , D. Vempaire , M. Touzeau , R. Ramos 9th Asia-Pacific Conference on Plasma Science and Technology (APCPST) and 21st Symposium on Plasma Science for Materials, Oct 2008, Huangshan, China Conference papers hal-00944941v1
	Spectroscopic investigation of plasma etching reactors M. Touzeau , R. Ramos , D. Vempaire , G. Cunge , N. Sadeghi VI Workshop em Fisica Molecular e Spectroscopia, 2008, Brazil Conference papers hal-00397783v1
	Gate Stack Patterning: challenges of the future O. R. Joubert , E. Pargon , G. Cunge , T. Chevolleau , B. Pelissier 1st International Conference on Plasma-Nanotechnology & Science (IC-PLANTS), 2008, nagoya, Japan Conference papers hal-00397778v1
	The challenges in gate stack patterning for the next technological nodes E. Pargon , T. Morel , E. Sungauer , A. Bazin , M. Martin Gordon research conference, Plasma processing science,, 2008, United States Conference papers hal-00397773v1
	Ar Ion Sputtering of GaAs Studied by Molecular Dynamics Simulation and Laser Spectroscopy of Ga Atoms in the Gas Phase E. Despiau-Pujo , P. Chabert , R. Ramos , G. Cunge , N. Sadeghi 55th International AVS Symposium & Topical Conferences, Oct 2008, boston, United States Conference papers hal-00400658v1
	Physical and chemical reactions in chlorine based etching plasmas: influence of plasma-surface interactions G. Cunge , N. Sadeghi , D. Vempaire , M. Touzeau , R. Ramos 9th Asia-Pacific Conference on Plasma Science and Technology (APCPST) and 21st Symposium on Plasma Science for Materials, 2008, China Conference papers hal-00397781v1
	Blue diode laser absorption spectroscopy of sputtered aluminium atoms R. Ramos , M. Touzeau , G. Cunge , N. Sadeghi Frontiers in Low Temperature Plasma Diagnostics VII,, 2007, United States Conference papers hal-00398863v1
	Interaction of Cl2 based plasmas with chamber walls in a silicon etching reactor G. Cunge , N. Sadeghi , R. Ramos , O. R. Joubert , M. Touzeau Frontiers in Low Temperature Plasma Diagnostics VII,, 2007, United Kingdom Conference papers hal-00397769v1
	Plasma etching challenges involved in gate stack patterning for 45 nm technological nodes and beyond O. R. Joubert , E. Pargon , G. Cunge , T. Chevolleau , B. Pelissier 1st workshop on plasma etch and strip in microelectronic (PESM), 2007, Louvain, Belgium Conference papers hal-00397771v1
	Impact of reactor walls chemical composition on radicals' densities in the chlorine based silicon etching ICP plasmas N. Sadeghi , G. Cunge , R. Ramos 18th International Symposium on Plasma Chemistry (ISPC), Aug 2007, Kyoto, Japan Conference papers hal-00944971v1
	Restoring the chamber walls surfaces of plasma reactors exposed to repeated fluorine-based plasma cleans R. Ramos , G. Cunge , B. Pelissier , O. R. Joubert , T. Chevolleau 16th International Colloquium on Plasma processes (CIP), 2007, toulouse, France Conference papers hal-00398865v1
	Plasma etching challenges of new materials involved in gate stack patterning for sub 45nm technological node O. R. Joubert , A. Le Gouil , R. Ramos , M. Helot , O. Luere 53rd International AVS Symposium & Topical Conferences, 2006, San Francisco, United States. ⟨10.1149/MA2006-01/8/367⟩ Conference papers hal-00397753v1
	Impact of chamber walls on radicals densities in Cl2 ICP plasmas G. Cunge , N. Sadeghi , R. Ramos , O. R. Joubert 53rd International AVS Symposium & Topical Conferences, 2006, san francisco, United States Conference papers hal-00400475v1
	Metal gate stack plasma patterning studies L. Vallier , T. Chevolleau , O. R. Joubert , G. Cunge , A. Le Gouil IEEE International Conference on Plasma Processes (ICOPS 06), 2006, traverse city, United States Conference papers hal-00397763v1
	Plasma Etching Challenges of New Materials Involved in Gate Stack Patterning for sub 45 nm Technological Nodes O. R. Joubert , A. Le Gouil , R. Ramos , M. Helot , G. Cunge Proceedings of the Electrochemical. Society (209th Meeting), 2006, denver, United States Conference papers hal-00398859v1
	Plasma etching challenges of new materials involved in gate stack patterning for sub-45 nm technological nodes O. Joubert , A. Le Gouil , R. Ramos , M. Helot , G. Cunge 209th ECS meeting, Denver, May 2006, Denver, United States Conference papers hal-00944953v1
	Understanding the impact of chamber walls during plasma etching: a key to control plasma processes in ULSI R. Ramos , G. Cunge , O. R. Joubert , M. Orlowski , T. Lill 53rd International AVS Symposium & Topical Conferences, 2006, san francisco, United States Conference papers hal-00400472v1
	Emerging Application of Fluorocarbon Plasmas for Integrated Circuits Fabrication T. Chevolleau , G. Cunge , Maxime Darnon , R. Ramos , L. Vallier 8th International workshop on fluorocarbon plasma, 2006, autrans, France Conference papers hal-00400476v1
	Plasma/reactor wall interactions in gate etching processes G. Cunge , R. Ramos , O. R. Joubert , N. Sadeghi , M. Mori 27th International symposium on dry process (DPS), 2005, jeju, South Korea Conference papers hal-00397119v1
	Innovative strategy to improve the stability of plasma etching processes R. Ramos , G. Cunge , B. Pelissier , O. R. Joubert 52nd International AVS Symposium & Topical Conferences, 2005, boston, United States Conference papers hal-00400466v1

	Depth-Resolving the Charge Compensation Mechanism from LiNiO 2 to NiO 2 Roberto Fantin , Thibaut Jousseaume , Raphael Ramos , Gauthier Lefevre , Ambroise van Roekeghem ACS Energy Letters, 2024, 9 (4), pp.1507-1515. ⟨10.1021/acsenergylett.4c00360⟩ Journal articles hal-04569373v1
	Evidencing Phase Transformations of Li6PS5Cl Argyrodite under Ambient Air and Dry Room Exposure Paul Naillou , Adrien Boulineau , Eric de Vito , Raphaël Ramos , Philippe Azaïs ACS Applied Materials & Interfaces, 2024, ⟨10.1021/acsami.4c11458⟩ Journal articles hal-04719412v1
	Direct growth of carbon nanotubes forests on carbon fibers to replace microporous layers in proton exchange membrane fuel cells Marie Fontana , Raphaël Ramos , Arnaud Morin , Jean Dijon Carbon, 2021, 172, pp.762 - 771. ⟨10.1016/j.carbon.2020.10.049⟩ Journal articles hal-03493137v1
	Investigation of Pt-Salt-Doped-Standalone-Multiwall Carbon Nanotubes for On-Chip Interconnect Applications Jie Liang , Rongmei Chen , Raphaël Ramos , Jaeyoung Lee , Hanako Okuno IEEE Transactions on Electron Devices, 2019, 66 (5), pp.2346-2352. ⟨10.1109/TED.2019.2901658⟩ Journal articles lirmm-02082869v1
	Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study Jaehyun Lee , Salim Berrada , Fikru Adamu-Lema , Nicole Nagy , Vihar P. Georgiev IEEE Transactions on Electron Devices, 2018, 65 (9), pp.3884-3892. ⟨10.1109/TED.2018.2853550⟩ Journal articles lirmm-01867729v1
	Variability study of MWCNT local interconnects considering defects and contact resistances - Part I: pristine MWCNT Rongmei Chen , Jie Liang , Jaehyun Lee , Vihar P. Georgiev , Raphael Ramos IEEE Transactions on Electron Devices, 2018, 65 (11), pp.4955-4962. ⟨10.1109/TED.2018.2868421⟩ Journal articles lirmm-01879935v1
	Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances - Part II: Impact of Charge Transfer Doping Rongmei Chen , Jie Liang , Jaehyun Lee , Vihar P. Georgiev , Raphael Ramos IEEE Transactions on Electron Devices, 2018, 65 (11), pp.4963-4970. ⟨10.1109/TED.2018.2868424⟩ Journal articles lirmm-01879940v1
	A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits Aida Todri-Sanial , Raphael Ramos , Hanako Okuno , Jean Dijon , Abitha Dhavamani IEEE Circuits and Systems Magazine -New Series-, 2017, 17 (2), pp.47-62. ⟨10.1109/MCAS.2017.2689538⟩ Journal articles lirmm-01795757v1
	No cytotoxicity or genotoxicity of graphene and graphene oxide in murine lung epithelial FE1 cells in vitro Stefan Bengtson , Kirsten Kling , Anne Mette Madsen , Asger W. Noergaard , Nicklas Raun Jacobsen Environmental and Molecular Mutagenesis, 2016, 57 (6), pp.469-482. ⟨10.1002/em.22017⟩ Journal articles cea-01849346v1
	Enhanced ionic liquid mobility induced by confinement in 1D CNT membranes Q. Berrod , F. Ferdeghini , P. Judeinstein , N. Genevaz , R. Ramos Nanoscale, 2016, 8 (15), pp.7845-7848. ⟨10.1039/C6NR01445C⟩ Journal articles hal-02051297v1
	Revisiting the mechanisms involved in Line Width Roughness smoothing of 193 nm photoresist patterns during HBr plasma treatment M. Brihoum , R. Ramos , K. Menguelti , G. Cunge , E. Pargon Journal of Applied Physics, 2013, 113, pp.013302. ⟨10.1063/1.4773068⟩ Journal articles hal-00904412v1
	Plasma treatments to improve Linewidth roughness during gate patterning L. Azarnouche , E. Pargon , K. Menguelti , M. Fouchier , M. Brihoum Proceedings of SPIE, the International Society for Optical Engineering, 2012, Vol. 8328, 83280H, 11pp Journal articles hal-00808681v1
	Radical surface interactions in industrial silicon plasma etch reactors G. Cunge , D. Vempaire , R. Ramos , M. Touzeau , O. Joubert Plasma Sources Science and Technology, 2010, 19, pp.4017. ⟨10.1088/0963-0252/19/3/034017⟩ Journal articles hal-01005939v1
	Plasma reactor dry cleaning strategy after TaC, MoN, WSi, W and WN etching processes R. Ramos , G. Cunge , O. Joubert , T. Lill Journal of Vacuum Science and Technology, 2009, B 27, pp.113-120 Journal articles hal-00397116v1
	Velocity distribution function of sputtered Ga atoms during inductively-coupled Ar plasma treatment of a GaAs surface Emilie Despiau-Pujo , Pascal Chabert , R. Ramos , G. Cunge , N. Sadeghi Journal of Vacuum Science & Technology A, 2009, 27, pp.356-361. ⟨10.1116/1.3081967⟩ Journal articles hal-00462482v1
	Gas temperature measurement in HBr, Cl2, SF6, CF4 and O2 plasmas G. Cunge , R. Ramos , D. Vempaire , M. Touzeau , M. Neijbauer Journal of Vacuum Science and Technology, 2009, 27 (3), pp.471-478. ⟨10.1116/1.3106626⟩ Journal articles hal-00388592v1
	Measured velocity distribution of sputtered Al atoms perpendicularly and parallel to the target R. Ramos , G. Cunge , M. Touzeau , N. Sadeghi Journal of Physics D: Applied Physics, 2008, pp.41 (15), (2008), 152003 Journal articles hal-00397105v1
	Plasma reactor dry cleaning strategy after TiN, TaN and HfO2 etching processes R. Ramos , G. Cunge , O. R. Joubert Journal of Vacuum Science and Technology, 2008, pp.B 26 (1), (2008), 181-188 Journal articles hal-00397102v1
	Tungsten metal gate etching in Cl2/O2 inductively coupled high density plasmas T. Morel , S. Barnola , R. Ramos , A. Beaurain , E. Pargon Journal of Vacuum Science and Technology, 2008, pp.B 26, (2008), 1875-1882 Journal articles hal-00397097v1
	Absorption Spectroscopy in BCl3 inductively coupled plasmas: determination of density, rotational, translational and vibrational temperature of BCl molecule R. Ramos , G. Cunge , M. Touzeau , N. Sadeghi Journal of Physics D: Applied Physics, 2008, pp.41 (11), (2008), 115205 Journal articles hal-00397107v1
	Influence of the reactor walls composition on radicals' densities and total pressure in Cl2 inductively coupled plasmas: I. Without silicon etching G. Cunge , N. Sadeghi , R. Ramos Journal of Applied Physics, 2007, pp.102, (2007), 093304 Journal articles hal-00397074v1
	Plasma/reactor walls interactions in advanced gate etching processes R. Ramos , G. Cunge , O. Joubert , N. Sadeghi , M. Mori Thin Solid Films, 2007, 515 (12), pp.4846-4852 Journal articles hal-00397069v1
	Cleaning Aluminum Fluoride coatings from plasma reactor walls in SiCl4/Cl2 plasmas R. Ramos , G. Cunge , B. Pelissier , O. Joubert Plasma Sources Science and Technology, 2007, pp.16, 711-715 Journal articles hal-00384274v1
	Influence of the reactor walls composition on radicals' densities and total pressure in Cl2 inductively coupled plasmas: II. During silicon etching G. Cunge , N. Sadeghi , R. Ramos Journal of Applied Physics, 2007, 102 (9), pp.102 093305. ⟨10.1063/1.2803881⟩ Journal articles hal-00384292v1
	On the interest of carbon-coated plasma reactor for advanced gate stack etching processes R. Ramos , G. Cunge , O. Joubert Journal of Vacuum Science and Technology, 2007, 25, pp.290-303. ⟨10.1116/1.2464126⟩ Journal articles hal-00397072v1
	Etching mechanisms of HfO2, SiO2, and poly-Si substrates in BCl3 plasmas E. Sungauer , E. Pargon , X. Mellhaoui , R. Ramos , G. Cunge Journal of Vacuum Science and Technology, 2007, pp.B 25, (2007), 1640-1646 Journal articles hal-00397068v1
	New chamber walls conditioning and cleaning strategies to improve the stability of plasma processes G. Cunge , B. Pelissier , O. Joubert , R. Ramos , C. Maurice Plasma Sources Science and Technology, 2005, pp.14 599 Journal articles hal-00384291v1

	PROCEDE DE FABRICATION D’UNE MEMBRANE A ELECTROLYTE Agathe Belime , M. Benwadih , R. Ramos , Quentin Berrod , Jean-Marc Zanotti France, N° de brevet: FR2002224. 2020 Patents hal-02997972v1

	Towards a practical use of sulfide solid electrolytes in all-solid-state-batteries: Impact of dry room exposure on H2S release and material properties Xavier Randrema , Ivan Leteyi Mfiban , Marine Soler , Manon Berthault , Sebastien Diry GORDON CONFERENCE, Jul 2022, Ventura, United States. 2022 Conference poster cea-04248083v1
	Progress on Pt-Salt Doped Carbon Nanotubes for Local Interconnects Jie Liang , Raphael Ramos , Jean Dijon , Hanako Okuno , Dipankar Kalita 12e Colloque National du GDR SoC/SiP, Jun 2018, Paris, France. 2018 Conference poster lirmm-02132496v1

	Interactions entre les plasmas de gravure à couplage inductif et les parois du réacteur Raphaël Ramos Physique [physics]. Université Joseph-Fourier - Grenoble I, 2008. Français. ⟨NNT : ⟩ Theses tel-00330664v1

Raphaël Ramos

Publications

Towards the industrialization of solid-state batteries: Impact of dry room exposure on sulfide-based solid electrolyte materials

Etch process cleaning to improve wafer to wafer reproducibility

Progress on carbon nanotube BEOL interconnects

Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects

The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulations

A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnects

On the origin of the line width roughness of photoresist patterns after plasma exposure

Challenges related to linewidth roughness

Challenges and future prospects in plasma etching processes

Absorption spectroscopy for plasma diagnostics

Challenges and future prospects in plasma etching

Reaction mechanisms in industrial silicon plasma etch reactors

Laser and LED based optical diagnostic techniques applied in industrial plasma etch reactors

Velocity distribution of Al sputtered atoms in an ICP reactor by laser absorption and Laser Induced Fluorescence

Physical and chemical reactions in Cl2 based etching plasmas: influence of plasma-surface interactions

Spectroscopic investigation of plasma etching reactors

Gate Stack Patterning: challenges of the future

The challenges in gate stack patterning for the next technological nodes

Ar Ion Sputtering of GaAs Studied by Molecular Dynamics Simulation and Laser Spectroscopy of Ga Atoms in the Gas Phase

Physical and chemical reactions in chlorine based etching plasmas: influence of plasma-surface interactions

Blue diode laser absorption spectroscopy of sputtered aluminium atoms

Interaction of Cl2 based plasmas with chamber walls in a silicon etching reactor

Plasma etching challenges involved in gate stack patterning for 45 nm technological nodes and beyond

Impact of reactor walls chemical composition on radicals' densities in the chlorine based silicon etching ICP plasmas

Restoring the chamber walls surfaces of plasma reactors exposed to repeated fluorine-based plasma cleans

Plasma etching challenges of new materials involved in gate stack patterning for sub 45nm technological node

Impact of chamber walls on radicals densities in Cl2 ICP plasmas

Metal gate stack plasma patterning studies

Plasma Etching Challenges of New Materials Involved in Gate Stack Patterning for sub 45 nm Technological Nodes

Plasma etching challenges of new materials involved in gate stack patterning for sub-45 nm technological nodes

Understanding the impact of chamber walls during plasma etching: a key to control plasma processes in ULSI

Emerging Application of Fluorocarbon Plasmas for Integrated Circuits Fabrication

Plasma/reactor wall interactions in gate etching processes

Innovative strategy to improve the stability of plasma etching processes

Depth-Resolving the Charge Compensation Mechanism from LiNiO 2 to NiO 2

Evidencing Phase Transformations of Li6PS5Cl Argyrodite under Ambient Air and Dry Room Exposure

Direct growth of carbon nanotubes forests on carbon fibers to replace microporous layers in proton exchange membrane fuel cells

Investigation of Pt-Salt-Doped-Standalone-Multiwall Carbon Nanotubes for On-Chip Interconnect Applications

Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study

Variability study of MWCNT local interconnects considering defects and contact resistances - Part I: pristine MWCNT

Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances - Part II: Impact of Charge Transfer Doping

A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits

No cytotoxicity or genotoxicity of graphene and graphene oxide in murine lung epithelial FE1 cells in vitro

Enhanced ionic liquid mobility induced by confinement in 1D CNT membranes

Revisiting the mechanisms involved in Line Width Roughness smoothing of 193 nm photoresist patterns during HBr plasma treatment

Plasma treatments to improve Linewidth roughness during gate patterning

Radical surface interactions in industrial silicon plasma etch reactors

Plasma reactor dry cleaning strategy after TaC, MoN, WSi, W and WN etching processes

Velocity distribution function of sputtered Ga atoms during inductively-coupled Ar plasma treatment of a GaAs surface

Gas temperature measurement in HBr, Cl2, SF6, CF4 and O2 plasmas

Measured velocity distribution of sputtered Al atoms perpendicularly and parallel to the target

Plasma reactor dry cleaning strategy after TiN, TaN and HfO2 etching processes

Tungsten metal gate etching in Cl2/O2 inductively coupled high density plasmas

Absorption Spectroscopy in BCl3 inductively coupled plasmas: determination of density, rotational, translational and vibrational temperature of BCl molecule

Influence of the reactor walls composition on radicals' densities and total pressure in Cl2 inductively coupled plasmas: I. Without silicon etching

Plasma/reactor walls interactions in advanced gate etching processes

Cleaning Aluminum Fluoride coatings from plasma reactor walls in SiCl4/Cl2 plasmas

Influence of the reactor walls composition on radicals' densities and total pressure in Cl2 inductively coupled plasmas: II. During silicon etching

On the interest of carbon-coated plasma reactor for advanced gate stack etching processes

Etching mechanisms of HfO2, SiO2, and poly-Si substrates in BCl3 plasmas

New chamber walls conditioning and cleaning strategies to improve the stability of plasma processes

PROCEDE DE FABRICATION D’UNE MEMBRANE A ELECTROLYTE

Towards a practical use of sulfide solid electrolytes in all-solid-state-batteries: Impact of dry room exposure on H2S release and material properties

Progress on Pt-Salt Doped Carbon Nanotubes for Local Interconnects

Interactions entre les plasmas de gravure à couplage inductif et les parois du réacteur