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Ali IBRAHIM
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New model of crack propagation of aluminium wire bonds in IGBT power modules under low temperature variationsMicroelectronics Reliability, 2023, 147, pp.115066. ⟨10.1016/j.microrel.2023.115066⟩
Article dans une revue
hal-04154649v1
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Finite elements analyses of early-stage crack propagation in aluminum wire bonds due to power cyclingMicroelectronics Reliability, 2022, 138, pp.114610. ⟨10.1016/j.microrel.2022.114610⟩
Article dans une revue
hal-04102314v1
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Microstructural evolution during the crack propagation at the bond-wire contact area of IGBT power modules upon power cyclingMicroelectronics Reliability, 2022, ⟨10.1016/j.microrel.2022.114635⟩
Article dans une revue
hal-03788643v1
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A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devicesMicroelectronics Reliability, 2022, 132, pp.114516. ⟨10.1016/j.microrel.2022.114516⟩
Article dans une revue
hal-03656143v1
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Physicochemical-microstructural approach for modeling the crack passage at topside metallic parts in IGBT semiconductor power electronics2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, Malta. pp.1-6, ⟨10.1109/EuroSimE54907.2022.9758895⟩
Communication dans un congrès
hal-03656147v1
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