Mounira Bouarroudj
- Systèmes et Applications des Technologies de l'Information et de l'Energie (SATIE)
- Composants et Systèmes pour l'Energie Electrique (SATIE-CSEE)
- Université Paris-Est Créteil Val-de-Marne - Paris 12 (UPEC UP12)
Publications
Publications
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Optimizing Shift Angle Topologies for PCB Toroidal Inductors Using Solenoid Models under DC BoundariesSymposium de Génie Électrique SGE 2025, CNRS, UPS, Jul 2025, Toulouse, France |
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Investigating the Impact of Alignment Angle Between Copper Turns and Magnetic Core on Magnetic Field Coupling in PCB Integrated InductorsThe 26th European Conference on Power Electronics and Applications, GDR SEEDS France & EPE Association, Mar 2025, Paris, France. ⟨10.34746/epe2025-0182⟩ |
Combining machine learning with finite element simulations for fast computation in power module failure Analysis due to wire bond degradation3rd IACM Digital Twins in Engineering Conference (DTE 2025) & 1st ECCOMAS Artificial Intelligence and Computational Methods in Applied Science (AICOMAS 2025), Feb 2025, Paris, France |
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Data-driven Metamodels for Failure Analysis of Power Electronic Modules36th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2025), Université de Bordeaux, ADERA, Oct 2025, Bordeaux, France |
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Optimizing Perpendicular Flux in PCB Embedded Inductors via Shift-Angle Topologies under DC Excitation6ème Symposium de Génie Électrique, Jul 2025, Toulouse, France |
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Comportement homogénéisé d'un microvia pour la modélisation mécanique d'un circuit imprimé avec composants enfouis26e Congrès Français de Mécanique, Laboratoire d'Etude des Microstructures et de Mécanique des Matériaux (LEM3 - UMR CNRS 7239), Aug 2025, Metz, France |
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Hybrid modeling for remaining useful life prediction in power module prognosis25th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2024, Catane, Italy. pp.1-9, ⟨10.1109/EuroSimE60745.2024.10491493⟩ |
Physics informed Markov chains for remaining useful life prediction of wire bonds in power modules35th European Symposium of Reliability of Electronic Devices, Failure Physics and Analysis (ESREF 2024), Sep 2024, Parme, Italy |
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Prédiction de la durée de vie restante d'un module de puissance par inférence bayesienneJournée thématique de la F2M: Approches probabilistes en mécanique, 2023, Marne la Vallée, France |
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Power Cycling Test of PCB-Embedded Power PackagingPCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2023, Nuremberg, Germany. ⟨10.30420/566091124⟩ |
Non-intrusive electro-mechanical reduced model of IGBT power modules24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EUROSIME 2023), 2023, Graz, Austria |
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Non-intrusive reduced order modelling for a coupled electro-thermo-mechanical problem10th International Conference on Computational Methods for Coupled Problems in Science and Engineering (COUPLED 2023), 2023, Chania, Greece |
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A non-intrusive multi-physics PGD-based reduced model for the prediction of power electronic module lifetime6th International Workshop on Model Reduction Techniques, Nov 2023, Paris-Saclay, France |
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Probabilistic and Physics-Informed Machine Learning for Predictive Maintenance with Time Series Data24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2023, Apr 2023, Graz, Austria. pp.1-8, ⟨10.1109/EuroSimE56861.2023.10100781⟩ |
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Non-intrusive electro-thermo-mechanical reduced model for diagnosis and prognostic on IGBT power modules2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2023, Graz, Austria. pp.1-9, ⟨10.1109/EuroSimE56861.2023.10100766⟩ |
Non-intrusive multi-physics PGD-based reduced model for the modeling of power electronic modulesModel Reduction and Surrogate Modeling, 2022, Berlin, Germany |
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Model reduction for sensitivity analysis of solder joint fracture in power electronic modulesInternational Conference on integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany |
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Condition monitoring and evaluation of Ron degradation during power cycling in switching mode of SiC-Mosfets power modules12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Mar 2022, Berlin, Germany |
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Construction d'un modèle réduit PGD pour l'étude de la fissuration thermo-mécanique des modules de puissance15ème colloque national en calcul des structures, Université Polytechnique Hauts-de-France [UPHF], May 2022, 83400 Hyères-les-Palmiers, France |
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Physicochemical-microstructural approach for modeling the crack passage at topside metallic parts in IGBT semiconductor power electronics2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2022, St Julian, Malta. pp.1-6, ⟨10.1109/EuroSimE54907.2022.9758895⟩ |
Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), Sep 2020, Lyon, France. pp.1-10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215758⟩ |
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Design And Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal FoamPCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Jul 2020, Nuremberg, Germany |
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Conducted Noise Investigation for IMS Based GaN HEMT Power Module by Black Box Model2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Sep 2020, Rome, Italy. pp.1-3, ⟨10.1109/EMCEUROPE48519.2020.9245757⟩ |
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EMC “Black Box” model for unbalanced power electronic converters2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Sep 2019, Barcelona, France. pp.957-962, ⟨10.1109/EMCEurope.2019.8872075⟩ |
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Inductances enfouies au PCB pour l'électronique de puissanceCOMET, Elaboration de composants passifs magnétiques, CNES Toulouse, Apr 2018, Toulouse, France |
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Surface analysis of smart power top metal: IR thermal measurement and source potential mappingInternational Symposium on Power Semiconductor Devices and ICs (ISPSD), 2016 28th, Jun 2016, Prague, Czech Republic. ⟨10.1109/ISPSD.2016.7520861⟩ |
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Analyse du vieillissement de la métallisation d'un MOSFET par la distribution du potentiel de sourceSymposium de Genie Electrique, Jun 2016, Grenoble, France |
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Etude comparative de l'effet des contraintes électriques extrêmes - application aux composants " Smart PowerSymposium de Génie Électrique 2014, Jul 2014, Cachan, France |
Robustness Study of SiC MOSFET Under Harsh Electrical and Thermal ConstraintsCENICS, 2014, Lisbonne, Portugal |
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3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditionsESREF, 2014, Berlin, Germany |
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Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24 V battery system applicationsESREF, 2013, Arcachon, France |
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Robustness of 1.2 kV SiC MOSFET devicesESREF, 2013, Arcachon, France |
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Investigation of 1.2 kV investigation of SiC MOSFETs for aeronautics applicationsPower Electronics and Applications (EPE), 2013 15th European Conference on, Sep 2013, Lille, France. pp.1-9, ⟨10.1109/EPE.2013.6634665⟩ |
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Etude du vieillissement de la couche de métallisation de composants de puissance à semi-conducteurÉlectronique de Puissance du Futur, Jun 2010, Saint Nazaire, France. pp.1-10 |
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Failure modes and robustness of SiC JFET transistors under current limiting operationsPower Electronics and Applications (EPE 2011),, Aug 2011, Birmingham, United Kingdom. pp.1-10 |
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Investigations on ageing of IGBT transistors under repetitive short-circuits operationsInternational Conference & Exhibition on Power Electronics/Intelligent Motion/Power Quality, Jun 2009, Shanghai, China. pp.237-242 |
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Temperature Levels Effects on the Thermo-Mechanical Behaviour of Solder Attach During Thermal Cycling of Power Electronic ModulesPower Electronics Specialists Conference, 2008. PESC 2008. IEEE, Jun 2008, Rhodes, Greece |
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Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modulesEPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p, ⟨10.1109/EPE.2007.4417457⟩ |
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Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2007, BORDEAUX, France. pp. 1719-1724, ⟨10.1016/j.microrel.2007.07.027⟩ |
Ageing Test Results of low voltage MOSFET Modules for Electrical VehiclesEPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p |
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Aluminum metallization and wire bonding aging in power MOSFET modules2017 |
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Etude de la fatigue thermo-mécanique de modules électroniques de puissance en ambiance de températures élevées pour des applications de traction de véhicules électriques et hybridesSciences de l'ingénieur [physics]. École normale supérieure de Cachan - ENS Cachan, 2008. Français. ⟨NNT : ⟩ |