DA
David Andreu
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Power Supply Investigation for Wireless Wafer TestLATW'08: 9th Latin-American Test Workshop, Mar 2008, Puebla, Mexico. pp.165-170
Communication dans un congrès
lirmm-00260205v1
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Testing System-In-Package WirelesslyDTIS: Design and Technology of Integrated Systems in Nanoscale Era, Sep 2006, Tunis, Tunisia. pp.222-226
Communication dans un congrès
lirmm-00094916v1
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TOETS: Work Package 1Poster de conférence lirmm-00653039v1 |
Wireless Wafer Test for Iterative Testing During System Assembly3D-Test: Testing Three-Dimensional Stacked Integrated Circuits, Nov 2010, Austin, Texas, United States. , 1st IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits, 2010
Poster de conférence
lirmm-00537849v1
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Wireless Test Structure for Integrated SystemsITC'2008: International Test Conference, Oct 2008, Santa Clara, CA, United States. pp.N/A, 2008, ⟨10.1109/TEST.2008.4700704⟩
Poster de conférence
lirmm-00375077v1
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System and Method for Wirelessly Testing Integrated CircuitsSpain, Patent n° : EP 08290891 WO 2010031879 (A1). 2008, pp.N/A
Brevet
lirmm-00767777v1
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