Fabien Parrain

49
Documents

Publications

Publications

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Heat management and losses of electrocaloric cooling devices based on electrostatic thermal switches

Lucas Depreux , Morgan Almanza , Nouh Zeggai , Fabien Parrain , Martino Lobue

Applied Thermal Engineering, 2022, pp.118290. ⟨10.1016/j.applthermaleng.2022.118290⟩

Article dans une revue hal-03616477v1
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Self-oscillation and heat management in a LaFeSi based thermomagnetic generator

Smail Ahmim , Morgan Almanza , Vincent Loyau , Frédéric Mazaleyrat , Alexandre Pasko et al.

Journal of Magnetism and Magnetic Materials, 2021, 540, pp.168428. ⟨10.1016/j.jmmm.2021.168428⟩

Article dans une revue hal-03348584v1
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Electrostatically actuated thermal switch device for caloric film

Morgan Almanza , Lucas Depreux , Fabien Parrain , Martino Lobue

Applied Physics Letters, 2018, 112 (8), pp.083901. ⟨10.1063/1.5009618⟩

Article dans une revue hal-01706363v1

Engineering the Structural Nonlinearity Using Multimodal-Shaped Springs in MEMS

Bogdan Vysotskyi , Fabien Parrain , Denis Aubry , Philippe Gaucher , Xavier Le Roux et al.

Journal of Microelectromechanical Systems, 2017, 27 (1), pp.1 - 7. ⟨10.1109/JMEMS.2017.2779179⟩

Article dans une revue hal-01664871v1
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Design and Simulation of Bistable Microsystem with Frequency-up conversion effect for Electrostatic Energy Harvesting

Bogdan Vysotsky , Fabien Parrain , Elie Lefeuvre , Xavier Leroux , D. Aubry et al.

Journal of Physics: Conference Series, 2016, 757, pp.12007. ⟨10.1088/1742-6596/757/1/012007⟩

Article dans une revue hal-01832552v1
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Innovative Energy Harvester Design Using Bistable Mechanism With Compensational Springs In Gravity Field

Bogdan Vysotskyi , Fabien Parrain , Denis Aubry , Philippe Gaucher , Elie Lefeuvre

Journal of Physics: Conference Series, 2016, 773 (012064), ⟨10.1088/1742-6596/773/1/012064⟩

Article dans une revue hal-01832550v1

Mechanical resistance of patterned BCB bonded joints for MEMS packaging

C. Cuminatto , M. Braccini , G. Schelcher , G. Parry , F. Parrain

Microelectronic Engineering, 2013, 111, pp.39-44. ⟨10.1016/j.mee.2013.05.012⟩

Article dans une revue istex hal-00869672v1

A sweeping mode integrated fingerprint sensor with 256 tactile microbeams

B. Charlot , F. Parrain , N. Galy , Skandar Basrour , B. Courtois

Journal of Microelectromechanical Systems, 2004, 13(4), pp.636-44. ⟨10.1109/JMEMS.2004.832195⟩

Article dans une revue hal-00007803v1

Microbeams with electronically controlled high thermal impedance

Salvador Mir , F. Parrain , B. Charlot , D. Veychard

Analog Integrated Circuits and Signal Processing, 2001, 29(1-2), pp.71-83. ⟨10.1023/A:1011282314105⟩

Article dans une revue istex hal-00012882v1

Generation of electrically induced stimuli for MEMS self-test

B. Charlot , Salvador Mir , F. Parrain , B. Courtois

Journal of Electronic Testing: : Theory and Applications, 2001, Dec. 17(6), pp.459-70. ⟨10.1023/A:1012860420235⟩

Article dans une revue istex hal-00007841v1

Capteur infrarouge CMOS à thermopiles comportant des fonctions de self-test

F. Parrain , Salvador Mir , B. Charlot , B. Courtois

Nano et micro technologies, 2001, 1 (3-4), pp.387-412

Article dans une revue hal-01455450v1
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A thin and light Gd-based thermomagnetic generator

Morgan Almanza , Nesrine Belkadi , Jean-Eudes Duvauchelle , Erika Fontana , Doan Nguyen Ba et al.

IEEE 2025 Conference on Advances in Magnetics (AIM 2025), Feb 2025, Bressanone, Italy

Communication dans un congrès hal-04976336v1
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Convertisseur Flyback pour l'alimentation de polymères électro-actifs

Christophe Baron , Elie Lefeuvre , Fabien Parrain , Martino Lobue , Morgan Almanza

symposium de génie électrique, Laboratoire Plasma et Conversion d'Energie (LAPLACE); Laboratoire d'Architecture et d'Analyse des Systèmes (LAAS-CNRS), Jul 2025, Toulouse, France

Communication dans un congrès hal-05252195v1

Relationship between process and electrocaloric effect in relaxor ferroelectric materials

Nouh Zeggai , Lucas Depreux , Fabien Parrain , Brahim Dkhil , Martino Lobue et al.

Journées de la Matière Condensée (JMC), Aug 2022, Lyon, France

Communication dans un congrès hal-03767893v1

Study of electrostatic actuation for electrocaloric cooling devices

Lucas Depreux , Morgan Almanza , Fabien Parrain , Martino Lobue

Thermag, Jun 2021, Baltimore (virtual), United States

Communication dans un congrès hal-03325302v1

A La-Fe-Si Based Thermo-Magnetic Generator

Smail Ahmim , Morgan Almanza , Alexandre Pasko , Vincent Loyau , Fabien Parrain et al.

Delft Days on Magneto Calorics DDMC 2019 Science Centre TU Delft, November 18-19, Aug 2021, Delft, Netherlands

Communication dans un congrès hal-03321193v1
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Study of the actuation losses in an electrocaloric cooling device

Lucas Depreux , Morgan Almanza , Fabien Parrain , Martino Lobue

4ème Symposium de Génie Électrique (SGE 2021), Jul 2021, Nantes, France

Communication dans un congrès hal-03325285v1

ELECTROCOOLING DEVICE BASED ON MULTILAYERS PVDF BASED POLYMER

Nouh Zeggai , Lucas Depreux , Fabien Parrain , Brahim Dkhil , Martino Lobue et al.

Digital Printing and Polymer Materials Conference, Dec 2021, Paris, France

Communication dans un congrès hal-03767427v1

Conception of a New Characterization Bench for Thermal Measurements of Flat Heat Pipes in Harsh Environments

Fabien Parrain , Lucas Blanc , Agnès Chaillot , Marion Woytasik , Olivier Maire et al.

15th European Advanced Technology Workshop on Micropackaging and Thermal Management, IMAPS, Feb 2020, La Rochelle (Charente-Maritime, Nouvelle-Aquitaine), France

Communication dans un congrès hal-04311817v1

Characterization of Mobility of Charged Dissociated Species in Dielectric Fluids For EHD Pumping Microsystems

Lucas Blanc , Fabien Parrain , Agnès Chaillot , Marion Woytasik , Olivier Maire et al.

2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), Jun 2020, Lyon, France. ⟨10.1109/DTIP51112.2020⟩

Communication dans un congrès hal-03029407v1

Design of a Ti-based microsensor for in vivo pressure monitoring

Gwenael Becan , Bertrand Boutaud , Edouard Laudrel , Fabien Parrain , Marion Woytasik et al.

2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), May 2019, Paris, France. pp.1-5, ⟨10.1109/DTIP.2019.8752842⟩

Communication dans un congrès hal-02306974v1

Electrical Pumping of a Fluid in a Diphasic Loop Using ElectroHydroDynamic (EHD) Effects for Electronic Cooling

Fabien Parrain , Lucas Blanc , Agnes Chaillot , Marion Woytasik , Olivier Maire et al.

14th European Advanced Technology Workshop on Micropackaging and Thermal Management, IMAPS, Feb 2019, La Rochelle (Charente-Maritime, Nouvelle-Aquitaine), France

Communication dans un congrès hal-04312836v1

New Solution for Thermal Management of Electronic Using Electro-Hydro-Dynamic (EHD) Pump in Heat Pipe

Lucas Blanc , Fabien Parrain , Agnes Chaillot , Marion Woytasik , Olivier Maire et al.

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), IEEE, Sep 2018, Stockholm, Sweden. pp.1-6, ⟨10.1109/THERMINIC.2018.8593287⟩

Communication dans un congrès hal-04311788v1
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Digital architecture for vibrating inertial sensors: modularity, performances, self-calibrations

Leopold Delahaye , J. Guérard , F. Parrain

ISS Inertial Sensors and Systems, Sep 2018, Brunswick, Germany

Communication dans un congrès hal-01983350v1

Electrostatic vibration energy harvester using multimodal-shaped springs for pacemaker application

Bogdan Vysotskyi , F. Parrain , X. Le Roux , E. Lefeuvre , P. Gaucher et al.

20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018, May 2018, Roma, Italy. pp.1-6, ⟨10.1109/DTIP.2018.8394216⟩

Communication dans un congrès hal-02453307v1

Electrostatically actuated thermal switch device for caloric film

Morgan Almanza , Sébastien Pruvost , Fabien Parrain , Martino Lobue

Thermag VIII : 8th International Conference on Caloric Cooling, Sep 2018, Darmstadt (Allemagne), Germany

Communication dans un congrès hal-04983731v1
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Miniaturization of Compensational Spring System using the Highly Nonlinear Curved beams in MEMS

Bogdan Vysotskyi , Denis Aubry , Philippe Gaucher , Elie Lefeuvre , Xavier Le Roux et al.

28th Micromechanics and Microsystems Europe Workshop, Aug 2017, Uppsala, Sweden. ⟨10.1088/1742-6596/922/1/012012⟩

Communication dans un congrès hal-01832547v1

Optical actuation and detection of MEMS resonators: Behavioral modeling and phase noise simulations

Guillaume Papin , Raphaël Levy , Alain Bosseboeuf , Filippo Fabbri , Fabien Parrain et al.

2012 IEEE International Frequency Control Symposium (FCS), May 2012, Baltimore, United States. pp.1-5, ⟨10.1109/FCS.2012.6243656⟩

Communication dans un congrès hal-02435458v1

Propagation d'une fissure dans une interface entre des lignes de polymère et un substrat rigide.

C. Cuminatto , G. Schelcher , G. Parry , F. Parrain , M. Braccini

MATERIAUX 2010, Oct 2010, NANTES, France

Communication dans un congrès hal-00533349v1
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ARCHITECTURE FOR INTEGRATED MEMS RESONATORS QUALITY FACTOR MEASUREMENT

H. Mathias , F. Parrain , J.-P. Gilles , S. Megherbi , M. Zhang et al.

DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. pp.6-10

Communication dans un congrès hal-00257651v1
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Noise and thermal stability of vibrating micro-gyrometers preamplifiers

R. Levy , A. Dupret , H. Mathias , J.-P. Gilles , F. Parrain et al.

DTIP 2007, Apr 2007, Stresa, Italy. pp.142-146

Communication dans un congrès hal-00257677v1
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MEMS Q-FACTOR ENHANCEMENT USING PARAMETRIC AMPLIFICATION: THEORETICAL STUDY AND DESIGN OF A PARAMETRIC DEVICE

L. Grasser , H. Mathias , F. Parrain , Xavier Le Roux , J.-P. Gilles

DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. pp.255-259

Communication dans un congrès hal-00257698v1

A full identification system for a tactile fingerprint sensor

N. Galy , B. Charlot , F. Parrain , B. Courtois

Design, Test, Integration, and Packaging of MEMS/MOEMS (DTIP'04), May 2004, Montreux, Suisse

Communication dans un congrès hal-01392556v1

A sweeping mode integrated tactile fingerprint sensor

B. Charlot , F. Parrain , N. Galy , B. Courtois

2003, pp.1031-4 vol.2, ⟨10.1109/JMEMS.2004.832195⟩

Communication dans un congrès hal-00007820v1

A CMOS compatible micromachined tactile fingerprint sensor

F. Parrain , N. Galy , B. Charlot , B. Courtois

Design, Test, Integration, and Packaging of MEMS/MOEMS (DTIP'02), May 2002, Mandelieu (Cannes), France

Communication dans un congrès hal-01391631v1

CMOS-compatible micromachined tactile fingerprint sensor

F. Parrain , B. Charlot , N. Galy , B. Courtois

2002, pp.Volume 4755; 97-104, ⟨10.1117/12.462857⟩

Communication dans un congrès hal-00007826v1

A self-testable CMOS thermopile-based infrared imager

B. Charlot , F. Parrain , Salvador Mir , B. Courtois

Design, Test, Integration, and Packaging of MEMS/MOEMS, 2001, Cannes, France. pp.96-103

Communication dans un congrès hal-00012879v1

High thermal impedance beams for suspended MEMS

Salvador Mir , B. Charlot , F. Parrain , D. Veychard

Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France. pp.99-107

Communication dans un congrès hal-00013022v1

Towards design and validation of mixed-technology SOCs

B. Courtois , Salvador Mir , B. Charlot , G. Nicolescu , P. Coste et al.

Great Lakes Symposium on VLSI (GSLVLSI 2000), 2000, Chicago (Illinois), United States. pp.29 - 33, ⟨10.1145/330855.330950⟩

Communication dans un congrès hal-00007757v1

Les capteurs magnétiques en technologies microsystèmes

F. Parrain

Dispositifs et physique des microsystèmes sur silicium (Traité EGEM, série Electronique et micro-électronique), Hermès Science, 175-198 : chapitre 5, 2002, ISBN: 2746205076

Chapitre d'ouvrage hal-00016263v1

Les microsystèmes thermiques

Salvador Mir , B. Charlot , F. Parrain

Dispositifs et physique des microsystèmes sur silicium (Traité EGEM, série Electronique et micro-électronique), Hermès Science, 218p., chapitre 2: 65-104, 2002

Chapitre d'ouvrage hal-00016260v1

Les interfaces microélectroniques

Salvador Mir , F. Parrain

Conception de microsystèmes sur silicium (Traité EGEM, série Electronique et micro-électronique), Hermès Science, 220 p., chapitre 6 : 177-215, 2002

Chapitre d'ouvrage hal-00016255v1
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Capteur intégré tactile d'empreintes digitales à microstructures piezorésistives

F. Parrain

Autre [cs.OH]. Institut National Polytechnique de Grenoble - INPG, 2002. Français. ⟨NNT : ⟩

Thèse tel-00002923v1