Georges HAMAOUI
Publications
Publications
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Spectral Emissivity Evolution of Radiative Cooling Materials during Water CondensationNano Micro Scale Heat Transfer Conference VIII, 2024 |
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Silicon Materials Mid-Infrared Direct Spectral Emissivity Measurement at Intermediate TemperaturesTPV15, Oct 2024, Madrid, Spain |
Integration of micro-fabricated thermal flow rate sensors in a 4H-SiC substrate passivated by a MPECVD-grown diamond layerThe 34th International Conference on Diamond and Carbon Materials (ICDCM 2024), Sep 2024, Dresde, Germany |
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Passive Nighttime Radiative Cooling using Black SiliconThe 10th International Symposium on Radiative Transfer, RAD-23, The International Centre for Heat and Mass Transfer (ICHMT), Jun 2023, Thessaloniki, Greece. pp.339-344, ⟨10.1615/RAD-23.510⟩ |
Randomly Micro-structured Silicon for Thermal Light Engineering: Radiative Properties and Applications2023 PhotonIcs and Electromagnetics Research Symposium (PIERS 2023), Jul 2023, Prague, Czech Republic |
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Thermal conductivity enhancement mechanism of polymer composites with carbon-based fillersJournées GDR: Journées Interfaces, Jul 2023, Paris, France |
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Experimental three-dimensional thermal mapping of a GaN on RF-SOI chip2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2022, Dublin, France. pp.1-5, ⟨10.1109/THERMINIC57263.2022.9950649⟩ |
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Wide Band High Level Thermal Radiation Emission of Highly Doped Black Silicon13th Conference on Thermophotovoltaic Generation of Electricity (TPV-13), Apr 2022, Miyazaki, Japan |
Local thermal analysis of polymer-carbon filler compositesNanoscale and Microscale Heat Transfer VII, Eurotherm seminar No 114, Nov 2022, Palerme (Italie), France |
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Highly sensitive resistive SThM probes for nanoscale thermometryEurotherm 114: Nanoscale and Microscale Heat Transfer VII, May 2022, Palermo, Italy |
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Radiative Properties of Surface Doped Black SiliconNanoscale and Microscale Heat Transfer VII, Eurotherm seminar No 114, May 2022, Palerme, Italy |
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Measurement and simulation of the three-dimensional temperature field in an RF SOI chip2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2021, Berlin, Germany. pp.1-5, ⟨10.1109/THERMINIC52472.2021.9626402⟩ |
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Thermal and Thermomechanical Investigation of Polymeric Thin Films on Substrate2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2020, Berlin, France. pp.226-231, ⟨10.1109/THERMINIC49743.2020.9420489⟩ |
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Nanothermometry by Means of Scanning Thermal Microscopy: Investigation of Electro-thermal Devices with Embedded Metallic LinesTHERMINIC 26 (Thermal Investigation of ICs and Systems), Sep 2019, Lecco, Italy |