Aida Todri-Sanial
Présentation
Publications
Publications
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Microelectronics Department Half-Day Seminar2019 |
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Carbon nanotubes for InterconnectsAida Todri-Sanial, Jean Dijon, Antonio Maffuci. Springer International Publishing, 2017, 978-3-319-29744-6 (Print) 978-3-319-29746-0 (Online). ⟨10.1007/978-3-319-29746-0⟩ |
Physical Design for 3D Integrated Circuits, 397 p., 2015, Series: Devices, Circuits, and Systems, CRC Press, 9781498710367 |
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Proceedings of IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2015), 2015, 978-1-4799-8718-4 |
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Signal Integrity for SoC Design and VerificationCalifornia State University, Long Beach, 2003 |
Exploring Carbon Nanotubes for 3D Power Delivery NetworksAida Todri-Sanial; Jean Dijon; Antonio Maffuci. Carbon Nanotubes for Interconnects, CRC Press, pp.283-314, 2017, 978-3-319-29746-0. ⟨10.1007/978-3-319-29746-0_10⟩ |
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Electromigration Alleviation Techniques for 3D Integrated CircuitsChao Wang. High Performance Computing for Big Data: Methodologies and Applications, CRC Press, pp.37-58, 2017, 9781498783996 |
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Exploration of Carbon Nanotubes For Efficient Power DeliverySaraju P. Mohanty; Ashok Srivastava. Nano-CMOS and Post-CMOS Electronics: Devices and Modelling, IET, pp.265-286, 2016, Chapter 9, 9781849199971 (print) 9781849199988 (online). ⟨10.1049/PBCS029E_ch9⟩ |
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Lumped Electro-Thermal Modeling and Analysis of Carbon Nanotube InterconnectsSaraju P. Mohanty; Ashok Srivastava. Nano-CMOS and Post-CMOS Electronics: Circuits and Design, IET, pp.201-218, 2016, Chapter 7, 978-1-84919-999-5. ⟨10.1049/PBCS030E_ch7⟩ |
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Design Methodology for 3D Power Delivery NetworksA. Todri-Sanial; Ch. Seng Tan. Physical Design for 3D Integrated Circuits, CRC Press, pp.30, 2015, Chapter 8, 9781498710367 |
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Overview of Physical Design Issues for 3D-Integrated CircuitsAida Todri-Sanial; Chuan Seng Tan. Physical Design for 3D Integrated Circuits, CRC Press, pp.31-37, 2015, Chapter 2. PHYSICAL DESIGN METHODS FOR 3D INTEGRATION, 9781498710367 |
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Two-Dimensional Oscillatory Neural Networks for Energy Efficient Neuromorphic Computing2020 |
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Design Space Exploration Of Emerging Technologies For Energy EfficiencyDigital Libraries [cs.DL]. University of Montpellier, 2014 |
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Oscillatory Neural Networks Implemented on FPGA for Edge Computing ApplicationsDATE 2023 - 26th Design, Automation and Test in Europe Conference and Exhibition, Apr 2023, Antwerp, Belgium |
Multi-Scale Simulations of Supported Pt Nanoclusters on Single-Layer MoS2 for Chemiresistive Wearable Biosensors2023 MRS Spring Meeting & Exhibit, Apr 2023, San Francisco, United States |
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Oscillatory Neural Networks Applications for Edge ComputingHiPEAC 2023 - European Conference on High-performance Embedded Architecture and Compilation, Jan 2023, Toulouse, France |
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Two-Layered Oscillatory Neural Networks with Analog Feedforward Majority Gate for Image Edge Detection ApplicationISCAS 2023 - IEEE International Symposium on Circuits and Systems, May 2023, Monterey, CA, United States. pp.1-5, ⟨10.1109/ISCAS46773.2023.10181366⟩ |
Beyond CMOS Sensory Neuron Devices Based on Vanadium Dioxide for In-Sensory Computing2023 MRS Spring Meeting & Exhibit, Apr 2023, San Francisco (CA), United States |
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SIFT-ONN: SIFT Feature Detection Algorithm Employing ONNs for Edge DetectionNICE 2023 - Neuro-Inspired Computational Elements Workshop, Apr 2023, San Antonio, TX, United States. ⟨10.1145/3584954.3584999⟩ |
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ONN-Based On-chip Learning for Obstacle Avoidance on Mobile RobotSSI 2023 - Smart System Integration Conference, Mar 2023, Bruges, Belgium |
Modelling Defective MoS2 and Au Interfaces in 2D Memristors by Combining DFT with Green’s Function Surface CalculationsMRS 2022 Fall Meeting, Nov 2022, Boston, United States |
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Effect of Physical Properties on Collective Behavior of Coupled Vanadium Dioxide Oscillators for Neuromorphic Computing ApplicationsE-MRS 2022 - Spring Meeting of the European Materials Research Society, May 2022, Virtual Conference, France |
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On-Chip Learning with a 15-neuron Digital Oscillatory Neural Network Implemented on ZYNQ ProcessorICONS 2022 - International Conference on Neuromorphic Systems, Jul 2022, Knoxville, Tennessee (hybrid), United States. ⟨10.1145/3546790.3546822⟩ |
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Ab Initio Simulations of Defective Metal Contacts in Beyond-CMOS Devices Based on Single-layer MoS2: Impact of Small and Extended DefectsGraphene 2022 - 12th European Conference in Graphene and 2D Materials, Jul 2022, Aachen, Germany |
Exploring Supported Metal Nanoclusters on MoS2 for the Chemical Detection of Biomolecules in Health Monitoring Wearable DevicesMRS 2022 Spring Meeting & Exhibit, May 2022, Online Event, United States |
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How Parallel Circuit Execution Can Be Useful for NISQ Computing?DATE 2022 - 25th Design, Automation and Test in Europe Conference and Exhibition, Mar 2022, Antwerp, Belgium. pp.1065-1070, ⟨10.23919/DATE54114.2022.9774512⟩ |
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Multi-programming Cross Platform Benchmarking for Quantum Computing HardwareQRE 2022 - 4th International Workshop on Quantum Resource Estimation, Jun 2022, New York, United States. ⟨10.48550/arXiv.2206.03144⟩ |
Oscillatory Neural Network for Edge Computing: A Mobile Robot Obstacle Avoidance ApplicationMetroXRAINE 2022 - IEEE International Conference on Metrology for Extended Reality, Artificial Intelligence, and Neural Engineering, Oct 2022, Rome, Italy. pp.181-186, ⟨10.1109/MetroXRAINE54828.2022.9967581⟩ |
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Simulations of Volatile Memristors Based on Vanadium Dioxide: Linking Material Properties to the Dynamics of Neuromorphic CircuitsMRS 2022 Fall Meeting, Nov 2022, Boston, United States |
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Oscillatory Neural Network as Hetero-Associative Memory for Image Edge DetectionNICE 2022 - 9th Neuro-Inspired Computational Elements Workshop, Mar 2022, New York (Virtual), United States. pp.13-21, ⟨10.1145/3517343.3517348⟩ |
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Oscillatory Neural Networks for Obstacle Avoidance on Mobile Surveillance Robot E4IJCNN 2022 - IEEE International Joint Conference on Neural Networks, Jul 2022, Padova, Italy. pp.1-8, ⟨10.1109/IJCNN55064.2022.9891923⟩ |
First-Principles Simulations of Vacancies and Grain Boundaries in Monolayer MoS2-Au Interfaces for Unconventional Computing ParadigmE-MRS 2022 - Spring Meeting of the European Materials Research Society, May 2022, Online Event, France |
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Simulation Toolchain for Neuromorphic Oscillatory Neural Networks Based on Beyond-CMOS Vanadium Dioxide DevicesFLEPS 2022 - IEEE International Conference on Flexible and Printable Sensors and Systems, Jul 2022, Wien, Austria. pp.1-4, ⟨10.1109/FLEPS53764.2022.9781525⟩ |
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Electrothermal Simulations of Synchronization Dynamics of Coupled Beyond-CMOS Vanadium Dioxide Oscillators for Neuromorphic Computing ApplicationsMRS 2022 Spring Meeting & Exhibit, Materials Research Society, May 2022, Honolulu, United States |
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VO2-based Oscillatory Ising Machine: The Role of External Temperature on PerformanceNANO 2022 - 22nd IEEE International Conference on Nanotechnology, Jul 2022, Palma de Mallorca, Spain. In press ? |
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First Principles Simulations of MoS2 Towards the Non-Enzymatic Sensing of CortisolGraphene 2021 - 11th European Conference in Graphene and 2D Materials, Oct 2021, Grenoble, France |
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Oscillatory Neural Networks for Edge AI ComputingISVLSI 2021 - IEEE Computer Society Annual Symposium on VLSI, Jul 2021, Tampa, United States. pp.326-331, ⟨10.1109/ISVLSI51109.2021.00066⟩ |
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MoS2 as the Sensing Platform for the Non-Enzymatic Detection of Cortisol: A First-Principles StudyImagineNano2021, Nov 2021, Bilbao, Spain |
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Multi-Scale Modeling and Simulation Flow for Oscillatory Neural Networks for Edge ComputingNEWCAS 2021 - 19th IEEE International New Circuits and Systems Conference, Jun 2021, Toulon, France. ⟨10.1109/NEWCAS50681.2021.9462761⟩ |
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First-principles DFT simulations of MoS2 for the non-enzymatic detection of cortisolE-MRS 2021 - Fall Meeting of the European Materials Research Society, Sep 2021, Online, Poland |
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Investigating MoS2 as the Sensing Substrate for the Non-Enzymatic Detection of Cortisol via Quantum Mechanical DFT SimulationsJMJC 2021 - 9e Journées Méditerranéennes des Jeunes Chercheurs, Oct 2021, Montpellier, France |
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Energy Efficient Neuromorphic Computing with beyond-CMOS Oscillatory Neural NetworksICONS 2021 - International Conference on Neuromorphic Systems, Jul 2021, Oak Ridge (Virtual), United States |
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A Hardware-aware Heuristic for the Qubit Mapping Problem in the NISQ EraYQIS 2021 - 6th International Conference for Young Quantum Information Scientists, Apr 2021, Online, United States |
Beyond-CMOS vanadium dioxide devices and oscillators for brain-like information processingE-MRS 2021 - Fall Meeting of the European Materials Research Society, Materials Research Society, Dec 2021, Boston, MA, United States |
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Beyond CMOS technologies for enabling integrating Artificial Intelligence at the EdgeEPoSS Annual Forum 2021, Oct 2021, Freiburg im Breisgau, Germany |
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Frequency Injection Locking-Controlled Oscillations for Synchronized Operations in VO2 Crossbar DevicesDRC 2021 - 79th Device Research Conference, Jun 2021, Santa Barbara (Virtual), United States. pp.1-2, ⟨10.1109/DRC52342.2021.9467129⟩ |
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Energy Consumption and Electronic Devices: Why we need to re-think chip design for AI?Venue Parcours Recherche Ingénieur (PRI), 2021, Montpellier, France |
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Exploring multi-programming for quantum algorithmsQuantum Computing (QC), 2021, online, France |
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Quantum Mechanical Simulations of 2D Materials for Unconventional Computing and Biosensing ApplicationsMC 2021 - 15th International Conference on Materials Chemistry, Jul 2021, Online Event, Ireland |
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Energy Efficient Neuromorphic Computing with Oscillatory Neural NetworksE-MRS 2021 - Fall Meeting of the European Materials Research Society, Dec 2021, Boston, MA, United States |
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Analyzing crosstalk error in the NISQ eraISVLSI 2021 - IEEE Computer Society Annual Symposium on VLSI, Jul 2021, Tampa, FL (virtual), United States. pp.428-430, ⟨10.1109/ISVLSI51109.2021.00084⟩ |
Beyond CMOS Devices for Low-Power Oscillatory Neural Networks for Edge AI ComputingAlbany Nanotechnology Symposium, 2021, New York, United States |
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2D Nanomaterials for Advancing Neuromorphic Computing2DMAT 2021 - Global Summit and Expo on Graphene and 2D Materials, Aug 2021, Paris, France. pp.106 |
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Exploring 1D and 2D Nanomaterials for Health Monitoring Wearable DevicesFLEPS 2021 - IEEE International Conference on Flexible and Printable Sensors and Systems, Jun 2021, Virtual, United Kingdom. pp.1-4, ⟨10.1109/FLEPS51544.2021.9469864⟩ |
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Dedicated Wearable Sensitive Strain Sensor, based on Carbon Nanotubes, for Monitoring the Rat Respiration RateECSA 2021 - 8th International Electronic Conference on Sensors and Applications, Nov 2021, Online, France. pp.27-34, ⟨10.3390/ecsa-8-11293⟩ |
VO2 oscillators on Si platform for neuromorphic computing applicationsE-MRS 2021 - Fall Meeting of the European Materials Research Society, Sep 2021, Warsaw, Poland |
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Stretchable Strain Sensors for Human Movement MonitoringDTIP 2020 - 22nd Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS, Jun 2020, (Virtual ), France. ⟨10.1109/DTIP51112.2020.9139154⟩ |
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Quantum Challenges: Hardware and Software PerspectivesFRANCE IS AI, 2020, Online, France |
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Quantum Initiative at the University of MontpellierFrench Tech London Quantum Webinar, Jun 2020, London, United Kingdom |
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NeurONN: Neuromorphic Computing for Artificial Intelligence at the Edge3rd AI Compute Symposium (IBM IEEE CAS/EDS), Oct 2020, Zurich (virtual), Switzerland |
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NeurONN: Neuromorphic Computing with Oscillatory Neural NetworksPhase-Change Switch Workshop, 2020, Virtual, France |
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Using Oscillatory Neural Network for Pattern Recognition and Mobile Robot ControlSOPHI.A SUMMIT, Nov 2020, Sophia Antipolis, France |
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Neuromorphic Computing based on Oscillatory Neural NetworksSOPHI.A SUMMIT, Nov 2020, Sophia Antipolis, France |
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Progress and Challenges on Quantum Computer-Aided DesignIBM Quantum Summit, Sep 2020, Virtual, France |
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EU H2020 NEURONN: Two-Dimensional Oscillatory Neural Networks for Energy Efficient Neuromorphic ComputingEFECS 2020 - European Forum for Electronic Components and Systems, Nov 2020, Brussels, Belgium |
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A Look Into Physical Modeling and Design for Carbon Nanotube based CircuitsCASS 2020 - 10th IEEE CASS Rio Grande do Sul Workshop, Nov 2020, Virtual, Brazil |
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Quantum Computing: Pushing the limits of computingIBM Think Digital Summit France, Oct 2020, Virtual, France |
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Design and Technology-level Optimization Challenges for Carbon Nanotube CircuitsEDA 2020 - International Workshop on Advanced Electronic Design Automation, Jan 2020, Xidian, China |
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An Emerging Trend in Post Moore Era: Monolithic 3D IC TechnologyASP-DAC 2020 - 25th Asia and South Pacific Design Automation Conference, Jan 2020, Beijing, China |
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Toward New Era of Computing: From Devices to ApplicationsWhat’s next in Computing ?, Jul 2020, Montpellier (virtual), France |
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Importance of Interconnects: A Technology-System-Level Design PerspectiveIEDM 2019 - 65th IEEE International Electron Device Meeting, Dec 2019, San Francisco, United States. pp.23.1.1-23.1.4, ⟨10.1109/IEDM19573.2019.8993558⟩ |
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Physical design and optimisation methods for TSV-based 3D and monolithic 3D integrationESSDERC-ESSCIRC 2019 - 15th Workshop on Heterogeneous Integration of Nanomaterials and Innovative Devices, Sep 2019, Krakow, Poland. pp.217-220 |
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Reliable Power Delivery and Analysis of Power-Supply Noise During Testing in Monolithic 3D ICsVTS 2019 - 37th IEEE VLSI Test Symposium, Apr 2019, Monterey, CA, United States. ⟨10.1109/VTS.2019.8758650⟩ |
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SmartVista: Smart Autonomous Multi Modal Sensors for Vital Signs MonitoringSmart System Integration - 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, Apr 2019, Barcelona, Spain |
Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation25th IEEE International Conference on Electronics Circuits and Systems (ICECS 2018), Dec 2018, Bordeaux, France. pp.217-220, ⟨10.1109/ICECS.2018.8617951⟩ |
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Heterogeneous Integration Roadmap (HIR): Co-Design Challenges and Perspectives
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A physics-based investigation of Pt-salt doped carbon nanotubes for local interconnectsIEDM: International Electron Devices Meeting, Dec 2017, San Francisco, United States. ⟨10.1109/IEDM.2017.8268502⟩ |
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Progress on carbon nanotube BEOL interconnectsDATE 2018 - 21st Design, Automation and Test in Europe Conference and Exhibition, Mar 2018, Dresden, Germany. pp.937-942, ⟨10.23919/DATE.2018.8342144⟩ |
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Challenges and Progress on Carbon Nanotube Integration for BEOL InterconnectsIITC: International Interconnect Technology Conference, Jun 2018, Santa Clara, United States. pp.16-18, ⟨10.1109/IITC.2018.8430411⟩ |
Chameleon: A Thermally Adaptive Error Correction Code Design for STT-MRAM LLCsDesign Automation Conference (DAC 2018), Jun 2018, San Fransisco, United States |
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A Robust Dual Reference Computing-in-Memory Implementation and Design Space Exploration Within STT-MRAMISVLSI 2018 - International Symposium on Very Large Scale Integration, Jul 2018, Hong Kong, China. pp.275-280, ⟨10.1109/ISVLSI.2018.00058⟩ |
Synchronised 4-Phase Resonant Power Clock Supply for Energy Efficient Adiabatic LogicICRC: International Conference on Rebooting Computing, Nov 2017, Washington, DC, United States. ⟨10.1109/ICRC.2017.8123661⟩ |
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Toward Carbon Nanotube ComputingEmerging Technology, May 2017, Varsovie, Poland |
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Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technologySISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.153-156, ⟨10.23919/SISPAD.2017.8085287⟩ |
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Electrical performance of carbon-based power distribution networks with thermal effectsSPI: Signal and Power Integrity, May 2017, Baveno, Italy. ⟨10.1109/SaPIW.2017.7944044⟩ |
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Power and Performance Analysis of Doped SW/DW CNT for On-Chip Interconnect ApplicationGRAPHENE, Mar 2017, Barcelone, Spain |
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A hierarchical model for CNT and Cu-CNT composite interconnects: from density functional theory to circuit-level simulationsIWCN: International Workshop on Computational Nanotechnology, Jun 2017, Windermere, United Kingdom |
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The impact of vacancy defects on CNT interconnects: From statistical atomistic study to circuit simulationsSISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.157-160, ⟨10.23919/SISPAD.2017.8085288⟩ |
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Atomistic to circuit level modeling of defective doped SWCNTs with contacts for on-chip interconnect applicationNMDC: Nanotechnology Materials and Devices Conference, Oct 2017, Singapore, Singapore. pp.66-67, ⟨10.1109/NMDC.2017.8350506⟩ |
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Quantitative evaluation of reliability and performance for STT-MRAMISCAS: International Symposium on Circuits and Systems, May 2016, Montréal, QC, Canada. pp.1150-1153, ⟨10.1109/ISCAS.2016.7527449⟩ |
Reliability and performance evaluation for STT-MRAM under temperature variationEuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2016, Montpellier, France. ⟨10.1109/EuroSimE.2016.7463380⟩ |
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Carbon-based Power Delivery Networks for nanoscale ICs: electrothermal performance analysisIEEE-NANO: Nanotechnology, Jul 2015, Rome, Italy. pp.416-419, ⟨10.1109/NANO.2015.7388625⟩ |
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Investigation of electrical and thermal properties of carbon nanotube interconnectsPATMOS: Power and Timing Modeling, Optimization and Simulation, Sep 2016, Brême, Zimbabwe. pp.25-32, ⟨10.1109/PATMOS.2016.7833421⟩ |
Modeling and Simulation of Carbon Nanotube InterconnectsSISPAD: Simulation of Semiconductor Processes and Devices, Sep 2016, Nuremberg, Germany |
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A clustering technique for fast electrothermal analysis of on-chip power distribution networksSPI: Signal and Power Integrity, May 2016, Turin, Italy. ⟨10.1109/SaPIW.2016.7496292⟩ |
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Investigation of the power-clock network impact on adiabatic logicSPI: Signal and Power Integrity, May 2016, Turin, Italy. ⟨10.1109/SaPIW.2016.7496270⟩ |
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Present and future prospects of carbon nanotube interconnects for energy efficient integrated circuitsEuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2016, Montpellier, France. ⟨10.1109/EuroSimE.2016.7463379⟩ |
Electrothermal Modeling and Analysis of Carbon Nanotube InterconnectsPATMOS: Power And Timing Modeling, Optimization and Simulation, Sep 2016, Brême, Germany |
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Physical description and analysis of doped carbon nanotube interconnectsPATMOS: Power And Timing Modeling, Optimization and Simulation, Sep 2016, Brême, Germany. pp.250-255, ⟨10.1109/PATMOS.2016.7833695⟩ |
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An architecture-level cache simulation framework supporting advanced PMA STT-MRAMNANOARCH: Nanoscale Architectures, Jun 2015, Boston, MA, United States. pp.7-12, ⟨10.1109/NANOARCH.2015.7180576⟩ |
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A body-biasing of readout circuit for STT-RAM with improved thermal reliabilityISCAS: International Symposium on Circuits and Systems, May 2015, Lisbon, Portugal. pp.1530-1533, ⟨10.1109/ISCAS.2015.7168937⟩ |
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On Analysis of On-chip DC-DC Converters for Power Delivery NetworksISVLSI: International Symposium on Very Large Scale Integration, Jul 2015, Montpellier, France. pp.557-560, ⟨10.1109/ISVLSI.2015.96⟩ |
Statistical Energy Study for 28nm FDSOI DevicesEuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2015, Budapest, Hungary. ⟨10.1109/EuroSimE.2015.7103149⟩ |
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On the Performance Exploration of 3D NoCs with Resistive-Open TSVsISVLSI 2015 - International Symposium on Very Large Scale Integration, Jul 2015, Montpellier, France. pp.579-584, ⟨10.1109/ISVLSI.2015.49⟩ |
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A node clustering reduction scheme for power grids electrothermal analysisSPI: Signal and Power Integrity, May 2015, Berlin, Germany. ⟨10.1109/SaPIW.2015.7237399⟩ |
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Carbon nanotube interconnects for energy-efficient integrated circuitsTNT: Trends in Nanotechnology, Sep 2015, Toulouse, France |
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A Delay Probability Metric for Input Pattern Ranking Under Process Variation and Supply NoiseISVLSI: International Symposium on Very Large Scale Integration, Jul 2014, Tampa, FL, United States. pp.226-231, ⟨10.1109/ISVLSI.2014.42⟩ |
Test and diagnosis of power switchesDDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. pp.213-218, ⟨10.1109/DDECS.2014.6868792⟩ |
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Electro-thermal characterization of Through-Silicon ViasEuroSimE, Apr 2014, Ghent, Belgium. ⟨10.1109/EuroSimE.2014.6813859⟩ |
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TSV aware timing analysis and diagnosis in paths with multiple TSVsVTS: VLSI Test Symposium, Apr 2014, Napa, CA, United States. ⟨10.1109/VTS.2014.6818772⟩ |
Performance exploration of partially connected 3D NoCs under manufacturing variabilityNEWCAS 2014 - 12th IEEE International New Circuits and Systems Conference, Jun 2014, Trois-Rivieres, QC, Canada. pp.61-64, ⟨10.1109/NEWCAS.2014.6933985⟩ |
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A Comprehensive Evaluation of Functional Programs for Power-Aware TestNATW: North Atlantic Test Workshop, May 2014, Johnson City, NY, United States. pp.69-72, ⟨10.1109/NATW.2014.23⟩ |
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Timing-aware ATPG for critical paths with multiple TSVsDDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. pp.116-121, ⟨10.1109/DDECS.2014.6868774⟩ |
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An intra-cell defect grading toolDDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. pp.298-301, ⟨10.1109/DDECS.2014.6868814⟩ |
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Exploring potentials of perpendicular magnetic anisotropy STT-MRAM for cache designICSICT: International Conference on Solid-State and Integrated Circuit Technology, Oct 2014, Guilin, China. ⟨10.1109/ICSICT.2014.7021342⟩ |
Path delay test in the presence of multi-aggressor crosstalk, power supply noise and ground bounceDDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. pp.207-212, ⟨10.1109/DDECS.2014.6868791⟩ |
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Power supply noise-aware workload assignments for homogeneous 3D MPSoCs with thermal considerationASP-DAC: Asia and South Pacific Design Automation Conference, Jan 2014, Singapore, Singapore. pp.544-549, ⟨10.1109/ASPDAC.2014.6742948⟩ |
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Investigation of horizontally aligned carbon nanotubes for efficient power delivery in 3D ICsSPI: Signal and Power Integrity, May 2014, Ghent, Belgium. ⟨10.1109/SaPIW.2014.6844535⟩ |
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iBoX — Jitter based Power Supply Noise sensorETS: European Test Symposium, May 2014, Paderborn, United States. ⟨10.1109/ETS.2014.6847830⟩ |
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Real-Time Testing of 90nm COTS SRAMs at Concordia Station in AntarcticaNSREC: Nuclear and Space Radiation Effects Conference, Jul 2014, Paris, France |
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Efficient Dynamic Test Methods for COTS SRAMs Under Heavy Ion IrradiationNSREC: Nuclear and Space Radiation Effects Conference, Jul 2014, Paris, France |
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Protecting combinational logic in pipelined microprocessor cores against transient and permanent faultsDDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2014, Warsaw, Poland. pp.223-225, ⟨10.1109/DDECS.2014.6868794⟩ |
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Computing Detection Probability of Delay Defects in Signal Line TSVsETS: European Test Symposium, May 2013, Avignon, France. ⟨10.1109/ETS.2013.6569349⟩ |
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A Built-in Scheme for Testing and Repairing Voltage Regulators of Low-Power SRAMsVTS: VLSI Test Symposium, Apr 2013, Berkeley, CA, United States. pp.1-6, ⟨10.1109/VTS.2013.6548894⟩ |
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On the Reuse of Read and Write Assist Circuits to Improve Test Efficiency in Low-Power SRAMsITC: International Test conference, Sep 2013, Anaheim, CA, United States. pp.1-10, ⟨10.1109/TEST.2013.6651927⟩ |
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SRAM Soft Error Rate Evaluation Under Atmospheric Neutron Radiation and PVT variationsIOLTS: International On-Line Testing Symposium, Jul 2013, Chania, Crete, Greece. pp.145-150, ⟨10.1109/IOLTS.2013.6604066⟩ |
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Adaptive Source Bias for Improved Resistive-Open Defect Coverage during SRAM TestingATS: Asian Test Symposium, Nov 2013, Jiaosi Township, Taiwan. pp.109-114, ⟨10.1109/ATS.2013.30⟩ |
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Test Solution for Data Retention Faults in Low-Power SRAMsDATE 2013 - 16th Design, Automation and Test in Europe Conference, Mar 2013, Grenoble, France. pp.442-447, ⟨10.7873/DATE.2013.099⟩ |
A novel method to mitigate TSV electromigration for 3D ICsISVLSI: IEEE Computer Society Annual Symposium on VLSI, Aug 2013, Natal, Brazil. pp.121-126, ⟨10.1109/ISVLSI.2013.6654633⟩ |
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On the correlation between Static Noise Margin and Soft Error Rate evaluated for a 40nm SRAM cellDFT: Defect and Fault Tolerance in VLSI and Nanotechnology Systems, Oct 2013, New York, United States. pp.143-148, ⟨10.1109/DFT.2013.6653597⟩ |
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Analyzing resistive-open defects in SRAM core-cell under the effect of process variabilityETS: European Test Symposium, May 2013, Avignon, France. ⟨10.1109/ETS.2013.6569373⟩ |
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Performance Characterization of TAS-MRAM Architectures in Presence of Capacitive DefectsVALID: Advances in System Testing and Validation Lifecycle, Oct 2013, Venice, Italy. pp.39-44 |
Characterization of an SRAM Based Particle Detector For Mixed-Field Radiation EnvironmentsIWASI: International Workshop on Advances in Sensors and Interfaces, Jun 2013, Bari, Italy. pp.75-80, ⟨10.1109/IWASI.2013.6576070⟩ |
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Effect-Cause Intra-Cell Diagnosis at Transistor LevelISQED 2013 - 14th International Symposium on Quality Electronic Design, Mar 2013, Santa Clara, CA, United States. pp.460-467, ⟨10.1109/ISQED.2013.6523652⟩ |
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Frequency domain power and thermal integrity analysis of 3D power delivery networksSPI: Signal and Power Integrity, May 2013, Paris, France. ⟨10.1109/SaPIW.2013.6558328⟩ |
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Temperature Impact on the Neutron SER of a Commercial 90nm SRAMNSREC: Nuclear and Space Radiation Effects Conference, Jul 2013, San Francisco, Ca, United States. pp.1-4 |
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Fast and Accurate Electro-Thermal Analysis of Three-Dimensional Power Delivery NetworksEuroSimE: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wroclaw, Poland. pp.1-4, ⟨10.1109/EuroSimE.2013.6529956⟩ |
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Multiple-Cell-Upsets on a commercial 90nm SRAM in Dynamic ModeRADECS: Radiation and Its Effects on Components and Systems, Sep 2013, Oxford, United Kingdom. pp.1-4, ⟨10.1109/RADECS.2013.6937429⟩ |
Mitigate TSV Electromigration for 3D ICs - From the Architecture PerspectiveInternational Symposium on VLSI, Natale, Brazil. pp.6 |
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Evaluating An SEU Monitor For Mixed-Field Radiation EnvironmentsiWoRID: International Workshop on Radiation Imaging Detectors, SOLEIL Synchrotron, Jun 2013, Paris, France |
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Analyzing the effect of concurrent variability in the core cells and sense amplifiers on SRAM read access failuresDTIS: Design and Technology of Integrated Systems in Nanoscale Era, Mar 2013, Abu Dhabi, United Arab Emirates. pp.39-44, ⟨10.1109/DTIS.2013.6527775⟩ |
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SEU Monitoring in Mixed-Field Radiation Environments of Particle AcceleratorsRADECS: Radiation and Its Effects on Components and Systems, Sep 2013, Oxford, United Kingdom. pp.1-4, ⟨10.1109/RADECS.2013.6937419⟩ |
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Improving Defect Localization Accuracy by means of Effect-Cause Intra-Cell Diagnosis at Transistor LevelSDD: Silicon Debug and Diagnosis, Sep 2013, Anaheim, CA, United States |
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Worst-Case Power Supply Noise and Temperature Distribution Analysis for 3D PDNs with Multiple Clock DomainsNEWCAS: New Circuits and Systems, Jun 2013, Paris, France. ⟨10.1109/NEWCAS.2013.6573628⟩ |
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Why and How Controlling Power Consumption During Test: A SurveyATS: Asian Test Symposium, Nov 2012, Niigata, Japan. pp. 221-226, ⟨10.1109/ATS.2012.30⟩ |
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Impacts of Resistive-Open Defects in the Word-Line Selection of TAS-MRAMsColloque GDR SoC-SiP, 2012, Paris, France |
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Through-Silicon-Via Resistive-Open Defect AnalysisETS: European Test Symposium, May 2012, Annecy, France. ⟨10.1109/ETS.2012.6233037⟩ |
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Complete Framework for the Estimation of the SRAM Core-Cell Resilience to RadiationRADECS: Radiation and its Effects on Components and Systems, Sep 2012, Biarritz, France |
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Power Supply Noise Sensor Based on Timing Uncertainty MeasurementsATS: Asian Test Symposium, Nov 2012, Niigata, Japan. pp.161-166, ⟨10.1109/ATS.2012.46⟩ |
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Low-power SRAMs Power Mode Control Logic: Failure Analysis and Test SolutionsITC'2012: International Test Conference, Nov 2012, Anaheim, CA, United States. pp.1-10, ⟨10.1109/TEST.2012.6401578⟩ |
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SRAM testing under Neutron Radiation for the evaluation of different algorithms stress15ème Journées Nationales du Réseau Doctoral en Microélectronique, Jun 2012, Marseille, France |
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Electro-Thermal Analysis of 3D Power Delivery NetworksDAC: Design Automation Conference, 2012, San Francisco, United States |
Impact of Resistive-Open Defects on the Heat Current of TAS-MRAM ArchitecturesDATE 2012 - 15th Design, Automation and Test in Europe Conference and Exhibition, Mar 2012, Dresden, Germany. pp.532-537, ⟨10.1109/DATE.2012.6176526⟩ |
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Fault Localization Improvement through an Intra-Cell Diagnosis ApproachISTFA 2012 - 38th International Symposium for Testing and Failure Analysis, Nov 2012, Phoenix, AZ, United States. pp.509-519 |
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Radiation Induced Effects on Electronic Systems and ICsSETS: South European Test Seminar, Mar 2012, Sauze d'Oulx, Italy |
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Dynamic Mode Test of a Commercial 4Mb Toggle MRAM under Neutron RadiationRADECS: European Conference on Radiation and Its Effects on Components and Systems, Sep 2012, Biarritz, France. pp.1-4 |
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Defect Localization Through an Effect-Cause based Intra-Cell DiagnosisColloque GDR SoC-SiP, 2012, Paris, France |
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Resistive-Open Defects Affecting Bit-Line Selection in TAS-MRAM ArchitecturesJNRDM: Journées Nationales du Réseau Doctoral en Microélectronique, 2012, Paris, France |
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A Novel Framework for Evaluating the SRAM Core-Cell Sensitivity to NeutronsRADECS: European Conference on Radiation and Its Effects on Components and Systems, Sep 2012, Biarritz, France. pp.1-4 |
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Dynamic Mode Testing of SRAMS under Neutron RadiationSixième colloque du GDR SOC-SIP du CNRS, Jun 2012, Paris, France |
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Defect Analysis in Power Mode Control Logic of Low-Power SRAMsETS: European Test Symposium, May 2012, Annecy, France. ⟨10.1109/ETS.2012.6233033⟩ |
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Resistive-Open Defect Analysis for Through-Silicon-ViasDCIS 2012 - 27th Conference on Design of Circuits and Integrated Systems, Nov 2012, Avignon, France |
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Impact of Resistive-Bridge Defects in TAS-MRAM ArchitecturesATS: Asian Test Symposium, Nov 2012, Niigata, Japan. pp.125-130, ⟨10.1109/ATS.2012.37⟩ |
A Pseudo-Dynamic Comparator for Error Detection in Fault Tolerant ArchitecturesVTS: VLSI Test Symposium, Apr 2012, Hawaii, United States. pp.50-55, ⟨10.1109/VTS.2012.6231079⟩ |
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Evaluation of Test Algorithms Stress Effect on SRAMs under Neutron RadiationIOLTS: International On-Line Testing Symposium, Jun 2012, Sitges, Spain. pp.212-222, ⟨10.1109/IOLTS.2012.6313853⟩ |
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Adaptive Voltage Scaling via Effective On-Chip Timing Uncertainty MeasurementsColloque GDR SoC-SiP, 2012, Paris, France |
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Analysis of Resistive-Open Defects in TAS-MRAM ArrayITC: International Test Conference, Sep 2011, Anaheim, CA, United States |
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Simultaneous Power and Thermal Integrity Analysis for 3D Integrated SystemsLPonTR'11: IEEE International Workshop on the Impact of Low Power on Test and Reliability, Trondheim, Norway |
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Failure Analysis and Test Solutions for Low-Power SRAMsATS: Asian Test Symposium, Nov 2011, New Delhi, India. pp.459-460, ⟨10.1109/ATS.2011.97⟩ |
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A Study of Path Delay Variations in the Presence of Uncorrelated Power and Ground Supply NoiseDDECS: Design and Diagnostics of Electronic Circuits and Systems, Apr 2011, Cottbus, Germany. pp.189-194, ⟨10.1109/DDECS.2011.5783078⟩ |
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Power-Aware Test Pattern Generation for At-Speed LOS TestingATS: Asian Test Symposium, Nov 2011, New Delhi, India. pp.506-510 |
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Power Supply Noise and Ground Bounce Aware Pattern Generation for Delay TestingNEWCAS: International New Circuits and Systems Conference, Jun 2011, Bordeaux, France. pp.73-76, ⟨10.1109/NEWCAS.2011.5981222⟩ |
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The Fast Track real time processor and its impact on muon isolation, tau and b-jet online selections at ATLASReal Time Conference (RT), 2010 17th IEEE-NPSS, 2010, Unknown, Unknown Region. pp.1-8, ⟨10.1109/RTC.2010.5750337⟩ |
Performance studies of CMS Pixel Tracker using DC-DC conversion powering schemeIEEE Nuclear Science Symposuim & Medical Imaging Conference, 2010, Knoxville, TN, United States. ⟨10.1109/NSSMIC.2010.5873924⟩ |
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A study of decoupling capacitor effectiveness in power and ground grid networksISQED 2009 - 10th International Symposium on Quality Electronic Design, Mar 2009, San Jose, CA, United States. pp.653-658, ⟨10.1109/ISQED.2009.4810371⟩ |
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Power distribution studies for CMS forward trackerIEEE Nuclear Science Symposium Conference Record (NSS/MIC), 2009, Orlando, United States. ⟨10.1109/NSSMIC.2009.5402390⟩ |
Electromigration study of power-gated gridsISLPED: International Symposium on Low Power Electronics and Design, Aug 2009, San Francisco, United States. pp.315-318, ⟨10.1145/1594233.1594311⟩ |
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A study of reliability issues in clock distribution networksIEEE International Conference on Computer Design, 2008, Lake Tahoe, CA, United States. ⟨10.1109/ICCD.2008.4751847⟩ |
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Power supply noise aware workload assignment for multi-core systemsICCAD: International Conference on Computer-Aided Design, 2008, San Jose, CA, United States. ⟨10.1109/ICCAD.2008.4681594⟩ |
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Electromigration and voltage drop aware power grid optimization for power gated ICsISLPED: International Symposium on Low Power Electronics and Design, 2007, Portland, OR, United States. ⟨10.1145/1283780.1283866⟩ |
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Analysis and optimization of power-gated ICs with multiple power gating configurationsICCAD: International Conference on Computer-Aided Design, 2007, San Jose, CA, United States. ⟨10.1109/ICCAD.2007.4397361⟩ |
Digital Oscillatory Neural Networks for AI Edge Applications17e Colloque National du GDR SoC², Jun 2023, Lyon, France |
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Multi-Scale Investigation of Self-Assembly Induced by Capillary-Forces in Arrays of Carbon Nanotubes—From Density Functional Theory to Gecko’s Effect2023 MRS Spring Meeting & Exhibit, Apr 2023, San Francisco (CA), United States |
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TCAD Modeling of Response Characteristics of VO2-Based Sensory NeuronANS 2022 - Albany Nanotechnology Symposium, Nov 2022, Albany, NY, United States. |
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Solving the Travelling Salesman Problem in Continuous Phase Domain with Neuromorphic Oscillatory Neural NetworksAI, Neuroscience and Hardware: From Neural to Artificial Systems and Back Again, Sep 2022, Bonn, Germany. |
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Digital Oscillatory Neural Networks for AI Edge Applications16e Colloque National du GDR SoC², Jun 2022, Strasbourg, France. |
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Ab Initio Quantum Mechanical Simulations of Defective MoS2 and Au Interfaces in 2D nanodevicesMEMRISYS 2022 - 5th International Conference on Memristive Materials, Devices & Systems, Nov 2022, Cambridge, MA, United States. |
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Exploring Multi-programming Applications in the NISQ EraQuantum Information Processing, Mar 2022, Pasadena, United States |
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Exploring Multi-programming Applications in the NISQ EraBristol Quantum Information Technologies Workshop, Apr 2022, Bristol, United Kingdom |
TCAD Electrothermal Simulations of Beyond-CMOS VO2 temperature-sensing neuron devicesMEMRISYS 2022 - 5th International Conference on Memristive Materials, Devices & Systems, Nov 2022, Boston, MA, United States. 2022 |
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Assessment of 1D and 2D Materials for Health Monitoring Wearable Devices15e Colloque National du GDR SoC², Jun 2021, Rennes, France. , 2021 |
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EU H2020 NeurONN: Two-Dimensional Oscillatory Neural Networks for Energy Efficient Neuromorphic ComputingEuroNanoForum 2021, May 2021, Braga, Portugal |
A Hardware-aware Heuristic for the Qubit Mapping Problem in the NISQ EraEQTC 2021 - 2nd European Quantum Technologies Conference, Nov 2021, Virtual, Ireland. , 2021 |
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A Hardware-aware Heuristic for the Qubit Mapping Problem in the NISQ Era15ème Colloque National du GDR SoC², Jun 2021, Rennes, France. |
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FPGA Implementation of Oscillatory Neural Networks for Artificial Intelligence Edge ComputingACM Europe Summer school on HPC Computer Architectures for AI and Dedicated Applications, Aug 2021, Barcelona (Virtual), Spain |
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EU H2020 NEURONN: 2D Oscillatory Neural Networks For Energy Efficient Neuromorphic Computing15ème Colloque National du GDR SoC², Jun 2021, Rennes, France. , 2021 |
Mobile Robot Obstacle Avoidance with Oscillatory Neural Networks on FPGAIBM-IEEE AI Compute Symposium, Oct 2021, Virtual, France |
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MoS2 for Unconventional Computing and Biosensing Applications: A First Principles StudyJTMS 2021 - Journées "Théorie, Modélisation et Simulation", Dec 2021, Rennes, France. |
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Piezoelectric Sensors Based on 1D/2D Materials for Smart Health Monitoring IoT13e Colloque National du GDR SoC², Jun 2019, Montpellier, France. , 2019 |
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Ultimate Power Dissipation for Computing based on Energy-Reversible and Capacitive Electromechanical Devices13e Colloque National Du GDR SoC², Jun 2019, Montpellier, France. , 2019 |
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SmartVista: Smart Autonomous Multi Modal Sensors for Vital Signs MonitoringWorkshop on ‘Smart Bioelectronic and Wearable Systems’, Oct 2019, Brussels, Belgium. , 2019 |
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Progress on Pt-Salt Doped Carbon Nanotubes for Local Interconnects12e Colloque National du GDR SoC/SiP, Jun 2018, Paris, France. 2018 |
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4-Phase Resonant Power-Clock Supply for Adiabatic Logic11e Colloque National du GDR SoC/SiP, Jun 2017, Bordeaux, France. 2017 |
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Investigation of Reliability and Performance for STT-MRAM under PVT Variations10e Colloque National du GDR SoC/SiP, Jun 2016, Nantes, France. , 2016 |
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Impact of Power-Clock Network on Adiabatic LogicColloque du GDR SoC-SiP, Jun 2016, Nantes, France. , 10ème Colloque National du GDR SoC-SiP, 2016 |
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Small Delay Defect Investigation in Critical Path Delay with Multiple TSVsEMicro-NE, Oct 2015, Campina Grande, Brazil. , X Escola de Microeletrônica do Nordeste, 2015 |
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Carbon Nanotubes for Energy Efficient Integrated CircuitsCNRS Colloque Physique Theorique et ses Interfaces, Nov 2014, Paris, France. 2014 |
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On Carbon Nanotubes as VLSI InterconnectsCMOS Emerging Technology Research Symposium, Jul 2014, Grenoble, France. 2014 |
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Fault-Effect Propagation Based Intra-cell Scan Chain DiagnosisColloque GDR SoC-SiP, Jun 2013, Lyon, France. 2013 |
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Performance Evaluation of Capacitive defects on TAS-MRAMsColloque GDR SoC-SiP, 2013, Lyon, France. 2013 |
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Investigating Multiple-Cell-Upsets on a 90mn SRAMColloque GDR SoC-SiP, 2013, Lyon, France. 2013 |
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Coupling-Based Resistive-Open Defects in TAS-MRAM ArchitecturesETS: European Test Symposium, May 2012, Annecy, France. Test Symposium (ETS), 2012 17th IEEE European, 2012, ⟨10.1109/ETS.2012.6233034⟩ |
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Resistive Open Defect Analysis for Through-Silicon-ViasETS: European Test Symposium, May 2012, Annecy, France. 17th IEEE European Test Symposium, pp.183, 2012 |
Piezoresistive Sensor Device with Amplification ModuleFrance, Patent n° : EP18167680A. 2018 |
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Piezoelectric BiosensorFrance, Patent n° : EP18167670A. 2018 |
Modeling Insulator-to-Metal Transition for Simulation of Oscillators based on Vanadium Dioxide for Applications in Neuromorphic Computing2021 |
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Power of Electronics and People’s Will2020 |
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NeurONN: des neurones oscillants pour une nouvelle architecture informatiqueTechno-Science.net, 2020 |
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NeurONN: des neurones oscillants pour une nouvelle architecture informatiqueActualités de l’INS2I (Institut des sciences de l'information et de leurs interactions), 2020 |
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SmartVista Open Day Workshop2019 |