Céline COMBETTES

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Publications

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Innovative ceramic-matrix composite substrates with tunable electrical conductivity for high-power applications

Driss Kenfaui , Zarel Valdez-Nava , Lionel Laudebat , Marie-Laure Locatelli , Céline Combettes et al.
Science and Technology of Advanced Materials, 2022, 23 (1), pp.735 - 751. ⟨10.1080/14686996.2022.2137695⟩
Article dans une revue hal-03851417 v2
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Fast cut-off, low I 2 T and high temperature monolithic on-chip fuse on silicon substrate for new fail-safe embedded power switch

Amirouche Oumaziz , Emmanuel Sarraute , Frédéric Richardeau , Abdelhakim Bourennane , Céline Combettes et al.
Microelectronics Reliability, 2021, pp.114240. ⟨10.1016/j.microrel.2021.114240⟩
Article dans une revue hal-03381413 v1
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New local electrical diagnostic tool for dielectric barrier discharge (DBD)

Clémence Tyl , Stéphane Martin , Céline Combettes , Gilles Brillat , Vincent Bley et al.
Review of Scientific Instruments, 2021, 92 (5), pp.053552. ⟨10.1063/5.0045654⟩
Article dans une revue hal-04777974 v2
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Soft ferrite cores characterization for integrated micro- inductors

Yen Mai Nguyen , David Bourrier , Samuel Charlot , Zarel Valdez Nava , Vincent Bley et al.
Journal of Micromechanics and Microengineering, 2014, 24 (10), ⟨10.1088/0960-1317/24/10/104003⟩
Article dans une revue hal-01443220 v1
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Soft ferrite cores characterization for integrated micro-inductors

Yen Mai Nguyen , Thomas Lopez , Jean-Pierre Laur , David Bourrier , Samuel Charlot et al.
Journal of Physics: Conference Series, 2013, 476, pp.012139. ⟨10.1088/1742-6596/476/1/012139⟩
Article dans une revue hal-05381885 v1

CaCu3Ti4O12 ceramics from co-precipitation method: Dielectric properties of pellets and thick films

B. Barbier , Céline Combettes , S. Guillemet-Fritsch , Thierry Chartier , Fabrice Rossignol et al.
Journal of the European Ceramic Society, 2009, 29, pp.731-735. ⟨10.1016/j.jeurceramsoc.2008.07.042⟩
Article dans une revue istex hal-00352732 v1
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Electrical and Physical Characterization of Bulk Ceramics and Thick Layers of Barium Titanate Manufactured Using Nanopowders

Dinh Quang Nguyen , Thierry Lebey , Philippe Castelan , Vincent Bley , Madona Boulos et al.
Journal of Materials Engineering and Performance, 2007, vol. 16, pp. 626-634. ⟨10.1007/s11665-007-9110-7⟩
Article dans une revue istex hal-00806095 v1
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Caractérisation de céramiques massives et de couches épaisses préparées à partir des nanopoudres de BaTiO3.

Dinh Quang Nguyen , Thierry Lebey , Vincent Bley , Madona Boulos , Sophie Guillemet-Fritsch et al.
European Journal of Electrical Engineering, 2006, 9 (4 - 5), pp.433-448. ⟨10.3166/rige.9.433-448⟩
Article dans une revue istex hal-03481662 v1
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Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly

Moisés Ferber , Paul Bruyère , Nicolas Botter , Alejandro Can , Souhila Bouzerd et al.
CIPS 2024, Mar 2024, Dusseldorf, Germany. pp.333-340
Communication dans un congrès hal-04521931 v1
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An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules

Amin Salim Obaid Al-Hinaai , Till Huesgen , Cyril Buttay , Eric Vagnon , Ildiko Ettinger et al.
Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩
Communication dans un congrès hal-04240225 v1
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Substrat céramique intégrant une poche nanocomposite résistive pour la montée en tension des modules de puissance

Marie-Laure Locatelli , Driss Kenfaui , Lionel Laudebat , Zarel Valdez Nava , Céline Combettes et al.
Symposium de Génie Electrique, Institut de Recherche en Energie Electrique de Nantes Atlantique (IREENA), Jul 2021, NANTES, France
Communication dans un congrès hal-03326680 v1
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Fast cut-off, low I 2 T and high temperature monolithic on-chip fuse on silicon substrate for new fail-safe embedded power switch

Amirouche Oumaziz , Emmanuel Sarraute , Frédéric Richardeau , Abdelhakim Bourennane , Céline Combettes et al.
32th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 2021, Oct 2021, Bordeaux, France
Communication dans un congrès hal-03372248 v1

Local electrical diagnostics of a homogeneous Dielectric Barrier Discharge at atmospheric pressure

Clémence Tyl , M. Kettlitz , H. Höft , Xi Lin , Céline Combettes et al.
16th International Symposium on High Pressure Low Temperature Plasma Chemistry (HaKone XVI), Sept. 2-7, 2018, Beijing (CHINA), 2018, Beijing, China
Communication dans un congrès hal-03964762 v1

Local electrical diagnostics of a homogeneous Dielectric Barrier Discharge at atmospheric pressure

Clémence Tyl , M. Kettlitz , H. Höft , Xi Lin , Céline Combettes et al.
24th E‌urophysics Conference on the Atomic and Molecular Physics of Ionized Gases (ESCAMPIG XXIV), July 17-21, 2018, Glasgow (UK), 2018, Glasgow, United Kingdom
Communication dans un congrès hal-03964763 v1
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CuO nanostructured sensors for enhanced CO detection

Justyna Jońca , R Lai-Cheong , Myrtil L. Kahn , Katia Fajerwerg , Céline Combettes et al.
EUROSENSORS 2017, Sep 2017, Paris, France
Communication dans un congrès hal-02046330 v1

High power PCB-embedded inductors based on ferrite powder

Rémy Caillaud , Cyril Buttay , Johan Le Lesle , Florent Morel , Roberto Mrad et al.
5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France
Communication dans un congrès hal-01535727 v1

EDT for Power Devices

Cyril Buttay , Chenjiang Yu , Eric Labouré , Vincent Bley , Céline Combettes
Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom
Communication dans un congrès hal-01373062 v1
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Comparison of topside contact layouts for power dies embedded in PCB

Chenjiang Yu , Cyril Buttay , Eric Labouré , Vincent Bley , Céline Combettes et al.
ESTC, IMAPS, Sep 2016, Grenoble, France. ⟨10.1109/ESTC.2016.7764707⟩
Communication dans un congrès hal-01373042 v1

Embedded Device Technology for Power Devices

C. Buttay , C. Yu , E. Labouré , Vincent Bley , Céline Combettes
Embedded Device Technology : "Disappearing Die – Embed your Chips", IMAPS conference, Sept. 22, 2016, Caldicot (UK), 2016, Caldicot, United Kingdom
Communication dans un congrès hal-03964759 v1
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Highly integrated power electronic converters using active devices embedded in printed-circuit board

Chenjiang Yu , Cyril Buttay , Eric Labouré , Vincent Bley , Céline Combettes
4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France
Communication dans un congrès hal-01197043 v1
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Selective GAS sensor based on screen-printed ZNO nanorods

Audrey Chapelle , Samuel Charlot , Véronique Conédéra , Justyna Jońca , Myrtil L. Kahn et al.
SENSORS, ENERGY HARVESTING, WIRELESS NETWORK &SMART OBJECTS CONFERENCE 2015 (SENSO2015), Oct 2015, Gardanne, France
Communication dans un congrès hal-02048003 v1

Low-profile small-size ferrite cores for powerSiP integrated inductors

Y. M. Nguyen , Magali Brunet , J.P. Laur , David Bourrier , Samuel Charlot et al.
15th European Conference on Power Electronics and Applications, Sep 2013, Lille, France. ⟨10.1109/EPE.2013.6634455⟩
Communication dans un congrès hal-03964664 v1

Caractérisation de céramiques CaCu3Ti4O12 : comparaison entre échantillons massifs et films épais

B. Barbier , Céline Combettes , S. Guillemet-Fritsch , Thierry Chartier , Fabrice Rossignol
Journées Annuelles du GFC, Mar 2008, Tarbes, France
Communication dans un congrès hal-00363169 v1

Elaboration and Characterization of Multilayer Ceramic Capacitors Based on High Permittivity CaCu3Ti4O12

B. Barbier , Céline Combettes , S. Guillemet-Fritsch , T. Chartier , F. Rossignol et al.
CICMT 2008: Ceramic Interconnect and Ceramic Microsystems Technologies, Munich, GERMANY, 2008, Munich, Germany
Communication dans un congrès hal-03966020 v1

Electrical modeling of a CaCu3Ti4O12 ceramic for capacitor applications

Axel Rumeau , Pierre Bidan , Thierry Lebey , B. Barbier , Céline Combettes et al.
CEIDP 2007 : Conference on Electrical Insulation and Dielectric Phenomena, Vancouver, Canada, 2007, Vancouver, Canada. pp.508-511
Communication dans un congrès hal-03964527 v1
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Pre-packaging of power components using photosensitive resin

Emilie Loupias , Cyril Buttay , Andrei Sabac , Vincent Bley , Céline Combettes
Journées Nationales sur les Technologies Emergentes en micro-nanofabrication (JNTE), Nov 2024, Saint-Etienne, France.
Poster de conférence hal-04905499 v1