Céline COMBETTES
26
Documents
Publications
Publications
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Stray Inductance of a Modular Switching Cell Designed for Easier DisassemblyCIPS 2024, Mar 2024, Dusseldorf, Germany. pp.333-340
Communication dans un congrès
hal-04521931
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An Advanced Integrated Cooling Solution for High Voltage and Power Density ModulesTherminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩
Communication dans un congrès
hal-04240225
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Substrat céramique intégrant une poche nanocomposite résistive pour la montée en tension des modules de puissanceSymposium de Génie Electrique, Institut de Recherche en Energie Electrique de Nantes Atlantique (IREENA), Jul 2021, NANTES, France
Communication dans un congrès
hal-03326680
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Fast cut-off, low I 2 T and high temperature monolithic on-chip fuse on silicon substrate for new fail-safe embedded power switch32th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 2021, Oct 2021, Bordeaux, France
Communication dans un congrès
hal-03372248
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Local electrical diagnostics of a homogeneous Dielectric Barrier Discharge at atmospheric pressure16th International Symposium on High Pressure Low Temperature Plasma Chemistry (HaKone XVI), Sept. 2-7, 2018, Beijing (CHINA), 2018, Beijing, China
Communication dans un congrès
hal-03964762
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Local electrical diagnostics of a homogeneous Dielectric Barrier Discharge at atmospheric pressure24th Europhysics Conference on the Atomic and Molecular Physics of Ionized Gases (ESCAMPIG XXIV), July 17-21, 2018, Glasgow (UK), 2018, Glasgow, United Kingdom
Communication dans un congrès
hal-03964763
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CuO nanostructured sensors for enhanced CO detectionEUROSENSORS 2017, Sep 2017, Paris, France
Communication dans un congrès
hal-02046330
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High power PCB-embedded inductors based on ferrite powder5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France
Communication dans un congrès
hal-01535727
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EDT for Power DevicesEmbedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom
Communication dans un congrès
hal-01373062
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Comparison of topside contact layouts for power dies embedded in PCBESTC, IMAPS, Sep 2016, Grenoble, France. ⟨10.1109/ESTC.2016.7764707⟩
Communication dans un congrès
hal-01373042
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Embedded Device Technology for Power DevicesEmbedded Device Technology : "Disappearing Die – Embed your Chips", IMAPS conference, Sept. 22, 2016, Caldicot (UK), 2016, Caldicot, United Kingdom
Communication dans un congrès
hal-03964759
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Highly integrated power electronic converters using active devices embedded in printed-circuit board4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France
Communication dans un congrès
hal-01197043
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Selective GAS sensor based on screen-printed ZNO nanorodsSENSORS, ENERGY HARVESTING, WIRELESS NETWORK &SMART OBJECTS CONFERENCE 2015 (SENSO2015), Oct 2015, Gardanne, France
Communication dans un congrès
hal-02048003
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Low-profile small-size ferrite cores for powerSiP integrated inductors15th European Conference on Power Electronics and Applications, Sep 2013, Lille, France. ⟨10.1109/EPE.2013.6634455⟩
Communication dans un congrès
hal-03964664
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Caractérisation de céramiques CaCu3Ti4O12 : comparaison entre échantillons massifs et films épaisJournées Annuelles du GFC, Mar 2008, Tarbes, France
Communication dans un congrès
hal-00363169
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Elaboration and Characterization of Multilayer Ceramic Capacitors Based on High Permittivity CaCu3Ti4O12CICMT 2008: Ceramic Interconnect and Ceramic Microsystems Technologies, Munich, GERMANY, 2008, Munich, Germany
Communication dans un congrès
hal-03966020
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Electrical modeling of a CaCu3Ti4O12 ceramic for capacitor applicationsCEIDP 2007 : Conference on Electrical Insulation and Dielectric Phenomena, Vancouver, Canada, 2007, Vancouver, Canada. pp.508-511
Communication dans un congrès
hal-03964527
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Pre-packaging of power components using photosensitive resinJournées Nationales sur les Technologies Emergentes en micro-nanofabrication (JNTE), Nov 2024, Saint-Etienne, France.
Poster de conférence
hal-04905499
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