Publications
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Stray Inductance of a Modular Switching Cell Designed for Easier DisassemblyCIPS 2024, Mar 2024, DUSSELDORF, Germany
Communication dans un congrès
hal-04521931v1
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An Advanced Integrated Cooling Solution for High Voltage and Power Density ModulesTherminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître
Communication dans un congrès
hal-04240225v1
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Enhancing voltage rating of standard power modules for harsh environment applicationsProceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩
Communication dans un congrès
hal-03760089v1
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Evidence of Partial Discharges in the Dielectric Liquid using Electro-Optic Probes2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2022), Oct 2022, Denver, CO, United States. pp.206-209, ⟨10.1109/CEIDP55452.2022.9985328⟩
Communication dans un congrès
hal-04080766v1
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodesProceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany
Communication dans un congrès
hal-03775977v1
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Comparison of Partial Discharge Activity in Synthetic Ester and Synthetic Ester- Based Fullerene Nanofluid Under AC 50 Hz2022 IEEE Electrical Insulation Conference (EIC), IEEE TDEI, Jun 2022, Knoxville, United States. pp.102-105, ⟨10.1109/EIC51169.2022.9833211⟩
Communication dans un congrès
hal-04047631v1
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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power ElectronicsProceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩
Communication dans un congrès
hal-03772005v1
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AC Breakdown Voltage and Partial Discharge Activity in Synthetic Ester and Synthetic Ester-Based Zirconia Nanofluid2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), IEEE TDEI, May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830968⟩
Communication dans un congrès
hal-04047638v1
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Design of a test package for high voltage SiC diodesProceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩
Communication dans un congrès
hal-03772006v1
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩
Communication dans un congrès
hal-03803771v1
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TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges3D-PEIM, Jun 2021, Osaka, Japan. pp.1-6, ⟨10.1109/3D-PEIM49630.2021.9497263⟩
Communication dans un congrès
hal-03629431v1
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Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic esterEIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩
Communication dans un congrès
hal-03515576v1
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Optical and Electrical Partial Discharge Measurement with A1N Dielectric Barrier in Mineral Oil2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.243-246, ⟨10.1109/CEIDP49254.2020.9437536⟩
Communication dans un congrès
hal-03392233v1
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Comparison of Different Insulating Liquids for PCB Embedded Power Modules2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.227-230, ⟨10.1109/CEIDP49254.2020.9437524⟩
Communication dans un congrès
hal-03392227v1
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Insulating Liquids, an Alternative to Silicone Gel for Power Electronic Devices2019 IEEE Electrical Insulation Conference (EIC), Jun 2019, Calgary, Canada. pp.299-303, ⟨10.1109/EIC43217.2019.9046577⟩
Communication dans un congrès
hal-02532739v1
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Numerical Study of a Liquid Metal Heat Spreader for Power Semiconductor DevicesECCE2012, IEEE Energy Conversion Congress & Exposition, Sep 2012, Raleigh, United States
Communication dans un congrès
hal-00735322v1
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Packaging à l'échelle du wafer pour les convertisseurs multicellulairesElectronique de Puissance du Futur 2012, Jul 2012, France
Communication dans un congrès
hal-00716747v1
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Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETMElectronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France
Communication dans un congrès
hal-00514401v1
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Series connection of IGBTAPEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244
Communication dans un congrès
hal-00461367v1
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Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal ElectrodeI2MTC 2009, 2009, Singapour, Singapore
Communication dans un congrès
hal-00384063v1
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Study and Realization of a Low Force 3D Press-Pack Power ModulePower Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054
Communication dans un congrès
hal-00292635v1
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A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration2009
Pré-publication, Document de travail
hal-00396884v1
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Etudes de faisabilité d'un module de puissance 3D de type presspack pour des applications de faible et moyenne puissances2008
Pré-publication, Document de travail
hal-00294246v1
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Solutions innovantes pour le packaging de convertisseurs statiques polyphasésSciences de l'ingénieur [physics]. Institut National Polytechnique de Grenoble - INPG, 2010. Français. ⟨NNT : ⟩
Thèse
tel-00494431v1
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Laboratory-scale characterization of lightning strikes: acoustical and electrical measurements synchronized with optical visualizationspp.045009, 2022, ⟨10.1121/2.0001656⟩
Proceedings/Recueil des communications
hal-04060664v1
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