Eric Vagnon

Enseignant Chercheur Ecole Centrale de Lyon Laboratoire Ampère
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Dielectric cooling of a medium-voltage power module

Cyril Buttay , Amin Salim Obaid Al-Hinaai , Till Huesgen , Hugo Reynes , Eric Vagnon et al.

Thermal 2025, IMAPS France, Mar 2025, La Rochelle, France

Communication dans un congrès hal-05499560v1
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Caractérisation Électrique d'un Packaging Modulaire 3D Assemblé par Pression et Incluant des Mousses Métalliques

Paul Bruyere , Yvan Avenas , Eric Vagnon

Symposium de Génie Électrique SGE 2025, Jul 2025, Toulouse, France

Communication dans un congrès hal-05169242v1
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Solid insulation electrical endurance assessment under square voltage

Mamadou Djan Balde , Eric Vagnon , Julien Huillery , Martin Guillet

CEIDP-2025, IEEE Conference on Electrical Insulation and Dielectric Phenomena, Sep 2025, Manchester (UK), United Kingdom

Communication dans un congrès hal-05308647v1
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Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly

Moisés Ferber , Paul Bruyère , Nicolas Botter , Alejandro Can , Souhila Bouzerd et al.

CIPS 2024, Mar 2024, Dusseldorf, Germany. pp.333-340

Communication dans un congrès hal-04521931v1
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Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power Electronics

Paul Bruyere , Eric Vagnon , Yvan Avenas , Mohamed El Khattabi

Conference on Integrated Power Electronics Systems (CIPS), Mar 2024, Dusseldorf, Germany

Communication dans un congrès hal-04515700v1

Effect of Fullerene Nanoparticles on the Electrostatic Charging Tendency of Natural Ester FR3

H. Khelifa , A. Beroual , E. Vagnon

2023 IEEE 22nd International Conference on Dielectric Liquids (ICDL), Jun 2023, Worcester, United States. pp.1-4, ⟨10.1109/ICDL59152.2023.10209318⟩

Communication dans un congrès hal-04578639v1

Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on AC Breakdown Voltage and Partial Discharge Activity of Synthetic and Natural Esters

H. Khelifa , E. Vagnon , A. Beroual

2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2023, East Rutherford, United States. pp.1-4, ⟨10.1109/CEIDP51414.2023.10410487⟩

Communication dans un congrès hal-04578645v1
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Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in Air

Paul Bruyere , Eric Vagnon , Yvan Avenas

Conference on Electrical Insulation and Dielectric Phenomena, Oct 2023, New Jersey, United States. ⟨10.1109/CEIDP51414.2023.10410485⟩

Communication dans un congrès hal-04281522v1
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An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules

Amin Salim Obaid Al-Hinaai , Till Huesgen , Cyril Buttay , Eric Vagnon , Ildiko Ettinger et al.

Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩

Communication dans un congrès hal-04240225v1

AC Dielectric Strength and Partial Discharge Activity in Naturel Ester and Naturel Ester-Based Fullerene Nanofluids

H. Khelifa , E. Vagnon , A. Beroual

2023 IEEE 22nd International Conference on Dielectric Liquids (ICDL), Jun 2023, Worcester, United States. pp.1-4, ⟨10.1109/ICDL59152.2023.10209333⟩

Communication dans un congrès hal-04578635v1

Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on Creeping Discharges Propagating Over Solid-Natural Ester FR3 Interface Under Lightning Impulse Voltage

H. Khelifa , A. Beroual , E. Vagnon

2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2023, East Rutherford, United States. pp.1-4, ⟨10.1109/CEIDP51414.2023.10410470⟩

Communication dans un congrès hal-04578649v1
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Enhancing voltage rating of standard power modules for harsh environment applications

Hugo Reynes , Eric Vagnon , Cyril Buttay , Martin Guillet

Proceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩

Communication dans un congrès hal-03760089v1
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Evidence of Partial Discharges in the Dielectric Liquid using Electro-Optic Probes

Somya Anand , Eric Vagnon , Martin Guillet

2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2022), Oct 2022, Denver, CO, United States. pp.206-209, ⟨10.1109/CEIDP55452.2022.9985328⟩

Communication dans un congrès hal-04080766v1
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Design of a test package for high voltage SiC diodes

Arthur Boutry , Bruno Lefebvre , Cyril Buttay , Eric Vagnon , Dominique Planson et al.

Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩

Communication dans un congrès hal-03772006v1

AC Breakdown Voltage and Partial Discharge Activity in Synthetic Ester and Synthetic Ester-Based Zirconia Nanofluid

Hocine Khelifa , Eric Vagnon , Abderrahmane Beroual

2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), IEEE TDEI, May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830968⟩

Communication dans un congrès hal-04047638v1
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil

Somya Anand , Eric Vagnon , Martin Guillet , Cyril Buttay

2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩

Communication dans un congrès hal-03803771v1
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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics

Amin Salim Obaid Al-Hinaai , Till Huesgen , Cyril Buttay , Eric Vagnon , Richard Zeitler et al.

Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩

Communication dans un congrès hal-03772005v1

Comparison of Partial Discharge Activity in Synthetic Ester and Synthetic Ester- Based Fullerene Nanofluid Under AC 50 Hz

Hocine Khelifa , Somya Anand , Abderrahmane Beroual , Eric Vagnon

2022 IEEE Electrical Insulation Conference (EIC), IEEE TDEI, Jun 2022, Knoxville, United States. pp.102-105, ⟨10.1109/EIC51169.2022.9833211⟩

Communication dans un congrès hal-04047631v1
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes

Arthur Boutry , Cyril Buttay , Besar Asllani , Bruno Lefebvre , Eric Vagnon et al.

Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany

Communication dans un congrès hal-03775977v1

TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges

Wendpanga-Fadel Bikinga , Bachir Mezrag , Yvan Avenas , Jean-Luc Schanen , Jean-Michel Guichon et al.

3D-PEIM, Jun 2021, Osaka, Japan. pp.1-6, ⟨10.1109/3D-PEIM49630.2021.9497263⟩

Communication dans un congrès hal-03629431v1
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Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester

Somya Anand , Eric Vagnon , Ayyoub Zouaghi , Martin Guillet , Cyril Buttay et al.

EIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩

Communication dans un congrès hal-03515576v1

Optical and Electrical Partial Discharge Measurement with A1N Dielectric Barrier in Mineral Oil

Ayyoub Zouaghi , Ouassim Agri , Eric Vagnon , Jean-Louis Augé

2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.243-246, ⟨10.1109/CEIDP49254.2020.9437536⟩

Communication dans un congrès hal-03392233v1

Comparison of Different Insulating Liquids for PCB Embedded Power Modules

Ouassim Agri , Eric Vagnon , Ayyoub Zouaghi , Jean-Louis Augé

2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.227-230, ⟨10.1109/CEIDP49254.2020.9437524⟩

Communication dans un congrès hal-03392227v1
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Insulating Liquids, an Alternative to Silicone Gel for Power Electronic Devices

Ouassim Agri , Jean-Louis Augé , Eric Vagnon , François Buret

2019 IEEE Electrical Insulation Conference (EIC), Jun 2019, Calgary, Canada. pp.299-303, ⟨10.1109/EIC43217.2019.9046577⟩

Communication dans un congrès hal-02532739v1

Numerical Study of a Liquid Metal Heat Spreader for Power Semiconductor Devices

Mansour Tawk , Yvan Avenas , Eric Vagnon , Aline Msaed

ECCE2012, IEEE Energy Conversion Congress & Exposition, Sep 2012, Raleigh, United States

Communication dans un congrès hal-00735322v1

Packaging à l'échelle du wafer pour les convertisseurs multicellulaires

Nicolas Clément, Jean-Paul Rouger , L. Benaissa , Jean-Christophe Crébier , Julie Widiez , J. Defonseca et al.

Electronique de Puissance du Futur 2012, Jul 2012, France

Communication dans un congrès hal-00716747v1
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Series connection of IGBT

The Van Nguyen , Pierre-Olivier Jeannin , Eric Vagnon , David Frey , Jean-Christophe Crébier

APEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244

Communication dans un congrès hal-00461367v1

Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM

Jean-Christophe Crébier , Yvan Avenas , Kremena Vladimirova , Pierre-Olivier Jeannin , Christian Schaeffer et al.

Electronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France

Communication dans un congrès hal-00514401v1
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Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal Electrode

Eric Vagnon , Yvan Avenas , Jean-Christophe Crébier , Pierre-Olivier Jeannin , I. Al Batta et al.

I2MTC 2009, 2009, Singapour, Singapore

Communication dans un congrès hal-00384063v1

Study and Realization of a Low Force 3D Press-Pack Power Module

Eric Vagnon , Jean-Christophe Crébier , Yvan Avenas , Pierre-Olivier Jeannin

Power Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054

Communication dans un congrès hal-00292635v1

Effect of MgO Nanoparticles on the AC Breakdown Voltage, Partial Discharge Activity, and Electrostatic Charging Tendency of Natural Ester

H. Khelifa , Paweł Skotnicki , Abderrahmane Beroual , Eric Vagnon , Maciej Jaroszewski

IEEE Transactions on Dielectrics and Electrical Insulation, 2024, 31 (3), pp.1350-1358. ⟨10.1109/TDEI.2024.3374244⟩

Article dans une revue hal-04835139v1
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Field Plate Integration for Mitigating Partial Discharge Activity in PCB-Embedded Power Electronic Modules

Paul Bruyere , Eric Vagnon , Yvan Avenas

Energies, 2024, 17 (9), pp.2035. ⟨10.3390/en17092035⟩

Article dans une revue hal-04611444v1

Effect of Zirconia Nanoparticles on the AC Breakdown Voltage of Mineral Oil, Synthetic, and Natural Esters

H. Khelifa , Eric Vagnon , Abderrahmane Beroual

IEEE Transactions on Dielectrics and Electrical Insulation, 2024, 31 (2), pp.731-737. ⟨10.1109/TDEI.2024.3364108⟩

Article dans une revue hal-04582524v1
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Effect of Fullerene and Graphene Nanoparticles on the AC Dielectric Strength of Natural Ester

Hocine Khelifa , Eric Vagnon , Abderrahmane Beroual

Energies, 2023, 16 (4), pp.1995. ⟨10.3390/en16041995⟩

Article dans une revue hal-04047619v1

Effect of Conducting and Semiconducting Nanoparticles on the AC Breakdown Voltage and Electrostatic Charging Tendency of Synthetic Ester

Hocine Khelifa , Abderrahmane Beroual , Eric Vagnon

IEEE Transactions on Dielectrics and Electrical Insulation, 2023, 30 (4), pp.1414-1421. ⟨10.1109/TDEI.2023.3261825⟩

Article dans une revue hal-04293096v1
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Effect of Conducting, Semi-Conducting and Insulating Nanoparticles on AC Breakdown Voltage and Partial Discharge Activity of Synthetic Ester: A Statistical Analysis

Hocine Khelifa , Abderrahmane Beroual , Eric Vagnon

Nanomaterials, 2022, 12 (12), pp.2105. ⟨10.3390/nano12122105⟩

Article dans une revue hal-04047624v1
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Optical Detection of Partial Discharges Under Fast Rising Square Voltages in Dielectric Liquids

Somya Anand , Eric Vagnon , Martin Guillet , Cyril Buttay

IEEE Access, 2022, 10, pp.89758-89768. ⟨10.1109/ACCESS.2022.3200748⟩

Article dans une revue hal-03768924v1

Packaging à l'échelle du wafer pour les convertisseurs multicellulaires

Nicolas Clément, Jean-Paul Rouger , L. Benaissa , Jean-Christophe Crébier , Julie Widiez , J. Defonseca et al.

European Journal of Electrical Engineering, 2013, 16, pp.3-4

Article dans une revue hal-00988239v1

Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM

Jean-Christophe Crébier , Yvan Avenas , Kremena Vladimirova , Pierre-Olivier Jeannin , Christian Schaeffer et al.

Revue Internanationale de Génie Electrique, 2011, pp.617-633. ⟨10.3166/ejee.14.617-633⟩

Article dans une revue istex hal-00790044v1

A Busbar Like Power Module Based on 3D Power Chip on Chip Hybrid Integration

Eric Vagnon , Pierre-Olivier Jeannin , Jean-Christophe Crébier , Yvan Avenas

IEEE Transactions on Industry Applications, 2010, 46 (5), pp.2046-2055

Article dans une revue hal-00608496v1

A Bus-Bar-Like Power Module Based on Three-Dimensional Power-Chip-on-Chip Hybrid Integration

Eric Vagnon , Pierre-Olivier Jeannin , Jean-Christophe Crébier , Yvan Avenas

IEEE Transactions on Industry Applications, 2010, 46 (5), pp.2046-2055. ⟨10.1109/tia.2010.2057401⟩

Article dans une revue hal-00608445v1
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Solutions innovantes pour le packaging de convertisseurs statiques polyphasés

Eric Vagnon

Sciences de l'ingénieur [physics]. Institut National Polytechnique de Grenoble - INPG, 2010. Français. ⟨NNT : ⟩

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