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Eric Vagnon

Enseignant Chercheur Ecole Centrale de Lyon Laboratoire Ampère
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Publications

Effect of Conducting and Semiconducting Nanoparticles on the AC Breakdown Voltage and Electrostatic Charging Tendency of Synthetic Ester

Hocine Khelifa , Abderrahmane Beroual , Eric Vagnon
IEEE Transactions on Dielectrics and Electrical Insulation, 2023, 30 (4), pp.1414-1421. ⟨10.1109/TDEI.2023.3261825⟩
Article dans une revue hal-04293096v1

Effect of Fullerene and Graphene Nanoparticles on the AC Dielectric Strength of Natural Ester

Hocine Khelifa , Eric Vagnon , Abderrahmane Beroual
Energies, 2023, 16 (4), pp.1995. ⟨10.3390/en16041995⟩
Article dans une revue hal-04047619v1

Effect of Conducting, Semi-Conducting and Insulating Nanoparticles on AC Breakdown Voltage and Partial Discharge Activity of Synthetic Ester: A Statistical Analysis

Hocine Khelifa , Abderrahmane Beroual , Eric Vagnon
Nanomaterials, 2022, 12 (12), pp.2105. ⟨10.3390/nano12122105⟩
Article dans une revue hal-04047624v1

AC Breakdown Voltage and Partial Discharge Activity in Synthetic Ester-Based Fullerene and Graphene Nanofluids

Hocine Khelifa , Eric Vagnon , Abderrahmane Beroual
IEEE Access, 2022, 10, pp.5620-5634. ⟨10.1109/ACCESS.2022.3140928⟩
Article dans une revue hal-03671948v1
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Optical Detection of Partial Discharges Under Fast Rising Square Voltages in Dielectric Liquids

Somya Anand , Eric Vagnon , Martin Guillet , Cyril Buttay
IEEE Access, 2022, 10, pp.89758-89768. ⟨10.1109/ACCESS.2022.3200748⟩
Article dans une revue hal-03768924v1

Packaging à l'échelle du wafer pour les convertisseurs multicellulaires

Nicolas Clément, Jean-Paul Rouger , L. Benaissa , Jean-Christophe Crébier , Julie Widiez , J. Defonseca
European Journal of Electrical Engineering, 2013, 16, pp.3-4
Article dans une revue hal-00988239v1

Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM

Jean-Christophe Crébier , Yvan Avenas , Kremena Vladimirova , Pierre-Olivier Jeannin , Christian Schaeffer
Revue Internanationale de Génie Electrique, 2011, pp.617-633
Article dans une revue hal-00790044v1

A Busbar Like Power Module Based on 3D Power Chip on Chip Hybrid Integration

Eric Vagnon , Pierre-Olivier Jeannin , Jean-Christophe Crébier , Yvan Avenas
IEEE Transactions on Industry Applications, 2010, 46 (5), pp.2046-2055
Article dans une revue hal-00608496v1

A Bus-Bar-Like Power Module Based on Three-Dimensional Power-Chip-on-Chip Hybrid Integration

Eric Vagnon , Pierre-Olivier Jeannin , Jean-Christophe Crébier , Yvan Avenas
IEEE Transactions on Industry Applications, 2010, 46 (5), pp.2046-2055
Article dans une revue hal-00608445v1
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Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly

Moisés Ferber , Paul Bruyère , Nicolas Botter , Alejandro Can , Souhila Bouzerd
CIPS 2024, Mar 2024, DUSSELDORF, Germany
Communication dans un congrès hal-04521931v1
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An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules

Amin Salim Obaid Al-Hinaai , Till Huesgen , Cyril Buttay , Eric Vagnon , Ildiko Ettinger
Therminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître
Communication dans un congrès hal-04240225v1
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Enhancing voltage rating of standard power modules for harsh environment applications

Hugo Reynes , Eric Vagnon , Cyril Buttay , Martin Guillet
Proceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩
Communication dans un congrès hal-03760089v1
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Evidence of Partial Discharges in the Dielectric Liquid using Electro-Optic Probes

Somya Anand , Eric Vagnon , Martin Guillet
2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2022), Oct 2022, Denver, CO, United States. pp.206-209, ⟨10.1109/CEIDP55452.2022.9985328⟩
Communication dans un congrès hal-04080766v1
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes

Arthur Boutry , Cyril Buttay , Besar Asllani , Bruno Lefebvre , Eric Vagnon
Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany
Communication dans un congrès hal-03775977v1

Comparison of Partial Discharge Activity in Synthetic Ester and Synthetic Ester- Based Fullerene Nanofluid Under AC 50 Hz

Hocine Khelifa , Somya Anand , Abderrahmane Beroual , Eric Vagnon
2022 IEEE Electrical Insulation Conference (EIC), IEEE TDEI, Jun 2022, Knoxville, United States. pp.102-105, ⟨10.1109/EIC51169.2022.9833211⟩
Communication dans un congrès hal-04047631v1
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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics

Amin Salim Obaid Al-Hinaai , Till Huesgen , Cyril Buttay , Eric Vagnon , Richard Zeitler
Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩
Communication dans un congrès hal-03772005v1

AC Breakdown Voltage and Partial Discharge Activity in Synthetic Ester and Synthetic Ester-Based Zirconia Nanofluid

Hocine Khelifa , Eric Vagnon , Abderrahmane Beroual
2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), IEEE TDEI, May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830968⟩
Communication dans un congrès hal-04047638v1
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Design of a test package for high voltage SiC diodes

Arthur Boutry , Bruno Lefebvre , Cyril Buttay , Eric Vagnon , Dominique Planson
Proceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩
Communication dans un congrès hal-03772006v1
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil

Somya Anand , Eric Vagnon , Martin Guillet , Cyril Buttay
2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩
Communication dans un congrès hal-03803771v1

TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges

Wendpanga-Fadel Bikinga , Bachir Mezrag , Yvan Avenas , Jean-Luc Schanen , Jean-Michel Guichon
3D-PEIM, Jun 2021, Osaka, Japan. pp.1-6, ⟨10.1109/3D-PEIM49630.2021.9497263⟩
Communication dans un congrès hal-03629431v1
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Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester

Somya Anand , Eric Vagnon , Ayyoub Zouaghi , Martin Guillet , Cyril Buttay
EIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩
Communication dans un congrès hal-03515576v1

Optical and Electrical Partial Discharge Measurement with A1N Dielectric Barrier in Mineral Oil

Ayyoub Zouaghi , Ouassim Agri , Eric Vagnon , Jean-Louis Augé
2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.243-246, ⟨10.1109/CEIDP49254.2020.9437536⟩
Communication dans un congrès hal-03392233v1

Comparison of Different Insulating Liquids for PCB Embedded Power Modules

Ouassim Agri , Eric Vagnon , Ayyoub Zouaghi , Jean-Louis Augé
2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.227-230, ⟨10.1109/CEIDP49254.2020.9437524⟩
Communication dans un congrès hal-03392227v1
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Insulating Liquids, an Alternative to Silicone Gel for Power Electronic Devices

Ouassim Agri , Jean-Louis Augé , Eric Vagnon , François Buret
2019 IEEE Electrical Insulation Conference (EIC), Jun 2019, Calgary, Canada. pp.299-303, ⟨10.1109/EIC43217.2019.9046577⟩
Communication dans un congrès hal-02532739v1

Numerical Study of a Liquid Metal Heat Spreader for Power Semiconductor Devices

Mansour Tawk , Yvan Avenas , Eric Vagnon , Aline Msaed
ECCE2012, IEEE Energy Conversion Congress & Exposition, Sep 2012, Raleigh, United States
Communication dans un congrès hal-00735322v1

Packaging à l'échelle du wafer pour les convertisseurs multicellulaires

Nicolas Clément, Jean-Paul Rouger , L. Benaissa , Jean-Christophe Crébier , Julie Widiez , J. Defonseca
Electronique de Puissance du Futur 2012, Jul 2012, France
Communication dans un congrès hal-00716747v1

Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM

Jean-Christophe Crébier , Yvan Avenas , Kremena Vladimirova , Pierre-Olivier Jeannin , Christian Schaeffer
Electronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France
Communication dans un congrès hal-00514401v1
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Series connection of IGBT

The Van Nguyen , Pierre-Olivier Jeannin , Eric Vagnon , David Frey , Jean-Christophe Crébier
APEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244
Communication dans un congrès hal-00461367v1
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Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal Electrode

Eric Vagnon , Yvan Avenas , Jean-Christophe Crébier , Pierre-Olivier Jeannin , I. Al Batta
I2MTC 2009, 2009, Singapour, Singapore
Communication dans un congrès hal-00384063v1

Study and Realization of a Low Force 3D Press-Pack Power Module

Eric Vagnon , Jean-Christophe Crébier , Yvan Avenas , Pierre-Olivier Jeannin
Power Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054
Communication dans un congrès hal-00292635v1
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Solutions innovantes pour le packaging de convertisseurs statiques polyphasés

Eric Vagnon
Sciences de l'ingénieur [physics]. Institut National Polytechnique de Grenoble - INPG, 2010. Français. ⟨NNT : ⟩
Thèse tel-00494431v1