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Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power Electronics
Paul Bruyere
,
Eric Vagnon
,
Yvan Avenas
,
Mohamed El Khattabi
Conference on Integrated Power Electronics Systems (CIPS), Mar 2024, Dusseldorf, Germany
Communication dans un congrès
hal-04515700
v1
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Stray Inductance of a Modular Switching Cell Designed for Easier Disassembly
Moisés Ferber
,
Paul Bruyère
,
Nicolas Botter
,
Alejandro Can
,
Souhila Bouzerd
et al.
CIPS 2024, Mar 2024, Dusseldorf, Germany
Communication dans un congrès
hal-04521931
v1
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Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on AC Breakdown Voltage and Partial Discharge Activity of Synthetic and Natural Esters
H. Khelifa
,
E. Vagnon
,
A. Beroual
Communication dans un congrès
hal-04578645
v1
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Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in Air
Paul Bruyere
,
Eric Vagnon
,
Yvan Avenas
Communication dans un congrès
hal-04281522
v1
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An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules
Amin Salim Obaid Al-Hinaai
,
Till Huesgen
,
Cyril Buttay
,
Eric Vagnon
,
Ildiko Ettinger
et al.
Communication dans un congrès
hal-04240225
v1
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AC Dielectric Strength and Partial Discharge Activity in Naturel Ester and Naturel Ester-Based Fullerene Nanofluids
H. Khelifa
,
E. Vagnon
,
A. Beroual
Communication dans un congrès
hal-04578635
v1
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Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on Creeping Discharges Propagating Over Solid-Natural Ester FR3 Interface Under Lightning Impulse Voltage
H. Khelifa
,
A. Beroual
,
E. Vagnon
Communication dans un congrès
hal-04578649
v1
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Effect of Fullerene Nanoparticles on the Electrostatic Charging Tendency of Natural Ester FR3
H. Khelifa
,
A. Beroual
,
E. Vagnon
Communication dans un congrès
hal-04578639
v1
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Enhancing voltage rating of standard power modules for harsh environment applications
Hugo Reynes
,
Eric Vagnon
,
Cyril Buttay
,
Martin Guillet
Proceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩
Communication dans un congrès
hal-03760089
v1
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Evidence of Partial Discharges in the Dielectric Liquid using Electro-Optic Probes
Somya Anand
,
Eric Vagnon
,
Martin Guillet
2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2022), Oct 2022, Denver, CO, United States. pp.206-209, ⟨10.1109/CEIDP55452.2022.9985328⟩
Communication dans un congrès
hal-04080766
v1
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil
Somya Anand
,
Eric Vagnon
,
Martin Guillet
,
Cyril Buttay
Communication dans un congrès
hal-03803771
v1
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AC Breakdown Voltage and Partial Discharge Activity in Synthetic Ester and Synthetic Ester-Based Zirconia Nanofluid
Hocine Khelifa
,
Eric Vagnon
,
Abderrahmane Beroual
Communication dans un congrès
hal-04047638
v1
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Design of a test package for high voltage SiC diodes
Arthur Boutry
,
Bruno Lefebvre
,
Cyril Buttay
,
Eric Vagnon
,
Dominique Planson
et al.
Communication dans un congrès
hal-03772006
v1
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Comparison of Partial Discharge Activity in Synthetic Ester and Synthetic Ester- Based Fullerene Nanofluid Under AC 50 Hz
Hocine Khelifa
,
Somya Anand
,
Abderrahmane Beroual
,
Eric Vagnon
Communication dans un congrès
hal-04047631
v1
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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics
Amin Salim Obaid Al-Hinaai
,
Till Huesgen
,
Cyril Buttay
,
Eric Vagnon
,
Richard Zeitler
et al.
Communication dans un congrès
hal-03772005
v1
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodes
Arthur Boutry
,
Cyril Buttay
,
Besar Asllani
,
Bruno Lefebvre
,
Eric Vagnon
et al.
Proceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany
Communication dans un congrès
hal-03775977
v1
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TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges
Wendpanga-Fadel Bikinga
,
Bachir Mezrag
,
Yvan Avenas
,
Jean-Luc Schanen
,
Jean-Michel Guichon
et al.
Communication dans un congrès
hal-03629431
v1
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Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic ester
Somya Anand
,
Eric Vagnon
,
Ayyoub Zouaghi
,
Martin Guillet
,
Cyril Buttay
et al.
Communication dans un congrès
hal-03515576
v1
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Optical and Electrical Partial Discharge Measurement with A1N Dielectric Barrier in Mineral Oil
Ayyoub Zouaghi
,
Ouassim Agri
,
Eric Vagnon
,
Jean-Louis Augé
Communication dans un congrès
hal-03392233
v1
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Comparison of Different Insulating Liquids for PCB Embedded Power Modules
Ouassim Agri
,
Eric Vagnon
,
Ayyoub Zouaghi
,
Jean-Louis Augé
Communication dans un congrès
hal-03392227
v1
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Insulating Liquids, an Alternative to Silicone Gel for Power Electronic Devices
Ouassim Agri
,
Jean-Louis Augé
,
Eric Vagnon
,
François Buret
Communication dans un congrès
hal-02532739
v1
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Packaging à l'échelle du wafer pour les convertisseurs multicellulaires
Nicolas Clément, Jean-Paul Rouger
,
L. Benaissa
,
Jean-Christophe Crébier
,
Julie Widiez
,
J. Defonseca
et al.
Electronique de Puissance du Futur 2012, Jul 2012, France
Communication dans un congrès
hal-00716747
v1
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Numerical Study of a Liquid Metal Heat Spreader for Power Semiconductor Devices
Mansour Tawk
,
Yvan Avenas
,
Eric Vagnon
,
Aline Msaed
ECCE2012, IEEE Energy Conversion Congress & Exposition, Sep 2012, Raleigh, United States
Communication dans un congrès
hal-00735322
v1
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Series connection of IGBT
The Van Nguyen
,
Pierre-Olivier Jeannin
,
Eric Vagnon
,
David Frey
,
Jean-Christophe Crébier
APEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244
Communication dans un congrès
hal-00461367
v1
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Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM
Jean-Christophe Crébier
,
Yvan Avenas
,
Kremena Vladimirova
,
Pierre-Olivier Jeannin
,
Christian Schaeffer
et al.
Electronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France
Communication dans un congrès
hal-00514401
v1
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Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal Electrode
Eric Vagnon
,
Yvan Avenas
,
Jean-Christophe Crébier
,
Pierre-Olivier Jeannin
,
I. Al Batta
et al.
I2MTC 2009, 2009, Singapour, Singapore
Communication dans un congrès
hal-00384063
v1
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Study and Realization of a Low Force 3D Press-Pack Power Module
Eric Vagnon
,
Jean-Christophe Crébier
,
Yvan Avenas
,
Pierre-Olivier Jeannin
Power Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054
Communication dans un congrès
hal-00292635
v1
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