Publications
Publications
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Nouveaux matériaux et contraintes d’isolation pour la montée en tension des dispositifs d’électronique de puissanceEnergie électrique. Université Claude Bernard Lyon 1, 2025 |
Dielectric cooling of a medium-voltage power moduleThermal 2025, IMAPS France, Mar 2025, La Rochelle, France |
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Caractérisation Électrique d'un Packaging Modulaire 3D Assemblé par Pression et Incluant des Mousses MétalliquesSymposium de Génie Électrique SGE 2025, Jul 2025, Toulouse, France |
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Solid insulation electrical endurance assessment under square voltageCEIDP-2025, IEEE Conference on Electrical Insulation and Dielectric Phenomena, Sep 2025, Manchester (UK), United Kingdom |
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Stray Inductance of a Modular Switching Cell Designed for Easier DisassemblyCIPS 2024, Mar 2024, Dusseldorf, Germany. pp.333-340 |
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Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power ElectronicsConference on Integrated Power Electronics Systems (CIPS), Mar 2024, Dusseldorf, Germany |
Effect of Fullerene Nanoparticles on the Electrostatic Charging Tendency of Natural Ester FR32023 IEEE 22nd International Conference on Dielectric Liquids (ICDL), Jun 2023, Worcester, United States. pp.1-4, ⟨10.1109/ICDL59152.2023.10209318⟩ |
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Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on AC Breakdown Voltage and Partial Discharge Activity of Synthetic and Natural Esters2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2023, East Rutherford, United States. pp.1-4, ⟨10.1109/CEIDP51414.2023.10410487⟩ |
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Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in AirConference on Electrical Insulation and Dielectric Phenomena, Oct 2023, New Jersey, United States. ⟨10.1109/CEIDP51414.2023.10410485⟩ |
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An Advanced Integrated Cooling Solution for High Voltage and Power Density ModulesTherminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩ |
AC Dielectric Strength and Partial Discharge Activity in Naturel Ester and Naturel Ester-Based Fullerene Nanofluids2023 IEEE 22nd International Conference on Dielectric Liquids (ICDL), Jun 2023, Worcester, United States. pp.1-4, ⟨10.1109/ICDL59152.2023.10209333⟩ |
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Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on Creeping Discharges Propagating Over Solid-Natural Ester FR3 Interface Under Lightning Impulse Voltage2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2023, East Rutherford, United States. pp.1-4, ⟨10.1109/CEIDP51414.2023.10410470⟩ |
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Enhancing voltage rating of standard power modules for harsh environment applicationsProceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩ |
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Evidence of Partial Discharges in the Dielectric Liquid using Electro-Optic Probes2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2022), Oct 2022, Denver, CO, United States. pp.206-209, ⟨10.1109/CEIDP55452.2022.9985328⟩ |
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Design of a test package for high voltage SiC diodesProceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩ |
AC Breakdown Voltage and Partial Discharge Activity in Synthetic Ester and Synthetic Ester-Based Zirconia Nanofluid2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), IEEE TDEI, May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830968⟩ |
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩ |
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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power ElectronicsProceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩ |
Comparison of Partial Discharge Activity in Synthetic Ester and Synthetic Ester- Based Fullerene Nanofluid Under AC 50 Hz2022 IEEE Electrical Insulation Conference (EIC), IEEE TDEI, Jun 2022, Knoxville, United States. pp.102-105, ⟨10.1109/EIC51169.2022.9833211⟩ |
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodesProceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany |
TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges3D-PEIM, Jun 2021, Osaka, Japan. pp.1-6, ⟨10.1109/3D-PEIM49630.2021.9497263⟩ |
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Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic esterEIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩ |
Optical and Electrical Partial Discharge Measurement with A1N Dielectric Barrier in Mineral Oil2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.243-246, ⟨10.1109/CEIDP49254.2020.9437536⟩ |
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Comparison of Different Insulating Liquids for PCB Embedded Power Modules2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.227-230, ⟨10.1109/CEIDP49254.2020.9437524⟩ |
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Insulating Liquids, an Alternative to Silicone Gel for Power Electronic Devices2019 IEEE Electrical Insulation Conference (EIC), Jun 2019, Calgary, Canada. pp.299-303, ⟨10.1109/EIC43217.2019.9046577⟩ |
Numerical Study of a Liquid Metal Heat Spreader for Power Semiconductor DevicesECCE2012, IEEE Energy Conversion Congress & Exposition, Sep 2012, Raleigh, United States |
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Packaging à l'échelle du wafer pour les convertisseurs multicellulairesElectronique de Puissance du Futur 2012, Jul 2012, France |
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Series connection of IGBTAPEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244 |
Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETMElectronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France |
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Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal ElectrodeI2MTC 2009, 2009, Singapour, Singapore |
Study and Realization of a Low Force 3D Press-Pack Power ModulePower Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054 |
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Laboratory-scale characterization of lightning strikes: acoustical and electrical measurements synchronized with optical visualizationspp.045009, 2022, ⟨10.1121/2.0001656⟩ |
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Solutions innovantes pour le packaging de convertisseurs statiques polyphasésSciences de l'ingénieur [physics]. Institut National Polytechnique de Grenoble - INPG, 2010. Français. ⟨NNT : ⟩ |
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A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration2009 |
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Etudes de faisabilité d'un module de puissance 3D de type presspack pour des applications de faible et moyenne puissances2008 |