Publications
Publications
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Nouveaux matériaux et contraintes d’isolation pour la montée en tension des dispositifs d’électronique de puissanceEnergie électrique. Université Claude Bernard Lyon 1, 2025
HDR
tel-05289745
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Dielectric cooling of a medium-voltage power moduleThermal 2025, IMAPS France, Mar 2025, La Rochelle, France
Communication dans un congrès
hal-05499560
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Solid insulation electrical endurance assessment under square voltageCEIDP-2025, IEEE Conference on Electrical Insulation and Dielectric Phenomena, Sep 2025, Manchester (UK), United Kingdom
Communication dans un congrès
hal-05308647
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Caractérisation Électrique d'un Packaging Modulaire 3D Assemblé par Pression et Incluant des Mousses MétalliquesSymposium de Génie Électrique SGE 2025, Jul 2025, Toulouse, France
Communication dans un congrès
hal-05169242
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Metal-Air-FR4 Electrical Field Management with Embedded Electrical Field Plates for PCB Embedded Power ElectronicsConference on Integrated Power Electronics Systems (CIPS), Mar 2024, Dusseldorf, Germany
Communication dans un congrès
hal-04515700
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Stray Inductance of a Modular Switching Cell Designed for Easier DisassemblyCIPS 2024, Mar 2024, Dusseldorf, Germany. pp.333-340
Communication dans un congrès
hal-04521931
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Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on AC Breakdown Voltage and Partial Discharge Activity of Synthetic and Natural Esters2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2023, East Rutherford, United States. pp.1-4, ⟨10.1109/CEIDP51414.2023.10410487⟩
Communication dans un congrès
hal-04578645
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Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in AirConference on Electrical Insulation and Dielectric Phenomena, Oct 2023, New Jersey, United States. ⟨10.1109/CEIDP51414.2023.10410485⟩
Communication dans un congrès
hal-04281522
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An Advanced Integrated Cooling Solution for High Voltage and Power Density ModulesTherminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩
Communication dans un congrès
hal-04240225
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AC Dielectric Strength and Partial Discharge Activity in Naturel Ester and Naturel Ester-Based Fullerene Nanofluids2023 IEEE 22nd International Conference on Dielectric Liquids (ICDL), Jun 2023, Worcester, United States. pp.1-4, ⟨10.1109/ICDL59152.2023.10209333⟩
Communication dans un congrès
hal-04578635
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Effect of Fe 3 O 4 and Al 2 O 3 Nanoparticles on Creeping Discharges Propagating Over Solid-Natural Ester FR3 Interface Under Lightning Impulse Voltage2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2023, East Rutherford, United States. pp.1-4, ⟨10.1109/CEIDP51414.2023.10410470⟩
Communication dans un congrès
hal-04578649
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Effect of Fullerene Nanoparticles on the Electrostatic Charging Tendency of Natural Ester FR32023 IEEE 22nd International Conference on Dielectric Liquids (ICDL), Jun 2023, Worcester, United States. pp.1-4, ⟨10.1109/ICDL59152.2023.10209318⟩
Communication dans un congrès
hal-04578639
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Enhancing voltage rating of standard power modules for harsh environment applicationsProceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩
Communication dans un congrès
hal-03760089
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Evidence of Partial Discharges in the Dielectric Liquid using Electro-Optic Probes2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2022), Oct 2022, Denver, CO, United States. pp.206-209, ⟨10.1109/CEIDP55452.2022.9985328⟩
Communication dans un congrès
hal-04080766
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩
Communication dans un congrès
hal-03803771
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Design of a test package for high voltage SiC diodesProceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩
Communication dans un congrès
hal-03772006
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AC Breakdown Voltage and Partial Discharge Activity in Synthetic Ester and Synthetic Ester-Based Zirconia Nanofluid2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), IEEE TDEI, May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830968⟩
Communication dans un congrès
hal-04047638
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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power ElectronicsProceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩
Communication dans un congrès
hal-03772005
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Comparison of Partial Discharge Activity in Synthetic Ester and Synthetic Ester- Based Fullerene Nanofluid Under AC 50 Hz2022 IEEE Electrical Insulation Conference (EIC), IEEE TDEI, Jun 2022, Knoxville, United States. pp.102-105, ⟨10.1109/EIC51169.2022.9833211⟩
Communication dans un congrès
hal-04047631
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodesProceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany
Communication dans un congrès
hal-03775977
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TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges3D-PEIM, Jun 2021, Osaka, Japan. pp.1-6, ⟨10.1109/3D-PEIM49630.2021.9497263⟩
Communication dans un congrès
hal-03629431
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Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic esterEIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩
Communication dans un congrès
hal-03515576
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Optical and Electrical Partial Discharge Measurement with A1N Dielectric Barrier in Mineral Oil2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.243-246, ⟨10.1109/CEIDP49254.2020.9437536⟩
Communication dans un congrès
hal-03392233
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Comparison of Different Insulating Liquids for PCB Embedded Power Modules2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2020, East Rutherford, France. pp.227-230, ⟨10.1109/CEIDP49254.2020.9437524⟩
Communication dans un congrès
hal-03392227
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Insulating Liquids, an Alternative to Silicone Gel for Power Electronic Devices2019 IEEE Electrical Insulation Conference (EIC), Jun 2019, Calgary, Canada. pp.299-303, ⟨10.1109/EIC43217.2019.9046577⟩
Communication dans un congrès
hal-02532739
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Packaging à l'échelle du wafer pour les convertisseurs multicellulairesElectronique de Puissance du Futur 2012, Jul 2012, France
Communication dans un congrès
hal-00716747
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Numerical Study of a Liquid Metal Heat Spreader for Power Semiconductor DevicesECCE2012, IEEE Energy Conversion Congress & Exposition, Sep 2012, Raleigh, United States
Communication dans un congrès
hal-00735322
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Series connection of IGBTAPEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244
Communication dans un congrès
hal-00461367
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Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETMElectronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France
Communication dans un congrès
hal-00514401
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Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal ElectrodeI2MTC 2009, 2009, Singapour, Singapore
Communication dans un congrès
hal-00384063
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Study and Realization of a Low Force 3D Press-Pack Power ModulePower Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054
Communication dans un congrès
hal-00292635
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Laboratory-scale characterization of lightning strikes: acoustical and electrical measurements synchronized with optical visualizationspp.045009, 2022, ⟨10.1121/2.0001656⟩
Proceedings/Recueil des communications
hal-04060664
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Solutions innovantes pour le packaging de convertisseurs statiques polyphasésSciences de l'ingénieur [physics]. Institut National Polytechnique de Grenoble - INPG, 2010. Français. ⟨NNT : ⟩
Thèse
tel-00494431
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A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration2009
Pré-publication, Document de travail
hal-00396884
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Etudes de faisabilité d'un module de puissance 3D de type presspack pour des applications de faible et moyenne puissances2008
Pré-publication, Document de travail
hal-00294246
v1
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