Fournel Frank

123
Documents

Présentation

Frank Fournel is 52 years old. He graduated from the "Ecole Supérieure de Physique et de Chimie Industrielle de la ville de Paris” (ESPCI) with a master in “Materials science” (thin layer option). He got his PhD in 2001 for his work in CEA Grenoble on the use of molecular bonding to elaborate twisted substrate in order to drive a self-positioning nanostructure growth. Just after this, he has been employed by CEA in the thin film and circuit layers transfer laboratory. His main focus is on the fundamental understanding of the direct bonding and its application in thin layer transfer technique and substrate engineering. Beside this, he has been involved or driven many international project with CEA industrial partners (STmicroelectronic, Alcatel, SOITEC, Aledia, Intel,…) which gave him the advantage to drive simultaneously academic research and applicative one. He is now the head of the bonding technology engineering in LETI. He is now also involved in metallic bonding (direct, eutectic or thermo-compression), in anodic bonding and in polymer bonding (permanent or temporary) and covalent bonding (SAB). His focus concerns now also all the 3D applications including temporary bonding for instance for Si interposer or including Cu/Cu hybrid bonding for high pitch interconnexions. In addition to all the wafer to wafer bonding approaches, he also study deeply the die to wafer bonding when direct bonding is used for photonic application or 3D one. He was involved in the SOI conference board for 3 years and he is now a board member of the international ECS Wafer Bonding Symposium conference as well as the International Wafer’Bond conference and LTB-3D. He has 218 international publications, 126 deposited patents and participated to two book chapters in 2025. He passed his HDR in 2009. He has been nominated CEA Senior Expert in 2010, CEA International Expert in 2014. He his French Research director since 2021. He is CEA Fellow since 2023.


Compétences

Hybrid bonding Molecular bonding Anodic, Eutectic and thermocompression bonding Temporary bonding Die to wafer direct bonding Wafer to wafer direct bonding

Publications

Publications

Hydroxide and fluoride catalyzed bonding interface closure for low-temperature wafer bonding

P. Noel , V. Larrey , S. Tardif , F. Rieutord , D. Landru et al.
Japanese Journal of Applied Physics, 2025, 64 (3), pp.03SP06. ⟨10.35848/1347-4065/adb6af⟩
Article dans une revue cea-04991363 v1

Spatial arrangements and types of dislocations in interfacial networks obtained by Si(001) wafer bonding at low twist angle: A TEM characterization

L. Patout , C. Alfonso , M. Descoins , F. Fournel , D. Mangelinck et al.
Materials Science in Semiconductor Processing, 2024, 184, pp.108814. ⟨10.1016/j.mssp.2024.108814⟩
Article dans une revue cea-04765424 v1
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Light emission from ion-implanted SiGe quantum dots grown on Si substrates

L. Spindlberger , J. Aberl , L. Vukušić , T. Fromherz , J.-M. Hartmann et al.
Materials Science in Semiconductor Processing, 2024, 181, pp.108616. ⟨10.1016/j.mssp.2024.108616⟩
Article dans une revue cea-04771112 v1
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A nanofluidic exchanger for harvesting saline gradient energy

Saranath Sripriya , Cyril Picard , Vincent Larrey , Frank Fournel , Elisabeth Charlaix
Lab on a Chip, 2024, ⟨10.1039/d4lc00544a⟩
Article dans une revue hal-04768354 v1
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Modulation of post-fracture roughness with induced shear stress in the smart cut process

Lucas Colonel , Q. Lomonaco , K. Abadie , L G Michaud , C. Morales et al.
Journal of Applied Physics, 2024, 136 (4), ⟨10.1063/5.0223114⟩
Article dans une revue cea-04767394 v1
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Spatial arrangements and types of dislocations in interfacial networks obtained by Si(001) wafer bonding at low twist angle : a TEM characterization

Loïc Patout , Claude Alfonso , Marion Descoins , Frank Fournel , Dominique Mangelinck et al.
Materials Science in Semiconductor Processing, 2024, 184
Article dans une revue hal-04683755 v1

Large-scale controlled coupling of single-photon emitters to high-index dielectric nanoantennas by AFM nanoxerography

Mélodie Humbert , Romain Hernandez , Nicolas Mallet , Guilhem Larrieu , Vincent Larrey et al.
Nanoscale, 2023, 15 (2), pp.599-608. ⟨10.1039/d2nr05526k⟩
Article dans une revue hal-04158706 v1
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SAB-enabled room temperature hybrid bonding

Pablo Renaud , Karine Abadie , Frank Fournel , Christophe Dubarry , Floriane Baudin et al.
ECS Transactions, 2023, 112 (3), pp.83-94. ⟨10.1149/11203.0083ecst⟩
Article dans une revue hal-04608606 v1
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Tailoring wavelength and emitter-orientation dependent propagation of single photons in silicon nanowires

Mélodie Humbert , Peter Wiecha , Gérard Colas Des Francs , Xiao Yu , Nicolas Mallet et al.
Physical Review Applied, 2022, 17 (1), pp.014008. ⟨10.1103/PhysRevApplied.17.014008⟩
Article dans une revue hal-03611963 v1

Stress Engineering in Germanium-Silicon Heterostructure Using Surface Activated Hot Bonding

Quentin Lomonaco , Karine Abadie , Christophe Morales , Laurent Gaëtan Michaud , Jérôme Richy et al.
ECS Transactions, 2022, 109 (4), pp.277-287. ⟨10.1149/10904.0277ecst⟩
Article dans une revue cea-04521825 v1
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Large scale integration of functional radio‐frequency flexible MEMS under large mechanical strain

Edy Azrak , Laurent Michaud , Jérôme Richy , Alexandre Reinhardt , Samuel Tardif et al.
Advanced Functional Materials, 2022, 2022, pp.2205404. ⟨10.1002/adfm.202205404⟩
Article dans une revue hal-03883016 v1

Double cantilever beam bonding energy measurement using confocal IR microscopy

L. Colonel , A. Calvez , F. Fournel , V. Larrey , S. Moreau et al.
Journal of Applied Physics, 2022, 132 (21), ⟨10.1063/5.0114668⟩
Article dans une revue cea-04521812 v1

Direct bonding, key enabler for 3D technologies

Emilie Bourjot , Frank Fournel
https://chipscalereview.com/wp-content/uploads/2022/09/ChipScale_Sep-Oct_2022-digital.pdf, 2022, 26 (5), pp.6
Article dans une revue cea-04680083 v1

AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth

Claire Besancon , Delphine Néel , Dalila Make , Joan Manel Ramírez , Giancarlo Cerulo et al.
Applied Sciences, 2022, 12 (1), pp.263. ⟨10.3390/app12010263⟩
Article dans une revue hal-03867618 v1

Impact of amino-alcohol organic molecule on various silicon oxide bondings

A. Calvez , F. Fournel , V. Larrey , G. Eleouet , C. Morales et al.
ECS Journal of Solid State Science and Technology, 2021, 10 (6), pp.064005. ⟨10.1149/2162-8777/ac08d7⟩
Article dans une revue cea-04916731 v1

Aluminium-nitride thin-films on polymer substrates obtained by adhesive bonding

Edy Azrak , Laurent Michaud , Alexandre Reinhardt , Samuel Tardif , Marie Bousquet et al.
ECS Journal of Solid State Science and Technology, 2021, Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications, 10 (6), pp.064001. ⟨10.1149/2162-8777/ac04ff⟩
Article dans une revue hal-03264152 v1
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Transfer of an ultrathin single crystal silicon film from a Silicon On Insulator to a polymer

L.G. Michaud , E. Azrak , C. Castan , F. Fournel , F. Rieutord et al.
Materials Today Nano, 2021, 13, pp.100107. ⟨10.1016/j.mtnano.2020.100107⟩
Article dans une revue cea-03096669 v1
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Advanced hydrogenation process applied on Ge on Si quantum dots for enhanced light emission

Lukas Spindlberger , Moonyong Kim , Johannes Aberl , Thomas Fromherz , Friedrich Schäffler et al.
Applied Physics Letters, 2021, 118 (8), pp.083104. ⟨10.1063/5.0036039⟩
Article dans une revue hal-04836721 v1
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Impact of the temperature process on the morphology of 3D temporary bonded wafers: Quantification and reducing of the effect

P. Montméat , M. Le Cocq , T. Enot , M. Zussy , F. Fournel
Materials Science in Semiconductor Processing, 2021, 136, pp.106156. ⟨10.1016/j.mssp.2021.106156⟩
Article dans une revue cea-04917047 v1
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Temporary polymer bonding for the manufacturing of thin wafers: An innovative low temperature process

P. Montméat , L. Bally , J. Dechamp , T. Enot , F. Fournel
Materials Science in Semiconductor Processing, 2021, 123, pp.105550 -. ⟨10.1016/j.mssp.2020.105550⟩
Article dans une revue hal-03492895 v1

Elaboration and characterization of a 200 mm stretchable and flexible ultra-thin semi-conductor film

Laurent Michaud , Clément Castan , Marc Zussy , Pierre Montméat , Vincent H Mareau et al.
Nanotechnology, 2020, 31 (14), pp.145302. ⟨10.1088/1361-6528/ab647a⟩
Article dans une revue cea-02534522 v1

Impact of an Amino-Alcohol Organic Molecule on SiO 2 and Si Bonding Energy

Frank Fournel , Aziliz Calvez , Vincent Larrey , Gaëlle Eleouet , Christophe Morales et al.
ECS Transactions, 2020, 98 (4), pp.3-9. ⟨10.1149/09804.0003ecst⟩
Article dans une revue cea-04922835 v1

Kinetic study of hydrogen lateral diffusion at high temperature in a directly-bonded InP-SiO 2 /Si substrate

C Besancon , F. Fournel , L Sanchez , N. Vaissiere , C. Dupre et al.
Nanotechnology, 2020, 31 (13), pp.135205. ⟨10.1088/1361-6528/ab5ce5⟩
Article dans une revue hal-02917600 v1

Comparison of AlGaInAs-Based Laser Behavior Grown on Hybrid InP-SiO₂/Si and InP Substrates

Claire Besancon , Giancarlo Cerulo , Delphine Néel , Nicolas Vaissière , Dalila Make et al.
IEEE Photonics Technology Letters, 2020, 32 (8), pp.469-472. ⟨10.1109/LPT.2020.2979254⟩
Article dans une revue hal-02917586 v1
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Unveiling the optical emission channels of monolayer semiconductors coupled to silicon nanoantennas

Jean-Marie Poumirol , Ioannis Paradisanos , Shivangi Shree , Gonzague Agez , Xavier Marie et al.
ACS photonics, 2020, 7 (11), pp.3106-3115. ⟨10.1021/acsphotonics.0c01175⟩
Article dans une revue hal-03075337 v1
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Measuring the surface bonding energy: A comparison between the classical double-cantilever beam experiment and its nanoscale analog

K. Pantzas , F. Fournel , A. Talneau , G. Patriarche , Éric Le Bourhis
AIP Advances, 2020, 10 (4), pp.045006. ⟨10.1063/1.5143843⟩
Article dans une revue hal-03030828 v1

SiO2-SiO2 die-to-wafer direct bonding interface weakening

Toshiyuki Tabata , Loic Sanchez , Vincent Larrey , Frank Fournel , Hubert Moriceau
Microelectronics Reliability, 2020, 107, pp.113589. ⟨10.1016/j.microrel.2020.113589⟩
Article dans une revue cea-04947360 v1

Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking

L. Arnaud , C. Karam , N. Bresson , C. Dubarry , S. Borel et al.
MRS Communications, 2020, 10 (4), pp.549-557. ⟨10.1557/mrc.2020.77⟩
Article dans une revue cea-04937828 v1
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FIVHeMA: Intraventricular fibrinolysis versus external ventricular drainage alone in aneurysmal subarachnoid hemorrhage: A randomized controlled trial

T. Gaberel , C. Gakuba , F. Fournel , E. Le Blanc , C. Gaillard et al.
Neurochirurgie, 2019, 65 (1), pp.14-19. ⟨10.1016/j.neuchi.2018.11.004⟩
Article dans une revue hal-02154104 v1

Epitaxial Growth of High‐Quality AlGaInAs‐Based Active Structures on a Directly Bonded InP‐SiO 2 /Si Substrate

Claire Besancon , Nicolas Vaissière , Cecilia Dupre , Frank Fournel , Loic Sanchez et al.
Physica Status Solidi A (applications and materials science), 2019, 217 (3), pp.1900523. ⟨10.1002/pssa.201900523⟩
Article dans une revue hal-02917597 v1
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Transient current technique for charged traps detection in silicon bonded interfaces

J. Bronuzzi , D. Bouvet , C. Charrier , F. Fournel , M. F. Garcia et al.
AIP Advances, 2019, 9 (2), pp.025307. ⟨10.1063/1.5079999⟩
Article dans une revue cea-02186439 v1
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Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers

K. Abadie , P. Montmeat , T. Enot , F. Fournel , M. Wimplinger
International Journal of Adhesion and Adhesives, 2019, 91, pp.123-130. ⟨10.1016/j.ijadhadh.2019.03.009⟩
Article dans une revue cea-02186447 v1
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Influence of water diffusion in deposited silicon oxides on direct bonding of hydrophilic surfaces

J. Desomberg , Frank Fournel , Hubert Moriceau , A. Roule , E. Barthel et al.
Microsystem Technologies, 2018, 24 (1), pp.801-808. ⟨10.1007/s00542-017-3527-1⟩
Article dans une revue hal-01821482 v1
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A direct sensor to measure minute liquid flow rates

Preeti Sharma , Jean-François Motte , Frank Fournel , Benjamin Cross , Elisabeth Charlaix et al.
Nano Letters, 2018, 18 (9), pp.5726-5730. ⟨10.1021/acs.nanolett.8b02332⟩
Article dans une revue hal-02001168 v1

Polymer bonding temperature impact on bonded stack morphology and adherence energy

P. Montmeat , T. Enot , G. Louro de Oliveira , F. Fournel
Microsystem Technologies, 2018, 24 (1), pp.793-799. ⟨10.1007/s00542-017-3519-1⟩
Article dans une revue cea-02186140 v1

Development and adhesion characterization of a silicon wafer for temporary bonding

P. Montmeat , T. Enot , G. Enyedi , M. Pellat , J. Thooris et al.
International Journal of Adhesion and Adhesives, 2018, 82, pp.100-107. ⟨10.1016/j.ijadhadh.2018.01.007⟩
Article dans une revue cea-02186238 v1
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Strongly Directional Scattering from Dielectric Nanowires

Peter Wiecha , Aurelien Cuche , Arnaud Arbouet , Christian Girard , Gérard Colas Des Francs et al.
ACS photonics, 2017, 4 (8), pp.2036 - 2046. ⟨10.1021/acsphotonics.7b00423⟩
Article dans une revue hal-01730478 v1

InGaAs-OI Substrate Fabrication on a 300 mm Wafer

A. Lecestre , N. Mallet , G. Larrieu , Sebastien Sollier , Julie Widiez et al.
Journal of Low Power Electronics and Applications, 2016, 6 (4), pp.19. ⟨10.3390/jlpea6040019⟩
Article dans une revue hal-01991855 v1

Interface water diffusion in silicon direct bonding

M. Tedjini , Frank Fournel , Hubert Moriceau , V. Larrey , Didier Landru et al.
Applied Physics Letters, 2016, 109 (11), pp.111603. ⟨10.1063/1.4962464⟩
Article dans une revue cea-01851936 v1

Direct Bonding Mechanism of ALD-Al 2 O 3 Thin Films

E. Beche , F. Fournel , V. Larrey , F. Rieutord , C. Morales et al.
ECS Journal of Solid State Science and Technology, 2015, 4 (5), pp.P171-P175
Article dans une revue hal-02016525 v1

Water Stress Corrosion in Bonded Structures

F. Fournel , C. Martin-Cocher , D. Radisson , V. Larrey , E. Beche et al.
ECS Journal of Solid State Science and Technology, 2015, 4 (5), pp.P124-P130. ⟨10.1149/2.0031505jss⟩
Article dans une revue hal-02016558 v1

Mechanism involved in direct hydrophobic Si(100)-2x1:H bonding

C. Rauer , Hubert Moriceau , François Rieutord , Jean-Michel Hartmann , Frank Fournel et al.
Microsystem Technologies, 2015, 21 (5), pp.961-968. ⟨10.1007/s00542-015-2443-5⟩
Article dans une revue hal-01616552 v1

Effect of Copper–Copper Direct Bonding on Voiding in Metal Thin Films

P. Gondcharton , B. Imbert , L. Benaissa , F. Fournel , M. Verdier
Journal of Electronic Materials, 2015, 44 (11), pp.4128-4133. ⟨10.1007/s11664-015-3992-1⟩
Article dans une revue hal-01263546 v1

Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films

Elodie Beche , Frank Fournel , Vincent Larrey , François Rieutord , F. Fillot
Microsystem Technologies, 2015, 21 (5), pp.953-959. ⟨10.1007/s00542-015-2437-3⟩
Article dans une revue hal-01586120 v1

Nature of Tunable Hole g Factors in Quantum Dots

N. Ares , V. N. Golovach , G. Katsaros , Mathieu Stoffel , F. Fournel et al.
Physical Review Letters, 2013, 110 (4), ⟨10.1103/PhysRevLett.110.046602⟩
Article dans une revue hal-01285177 v1

Observation of Spin-Selective Tunneling in SiGe Nanocrystals

G. Katsaros , Vitaly N. Golovach , Panayotis Spathis , Natalia Ares , M. Stoffel et al.
Physical Review Letters, 2011, 107 (24), pp.246601. ⟨10.1103/PhysRevLett.107.246601⟩
Article dans une revue hal-00984199 v1
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The angular dislocation parallel to a free surface. Application to a (111)Si low angle twist boundary

Salem Neily , Sami Youssef , Frank Fournel , R. Bonnet
Philosophical Magazine, 2011, 91 (31), pp.1. ⟨10.1080/14786435.2011.600734⟩
Article dans une revue hal-00723598 v1

Hybrid superconductor-semiconductor devices made from self-assembled SiGe nanocrystals on silicon

G. Katsaros , P. Spathis , M. Stoffel , F. Fournel , M. Mongillo et al.
Nature Nanotechnology, 2010, 5, pp.458-464. ⟨10.1038/nnano.2010.84⟩
Article dans une revue hal-00700017 v1

Alternate dissociation of the screw dislocations in a (001) buried small-angle twist boundary in silicon

R. Bonnet , M. Loubradou , S. Youssef , J.L. Rouvière , F. Fournel
Philosophical Magazine, 2009, 89 (5), pp.413-434
Article dans une revue hal-00389424 v1

Mechanism of Thermal Silicon Oxide Direct Wafer Bonding

C. Ventosa , C. Morales , L. Libralesso , F. Fournel , A. Papon et al.
Electrochemical and Solid-State Letters, 2009, 12 (10), pp.H373. ⟨10.1149/1.3193533⟩
Article dans une revue hal-04526268 v1

Performance and Physics of sub-50nm Strained Si on Si1-xGex-On-Insulator (SGOI) nMOSFETs

F. Andrieu , T. Ernst , O. Faynot , O. Rozeau , Y. Bogumilowicz et al.
Solid-State Electronics, 2006, 50, pp.566
Article dans une revue hal-00145116 v1

Performance and Physics of sub-50nm Strained Si on Si1-xGex-On-Insulator (SGOI) MOSFETs

F. Andrieu , T. Ernst , O. Faynot , O. Rozeau , Y. Bogumilowicz et al.
Solid-State Electronics, 2006, 50, pp.566
Article dans une revue hal-00145501 v1

Ge quantum dots growth on nanopatterned Si(001) surface: Morphology and stress relaxation study

A. Pascale , P. Gentile , J. Eymery , J. Meziere , A. Bavard et al.
Surface Science : A Journal Devoted to the Physics and Chemistry of Interfaces, 2006, 600 (16), pp.3187 - 3193. ⟨10.1016/j.susc.2006.06.004⟩
Article dans une revue istex hal-01876867 v1

Controlled Ge quantum dots positioning with nano-patterned Si(001) substrates

A. Bavard , J. Eymery , A. Pascale , F. Fournel
physica status solidi (b), 2006, 243 (15), pp.3963 - 3967. ⟨10.1002/pssb.200671533⟩
Article dans une revue istex hal-01875054 v1
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Electronic and optical properties of Si ∕ Si O 2 nanostructures. I. Electron-hole collective processes in single Si ∕ Si O 2 quantum wells

N. Pauc , V. Calvo , J. Eymery , F. Fournel , N. Magnea
Physical Review B: Condensed Matter and Materials Physics (1998-2015), 2005, 72 (20), ⟨10.1103/PhysRevB.72.205324⟩
Article dans une revue hal-02060353 v1

Photoluminescence of nanometric single silicon quantum wells

J. Eymery , N. Pauc , V. Calvo , F. Fournel , N. Magnea
Optical Materials, 2005, 27 (5), pp.1000 - 1003. ⟨10.1016/j.optmat.2004.08.052⟩
Article dans une revue istex hal-01875076 v1

Ultra-thin strained SOI substrate analysis by pseudo-MOS measurements

C. Gallon , C. Fenouillet-Beranger , N. Bresson , Sorin Cristoloveanu , Michel Allibert et al.
Microelectronic Engineering, 2005, 80, pp. 241-244. ⟨10.1016/j.mee.2005.04.074⟩
Article dans une revue istex hal-00417214 v1

Germanium growth on nanopatterned surface studied by STM

P. Gentile , J. Eymery , F. Leroy , F. Fournel , J. Meziere et al.
Journal of Crystal Growth, 2005, 275 (1-2), pp.e1609 - e1613. ⟨10.1016/j.jcrysgro.2004.11.177⟩
Article dans une revue istex hal-01875068 v1

Electron hole liquid in silicon single quantum wells

N. Pauc , V. Calvo , J. Eymery , F. Fournel , N. Magnea
Optical Materials, 2005, 27 (5), pp.995 - 999. ⟨10.1016/j.optmat.2004.08.051⟩
Article dans une revue istex hal-01875073 v1
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Two-Dimensional Electron-Hole Liquid in Single Si Quantum Wells with Large Electronic and Dielectric Confinement

N. Pauc , V. Calvo , J. Eymery , F. Fournel , N. Magnea
Physical Review Letters, 2004, 92 (23), ⟨10.1103/PhysRevLett.92.236802⟩
Article dans une revue hal-02060361 v1

Engineering strained silicon on insulator wafers with the Smart CutTM technology

B. Ghyselen , J.-M. Hartmann , T. Ernst , C. Aulnette , B. Osternaud et al.
Solid-State Electronics, 2004, 48 (8), pp.1285-1296. ⟨10.1016/j.sse.2004.01.011⟩
Article dans une revue istex hal-04175606 v1

Controlled surface nanopatterning with buried dislocation arrays

F. Leroy , J. Eymery , P. Gentile , F. Fournel
Surface Science : A Journal Devoted to the Physics and Chemistry of Interfaces, 2003, 545 (3), pp.211 - 219. ⟨10.1016/j.susc.2003.08.051⟩
Article dans une revue istex hal-01876866 v1

Grazing incidence x-ray scattering investigation of Si surface patterned with buried dislocation networks

F. Leroy , J. Eymery , D. Buttard , G. Renaud , R. Lazzari et al.
Applied Physics Letters, 2003, 82 (16), pp.2598 - 2600. ⟨10.1063/1.1568545⟩
Article dans une revue hal-01442883 v1

GIXRD of nanoscale strain patterning in wafer bonding

J. Eymery , F. Leroy , F. Fournel
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 2003, 200, pp.73 - 78. ⟨10.1016/S0168-583X(02)01677-4⟩
Article dans une revue istex hal-01876871 v1

Ordering of Ge quantum dots with buried Si dislocation networks

F. Leroy , J. Eymery , P. Gentile , F. Fournel
Applied Physics Letters, 2002, 80 (17), pp.3078-3080
Article dans une revue cea-01989695 v1

X-ray reflectivity of silicon on insulator wafers

J. Eymery , F. Rieutord , F. Fournel , D. Buttard , H. Moriceau
Materials Science in Semiconductor Processing, 2001, 4 (1-3), pp.31 - 33. ⟨10.1016/S1369-8001(00)00158-X⟩
Article dans une revue istex hal-01876885 v1

Confinement induced enhancement of the emission in Er-implanted Si/SiO2 quantum wells fabricated on SOI substrates

D. Sotta , V. Calvo , H. Ulmer-Tuffigo , N. Magnea , Emmanuel Hadji et al.
Materials Science and Engineering: B, 2001, 81 (1-3), pp.43-45
Article dans une revue cea-01996944 v1

Grazing incidence X-ray studies of twist-bonded Si/Si and Si/SiO2 interfaces

D. Buttard , J. Eymery , F. Rieutord , F. Fournel , D Lübbert et al.
Physica B: Condensed Matter, 2000, 283 (1-3), pp.103 - 107. ⟨10.1016/S0921-4526(99)01900-6⟩
Article dans une revue istex hal-01876872 v1

Ultra thin silicon films directly bonded onto silicon wafers

F. Fournel , H. Moriceau , N. Magnea , J. Eymery , J.L Rouvière et al.
Materials Science and Engineering: B, 2000, 73 (1-3), pp.42 - 46. ⟨10.1016/S0921-5107(99)00431-6⟩
Article dans une revue istex hal-01876883 v1

Nanometric patterning with ultrathin twist bonded silicon wafers

F. Fournel , H. Moriceau , N. Magnea , J. Eymery , B Buttard et al.
Thin Solid Films, 2000, 380 (1-2), pp.10 - 14. ⟨10.1016/S0040-6090(00)01460-7⟩
Article dans une revue istex hal-01876895 v1

Grazing incidence X-ray studies of twist-bonded Si/Si and Si/SiO2 interfaces

D. Buttard , J. Eymery , F. Rieutord , F. Fournel , D Lübbert et al.
Physica B: Condensed Matter, 2000, 283 (1-3), pp.103 - 107. ⟨10.1016/S0921-4526(99)01900-6⟩
Article dans une revue istex hal-01876874 v1

Ultra low temperature hybrid bonding: morphological and electrical characterizations

Margot Faure , Christophe Dubarry , Pablo Renaud , Floriane Baudin , Sébastien Dominguez et al.
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Sep 2024, Berlin, Germany. ⟨10.1109/ESTC60143.2024.10712151⟩
Communication dans un congrès cea-04924735 v1

Fine pitch Nb-Nb Direct Bonding for quantum applications

Pablo Renaud , Christophe Dubarry , Nicolas Bresson , Edouard Deschaseaux , Frank Fournel et al.
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), May 2024, Denver, United States. pp.441-446, ⟨10.1109/ECTC51529.2024.00076⟩
Communication dans un congrès cea-04758586 v1

Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding

Richard van Haren , Suwen Li , Mart Baars , Blandine Minghetti , Leon van Dijk et al.
Novel Patterning Technologies 2024, Feb 2024, San Jose, United States. pp.1295606, ⟨10.1117/12.3010477⟩
Communication dans un congrès cea-04769554 v1

Towards 200 mm 2D materials transfer: Wafer scale characterizations during 2D materials transfer onto temporary substrate.

Paul Brunet , Thibaut Meyer , Emmanuel Rolland , Benjamin Dey , Stephane Cadot et al.
2024 MRS Fall Meeting, Dec 2024, BOSTON, United States
Communication dans un congrès cea-04768415 v1

Copper Microstructure Optimization for Fine Pitch Low Temperature Cu/SiO 2 Hybrid Bonding

Marie Maubert , Mathilde Gottardi , Pierre-Emile Philip , Emilie Fragnaud , Gilles Romero et al.
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), May 2024, Denver, United States. pp.631-636, ⟨10.1109/ECTC51529.2024.00105⟩
Communication dans un congrès cea-04758477 v1

3D sequential integration with Si CMOS stacked on 28nm industrial FDSOI with Cu-ULK iBEOL featuring RO and HDR pixel

T. Mota-Frutuoso , Valerie Lapras , Laurent Brunet , L. Basset , J. Lugo et al.
IEDM 2023 - IEEE International Electron Devices Meeting, Dec 2023, San Francisco, United States. ⟨10.1109/IEDM45741.2023.10413864⟩
Communication dans un congrès cea-04540443 v1

Integration and process challenges of self assembly applied to die-to-wafer hybrid bonding

Emilie Bourjot , Alice Bond , Noura Nadi , Thierry Enot , Loic Sanchez et al.
ECTC 2023 - IEEE 73rd Electronic Components and Technology Conference, May 2023, Orlando, United States. pp.1397-1402, ⟨10.1109/ECTC51909.2023.00239⟩
Communication dans un congrès hal-04757847 v1

Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations

Richard van Haren , Suwen Li , Blandine Minghetti , Leon van Dijk , Klaas Brantjes et al.
Metrology, Inspection, and Process Control XXXVII, Feb 2023, San Jose, United States. pp.76, ⟨10.1117/12.2657422⟩
Communication dans un congrès cea-04755920 v1

Large Diameter Epi-Ready InP on Si (InPOSi) Substrates

B. Ghyselen , Fx Darras , O. Mourey , C. Navone , L. Sanchez et al.
International Conference on Compound Semiconductor Manufacturing Technology, May 2023, Orlando, United States
Communication dans un congrès hal-04624561 v1
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Stressed Si/Si homo-structures manufacturing using surface activated bonding in temperature

Karine Abadie , Quentin Lomonaco , Laurent Michaud , Lucas Colonel , Christophe Morales et al.
WaferBond’22 - The International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration, Oct 2022, Schmalkalden, Germany
Communication dans un congrès cea-04613733 v1
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Caractérisation acoustique de l’énergie de collage direct

Amine Iklil , Gilles Despaux , Frank Fournel , Emilie Deloffre , Emmanuel Le Clézio
16ème Congrès Français d'Acoustique, CFA2022, Société Française d'Acoustique; Laboratoire de Mécanique et d'Acoustique, Apr 2022, Marseille, France
Communication dans un congrès hal-03848159 v1

10 μm and 5 μm Die-to-Wafer Direct Hybrid Bonding

Emilie Bourjot , Alice Bond , Carine Ladner , Nicolas Bresson , Stephane Moreau et al.
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sep 2022, Sibiu, Romania. pp.31-38, ⟨10.1109/ESTC55720.2022.9939476⟩
Communication dans un congrès cea-04521796 v1

AlGaInAs Multi-Quantum Well Laser Array on Silicon Achieved by InP-Seed-Bonding and MOVPE Selective Area Growth

Claire Besancon , Nicolas Vaissiere , Delphine Neel , Hussein Mehdi , Gauthier Lefevre et al.
2022 Compound Semiconductor Week (CSW), Jun 2022, Ann Arbor, United States. pp.1-2, ⟨10.1109/CSW55288.2022.9930433⟩
Communication dans un congrès hal-04627233 v1
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Engineered SiC materials for power technologies

Walter Schwarzenbach , Séverin Rouchier , Guillaume Berre , Romain Boulet , Olivier Ledoux et al.
ICICDT 2022 - 2022 International Conference on IC Design and Technology, Sep 2022, Hanoi, Vietnam. pp.55-56, ⟨10.1109/ICICDT56182.2022.9933092⟩
Communication dans un congrès cea-04528483 v1

Transfer of an AlGaAs/GaAs crystalline Bragg mirror from a GaAs substrate to a fused silica substrate by direct bonding

Victor Hui , Agathe André , Alexandre Arnoult , Pascal Besson , Christophe Dubarry et al.
Optics and Photonics for Advanced Dimensional Metrology II, Apr 2022, Strasbourg, France. pp.20, ⟨10.1117/12.2621898⟩
Communication dans un congrès cea-04793515 v1

Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding

Emilie Bourjot , Clement Castan , Noura Nadi , Alice Bond , Nicolas Bresson et al.
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), Jun 2021, San Diego, United States. pp.470-475, ⟨10.1109/ECTC32696.2021.00085⟩
Communication dans un congrès cea-04951727 v1

Opportunities and challenges brought by 3D-sequential integration

Christoforos Theodorou , P. Batude , L. Brunet , C. Fenouillet-Beranger , D. Lattard et al.
2021 IEEE International Interconnect Technology Conference (IITC), Jul 2021, Kyoto, France. pp.1-1, ⟨10.1109/IITC51362.2021.9537356⟩
Communication dans un congrès hal-03434018 v1

Laser Array Covering 155 nm Wide Spectral Band Achieved by Selective Area Growth on Silicon Wafer

C. Besancon , P. Fanneau , D. Neel , G. Cerulo , N. Vaissiere et al.
2020 European Conference on Optical Communications (ECOC), Dec 2020, Brussels, Belgium. pp.1-4, ⟨10.1109/ECOC48923.2020.9333230⟩
Communication dans un congrès hal-04627280 v1

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields

A. Jouve , L. Sanchez , C. Castan , N. Bresson , F. Fournel et al.
2019 International 3D Systems Integration Conference (3DIC), Oct 2019, Sendai, Japan. pp.1-7, ⟨10.1109/3DIC48104.2019.9058905⟩
Communication dans un congrès cea-04777615 v1

A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors

A. Jouve , E. Lagoutte , R. Crochemore , G. Mauguen , T. Flahaut et al.
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Jun 2020, Orlando, United States. pp.201-209, ⟨10.1109/ECTC32862.2020.00044⟩
Communication dans un congrès cea-04924159 v1

High temperature sealing of silicon oxide/oxide bonding interfaces

François Rieutord , S. Tardif , Frank Fournel , Vincent Larrey , Didier Landru et al.
PRiME 2020, Oct 2020, Online, United States. pp.1627-1627, ⟨10.1149/MA2020-02221627mtgabs⟩
Communication dans un congrès cea-03096019 v1

Die-to-Wafer 3D Interconnections Operating at Sub-Kelvin Temperatures for Quantum Computation

Candice Thomas , Jean Charbonnier , Arnaud Garnier , Nicolas Bresson , Frank Fournel et al.
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), Sep 2020, Tønsberg, Norway. pp.1-7, ⟨10.1109/ESTC48849.2020.9229657⟩
Communication dans un congrès hal-03455251 v1

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

E. Bourjot , P. Stewart , C. Dubarry , E. Lagoutte , E. Rolland et al.
2019 International 3D Systems Integration Conference (3DIC), Oct 2019, Sendai, Japan. pp.1-5, ⟨10.1109/3DIC48104.2019.9058783⟩
Communication dans un congrès cea-04776545 v1

Highly Strained Silicon on Polymer Obtained By Temporary Polymer Wafer Bonding

Laurent Gaëtan Michaud , Clément Castan , Pierre Montméat , Edy Azrak , Nikita Nikitskiy et al.
PRiME 2020, Oct 2020, Online, United States. pp.1618-1618, ⟨10.1149/MA2020-02221618mtgabs⟩
Communication dans un congrès cea-03096035 v1

High-quality Epitaxial Growth of AlGaInAs-based Active Structure on a Directly-Bonded InPoSi Substrate

Claire Besancon , Jean Decobert , Jean-Pierre Le Goec , Nicolas Vaissière , Cecilia Dupre et al.
2019 Compound Semiconductor Week (CSW), May 2019, Nara, Japan. pp.1-2, ⟨10.1109/ICIPRM.2019.8818994⟩
Communication dans un congrès hal-02330625 v1

Breakthroughs in 3D Sequential technology

L. Brunet , C. Fenouillet-Beranger , P. Batude , S. Beaurepaire , F. Ponthenier et al.
2018 IEEE International Electron Devices Meeting (IEDM), Dec 2018, San Francisco, United States. pp.7.2.1-7.2.4, ⟨10.1109/IEDM.2018.8614653⟩
Communication dans un congrès cea-04808833 v1

Robustness and reliability achievements for direct hybrid bonding integration: a review

S. Moreau , J. Jourdon , S. Lhostis , D. Bouchu , Y. Henrion et al.
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), May 2019, Kanazawa, Japan. pp.11-11, ⟨10.23919/LTB-3D.2019.8735353⟩
Communication dans un congrès cea-04521620 v1

Die to wafer direct bonding: from fundamental mechanisms to optoelectronic and 3D applications

F. Fournel , L. Sanchez , B. Montmayeul , C. Castan , M. Laugier et al.
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), May 2019, Kanazawa, Japan. pp.16-16, ⟨10.23919/LTB-3D.2019.8735248⟩
Communication dans un congrès cea-04790247 v1

Self-Assembly Process for 3D Die-to-Wafer using Direct Bonding: A Step Forward Toward Process Automatisation

Jouve Amandine , Loic Sanchez , Clement Castan , Maxence Laugier , Emmanuel Rolland et al.
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), May 2019, Las Vegas, United States. pp.225-234, ⟨10.1109/ECTC.2019.00041⟩
Communication dans un congrès cea-04783270 v1

(Invited) Water Transport Along Si/Si Direct Wafer Bonding Interfaces

François Rieutord , Samuel Tardif , Ivan Nikitskiy , Frank Fournel , Marwan Tedjini et al.
AIMES 2018, Electrochemical Society ECS, Sep 2018, CANCUN, Mexico. pp.39-47, ⟨10.1149/08605.0039ecst⟩
Communication dans un congrès hal-02005572 v1

A sensor to measure flow rate in individual nanopore

Preeti Sharma , Jean-François Motte , Frank Fournel , Benjamin Cross , Élisabeth Charlaix et al.
Journées de la matière condensée, Aug 2018, Grenoble, France
Communication dans un congrès hal-02017568 v1

Wafer-Bonded AlGaAs///Si Dual-Junction Solar Cells

Elias Veinberg-Vidal , Laura Vauche , Clément Weick , Jeremy da Fonseca , Christophe Jany et al.
2017 IEEE 44th Photovoltaic Specialists Conference (PVSC), Jun 2017, Washington, United States. pp.2562-2565, ⟨10.1109/PVSC.2017.8366116⟩
Communication dans un congrès hal-02042351 v1

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

A. Jouve , V. Balan , N. Bresson , C. Euvrard-Colnat , F. Fournel et al.
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), Oct 2017, Burlingame, Canada. pp.1-2, ⟨10.1109/S3S.2017.8309213⟩
Communication dans un congrès cea-02185349 v1

Strongly directional scattering from dielectric nanowires

Vincent Paillard , Peter Wiecha , Arnaud Arbouet , Aurelien Cuche , Christian Girard et al.
META 2017, Symp. 14 "Fano resonances in optics and microwaves, Jul 2017, Incheon- Seoul, South Korea
Communication dans un congrès hal-01768972 v1

Adhesion Energy and Bonding Wave Velocity Measurements

V. Larrey , G. Mauguen , F. Fournel , D. Radisson , F. Rieutord et al.
PRIME 2016, Oct 2016, Honolulu, United States. pp.145-152, ⟨10.1149/07509.0145ecst⟩
Communication dans un congrès hal-01974477 v1

Transfer of Ultra-Thin Semi-Conductor Films onto Flexible Substrates

P. Montméat , I. de Nigris Brandolisi , S. Tardif , T. Enot , G. Enyedi et al.
PRiME 2016/230th ECS Meeting, Electrochemical Society, Oct 2016, Honolulu, United States. pp.247-252, ⟨10.1149/07509.0247ecst⟩
Communication dans un congrès hal-02016097 v1

Linear and nonlinear light scattering properties of individual silicon nanowires.

Vincent Paillard , Peter Wiecha , Arnaud Arbouet , Christian Girard , Thierry Baron et al.
6th Int. Conf. on Nanostructures and Nanomaterials Self-Assembly (nanosea 2016), Jul 2016, Giardini Naxos, Italy
Communication dans un congrès hal-01768994 v1

Linear and nonlinear optical properties properties of individual silicon nanowires.

Vincent Paillard , Peter Wiecha , Arnaud Arbouet , Christian Girard , Aurélie Lecestre et al.
ECS Meeting, nanoscale luminescent materials, May 2016, San Diego, United States
Communication dans un congrès hal-01769024 v1

Edge Water Penetration in Direct Bonding Interface

F. Rieutord , S. Tardif , D. Landru , O. Kononchuk , V. Larrey et al.
PRiME 2016/230th ECS Meeting, Electrochemical Society, Oct 2016, Honolulu, United States. pp.163-167, ⟨10.1149/07509.0163ecst⟩
Communication dans un congrès hal-02016077 v1

Impact of Water Edge Absorption on Silicon Oxide Direct Bonding Energy

F. Fournel , M. Tedjini , V. Larrey , F. Rieutord , C. Morales et al.
PRIME 2016, Oct 2016, Honolulu, United States. pp.129-134, ⟨10.1149/07509.0129ecst⟩
Communication dans un congrès hal-01974475 v1

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude , C. Fenouillet-Beranger , L. Pasini , V. Lu , F. Deprat et al.
2015 IEEE Symposium on VLSI Technology, Jun 2015, Kyoto, Japan. pp.T48-T49, ⟨10.1109/VLSIT.2015.7223698⟩
Communication dans un congrès hal-02049760 v1

Direct Bonding Mechanism of ALD-Al2O3 Thin Films

E. Beche , F. Fournel , V. Larrey , F. Rieutord , C. Morales et al.
13th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications as part of the 226th Meeting of the Electrochem Soc, ECS, Oct 2014, Cancun, Mexico. pp.57-65, ⟨10.1149/06405.0057ecst⟩
Communication dans un congrès hal-02015924 v1

(Invited) Water Stress Corrosion in Bonded Structures

F. Fournel , C. Martin-Cocher , D. Radisson , V. Larrey , E. Beche et al.
13th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications as part of the 226th Meeting of the Electrochem Soc, Oct 2014, Cancun, Mexico. pp.121-132
Communication dans un congrès hal-02015940 v1

In-Depth Study of Strained SGOI nMOSFETs down to 30nm Gate Length

F. Andrieu , T. Ernst , O. Faynot , O. Rozeau , Y. Bogumilowicz et al.
35st European Solid-State Device Research Conference, 2005, Grenoble, France
Communication dans un congrès hal-00146508 v1

Elaboration de Nanocristaux Silicium, propriétés électriques et optiques

T. Baron , F. Mazen , A. Souifi , P. Gentile , F. Fournel et al.
VIIIème Journées de la Matière Condensée, 2002, Marseille, France
Communication dans un congrès hal-00486149 v1

Collage direct - Assemblage sans adhésif pour environnements extrêmes

Aurélien Maurel-Pantel , Frank Fournel , Thierry Billeton , Jérôme Debray , Christophe Hecquet et al.
Techniques de l'ingénieur, pp.N 2000, 2024, ⟨10.51257/a-v1-n2000⟩
Chapitre d'ouvrage hal-04801185 v1

Fano-Resonances in High Index Dielectric Nanowires for Directional Scattering

Peter Wiecha , Aurelien Cuche , Houssem Kallel , Gérard Colas Des Francs , Aurélie Lecestre et al.
Herausgeber: Kamenetskii, Eugene, Sadreev, Almas, Miroshnichenko, Andrey (Eds.). Fano Resonances in Optics and Microwaves: Physics and Applications, Springer, pp.283-310, 2018, 978-3-319-99730-8
Chapitre d'ouvrage hal-01850259 v1
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Applications de l'adhésion moléculaire

Frank Fournel
Génie des procédés. Université Grenoble 1, 2009
HDR tel-04086626 v1