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Francis CALMON

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Publications

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Shallow Trench Isolation Patterning to Improve Photon Detection Probability of Single-Photon Avalanche Diodes Integrated in FD-SOI CMOS Technology

Shaochen Gao , Vu Duc-Tung , Thibauld Cazimajou , Patrick Pittet , Martine Le Berre et al.
Photonics, 2024, 11 (6), pp.526. ⟨10.3390/photonics11060526⟩
Article dans une revue hal-04599693 v1

Integration of an Ultra-Fast Active Quenching Circuit with a Monolithic 3D SPAD Pixel in a 28 nm FD-SOI CMOS Technology

Mohammadreza Dolatpoor Lakeh , Jean-Baptiste Kammerer , Jean-Baptiste Schell , Dylan Issartel , Shaochen Gao et al.
Sensors and Actuators A: Physical , 2023, 363, pp.114744. ⟨10.1016/j.sna.2023.114744⟩
Article dans une revue hal-04241792 v1
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Architecture optimization of SPAD integrated in 28 nm FD-SOI CMOS technology to reduce the DCR

D. Issartel , S. Gao , P. Pittet , R. Cellier , D. Golanski et al.
Solid-State Electronics, 2022, 191, pp.108297. ⟨10.1016/j.sse.2022.108297⟩
Article dans une revue hal-03651521 v1
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An analytical solution for McIntyre’s model of avalanche triggering probability for SPAD compact modeling and performance exploration

Tulio Chaves de Albuquerque , Dylan Issartel , Shaochen Gao , Younes Benhammou , Dominique Golanski et al.
Semiconductor Science and Technology, 2021, ⟨10.1088/1361-6641/ac00d0⟩
Article dans une revue hal-03255595 v1
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An Ultrafast Active Quenching Active Reset Circuit with 50 % SPAD Afterpulsing Reduction in a 28 nm FD-SOI CMOS Technology Using Body Biasing Technique

Mohammadreza Dolatpoor Lakeh , Jean-Baptiste Kammerer , Enagnon Aguenounon , Dylan Issartel , Jean-Baptiste Schell et al.
Article dans une revue hal-03254577 v1
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Indirect Avalanche Event Detection of Single Photon Avalanche Diode Implemented in CMOS FDSOI Technology

Tulio Chaves de Albuquerque , Dylan Issartel , Raphaël Clerc , Patrick Pittet , Rémy Cellier et al.
Solid-State Electronics, 2020, pp.107636. ⟨10.1016/j.sse.2019.107636⟩
Article dans une revue hal-02294857 v1

3D Silicon Coincidence Avalanche Detector (3D-SiCAD) for charged particle detection

M.M. Vignetti , F. Calmon , P. Pittet , G. Pares , R. Cellier et al.
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2018, 881, pp.53-59. ⟨10.1016/j.nima.2017.10.089⟩
Article dans une revue hal-01703734 v1

Simulation study of a novel 3D SPAD pixel in an advanced FD-SOI technology

M.M. Vignetti , F. Calmon , P. Lesieur , A. Savoy-Navarro
Solid-State Electronics, 2017, 128, pp.163 - 171. ⟨10.1016/j.sse.2016.10.014⟩
Article dans une revue hal-01885619 v1

Investigation of the in-plane and out-of-plane electrical properties of metallic nanoparticles in dielectric matrix thin films elaborated by atomic layer deposition

Daniel Thomas , Etienne Puyoo , Martine Le Berre , Liviu Militaru , Siddardha Koneti et al.
Nanotechnology, 2017, 28 (45), 455602 (8 p.). ⟨10.1088/1361-6528/aa8b5e⟩
Article dans une revue hal-01644827 v1
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A High-Efficiency Compact Planar Antenna for ISM Wireless Systems

Tao Zhou , Yazi Cao , Zhiqun Cheng , Martine Le Berre , Francis Calmon
International Journal of Antennas and Propagation, 2017, 2017, pp.7319275. ⟨10.1155/2017/7319275⟩
Article dans une revue hal-01888316 v1

Electrothermal Modeling for 3-D Nanoscale Circuit Substrates: Noise

Yue Ma , Latifa Fakri-Bouchet , Francis Calmon , Christian Gontrand
IEEE Transactions on Components and Packaging Technologies, 2016, 6 (7), pp.1042-1052. ⟨10.1109/TCPMT.2016.2575363⟩
Article dans une revue hal-01701400 v1

Miniaturized Tunable TeraHertz Antenna Based on Graphene

Tao Zhou , Z. Cheng , H. Zhang , M. Le Berre , Liviu Militaru et al.
Microwave and Optical Technology Letters, 2015, 56 (8), pp. 1792-1794
Article dans une revue hal-01489440 v1

Study and characterization of the irreversible transformation of electrically stressed planar Ti/TiOx /Ti junctions

N. Guillaume , E. Puyoo , M. Le Berre , D. Albertini , N. Baboux et al.
Journal of Applied Physics, 2015, 118 (14), pp.144502. ⟨10.1063/1.4932646⟩
Article dans une revue hal-02048470 v1

Preliminary simulation study of a Coincidence Avalanche Pixel Sensor

Matteo Vignetti , Francis Calmon , Rémy Cellier , Patrick Pittet , Laurent Quiquerez et al.
Journal of Instrumentation, 2015, 10, pp.C06007. ⟨10.1088/1748-0221/10/06/C06007⟩
Article dans une revue hal-01489375 v1

An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration

Jean-Etienne Lorival , Francis Calmon , Fengyuan Sun , Felipe Frantz , Carole Plossu et al.
Microelectronics Journal, 2015, 46 (2), pp.153-165. ⟨10.1016/j.mejo.2014.12.002⟩
Article dans une revue hal-02060679 v1

Tunnel junction engineering for optimized Metallic Single Electron Transistor

K. El Hajjam , Mohamed-Amine Bounouar , Nicolas Baboux , S. Ecoffey , M. Guilmain et al.
IEEE Transactions on Electron Devices, 2015, 62 (9), pp.2298-3003. ⟨10.1109/TED.2015.2452575⟩
Article dans une revue hal-01489315 v1

Design guidelines for the integration of Geiger-mode avalanche diodes in standard CMOS technologies

M.M. Vignetti , F. Calmon , R. Cellier , P. Pittet , L. Quiquerez et al.
Microelectronics Journal, 2015, 46 (10), pp.900 - 910. ⟨10.1016/j.mejo.2015.07.002⟩
Article dans une revue hal-01886644 v1

Electrical characterization and TCAD simulations of multi-gate bulk nMOSFET

Inga Zbierska , Liviu Militaru , Françis Calmon , Sylvain Feruglio , Guo-Neng Lu
Microelectronics Journal, 2015, 46 (7), pp.588-592. ⟨10.1016/j.mejo.2015.03.018⟩
Article dans une revue hal-01488981 v1

Highly transparent low capacitance PEALD Al2O3-HfO2 tunnel junction engineering

K. El Hajjam , Nicolas Baboux , Francis Calmon , Abdelkader Souifi , O. Poncelet et al.
Journal of Vacuum Science and Technology, 2014, 32, pp.01A132
Article dans une revue hal-01490344 v1

3D substrate modeling; from a first order electrical analysis, towards some possible signal fluctuations consideration, for radiofrequency circuits

Christian Gontrand , Fengyuan Sun , R. Cardenas , P. Ma , Carole Plossu et al.
Microelectronics Journal, 2014, 45, pp.1061-1068
Article dans une revue hal-01490330 v1

Through silicon vias: from a physical point of view to a compact models initiation

Fengyuan Sun , Jean-Etienne Lorival , Francis Calmon , Christian Gontrand
The International Journal for Computation and Mathematics in Electrical and Elec, 2014, 33, pp.1462-1484
Article dans une revue hal-01489936 v1

Enhanced tunable nonreciprocal effect in CRLH coplanar transmission line on YIG without series capacitive loading

Tao Zhou , Martine Le Berre , Gwenaelle Vest , Calmon F. , Farid Boukchiche et al.
Microwave and Optical Technology Letters, 2013, ⟨10.1002/mop.27979⟩
Article dans une revue istex hal-03327975 v1

Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking

E. Eid , T. Lacrevaz , C. Bermond , S. de Rivaz , S. Capraro et al.
Microelectronic Engineering, 2011, 88 (5), pp.729-733
Article dans une revue hal-01068838 v1

Coplanar waveguides with or without barium ferrite thin films

T. Zhou , M. Le Berre , Evangéline Bènevent , A.-S. Dehlinger , F. Calmon et al.
Microwave and Optical Technology Letters, 2010, 52 (9), pp.2007-2010. ⟨10.1002/mop.25393⟩
Article dans une revue istex ujm-00733387 v1

Performances Comparison of Si and GaAs Based Resonant Tunneling Diodes

E. Buccafurri , R. Clerc , F. Calmon , M.G. Pala , A. Poncet et al.
physica status solidi (c), 2009, 6 (6), pp.1408-1411
Article dans une revue hal-00596139 v1

Interdigitated back contact solar cells with SiO2 and SiN back surface passivation

I. Jozwik , P. Papet , A. Kaminski , E. Fourmond , F. Calmon et al.
Journal of Non-Crystalline Solids, 2008, 354 (35-39), pp.4341-4344. ⟨10.1016/j.jnoncrysol.2008.06.083⟩
Article dans une revue istex hal-02328336 v1

FPGA and mixed FPGA-DSP implementations of electrical drive algorithms

F. Calmon , M. Fathallah , Pierre-Jean Viverge , C. Gontrand , J. Carrabina et al.
Lecture Notes in Computer Science, 2002, 2438, pp.1144-1147
Article dans une revue hal-00141474 v1
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Les composants de puissance : état de l'art, les évolutions

Jean-Pierre Chante , Bruno Allard , Dominique Bergogne , Francis Calmon , René Elhinger et al.
Revue Internationale de Génie Electrique, RIGE, 1998
Article dans une revue hal-02117240 v1
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Numerical and Analytical Investigations on IGBTs Thermal Behaviour

F. Calmon , J.-P. Chante , A. Sénès , B. Reymond
Journal de Physique III, 1997, 7 (3), pp.689-705. ⟨10.1051/jp3:1997149⟩
Article dans une revue istex jpa-00249607 v1

Front-Side Photon Detection improvement of SPAD integrated in FD-SOI CMOS Technology thanks to STI patterning

Duc Tung Vu , Shaochen Gao , Thibauld Cazimajou , Patrick Pittet , Martine Le Berre et al.
ISSW 2024 Te International Spad Sensor Workshop, 4-6 June 2024, Trento, Italy, Jun 2024, Trento, Italy
Communication dans un congrès hal-04493136 v1

Transient Measurements of Avalanche Dynamics and Quenching in SPADs

Wilfried Uhring , Mohammadreza Dolatpoor Lakeh , Francis Calmon , Raul Andres Bianchi , Denis Rideau et al.
ISSW 2024 Te International Spad Sensor Workshop, 4-6 June 2024, Trento, Italy, Jun 2024, Trento, France
Communication dans un congrès hal-04493135 v1
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Indoor Optical Wireless Communication Coverage Optimization Using a SiPM Photoreceiver

Bastien Béchadergue , Thibauld Cazimajou , Fabien Mandorlo , Calmon F.
2023 IEEE Wireless Communications and Networking Conference (WCNC), Mar 2023, Glasgow, United Kingdom. pp.1-6, ⟨10.1109/WCNC55385.2023.10118956⟩
Communication dans un congrès hal-04145642 v1

Statistical measurements and Monte-Carlo simulations of DCR in SPADs

Mathieu Sicre , Megan Agnew , Christel Buj , Caroline Coutier , Dominique Golanski et al.
ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC), Sep 2022, Milan, Italy. pp.193-196, ⟨10.1109/ESSCIRC55480.2022.9911519⟩
Communication dans un congrès hal-04138798 v1

Identification of stress factors and degradation mechanisms inducing DCR drift in SPADs

Mathieu Sicre , Xavier Federspiel , David Roy , Bastien Mamby , Caroline Coutier et al.
2022 IEEE International Integrated Reliability Workshop (IIRW), Oct 2022, South Lake Tahoe, United States. pp.1-5, ⟨10.1109/IIRW56459.2022.10032759⟩
Communication dans un congrès hal-04138806 v1

Improving the Photon Detection Probability of SPAD implemented in FD-SOI CMOS Technology with light-trapping concept

S. Gao , D. Issartel , Régis Orobtchouk , Fabien Mandorlo , D. Golanski et al.
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS), Sep 2021, Caen, France. ⟨10.1109/EuroSOI-ULIS53016.2021.9560684⟩
Communication dans un congrès hal-03622066 v1
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An Active Quenching Circuit for a Native 3D SPAD Pixel in a 28 nm CMOS FDSOI Technology

Mohammadreza Dolatpoor Lakeh , Jean-Baptiste Kammerer , Wilfried Uhring , Francis Calmon , Dylan Issartel et al.
IEEE NEWCAS 2021, 2021, En ligne, France. ⟨10.1109/NEWCAS50681.2021.9462754⟩
Communication dans un congrès hal-03238121 v1

Dark Count Rate in Single-Photon Avalanche Diodes: characterization and modeling study

M. Sicre , M. Agnew , C. Buj , J. Coignus , D. Golanski et al.
ESSCIRC / ESSDERC 2021 - IEEE 47th European Solid State Circuits Conference, Sep 2021, Grenoble, France. pp.143-146, ⟨10.1109/ESSCIRC53450.2021.9567806⟩
Communication dans un congrès hal-03622065 v1
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3D Electro-optical Simulations for Improving the Photon Detection Probability of SPAD Implemented in FD-SOI CMOS Technology

S. Gao , D. Issartel , R. Orobtchouk , F. Mandorlo , D. Golanski et al.
2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Sep 2021, Dallas, United States. pp.301-304, ⟨10.1109/SISPAD54002.2021.9592555⟩
Communication dans un congrès halshs-03515486 v1

Avalanche Transient Simulations of SPAD integrated in 28nm FD-SOI CMOS Technology

D. Issartel , S. Gao , S. Hagen , P. Pittet , R. Cellier et al.
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS), Sep 2021, Caen, France. ⟨10.1109/EuroSOI-ULIS53016.2021.9560679⟩
Communication dans un congrès hal-03622067 v1

SPAD FDSOI cell optimization for lower dark count rate achievement

D. Issartel , T. Chaves de Albuquerque , R. Clerc , P. Pittet , R. Cellier et al.
2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Sep 2020, Caen, France. pp.1-5, ⟨10.1109/EUROSOI-ULIS49407.2020.9365292⟩
Communication dans un congrès hal-03254726 v1

An Ultrafast Active Quenching Circuit for SPAD in CMOS 28nm FDSOI Technology

Mohammadreza Dolatpoor Lakeh , Jean-Baptiste Kammerer , Wilfried Uhring , Jean-Baptiste Schell , Calmon F.
2020 IEEE SENSORS, Oct 2020, Rotterdam, Netherlands. pp.1-4, ⟨10.1109/SENSORS47125.2020.9278902⟩
Communication dans un congrès hal-03254822 v1
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Lowering the Dark Count Rate of SPAD Implemented in CMOS FDSOI Technology

T. Chaves de Albuquerque , D. Issartel , R. Clerc , P. Pittet , R. Cellier et al.
EUROSOI ULIS 2019, Apr 2019, Grenoble, France. ⟨10.1109/EUROSOI-ULIS45800.2019.9041916⟩
Communication dans un congrès hal-02333580 v1

Body-biasing considerations with SPAD FDSOI: advantages and drawbacks

T. Chaves de Albuquerque , D. Issartel , R. Clerc , P. Pittet , R. Cellier et al.
ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC), Sep 2019, Cracow, Poland. pp.210-213, ⟨10.1109/essderc.2019.8901825⟩
Communication dans un congrès hal-02379994 v1

Integration of SPAD in 28nm FDSOI CMOS technology

T. Chaves de Albuquerque , F. Calmon , R. Clerc , P. Pittet , Y. Benhammou et al.
ESSDERC, 2018, Dresden, Germany. ⟨10.1109/ESSDERC.2018.8486852⟩
Communication dans un congrès hal-01958249 v1

Pt nanoislands embedded in Al2O3 matrix: from ALD-based fabrication to structural to electrical characterization

Daniel Thomas , Etienne Puyoo , Martine Le Berre , Liviu Militaru , S. Koneti et al.
EMRS Spring Meeting, Jan 2017, Strasbourg, France
Communication dans un congrès hal-01701466 v1

PEALD Platinum Nano-island SET Fabrication and Electrical Characterization

Daniel Thomas , Etienne Puyoo , M. Le Berre , Liviu Militaru , S. Koneti et al.
AVS 17th International Conference on Atomic Layer Deposition, Jan 2017, Denver, United States
Communication dans un congrès hal-01701467 v1

Development of a 3D silicon coincidence avalanche detector for charged particle tracking in medical applications

M. Vignetti , F. Calmon , P. Pittet , G. Pares , R. Cellier et al.
2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD), Oct 2016, Strasbourg, France. ⟨10.1109/NSSMIC.2016.8069553⟩
Communication dans un congrès hal-01886637 v1

A novel 3D pixel concept for Geiger-mode detection in SOI technology

Matteo Vignetti , Francis Calmon , P. Lesieur , T. Graziosi , A. Savoy-Navarro
Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, 2016, Vienna, Austria
Communication dans un congrès hal-01489132 v1

Novel 3D SPAD architecture in an advanced FDSOI technology

Francis Calmon , Matteo Vignetti
8th International Workshop on Intelligent Fast Interconnected and Efficient Devices for Frontier Exploitation in Research and Industry (INFIERI), 2016, FermiLab, USA, United States
Communication dans un congrès hal-01489097 v1

Shadow Edge Lithography coupled with ALD growth of Alumina and Platinum Nanoislands Towards the Fabrication of Single Electron Transistors

Daniel Thomas , Etienne Puyoo , M. Le Berre , Liviu Militaru , S. Koneti et al.
EMRS Fall Meeting, 2016, Warsaw, Poland
Communication dans un congrès hal-01489069 v1

On the irreversible transformation of Ti/TiOx/Ti junctions under electrical stress

Etienne Puyoo , Nicolas Guillaume , M. Le Berre , David Albertini , Nicolas Baboux et al.
Energy Materials and Nanotechnology, 2016, Prague, Czech Republic
Communication dans un congrès hal-01489096 v1

Enhancing electrical performances of Metallic DG-SET based circuits by Tunnel junction engineering

K. El Hajjam , Mohamed-Amine Bounouar , D. Drouin , Francis Calmon
Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, 2016, Vienna, Austria
Communication dans un congrès hal-01489101 v1

A time-integration based quenching circuit for Geiger-mode avalanche diodes

M. Vignetti , F. Calmon , R. Cellier , P. Pittet , L. Quiquerez et al.
2015 IEEE 13th International New Circuits and Systems Conference (NEWCAS), Jun 2015, Grenoble, France. ⟨10.1109/NEWCAS.2015.7182007⟩
Communication dans un congrès hal-01886653 v1

Oxydation locale d’une couche de titane par AFM pour la réalisation de composants mono-électroniques : étude paramétrée de différents modes de types de pointes

Nicolas Guillaume , Etienne Puyoo , Martine Le Berre , David Albertini , Nicolas Baboux et al.
17èmes Journées Nationales du Réseau Doctoral en Micro-Nanoélectronique, 2014, Lille, France
Communication dans un congrès hal-01489838 v1

Towards Nano-Computing Blocks Using Room Temperature Double-Gate Single Electron Transistors

Mohamed-Amine Bounouar , D. Drouin , Francis Calmon
12th IEEE International New Circuits and Systems Conference (NEWCAS 2014), 2014, Trois-Rivières, Canada
Communication dans un congrès hal-01489822 v1

Investigation of Electrical Characteristics of Multi-Gate Bulk nMOSFET

Inga Jolanta Zbierska , L. Militaru , F. Calmon , Sylvain Feruglio , Guo-Neng Lu
29th International Conference on Microelectronics - MIEL 2014, May 2014, Belgrade, Serbia. pp.95 - 98, ⟨10.1109/MIEL.2014.6842094⟩
Communication dans un congrès hal-01201800 v1

Electrical modeling of 3D interconnects: a set of tools under development

Francis Calmon , Christian Gontrand
Fourth International Workshop on Intelligent Fast Interconnected and Efficient Devices for Frontier Exploitation in Research and Industry, 2014, Madrid, Spain
Communication dans un congrès hal-01490294 v1

3D Integration of CMOS Image Sensor with Coprocessor Using TSV last and Micro-Bumps Technologies

P. Coudrain , Dominique Henry , A. Berthelot , J. Charbonnier , S. Verrun et al.
IEEE 63rd Electronic Components and Technology Conf., May 2013, Las Vegas, United States. pp.674-682
Communication dans un congrès hal-01018405 v1

Experimental Study of a Bulk-Technology Tri-gates nMOSFET

Inga Zbierska , Liviu Militaru , Françis Calmon , Sylvain Feruglio , Guo-Neng Lu
Colloque du GDR Systemes materiels-logiciels integres, Jun 2013, Lyon, France
Communication dans un congrès hal-01217536 v1

Nano fabrication of oxide patterns using Atomic Force Microscopy on titanium towards the development of Nano devices

Guillaume Nicolas , Etienne Puyoo , Martine Le Berre , David Albertini , Nicolas Baboux et al.
ICQNM (Seventh International Conference on Quantum, Nano and Micro Technologies), Aug 2013, Barcelone, Spain
Communication dans un congrès hal-02074965 v1

Room temperature double gate single electron transistor based standard cell library

Mohamed Amine Bounouar , Arnaud Beaumont , Khalil El Hajjam , Francis Calmon , Dominique A Drouin
2012 IEEE/ACM International Symposium on Nanoscale Architectures, Jul 2012, Amsterdam, France. pp.146-151, ⟨10.1145/2765491.2765518⟩
Communication dans un congrès hal-02074668 v1

Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC.

E. Eid , T. Lacrevaz , G. Houzet , C. Bermond , B. Fléchet et al.
IEEE 62nd Electronic Components and Technology Conf.,, May 2012, San Diego, United States
Communication dans un congrès hal-01062188 v1

On the use of nanoelectronic logic cells based on metallic Single Electron Transistors

Mohamed Amine Bounouar , Arnaud Beaumont , Francis Calmon , Dominique A Drouin
2012 13th International Conference on Ultimate Integration on Silicon (ULIS), Mar 2012, Grenoble, France. pp.157-160, ⟨10.1109/ULIS.2012.6193381⟩
Communication dans un congrès hal-02374490 v1

Caractérisation des couplages électriques RF par les substrats de silicium en intégration 3D de circuits

E. Eid , T. Lacrevaz , C. Bermond , S. Capraro , A. Farcy et al.
JNM'11, May 2011, Brest, France
Communication dans un congrès hal-01073528 v1

“Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking” Materials for Advanced Metallization, March 7-10, 2010, Mechelen, Belgium.

Eid E. , Lacrevaz T. , Bermond C. , Rivaz S. De , Capraro S. et al.
Materials for Advanced Metallization, Mechelen, Belgium., Mar 2010, Mechelen, Belgium
Communication dans un congrès hal-01074511 v1

Characterization and Modeling of RF Substrate Coupling Effects due to Vertical Interconnects in 3D Integrated Circuit Stacking

E. Eid , T. Lacrevaz , C. Bermond , S. de Rivaz , S. Capraro et al.
IEEE Signal Propagation on Interconnects,, May 2010, Hidelsheim, Germany
Communication dans un congrès hal-00604327 v1

Frequency and Time Domain Characterization of Substrate Coupling Effects in 3D Integration Stack

E. Eid , T. Lacrevaz , C. Bermond , S. Capraro , J. Roullard et al.
IEEE Int. Electronics Manufacturing Technology Conf.,, Dec 2010, Melaka, Malaysia
Communication dans un congrès hal-00604338 v1

Effets de couplage RF par les substrats de silicium dans les empilements de circuits intégrés 3D

E. Eid , T. Lacrevaz , C. Bermond , S. de Rivaz , S. Capraro et al.
11e Journées Caractérisation Microondes et Matériaux, Apr 2010, Brest, France
Communication dans un congrès hal-00604503 v1

Modélisation RLCG de lignes coplanaires sur un substrat Silicium pour applications CMOS

O. Valorge , F. Calmon , M. Le Berre , C. Gontrand , E. Eid et al.
15e Compatibilité Electromagnétique CEM 2010, Apr 2010, Limoges, France
Communication dans un congrès hal-00604508 v1

Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking

E. Eid , T. Lacrevaz , C. Bermond , S. de Rivaz , S. Capraro et al.
Materials for Advanced Metallization, Mar 2010, Mechelen, Belgium
Communication dans un congrès hal-00604323 v1

Intrinsic Cut Off Frequency of Si and GaAs Based Resonant Tunneling Diodes

E. Buccafurri , R. Clerc , F. Calmon , M. Pala , A. Poncet et al.
Int. Conference on Ultimate Integration of Silicon, Aachen, Mar 2009, Germany. pp.91-94
Communication dans un congrès hal-00604239 v1

Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking

E. Eid , T. Lacrevaz , S. de Rivaz , C. Bermond , B. Fléchet et al.
Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking, Sep 2009, San Francisco, United States
Communication dans un congrès hal-00602866 v1

Challenges and Prospects of RF Oscillators Using Silicon Resonant Tunneling Diodes

E. Buccafurri , A. Medjahdi , F. Calmon , R. Clerc , M. Pala et al.
European Solid-State Device Research Conference, Sep 2009, Athènes, Greece. pp.237-241
Communication dans un congrès hal-00603719 v1

Performances Comparison of Si and GaAs Based Resonant Tunneling Diodes

E. Buccafurri , R. Clerc , F. Calmon , M. Pala , A. Poncet et al.
ISCS 2008, The International Symposium on Compound Semiconductors, Sep 2008, Grenoble, France
Communication dans un congrès hal-00391921 v1

Correlations between DCR and PDP of SPAD integrated in a 28 nm FD-SOI CMOS Technology

Shaochen Gao Gao , Dylan Issartel , Mohammadreza Dolatpoor Lakeh , Fabien Mandorlo , Régis Orobtchouk et al.
2023, International Image Sensor Workshop (IISW), Crieff, United Kingdom, 21-25 May, 2023, May 2023, Crieff, United Kingdom. 2023
Poster de conférence hal-03977945 v1

3D Silicon Coincidence Avalanche Detector (3D-SiCAD) for Hadrontherapy and Proton Tomography : Preliminary Results on Charged Particle Detection

M. Vignetti , F. Calmon , P. Pittet , G. Pares , R. Cellier et al.
Forum de la Recherche en Cancérologie Auvergne-Rhône-Alpes 2017, Apr 2017, Lyon, France
Poster de conférence hal-01504838 v1

ALD growth of Platinum Nanoislands on Alumina for Single Electron Transistors Applications

Daniel Thomas , Etienne Puyoo , Martine Le Berre , Liviu Militaru , S. Koneti et al.
ALD growth of Platinum Nanoislands on Alumina for Single Electron Transistors Applications, 2016, Paris, France. 2016
Poster de conférence hal-01489072 v1

On the behavior of electrically stressed Ti/TiOx/Ti junctions fabricated by local anodic oxidation

Nicolas Guillaume , Etienne Puyoo , M. Le Berre , David Albertini , Nicolas Baboux et al.
On the behavior of electrically stressed Ti/TiOx/Ti junctions fabricated by local anodic oxidation, 2015, Lille, France. 2015
Poster de conférence hal-01489627 v1

Shadow Edge Evaporation for Single Electron Transistors

Daniel Thomas , Etienne Puyoo , Martine Le Berre , Liviu Militaru , David Albertini et al.
Shadow Edge Evaporation for Single Electron Transistors, 2015, Lyon, France. 2015
Poster de conférence hal-01489632 v1

Oxydation locale d’une couche de titane par AFM pour la réalisation de composants mono-électroniques : étude paramétrée de différents modes de types de pointes

Nicolas Guillaume , Etienne Puyoo , Martine Le Berre , David Albertini , Nicolas Baboux et al.
Journées Nationales du Réseau Doctoral en Micro-Nanoélectronique, May 2014, Lille, France
Poster de conférence hal-02075131 v1

Comparison of two conductive AFM probes for the local nano-oxidation of Ti thin films

Nicolas Guillaume , Etienne Puyoo , David Albertini , Nicolas Baboux , Martine Le Berre et al.
Journées Nationales sur les Technologies Emergentes en micro-nanofabrication, May 2013, Evian, France
Poster de conférence hal-02075206 v1

Use of Atomic Force Microscopy towards the Development of Nano Devices by Fabricating Oxide Patterns on Titanium thin Film

Nicolas Guillaume , Etienne Puyoo , David Albertini , Nicolas Baboux , Martine Le Berre et al.
First French-German Summer School on Noncontact Atomic Force Microscopy, Oct 2013, Porquerolles, France
Poster de conférence hal-02075144 v1

Oxydation par AFM de fines couches métalliques pour la réalisation de composants mono-électroniques

Nicolas Guillaume , Etienne Puyoo , Martine Le Berre , David Albertini , Nicolas Baboux et al.
Journées Nationales du Réseau Doctoral en Micro-Nanoélectronique, Jun 2013, Grenoble, France
Poster de conférence hal-02075185 v1

Elaboration by AFM lithography of nanostructured Ti/TiOx/Ti tunnel junction

Nicolas Guillaume , Etienne Puyoo , David Albertini , Nicolas Baboux , Martine Le Berre et al.
Euromat 2013 (European Congress & Exhibition on Advanced Materials and Processes), Sep 2013, Seville, Spain
Poster de conférence hal-02075164 v1

Mixed-Signal IC Design addressed to Substrate Noise Immunity in Bulk Silicon ; towards 3D circuits

Olivier Valorge , Fengyuan Sun , Jean-Etienne Lorival , Francis Calmon , Christian Gontrand
CRC Press, Germany. Mixed-Signal IC Design addressed to Substrate Noise Immunity in Bulk Silicon ; towards 3D circuits, VALORGE, SUN, LORIVAL, CALMON, GONTRAND, 2015
Chapitre d'ouvrage hal-01489586 v1