
Publications
Publications
Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditions2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2023, Graz, Australia. pp.1-12, ⟨10.1109/EuroSimE56861.2023.10100843⟩
Communication dans un congrès
hal-04275342
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Direct heat sink printing on metallized ceramic substrate for power electronics applications: heat treatment identification and its impacts11th International Conference on Integrated Power Electronics Systems, Mar 2020, Berlin, Germany. pp.1-5
Communication dans un congrès
hal-03541453
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Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurementsIEEE 68th Electronic Components and Technology Conference, May 2018, San Diego, United States. pp.748-755, ⟨10.1109/ECTC.2018.00116⟩
Communication dans un congrès
hal-02359827
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Automation of a creep-testing machine for research activitiesInternational Conference on Research and Education in Mechatronics (REM), Jun 2018, Delft, Netherlands. pp.0
Communication dans un congrès
hal-01944240
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Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes7th International Conference on Structural Analysis of Advanced Materials, ICSAAM 2017, Sep 2017, Bucharest, Romania. pp.030009, ⟨10.1063/1.5024159⟩
Communication dans un congrès
hal-02359830
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FE simulation of interfacial delamination between SiO2 thin film and polymeric substrateEuropean Congress and Exhibition on Advanced Materials, EuroMat 2017, Sep 2017, Thessaloniki, Greece. pp.0
Communication dans un congrès
hal-02359883
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Mechanical fatigue assessment of SAC305 solder joints under harmonic and random vibrations17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016), Apr 2016, Dresden, Germany. pp. 1-8, ⟨10.1109/EuroSimE.2016.7463294⟩
Communication dans un congrès
hal-01449177
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Mechanical adhesion of SIO2 thin film on a polymeric substrate under compressive stressXXXI International Conference on Surface Modification Technologies (SMT31), Jul 2016, Mons, Belgium. pp.1-10
Communication dans un congrès
hal-02359832
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A comparative study of microscratch and microtensile adhesion tests for nickel coatings on various substratesDTIP 2-4 April 2014,, Apr 2014, Cannes, France. pp.0
Communication dans un congrès
hal-04080168
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Parametric identification of elastic-plastic constitutive laws using spherical indentation5th International Symposium on Aircraft Materials - ACMA 2014, Apr 2014, Marrakech, Morocco. pp. 1-8
Communication dans un congrès
hal-03667152
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Study and mechanical characterization of high temperature power electronic packagingCFM 2013 - 21ème Congrès Français de Mécanique, Aug 2013, Bordeaux, France
Communication dans un congrès
hal-03440495
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Ball-burnishing process influence on hardness ans residual stresses of aluminium A9201717th International Research/Expert Conference "Trends in the Development of Machinery and Associated Technology, Sep 2013, Istanbul, Turkey
Communication dans un congrès
hal-00933397
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Etude expérimentale du soudage par laser YAG de l'alliage base nickel Hastelloy XJournées Annuelles de la SF2M, Oct 2013, Villeneuve d'Ascq, France. pp.0, ⟨10.1051/matecconf/20130702011⟩
Communication dans un congrès
hal-04003308
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Caractérisation expérimentale du comportement mécanique d’assemblage haute température pour l’électronique de puissanceJournées annuelles de la SF2M, Oct 2013, Villeuve d'Ascq, France. pp.0, ⟨10.1051/matecconf/20130702013⟩
Communication dans un congrès
hal-04003305
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Numerical modeling and prediction of thermomechanical degradation of power electronic packagingICSAAM 2013, The 5th International Conference on Structural Analysis of Advanced Materials, Sep 2013, Island of Kos, Greece
Communication dans un congrès
hal-00944556
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Study of the localized corrosion of over-aged aeronautical 2024 aluminum alloy. Kelvin probe Force Microscopy (KFM) applicationACMA 2012, May 2012, Fez, Morocco
Communication dans un congrès
hal-00933398
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Corrosion and stress corrosion cracking behaviour of 2050 aluminium-lithium alloy joined by friction stir welding (FSW)EUROCORR 2012, Sep 2012, Istanbul, Turkey. pp.0
Communication dans un congrès
hal-04104017
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Etude du comportement mécanique des joints de brasure Au-Ge pour le report des composants SiC pour l'électronique de puissance haute température14ème édition de la Conférence Electronique de Puissance du Futur, Jul 2012, Bordeaux, France
Communication dans un congrès
hal-00944560
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Viscoplastic behavior of diamond die attach subjected to high temperature conditions13th International conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, EuroSimE 2012, Apr 2012, Lisbon, Portugal. pp.1-6
Communication dans un congrès
hal-04003394
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Focus on the interactions between artificial microstructural ageing and susceptibility to localized corrosion under cyclic corrosion tests of an aeronautic 2024-T351 aluminium alloyEUROCORR 2012, Sep 2012, Istanbul, Turkey. pp.0
Communication dans un congrès
hal-04086637
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Implémentation d'une loi de comportement basée sur un potentiel viscoplastique couplé à l'endommagement poreux: application à un alliage d'électronique de puissanceCFM 2011 - 20ème Congrès Français de Mécanique, Aug 2011, Besançon, France
Communication dans un congrès
hal-03422655
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Mechanical and Surface Properties of Chemical Vapour Deposited Protective Aluminium Oxide Films on TA6V AlloyCIMTEC 2010 - 12th International Ceramics Congress Part E, Jun 2010, Montecatini Terme, Italy. pp.66-73
Communication dans un congrès
hal-04093346
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Micro-scale modeling of carbon-fiber reinforced thermoplastic materials5th International Conference on Advances in Mechanical Engineering and Mechanics, Dec 2010, Hammamet, Tunisia
Communication dans un congrès
hal-00944565
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Impact of disturbed drilling conditions on the surface integrity of a Nickel-base superalloyCIRP ICME '10 - 7th CIRP International Conference on INTELLIGENT COMPUTATION IN MANUFACTURING ENGINEERING, Jun 2010, Capri, Italy
Communication dans un congrès
hal-00944562
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Mechanical characterization of an Au-Ge solder alloy for high temperature electronic devices6th International Conference on Integrated Power Electronics Systems (CIPS), Mar 2010, Nuremberg, Germany
Communication dans un congrès
hal-00933399
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Potabilisation de l’eau par filtration membranaire : étude expérimentale des mécanismes de transfert des bactéries à travers la structure poreuse.11ème Congrès de la Société Française de Génie des Procédés, Oct 2007, Saint-Etienne, France. pp.0
Communication dans un congrès
hal-04106093
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Characterization of refractory titanium alloys welded by TIG and laser processes11th World Conference on Titanium, Jun 2007, Kyoto, Japan. pp.1361-1364
Communication dans un congrès
hal-04030525
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Adherence of coatings: determination - problems - examples21st international conference on surface modification technologies, Sep 2007, Paris, France. pp.0
Communication dans un congrès
hal-04106648
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Modélisation des assemblages de ballons pressurisés stratosphériques8e Colloque national en calcul des structures, CSMA, May 2007, Giens, France
Communication dans un congrès
hal-01492457
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Composite Coatings with Talc ParticlesVth International Colloquium on Chromium Plating, May 2004, Saint-etienne, France
Communication dans un congrès
hal-00201703
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Deposition of Aluminium Nitride films by Plasma enhanced chemical vapour deposition18th Int. Conf. on Surface Modification Technologies (SMT18), Nov 2004, Dijon, France
Communication dans un congrès
hal-01741696
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Un procédé conventionnel pour de nouveaux matériaux :les revêtements composites métal / particulesSURFAIR 2004, Jun 2004, Toulouse, France
Communication dans un congrès
hal-00201720
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High temperature oxidation behaviour and creep properties of ods alloy PM200014th international plansee seminar, May 1997, Reutte, Austria. p.869-886
Communication dans un congrès
hal-01799155
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Effects of WAAM Process Parameters on Metallurgical and Mechanical Properties of Ti-6Al-4V DepositsAdvances in Materials, Mechanics and Manufacturing, pp.26-35, 2019, ⟨10.1007/978-3-030-24247-3_4⟩
Chapitre d'ouvrage
hal-02485067
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Understanding mechanisms of adhesion of SiO2 thin films evaporated on a polymeric substrate43th International Conference on Metallurgical Coatings and Thin Films (ICMCTF), Apr 2016, San Diego, United States. Proceedings of the 43th International Conference on Metallurgical Coatings and Thin Films (ICMCTF), pp.0, 2016
Poster de conférence
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