
Karim Inal
57
Documents
Présentation
Thèse Orsay-ENSAM, ATER ENSAM Paris, MCF ENSAM Metz puis Aix en Provence, Pr ENSMSE Gardanne, Pr MinesParisTech Sophia
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Publications
Discharge frequency and reagents choice effects on robustness of silicon nitride (Si3N4) thin layers deposited by PECVD (Plasma-Enhanced Chemical Vapor Deposition)European Conference on Heat Treatment and Surface Engineering, Jun 2017, Nice, France
Communication dans un congrès
hal-01721378
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The impact of nitrogen plasma treatments on SixNyHz moisture sensitivityConference on Plasma Based Ion Implantation & Deposition, Oct 2017, Shanghai, France
Communication dans un congrès
hal-01721379
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Etude XPS de la ré-oxydation de films de Nichrome dans la chambre d'analyse lors du profilage séquentiel par érosionELSPEC'16, 7eme conférence francophone sur les spectroscopies d’électrons, May 2016, Versailles_Meudon, France
Communication dans un congrès
hal-01444740
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Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, Singapore. pp.346-351, ⟨10.1109/EPTC.2015.7412333⟩
Communication dans un congrès
hal-01354249
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Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p. - ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
Communication dans un congrès
hal-01247921
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On the material depletion rate due to electromigration in a copper TSV structure 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , IEEE, Oct 2014, S. Lake Tahoe, California, United States. pp.111-114 - ISBN 978-1-4799-7308-8 ⟨10.1109/IIRW.2014.7049523⟩
Communication dans un congrès
hal-01298215
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Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.975-981, ⟨10.4028/www.scientific.net/AMR.996.975⟩
Communication dans un congrès
hal-01063670
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Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.930-935, ⟨10.4028/www.scientific.net/AMR.996.930⟩
Communication dans un congrès
hal-01063661
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CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 8 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813808⟩
Communication dans un congrès
hal-01024448
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Hemispherical curved monolithic cooled and uncooled infrared focal plane arrays for compact camerasInfrared Technology and Applications XL, May 2014, Baltimore, United States. art. no. 90702T - 8 p., ⟨10.1117/12.2049967⟩
Communication dans un congrès
hal-01060488
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Determination of material properties and failure using in-situ thermo-mechanical probe2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. pp.Article number 7056700 - ISBN 978-2-35500-028-7, ⟨10.1109/DTIP.2014.7056700⟩
Communication dans un congrès
hal-01143767
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Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 6 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813834⟩
Communication dans un congrès
hal-01024062
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INVESTIGATION OF BORON AND NITROGEN ION BEAM IMPLANTATION IN GOLD THIN FILMS FOR OHMIC MEMS SWITCH CONTACT IMPROVEMENTTansducers and Eurosensors XXVII, Jun 2013, Barcelona, Spain
Communication dans un congrès
emse-00840099
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First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4
Communication dans un congrès
hal-01052908
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Mechanical behavior of flexible silicon devices curved in spherical configurations14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wroclaw, Poland. 7 p. - Article number 6529978, ⟨10.1109/EuroSimE.2013.6529978⟩
Communication dans un congrès
hal-00857209
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Selective Sintering of Inkjet-Printed Silver Inks Using Variable Frequency MicrowaveGlobal Congress on Microwave Energy Applications, Jul 2012, Long Beach, California, United States
Communication dans un congrès
emse-00714123
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Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packagesMiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01
Communication dans un congrès
emse-00691806
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Micro-mechanical modeling of brittle fracture of French RPV steel - A comprehensive study of stress triaxiality effectASME 2008 Pressure Vessels and Piping Conference, Jul 2008, Chicago, United States. pp.Volume 6: Materials and Fabrication, Parts A and B, ⟨10.1115/PVP2008-61334⟩
Communication dans un congrès
hal-00671909
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Optimal sintering technologies applied to inkjet-printed silver nanoparticles for microelectronics applicationsInternational Conference on Sintering 2011, Aug 2011, Jeju, South Korea
Communication dans un congrès
emse-00638031
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Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in MicroelectronicsMaterials Research Society Spring Meeting, 2011, San Francisco, United States. pp.O8.10, ⟨10.1557/opl.2011.1264⟩
Communication dans un congrès
emse-00576968
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Printed Ag nanoparticles on Evaporated Au System: Impact of Microstructure on Mechanical and Electrical PropertiesEuropean Materials Research Society Spring Meeting, May 2011, Nice, France
Communication dans un congrès
emse-00594778
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Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulationInternational Interconnect Technology Conference and Materials for Advanced Metallization 2011, May 2011, Dresde, Germany. pp.1-3, ⟨10.1109/IITC.2011.5940351⟩
Communication dans un congrès
emse-00638030
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Analyse de déformations et contraintes locales par couplage EBSD et microdiffraction KosselMatériaux 2010, Oct 2010, Nantes, France. pp.0461
Communication dans un congrès
emse-00533744
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Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packagesESTC 2010. Electronics System Integration Technology Conference, Sep 2010, Berlin, Germany. pp.AP-4, ⟨10.1109/ESTC.2010.5642997⟩
Communication dans un congrès
emse-00530148
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Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic ModelingElectronics System Integration Technology Conference ESTC 2010, Sep 2010, Berlin, Germany. pp.P0027, ⟨10.1109/ESTC.2010.5642863⟩
Communication dans un congrès
emse-00533813
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Microstructure evolution of gold thin films under spherical indentation for micro switches contact applicationsEuropean Materials Research Society 2010, Jun 2010, Strasbourg, France
Communication dans un congrès
emse-00554023
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Nanoindentation de couches dures ultramines de ruthénium sur orMateriaux 2010, Oct 2010, Nantes, France. pp.0641
Communication dans un congrès
emse-00533722
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Time dependence investigation of the electrical resistance of Au / Au thin film micro contacts25th International Conference on Electrical Contacts & 56th IEEE Holm Conference on Electrical Contacts, Oct 2010, Charleston, United States. pp.58-64, ⟨10.1109/HOLM.2010.5619563⟩
Communication dans un congrès
emse-00533805
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Mechanical study of the probing effect on PAD structuresARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Communication dans un congrès
emse-00470630
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Direct-writing of conductive patterns based on printed and sintered silver nanoparticlesARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Communication dans un congrès
emse-00470613
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Effect of Packaging Design on Wire Bond Interconnection ReliabilityARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Communication dans un congrès
emse-00470634
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Hierarchical image analysis for roughness characterization5th International Colloquium Micro-Tribology '09, Sep 2009, Milowka, Poland
Communication dans un congrès
emse-00470605
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Thermal optimization of silver nanoparticles sintering for low resistive printed applicationsMME 09. 20th MicroMechanics Europe Workshop, Sep 2009, Toulouse, France. pp.D07/ 1-4
Communication dans un congrès
emse-00466405
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stress determination with Kossel microdiffraction in a scanning electron microscope7th European Conference on Residual Stresses (ECRS7, Berlin, Jan 2006, Germany
Communication dans un congrès
hal-00111936
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A crystallographic approach of brittle fracture in the 16MND5 bainitic steel. In-situ X-ray diffraction and scanning electron microscope measurements at low temperatures9th European Mechanics of Materials Conference/ Euromech Mecamat 2006/ Local approach to fracture, May 2006, Moret-sur-Loing, France
Communication dans un congrès
hal-01342979
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Modélisation et simulation du comportement thermomécanique des aciers austénitiques à effet TWIP (TWinning Induced Plasticity)17e Congrès Français de Mécanique, 2005, Troyes, France. pp.1-6
Communication dans un congrès
hal-04275411
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Impression et recuit de nanoparticules métalliques pour l’électronique impriméeTechniques de l'Ingénieur, Référence RE 222lab et Doc. RE 222, Editions T.I., 27 + 5 p., 2014
Chapitre d'ouvrage
hal-01107859
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