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Karim Inal

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Thèse Orsay-ENSAM, ATER ENSAM Paris, MCF ENSAM Metz puis Aix en Provence, Pr ENSMSE Gardanne, Pr MinesParisTech Sophia

Publications

Micro-Indentation of oxidized low carbon steel to evaluate properties of oxides

Victor Claverie-Burgué , Pierre Montmitonnet , Karim Inal , Alain Burr , Alexis Nicolaÿ
IOP Conference Series: Materials Science and Engineering, 2022, 1270 (1), pp.012106. ⟨10.1088/1757-899X/1270/1/012106⟩
Journal articles hal-03924281v1

Investigations of Thermomechanical Stress Induced by TSV-Middle (Through-Silicon via) in 3-D ICs by Means of CMOS Sensors and Finite-Element Method

Komi Atchou Ewuame , Vincent Fiori , Karim Inal , Pierre-Olivier Bouchard , Sebastien Gallois-Garreignot
IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, 2015, 5 (8), pp.1085-1092 - Article number 7164297. ⟨10.1109/TCPMT.2015.2445099⟩
Journal articles hal-01221158v1

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence

Simon Gousseau , Stéphane Moreau , David Bouchu , Alexis Farcy , Pierre Montmitonnet
Microelectronics Reliability, 2015, 55 (8), pp.1205-1213. ⟨10.1016/j.microrel.2015.05.019⟩
Journal articles hal-01166314v1

Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect

Sebastian Orellana , Brice Arrazat , Pascal Fornara , Christian Rivero , Sylvain Blayac
Microelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1896-1900. ⟨10.1016/j.microrel.2015.06.032⟩
Journal articles hal-01180626v1

Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices

Kokou Adokanou , Karim Inal , Pierre Montmitonnet , Francis Pressecq , Barbara Bonnet
Microelectronics Reliability, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩
Journal articles hal-01180774v1

From stress sensor towards back end of line embedded thermo-mechanical sensor

Brice Arrazat , Sebastian Orellana , Christian Rivero , P. Fornara , Antonio Di Giacomo
Microelectronic Engineering, 2014, 120, pp.41-46. ⟨10.1016/j.mee.2013.12.013⟩
Journal articles hal-00932762v1
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Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticles

Romain Cauchois , Mohamed Saadaoui , Abdelwahhab Yakoub , Karim Inal , Béatrice Dubois-Bonvalot
Journal of Materials Science, 2012, 47 (20), pp.7110-7116. ⟨10.1007/s10853-012-6366-6⟩
Journal articles emse-00673215v1

Selective image analysis for roughness characterisation

Pierre-Yves Duvivier , Vincent Mandrillon , Karim Inal
Tribology - Materials, Surfaces & Interfaces, 2010, 4 (3), pp.136-143
Journal articles emse-00533815v1
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A micromechanical interpretation of the temperature dependence of Beremin model parameters for french RPV steel

Jean-Philippe Mathieu , Karim Inal , Sophie Berveiller , Olivier Diard
Journal of Nuclear Materials, 2010, 406 (1), pp.97-112. ⟨10.1016/j.jnucmat.2010.02.025⟩
Journal articles hal-00833671v1
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Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperatures

Raphaël Pesci , Karim Inal , Renaud Masson
Materials Science and Engineering: A, 2009, 527 (1-2), pp.376-386. ⟨10.1016/j.msea.2009.08.020⟩
Journal articles hal-01166251v1

Residual stress estimation in damascene copper interconnects using embedded sensors

Renaud Vayrette , C. Rivero , B. Gros , Sylvain Blayac , Karim Inal
Microelectronic Engineering, 2009, 87 (3), pp.412-415. ⟨10.1016/j.mee.2009.05.017⟩
Journal articles emse-00450882v1

Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperatures

Raphaël Pesci , Karim Inal , Renaud Masson
Materials Science and Engineering: A, 2009, 527 (1-2), pp.376-386. ⟨10.1016/j.msea.2009.08.020⟩
Journal articles emse-00466384v1

Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications

Mamadou Diobet Diop , Vincent Mandrillon , Hervé Boutry , Karim Inal , Roland Fortunier
Microelectronic Engineering, 2009, 87 (3), pp.522-526. ⟨10.1016/j.mee.2009.07.020⟩
Journal articles emse-00450478v1

Modelling the behaviour of polycrystalline austenitic steel with twinning-induced plasticity effect

N. Shiekhelsouk , V. Favier , Karim Inal , M. Cherkaoui
International Journal of Plasticity, 2009, 25 (1), pp.105-133. ⟨10.1016/j.ijplas.2007.11.004⟩
Journal articles emse-00429576v1

Numerical investigations of smart card module: parametric analysis and design optimization

Man Su , Xavier Boddaert , Karim Inal
IEEE Transactions on Device and Materials Reliability, 2008, 8 (3), pp.464-470. ⟨10.1109/TDMR.2008.2002347⟩
Journal articles emse-00476018v1
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Inter- and Intragranular Stress Determination with Kossel Microdiffraction in a Scanning Electron Microscope

Raphaël Pesci , Karim Inal , Sophie Berveiller , Etienne Patoor , Jean-Sébastien Lecomte
Materials Science Forum, 2006, 524-525, pp.109-114. ⟨10.4028/www.scientific.net/MSF.524-525.109⟩
Journal articles hal-01213863v1
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Grain and phase stress criteria for behaviour and cleavage in duplex and bainitic steels

Karim Inal , Raphaël Pesci , Jean-Lou Lebrun , Olivier Diard , Renaud Masson
Fatigue and Fracture of Engineering Materials and Structures, 2006, 29 (9-10), pp.685-696. ⟨10.1111/j.1460-2695.2006.01056.x⟩
Journal articles hal-01203493v1
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Stress distribution and cleavage analysis in a 16MnNiMo5 bainitic steel X-ray diffraction and multiscale polycrystalline modelling

Raphaël Pesci , Karim Inal , Renaud Masson
Journal of Materials Science and Technology, 2004, 20 (Suppl. 1), pp.32-34
Journal articles hal-01187577v1
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Distribution des contraintes dans l’acier bainitique 16MND5. Analyse expérimentale et modélisation polycristalline

Raphaël Pesci , Karim Inal , Marcel Berveiller , Renaud Masson
Mechanics & Industry, 2003, 4 (4), pp.457-465. ⟨10.1016/S1296-2139(03)00075-7⟩
Journal articles hal-01203593v1
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Internal Stress Analysis for the Damage Study of a 16MND5 Bainitic Steel

Raphaël Pesci , Karim Inal , Marcel Berveiller , Jean-Lu Lebrun
Materials Science Forum, 2002, 404-407, pp.641-646. ⟨10.4028/www.scientific.net/MSF.404-407.641⟩
Journal articles hal-01245099v1

The impact of nitrogen plasma treatments on SixNyHz moisture sensitivity

Catheline Cazako , Karim Inal , Alain Burr , Frédéric Georgi
Conference on Plasma Based Ion Implantation & Deposition, Oct 2017, Shanghai, France
Conference papers hal-01721379v1

Discharge frequency and reagents choice effects on robustness of silicon nitride (Si3N4) thin layers deposited by PECVD (Plasma-Enhanced Chemical Vapor Deposition)

Catheline Cazako , Karim Inal , Alain Burr , Frédéric Georgi , Rodolphe Cauro
European Conference on Heat Treatment and Surface Engineering, Jun 2017, Nice, France
Conference papers hal-01721378v1

Etude XPS de la ré-oxydation de films de Nichrome dans la chambre d'analyse lors du profilage séquentiel par érosion

Frédéric Georgi , Romain Macabies , Muriel Bouttemy , Damien Aureau , Karim Inal
ELSPEC'16, 7eme conférence francophone sur les spectroscopies d’électrons, May 2016, Versailles_Meudon, France
Conference papers hal-01444740v1
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Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testing

Kokou Adokanou , Karim Inal , Pierre Montmitonnet , Frédéric Courtade , Barbara Bonnet
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p. - ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
Conference papers hal-01247921v1

Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts

Komi Atchou Ewuame , Pierre-Olivier Bouchard , Vincent Fiori , Sebastien Gallois-Garreignot , Karim Inal
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, Singapore. pp.346-351, ⟨10.1109/EPTC.2015.7412333⟩
Conference papers hal-01354249v1

On the material depletion rate due to electromigration in a copper TSV structure

Roberto Lacerda de Orio , Simon Gousseau , Stéphane Moreau , Hajdin Ceric , Siegfried Selberherr
2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) , IEEE, Oct 2014, S. Lake Tahoe, California, United States. pp.111-114 - ISBN 978-1-4799-7308-8 ⟨10.1109/IIRW.2014.7049523⟩
Conference papers hal-01298215v1

Determination of material properties and failure using in-situ thermo-mechanical probe

Brice Arrazat , Sebastian Orellana , C. Rivero , P. Fornara , Antonio Di Giacomo
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014, Apr 2014, Cannes, France. pp.Article number 7056700 - ISBN 978-2-35500-028-7, ⟨10.1109/DTIP.2014.7056700⟩
Conference papers hal-01143767v1

Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technology

Romain Cauchois , András Borbély , Patrice Gergaud , Mohamed Saadaoui , Karim Inal
9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.930-935, ⟨10.4028/www.scientific.net/AMR.996.930⟩
Conference papers hal-01063661v1

Hemispherical curved monolithic cooled and uncooled infrared focal plane arrays for compact cameras

Kévin Tekaya , Manuel Fendler , Delphine Dumas , Yann Gaeremynck , David Henry
Infrared Technology and Applications XL, May 2014, Baltimore, Maryland, United States. art. no. 90702T - 8 p., ⟨10.1117/12.2049967⟩
Conference papers hal-01060488v1

CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon

Komi Atchou Ewuame , Vincent Fiori , Karim Inal , Pierre-Olivier Bouchard , Sébastien Gallois-Garreignot
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 8 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813808⟩
Conference papers hal-01024448v1

Investigation of TSV induced thermo-mechanical stress: Implementation of piezoresistive sensors and correlation with simulation

Komi Atchou Ewuame , Vincent Fiori , Karim Inal , Pierre-Olivier Bouchard , Sébastien Gallois-Garreignot
9th European Conference on Residual Stresses, ECRS 2014, Jul 2014, Troyes, France. pp.975-981, ⟨10.4028/www.scientific.net/AMR.996.975⟩
Conference papers hal-01063670v1

Improvement of freestanding CMOS-MEMS through detailed stress analysis in metallic layers

Sebastian Orellana , Brice Arrazat , P. Fornara , Christian Rivero , Antonio Di Giacomo
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Apr 2014, Ghent, Belgium. 6 p. - ISBN 978-1-4799-4791-1, ⟨10.1109/EuroSimE.2014.6813834⟩
Conference papers hal-01024062v1

Mechanical behavior of flexible silicon devices curved in spherical configurations

Kévin Tekaya , Manuel Fendler , Karim Inal , Elisabeth Massoni , Herve Ribot
14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wroclaw, Poland. 7 p. - Article number 6529978, ⟨10.1109/EuroSimE.2013.6529978⟩
Conference papers hal-00857209v1

First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures

Simon Gousseau , Stéphane Moreau , David Bouchu , Alexis Farcy , Pierre Montmitonnet
39th International Symposium for Testing and Failure Analysis - ISTFA 2013, Nov 2013, San Jose, California, United States. pp.59-68 - ISBN 978-1-62708-022-4
Conference papers hal-01052908v1
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INVESTIGATION OF BORON AND NITROGEN ION BEAM IMPLANTATION IN GOLD THIN FILMS FOR OHMIC MEMS SWITCH CONTACT IMPROVEMENT

Brice Arrazat , Karim Inal , Patrice Gergaud
Tansducers and Eurosensors XXVII, Jun 2013, Barcelona, Spain
Conference papers emse-00840099v1

Selective Sintering of Inkjet-Printed Silver Inks Using Variable Frequency Microwave

Romain Cauchois , Daniel Żymełka , Karim Inal , Mohamed Saadaoui
Global Congress on Microwave Energy Applications, Jul 2012, Long Beach, California, United States
Conference papers emse-00714123v1
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Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages

Romain Cauchois , Mohamed Saadaoui , Jacques Legeleux , Thierry Malia , Béatrice Dubois-Bonvalot
MiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01
Conference papers emse-00691806v1

Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation

François Le Texier , Jessica Mazuir , Man Su , Mohamed Saadaoui , Jean-Luc Liotard
International Interconnect Technology Conference and Materials for Advanced Metallization 2011, May 2011, Dresde, Germany. pp.1-3, ⟨10.1109/IITC.2011.5940351⟩
Conference papers emse-00638030v1

Optimal sintering technologies applied to inkjet-printed silver nanoparticles for microelectronics applications

Romain Cauchois , Mohamed Saadaoui , Abdelwahhab Yakoub , Karim Inal , Béatrice Dubois-Bonvalot
International Conference on Sintering 2011, Aug 2011, Jeju, South Korea
Conference papers emse-00638031v1

Printed Ag nanoparticles on Evaporated Au System: Impact of Microstructure on Mechanical and Electrical Properties

Romain Cauchois , Mohamed Saadaoui , Karim Inal , Béatrice Dubois-Bonvalot , Jean-Christophe Fidalgo
European Materials Research Society Spring Meeting, May 2011, Nice, France
Conference papers emse-00594778v1
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Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics

Romain Cauchois , Mohamed Saadaoui , Karim Inal , Béatrice Dubois-Bonvalot , Jean-Christophe Fidalgo
Materials Research Society Spring Meeting, 2011, San Francisco, United States. pp.O8.10, ⟨10.1557/opl.2011.1264⟩
Conference papers emse-00576968v1

Nanoindentation de couches dures ultramines de ruthénium sur or

Brice Arrazat , Vincent Mandrillon , Karim Inal
Materiaux 2010, Oct 2010, Nantes, France. pp.0641
Conference papers emse-00533722v1
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Microstructure evolution of gold thin films under spherical indentation for micro switches contact applications

Brice Arrazat , Vincent Mandrillon , Karim Inal , Maxime Vincent , Christophe Poulain
European Materials Research Society 2010, Jun 2010, Strasbourg, France
Conference papers emse-00554023v1

Time dependence investigation of the electrical resistance of Au / Au thin film micro contacts

Pierre-Yves Duvivier , Vincent Mandrillon , Karim Inal
25th International Conference on Electrical Contacts & 56th IEEE Holm Conference on Electrical Contacts, Oct 2010, Charleston, United States. pp.58-64, ⟨10.1109/HOLM.2010.5619563⟩
Conference papers emse-00533805v1

Analyse de déformations et contraintes locales par couplage EBSD et microdiffraction Kossel

Denis Bouscaud , Sophie Berveiller , Raphael Pesci , Claire Maurice , Roland Fortunier
Matériaux 2010, Oct 2010, Nantes, France. pp.0461
Conference papers emse-00533744v1

Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling

Romuald Roucou , Vincent Fiori , Karim Inal , Hervé Jaouen
Electronics System Integration Technology Conference ESTC 2010, Sep 2010, Berlin, Germany. pp.P0027, ⟨10.1109/ESTC.2010.5642863⟩
Conference papers emse-00533813v1
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Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

Romain Cauchois , Mohamed Saadaoui , Jacques Legeleux , Thierry Malia , Béatrice Dubois-Bonvalot
ESTC 2010. Electronics System Integration Technology Conference, Sep 2010, Berlin, Germany. pp.AP-4, ⟨10.1109/ESTC.2010.5642997⟩
Conference papers emse-00530148v1

Hierarchical image analysis for roughness characterization

Pierre-Yves Duvivier , Vincent Mandrillon , Jean-Philippe Polizzi , Karim Inal
5th International Colloquium Micro-Tribology '09, Sep 2009, Milowka, Poland
Conference papers emse-00470605v1

Mechanical study of the probing effect on PAD structures

Romuald Roucou , Florian Cacho , Vincent Fiori , Karim Inal , Xavier Boddaert
ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Conference papers emse-00470630v1

Contraintes résiduelles dans les interconnexions submicroniques. Prise en compte des dimensions des lignes de cuivre par microcapteurs embarqués

Renaud Vayrette , Sylvain Blayac , Christian Rivero , Karim Inal
Congrès Français de Mécanique CFM'2009, Aug 2009, Marseille, France. pp.1326
Conference papers emse-00466583v1

Effect of Packaging Design on Wire Bond Interconnection Reliability

Man Su , Karim Inal , Xavier Boddaert
ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Conference papers emse-00470634v1

Direct-writing of conductive patterns based on printed and sintered silver nanoparticles

Romain Cauchois , Mohamed Saadaoui , Karim Inal , Béatrice Dubois-Bonvalot , Jean-Cristophe Fidalgo
ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Conference papers emse-00470613v1

Thermal optimization of silver nanoparticles sintering for low resistive printed applications

Romain Cauchois , Mohamed Saadaoui , Karim Inal , Béatrice Dubois-Bonvalot , J.-C. Fidalgo
MME 09. 20th MicroMechanics Europe Workshop, Sep 2009, Toulouse, France. pp.D07/ 1-4
Conference papers emse-00466405v1
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Micro-mechanical modeling of brittle fracture of French RPV steel - A comprehensive study of stress triaxiality effect

Jean-Philippe Mathieu , Karim Inal , Sophie Berveiller , Olivier Diard
ASME 2008 Pressure Vessels and Piping Conference, Jul 2008, Chicago, United States. pp.Volume 6: Materials and Fabrication, Parts A and B, ⟨10.1115/PVP2008-61334⟩
Conference papers hal-00671909v1

stress determination with Kossel microdiffraction in a scanning electron microscope

Sophie Berveiller , Etienne Patoor , Jean-Sébastien Lecomte , Karim Inal , A. Eberhardt
7th European Conference on Residual Stresses (ECRS7, Berlin, Jan 2006, Germany
Conference papers hal-00111936v1
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A crystallographic approach of brittle fracture in the 16MND5 bainitic steel. In-situ X-ray diffraction and scanning electron microscope measurements at low temperatures

Raphaël Pesci , Karim Inal , Renaud Masson
9th European Mechanics of Materials Conference/ Euromech Mecamat 2006/ Local approach to fracture, May 2006, Moret-sur-Loing, France
Conference papers hal-01342979v1
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Modélisation et simulation du comportement thermomécanique des aciers austénitiques à effet TWIP (TWinning Induced Plasticity)

Mohamad Najeeb Shiekhelsouk , Véronique Favier , Karim Inal , Mohamed Cherkaoui
17e Congrès Français de Mécanique, 2005, Troyes, France. pp.1-6
Conference papers hal-04275411v1

Impression et recuit de nanoparticules métalliques pour l’électronique imprimée

Romain Cauchois , Mohamed Saadaoui , Karim Inal
Techniques de l'Ingénieur, Référence RE 222lab et Doc. RE 222, Editions T.I., 27 + 5 p., 2014
Book sections hal-01107859v1