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Développement et évaluation fonctionnelle d’un convertisseur électronique de puissance sur substrat PLA
Camille Herlent
,
Guillaume Hérault
,
Nouh Zeggai
,
Hattali, M L
,
Morgan Almanza
et al.
Journée technique - Le Packaging Electronique Durable, IEEE-EPS France, Dec 2024, Grenoble, France
Communication dans un congrès
hal-04830163
v1
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État de l'art de la recherche vers une électronique de puissance soutenable
Bruno Allard
,
Morgan Almanza
,
Matthieu Beley
,
H. Ben Ahmed
,
Daniel Chatroux
et al.
Symposium de Génie Electrique (SGE2023), Jul 2023, Lille, France
Communication dans un congrès
hal-04244521
v1
|
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Optimal energy management of offshore wind farms considering the combination of overplanting and dynamic rating
Ildar Daminov
,
Anne Blavette
,
Salvy Bourguet
,
Hamid Ben Ahmed
,
Pierre Warlop
et al.
Cigré Paris session, Aug 2022, Paris, France
Communication dans un congrès
hal-03767635
v1
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TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges
Wendpanga-Fadel Bikinga
,
Bachir Mezrag
,
Yvan Avenas
,
Jean-Luc Schanen
,
Jean-Michel Guichon
et al.
Communication dans un congrès
hal-03629431
v1
|
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In-situ condition monitoring system to study the ageing of power semi-conductor devices in photovoltaic inverters
Mouhannad Dbeiss
,
Yvan Avenas
,
Henri Zara
,
Laurent Dupont
CIPS 2018, Mar 2018, stuutgart, Germany
Communication dans un congrès
hal-01753108
v1
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Thermal characterization of an IGBT power module with on-die temperature sensors
Badr El Boudour Bidouche
,
Yvan Avenas
,
Mouslim Essakili
,
Laurent Dupont
APEC 2017 - IEEE Applied Power Electronics Conference and Exposition, May 2017, Tampa, United States. pp. 2317-2322, ⟨10.1109/APEC.2017.7931023⟩
Communication dans un congrès
hal-01687242
v1
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Evaluation of multi-void and drain metallization thickness effects on the electro thermal behavior of Si MOSFET under forward bias conditions
Son Ha Tran
,
Laurent Dupont
,
Zoubir Khatir
Communication dans un congrès
hal-01703938
v1
|
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A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles
Mouhannad-G Dbeiss
,
Yvan Avenas
,
Henri Zara
,
Laurent Dupont
Communication dans un congrès
hal-01689604
v1
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Instrumented chip dedicated to semiconductor temperature measurements in power electronic converters
Ibrahima Ka
,
Yvan Avenas
,
Laurent Dupont
,
Raha Vafaei
,
Benoît Thollin
et al.
Communication dans un congrès
hal-01684165
v1
|
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Instrumented Chip Dedicated to Semiconductor Temperature Measurements in Power Electronic Converters
Ibrahima Ka
,
Yvan Avenas
,
Laurent Dupont
,
Raha Vafaei
,
Benoit Thollin
et al.
Energy Conversion Congress and Exposition (ECCE 2016), Oct 2016, Milwaukee, United States
Communication dans un congrès
hal-01377217
v1
|
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Développement d'une puce instrumentée adaptée à la mesure de température dans les modules de puissance
Ibrahima Ka
,
Yvan Avenas
,
Laurent Dupont
,
Mickael Petit
2ème Symposium de Génie Electrique (SGE 2016), Jun 2016, Grenoble, France
Communication dans un congrès
hal-01466194
v2
|
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Experimental Evaluation of IGBT Junction Temperature Measurement via a Modified-VCE (VCE_VGE) Method with Series Resistance Removal
Nick Baker
,
Francesco Iannuzzo
,
Stig Munk-Nielsen
,
Laurent Dupont
,
Yvan Avenas
CIPS2016 - 9th Conference on Integrated Power Electronics Systems, Mar 2016, Nuremberg, Germany. 6p
Communication dans un congrès
hal-01466153
v1
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Experimental evaluation of IGBT junction temperature measurement via peak gate current
Nick Baker
,
Stig Munk-Nielsen
,
Francesco Iannuzzo
,
Laurent Dupont
,
Marco Liserre
EPE'15 ECCE-Europe, 2015 17th European Conference on Power Electronics and Applications, Sep 2015, Genève, Switzerland. 11p., ⟨10.1109/EPE.2015.7311733⟩
Communication dans un congrès
hal-01704586
v1
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Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions
Son Ha Tran
,
Laurent Dupont
,
Zoubir Khatir
ESREF-25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Sep 2014, BERLIN, Germany. pp.PP.1921-1926, ⟨10.1016/j.microrel.2014.07.152⟩
Communication dans un congrès
hal-01471815
v1
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Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage
Laurent Dupont
,
Yvan Avenas
Symposium de Génie Electrique - SGE2014, Jul 2014, Cachan, France
Communication dans un congrès
hal-01024080
v1
|
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Evaluation du comportement électrothermique de transistors MOSFET en conduction en présence de défaut dans la brasure
Son Ha Tran
,
Laurent Dupont
,
Zoubir Khatir
Symposium de Génie Électrique 2014, Jul 2014, Cachan, France
Communication dans un congrès
hal-01065178
v1
|
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Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for On-line Chip Temperature Measurements of IGBT Devices
Laurent Dupont
,
Yvan Avenas
ECCE2014, Sep 2014, Pittsburg, United States
Communication dans un congrès
hal-01069990
v1
|
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Evaluation de paramètres thermosensibles basés sur la mesure de la tension directe de composants IGBT pour une utilisation dans des conditions d'usage
Laurent Dupont
,
Yvan Avenas
Symposium de Génie Électrique 2014, Jul 2014, Cachan, France
Communication dans un congrès
hal-01065323
v1
|
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Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters
Nick Baker
,
Marco Liserre
,
Laurent Dupont
,
Yvan Avenas
IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, Nov 2013, Vienne, Austria. p. 942-948, ⟨10.1109/IECON.2013.6699260⟩
Communication dans un congrès
hal-01704649
v1
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Partial Thermal Impedance Measurement for Die Interconnection Characterization by a Microsecond 'Pulsed Heating Curve Technique
Benoit Thollin
,
Laurent Dupont
,
Zoubir Khatir
,
Yvan Avenas
,
Jean Christophe Crebier
et al.
European Conference on Power Electronics and Applications, Sep 2013, France. 10p
Communication dans un congrès
hal-01056909
v1
|
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Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters
N. Baker
,
M. Liserre
,
Laurent Dupont
,
Yvan Avenas
Annual Conference of the IEEE Industrial Electronics Society, IECON, 2013, Vienne, Austria. pp.942-948
Communication dans un congrès
hal-00988264
v1
|
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Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve Technique
Benoît Thollin
,
Laurent Dupont
,
Zoubir Khatir
,
Yvan Avenas
,
Jean-Christophe Crébier
et al.
EPE'13 ECCE Europe, 2013, Lille, France
Communication dans un congrès
hal-00988257
v1
|
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The combined effect of failure factors in power modules for automotive applications
Souad Bachti
,
Laurent Dupont
,
Serge Loudot
,
Gérard Coquery
PCIM Europe 2012 - International Exhibition & Conference for Power Electronics, Intelligent Motion and Power Quality 2012, May 2012, Nuremberg, Germany. pp.502-509
Communication dans un congrès
hal-01687269
v1
|
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Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters
Laurent Dupont
,
Yvan Avenas
,
Pierre-Olivier Jeannin
Applied Power Electronics Conference and Exposition APEC 2012, Feb 2012, Orlando, United States. p 182 à 189
Communication dans un congrès
hal-00673411
v1
|
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Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters
Laurent Dupont
,
Yvan Avenas
,
Pierre Olivier Jeannin
APEC 2012 - IEEE Applied Power Electronics Conference and Exposition, Feb 2012, Orlando, United States. p. 182-189, ⟨10.1109/APEC.2012.6165817⟩
Communication dans un congrès
hal-01703887
v1
|
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Optimization of wire connections design for power electronics
Yoshua Celnikier
,
Laurent Dupont
,
Eveline Herve
,
Gérard Coquery
,
Lahouari Benabou
ESREF 2011 - 22nd European Symposium Reliability of Electron Devices, Failure Physics and Analysis, Oct 2011, Bordeaux, France. pp 1892-1897, ⟨10.1016/j.microrel.2011.06.058⟩
Communication dans un congrès
istex
hal-01704479
v1
|
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Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)
Benoit Thollin
,
Jean-Christophe Crebier
,
Yvan Avenas
,
Pierre-Olivier Jeannin
,
Zoubir Khatir
et al.
ECCE 2011 - IEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, Sep 2011, PHOENIX, United States. pp.60-67, ⟨10.1109/ECCE.2011.6063749⟩
Communication dans un congrès
hal-00881531
v1
|
|
Etude d'interfaces thermiques pour le management thermique des modules de puissance
Jean Pierre Ousten
,
Ludovic Menager
,
Zoubir Khatir
,
Laurent Dupont
EPF 2010 - 10th European Power Electronics Conference, Jun 2010, St Nazaire, France. 5p
Communication dans un congrès
hal-01704057
v1
|
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Accelerated Active Ageing Test on SiC JFETs Power Module with Silver Joining Technology for High Temperature Application
Laurent Dupont
,
Gérard Coquery
,
Kai Kriegel
,
Ashot Melkonyan
ESREF 2009 - 20th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, Oct 2009, Bordeaux, France. pp. 1375-1380, ⟨10.1016/j.microrel.2009.07.050⟩
Communication dans un congrès
hal-01701967
v1
|
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Innovative connectivity for double side cooling and connection of power dice in the context of automotive power mechatronic packaging for high power inverters
Jean-Michel Morelle
,
Laurent Dupont
,
Gérard Coquery
,
Yoshua Celnikier
APE 2009 - 3rd International Conference Automotive power electronics, Mar 2009, PARIS, France. 6p
Communication dans un congrès
hal-01704384
v1
|
|
Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules
Mounira Bouarroudj
,
Zoubir Khatir
,
Jean Pierre Ousten
,
Laurent Dupont
,
Stéphane Lefebvre
et al.
EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p, ⟨10.1109/EPE.2007.4417457⟩
Communication dans un congrès
hal-01702003
v1
|
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Degradation behavior of 600V-200A IGBT modules under Power cycling and high temperature environment conditions
Mounira Bouarroudj
,
Zoubir Khatir
,
Jean Pierre Ousten
,
Frédéric Badel
,
Laurent Dupont
et al.
18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct 2007, BORDEAUX, France. pp. 1719-1724, ⟨10.1016/j.microrel.2007.07.027⟩
Communication dans un congrès
hal-01702036
v1
|
|
Ageing Test Results of low voltage MOSFET Modules for Electrical Vehicles
Laurent Dupont
,
Stéphane Lefebvre
,
Mounira Bouarroudj
,
Zoubir Khatir
,
Jean-Claude Faugieres
et al.
EPE 2007 - 12th European Conference on Power Electronics and Applications, Sep 2007, Aalborg, Denmark. 10p
Communication dans un congrès
hal-01701952
v1
|
|
Evaluation de technologies de substrats céramiques sous des cyclages en température de forte amplitude
Laurent Dupont
,
Stéphane Lefebvre
,
Zoubir Khatir
,
Serge Bontemps
,
Régis Meuret
EPF 2006 - Electronique de Puissance du Futur, Jul 2006, Grenoble, France. 6p
Communication dans un congrès
hal-01704147
v1
|
|
Fiabilité des composants de puissance dans des environnements hautes températures
Laurent Dupont
,
Zoubir Khatir
,
Stéphane Lefebvre
,
Régis Meuret
,
Serge Bontemps
(ITCT 2006 - Journées internationales d'études Ingénieries des Technologies Communes aux Transports terrestres, maritimes, aériens et spatiaux, Nov 2006, Paris, France. 6p
Communication dans un congrès
hal-01704363
v1
|
|
Evaluation of Substrate Technologies under High Temperature Cycling
Laurent Dupont
,
Stéphane Lefebvre
,
Zoubir Khatir
,
Serge Bontemps
CIPS 2006 - 4th International Conference on Integrated Power Electronics Systems, Jun 2006, Naples, Italy. 6p
Communication dans un congrès
hal-01704198
v1
|
|
Evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications
Laurent Dupont
,
Régis Meuret
,
Zoubir Khatir
,
B Parmentier
,
Stéphane Lefebvre
et al.
HITEN 2005 - International Conference on High Temperature Electronics, Sep 2005, Paris, France. 6p
Communication dans un congrès
hal-01704218
v1
|
|
Electrical Characterizations and evaluation of thermo-mechanical stresses of a power module dedicated to high temperature applications
Laurent Dupont
,
Zoubir Khatir
,
Stéphane Lefebvre
,
Régis Meuret
,
B Parmentier
et al.
EPE 2005 - 11th European Conférence on Power Electronics and Applications, Sep 2005, Dresde, Germany. 11p, ⟨10.1109/EPE.2005.219580⟩
Communication dans un congrès
hal-01704015
v1
|
|
Characterisation of silicon carbide schottky diodes and COOLMOS transistors at high temperature
Laurent Dupont
,
Stéphane Lefebvre
,
Zoubir Khatir
,
Serge Bontemps
,
Régis Meuret
Communication dans un congrès
hal-01701982
v1
|
|
Development of high temperature power module for avionics applications
Laurent Dupont
,
Stéphane Lefebvre
,
Serge Bontemps
,
Zoubir Khatir
,
Régis Meuret
PCIM 2004 - International conference power electronics, intelligent motion, power quality, May 2004, Nuremberg, Germany. pp.6P
Communication dans un congrès
hal-01702065
v1
|
|
Développement d'un module de puissance pour tester la fiabilité d'un convertisseur haute température
Laurent Dupont
,
Stéphane Lefebvre
,
Zoubir Khatir
,
Serge Bontemps
,
Régis Meuret
SAAEI-EPF 2004 - Annual seminar on automatic control, industrial electronics and instrumentation, Electronique de puissance du futur, Sep 2004, Toulouse, France. pp.3-6
Communication dans un congrès
hal-01702105
v1
|
|
Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT
Laurent Dupont
,
Stéphane Lefebvre
,
Zoubir Khatir
,
Jean Claude Faugiere
10th European Conférence on Power Electronics and Applications, Sep 2003, France. 8p
Communication dans un congrès
hal-00868868
v1
|