MG

Magali Gregoire

40
Documents

Publications

Publications

Deposit thumbnail

Redistribution of Pt during the agglomeration of NiSi

D. Mangelinck , Fabriziofranco Morris Anak , K. Dabertrand , S. Guillemin , Ch. Girardeaux et al.

Acta Materialia, 2025, 286, pp.120698. ⟨10.1016/j.actamat.2024.120698⟩

Article dans une revue hal-05194216v1
Deposit thumbnail

Influence of the annealing schemes on the formation and stability of Ni(Pt)Si thin films: partial, laser, total, and unique anneal

Fabriziofranco Morris Anak , Andrea Campos , Magali Gregoire , Adrien Estellon , Marc Lombard et al.

Materials Science in Semiconductor Processing, 2025, 184, pp.108806. ⟨10.1016/j.mssp.2024.108806⟩

Article dans une revue hal-04789456v1
Deposit thumbnail

Multiple-step Siconi pre-clean advantages for Ni(Pt)Si film formation in the frame of advanced FDSOI technology development

Magali Grégoire , Fabriziofranco Morris Anak , Camille Sgrillo , Jean-Gabriel Mattei , Hugo Nuez et al.

Materials Science in Semiconductor Processing, 2025, 198, pp.109783. ⟨10.1016/j.mssp.2025.109783⟩

Article dans une revue hal-05393464v1
Deposit thumbnail

C54-TiSi$_2$ formation using nanosecond laser annealing of A-Si/Ti/A-Si stacks

Réda Guelladress , Sébastien Kerdilès , Mélanie Dartois , Chiara Sabbione , Magali Gregoire et al.

Thin Solid Films, 2024, 798, pp.140386. ⟨10.1016/j.tsf.2024.140386⟩

Article dans une revue cea-04770913v1

Influence of the annealing schemes on the formation and stability of Ni(Pt)Si thin films: Partial, laser, total, and one-step annealings

Fabriziofranco Morris Anak , Andréa Campos , Magali Grégoire , Adrien Estellon , Marc Lombard et al.

Materials Science in Semiconductor Processing, 2024, 184, pp.108806. ⟨10.1016/j.mssp.2024.108806⟩

Article dans une revue cea-04765828v1
Deposit thumbnail

On the influence of Ni(Pt)Si thin film formation on agglomeration threshold temperature and its impact on 3D imaging technology integration

M. Grégoire , F. Morris Anak , S. Verdier , K. Dabertrand , S. Guillemin et al.

Microelectronic Engineering, 2023, 271-272, pp.111937. ⟨10.1016/j.mee.2023.111937⟩

Article dans une revue hal-04285798v1

Ni(Pt)-based CMOS-compatible contacts on p-InGaAs for III–V photonic devices

Flore Boyer , Karen Dabertrand , Nicolas Bernier , Christophe Jany , Patrice Gergaud et al.

Materials Science in Semiconductor Processing, 2023, 154, pp.107199. ⟨10.1016/j.mssp.2022.107199⟩

Article dans une revue hal-04742893v1
Deposit thumbnail

Influence of Si surface preparation on CoSi2 formation and agglomeration

Andréa Newman , Andrea Campos , David Pujol , Pascal Fornara , Magali Gregoire et al.

Materials Science in Semiconductor Processing, 2023, 162, pp.107488. ⟨10.1016/j.mssp.2023.107488⟩

Article dans une revue hal-04285750v1

Optimized emitter-base interface cleaning for advanced Heterojunction Bipolar Transistors

E. Brezza , F. Deprat , C. de Buttet , A. Gauthier , M. Gregoire et al.

Solid-State Electronics, 2023, 204, pp.108654. ⟨10.1016/j.sse.2023.108654⟩

Article dans une revue hal-04084450v1
Deposit thumbnail

Impact of the pre amorphization by Ge implantation on Ni$_{0.9}$Pt$_{0.1}$ silicide

C. Delwail , S. Joblot , F. Mazen , F. Abbate , L. Lachal et al.

Microelectronic Engineering, 2022, 254, pp.111705. ⟨10.1016/j.mee.2021.111705⟩

Article dans une revue hal-03863804v1
Deposit thumbnail

Platinum redistribution in the Ni0.9Pt0.1/InP system: Impact on solid-state reaction and layer morphology

F. Boyer , K. Dabertrand , P. Gergaud , M. Grégoire , Quentin Rafhay et al.

Materials Science in Semiconductor Processing, 2021, 128, pp.105731. ⟨10.1016/j.mssp.2021.105731⟩

Article dans une revue hal-04742836v1
Deposit thumbnail

Integration of the Ni/InP system on a 300 mm platform for III-V/Si hybrid lasers

Flore Boyer , Patrice Gergaud , Karen Dabertrand , Denis Mariolle , Christophe Jany et al.

Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics, 2020, 38 (1), pp.012209. ⟨10.1116/1.5128554⟩

Article dans une revue hal-04743063v1
Deposit thumbnail

IMPACT OF NANOSECOND LASER ENERGY DENSITY ON THE C40-TiSi2 FORMATION AND C54-TiSi2 TRANSFORMATION TEMPERATURE.

Laura Esposito , S. Kerdiles , M. Gregoire , P. Benigni , K. Dabertrand et al.

Journal of Applied Physics, 2020, 128 (8), pp.085305. ⟨10.1063/5.0016091⟩

Article dans une revue hal-02922876v1

Integration, BEOL, and Thermal Stress Impact on CMOS-Compatible Titanium-Based Contacts for III–V Devices on a 300-mm Platform

F. Boyer , K. Dabertrand , C. Jany , P. Gergaud , N. Coudurier et al.

IEEE Transactions on Electron Devices, 2020, 67 (6), pp.2495-2502. ⟨10.1109/TED.2020.2985766⟩

Article dans une revue hal-04743053v1
Deposit thumbnail

Redistribution of phosphorus during Ni 0.9 Pt 0.1 -based silicide formation on phosphorus implanted Si substrates

M. Lemang , Ph. Rodriguez , F. Nemouchi , M. Juhel , M. Grégoire et al.

Journal of Applied Physics, 2018, 123 (8), ⟨10.1063/1.5020123⟩

Article dans une revue hal-01728691v1

Redistribution of phosphorus during NiPtSi formation on in-situ doped Si

M. Lemang , Ph. Rodriguez , M. Gregoire , M. Juhel , B. Saidi et al.

Microelectronic Engineering, 2018, 202, pp.25-30. ⟨10.1016/j.mee.2018.10.005⟩

Article dans une revue hal-02403309v1

Boron atomic-scale mapping in advanced microelectronics by atom probe tomography

Robert Estivill , Marc Juhel , Germain Servanton , Magali Grégoire , Fréderic Lorut et al.

Applied Physics Letters, 2017, 110, pp.252105. ⟨10.1063/1.4989676⟩

Article dans une revue hal-01765934v1

Thermal stability of Ni1-uPtu (0 < u < 0.15) germanosilicide

E. Bourjot , M. Gregoire , F. Nemouchi , Dominique Mangelinck

Journal of Applied Physics, 2017, 121 (13), ⟨10.1063/1.4979529⟩

Article dans une revue hal-01694204v1
Deposit thumbnail

Ultra-thin dielectric insertions for contact resistivity lowering in advanced CMOS: Promises and challenges

Julien Borrel , Louis Hutin , Donato Kava , Rémy Gassilloud , Nicolas Bernier et al.

Japanese Journal of Applied Physics, 2017, 56 (4), pp.04CB02. ⟨10.7567/JJAP.56.04CB02⟩

Article dans une revue hal-03325004v1
Deposit thumbnail

Modeling of Fermi-level pinning alleviation with MIS contacts: n and pMOSFETs cointegration considerations-Part I

Julien Borrel , Louis Hutin , Olivier Rozeau , Marie-Anne Jaud , Sebastien Martinie et al.

IEEE Transactions on Electron Devices, 2016, 63 (9), pp.3413-3418. ⟨10.1109/TED.2016.2590836⟩

Article dans une revue hal-03325007v1

Atomic Scale Investigation of Arsenic Segregation in High-k Metal Gate Stacks

Robert Estivill , Marc Juhel , Magali Gregoire , Adeline Grenier , Vincent Delaye et al.

Scripta Materialia, 2016, 113, pp.231-235. ⟨10.1016/j.scriptamat.2015.10.034⟩

Article dans une revue hal-01954200v1
Deposit thumbnail

Modeling of Fermi-level pinning alleviation with MIS contacts: n and pMOSFETs cointegration considerations-Part II

Julien Borrel , Louis Hutin , Olivier Rozeau , Marie-Anne Jaud , Sebastien Martinie et al.

IEEE Transactions on Electron Devices, 2016, 63 (9), pp.3419-3423. ⟨10.1109/TED.2016.2590826⟩

Article dans une revue hal-03325006v1

Kinetics study of NiPt(10 at.%)/Si0.7Ge0.3 solid state reactions

E. Bourjot , Magali Putero , C. Perrin-Pellegrino , P. Gergaud , Magali Gregoire et al.

Microelectronic Engineering, 2014, 120, pp.163-167. ⟨10.1016/j.mee.2013.12.009⟩

Article dans une revue hal-01951263v1

Impact of local back biasing on performance in hybrid FDSOI/bulk high-k/metal gate low power (LP) technology

C. Fenouillet-Beranger , P. Perreau , T. Benoist , C. Richier , S. Haendler et al.

Solid-State Electronics, 2013, 88, pp.15-20,. ⟨10.1016/j.sse.2013.04.008⟩

Article dans une revue istex hal-01002051v1

Enhanced RF Switch Performance in RFSOI Technology: Achieving 74 fs R ON ·C OFF and 3.3 V RFV MAX on Thinned SOI

Thomas Bordignon , Luca Lucci , Thibaud Fache , Clément Pribat , Magali Grégoire et al.

2024 IEEE European Solid-State Electronics Research Conference (ESSERC), Sep 2024, Bruges, Belgium. pp.448-451, ⟨10.1109/ESSERC62670.2024.10719593⟩

Communication dans un congrès hal-04786482v1

Si capacitive modulator integration in a 300mm silicon photonics platform using different annealing conditions

Ismael Charlet , Lucas Deniel , Pablo Acosta-Alba , Yohan Desieres , Sylvain Guerber et al.

Silicon Photonics XVI, Mar 2021, Online Only, France. pp.116910R, ⟨10.1117/12.2577806⟩

Communication dans un congrès cea-04948644v1
Deposit thumbnail

Impact of Nanosecond Laser Annealing on the Formation of Titanium Silicides

Laura Esposito , Sebastien Kerdiles , Magali Gregoire , Dominique Mangelinck

2021 20th International Workshop on Junction Technology (IWJT), Jun 2021, Kyoto, France. pp.1-6, ⟨10.23919/IWJT52818.2021.9609410⟩

Communication dans un congrès hal-03454117v1

Nickel-based CMOS-compatible contacts on p-In 0.53 Ga 0.47 As for III-V / silicon hybrid lasers

F. Boyer , K. Dabertrand , P. Gergaud , N. Coudurier , F. Nemouchi et al.

2020 IEEE International Interconnect Technology Conference (IITC), Oct 2020, San Jose, France. pp.121-123, ⟨10.1109/IITC47697.2020.9515625⟩

Communication dans un congrès hal-04742876v1

28nm FDSOI CMOS Technology (FEOL and BEOL) Thermal Stability for 3D Sequential Integration: Yield and Reliability Analysis

C. Cavalcante , C. Fenouillet-Beranger , P. Batude , X. Garros , X. Federspiel et al.

2020 IEEE Symposium on VLSI Technology, Jun 2020, Honolulu, United States. pp.1-2, ⟨10.1109/VLSITechnology18217.2020.9265075⟩

Communication dans un congrès cea-04521647v1

Reliability of CMOS-Compatible Ti / n-InP and Ti / p-InGaAs Ohmic Contacts for Hybrid III-V / Si Lasers

F. Boyer , C. Jany , J. da Fonseca , B. Szelag , V. Amalberg et al.

2019 IEEE 16th International Conference on Group IV Photonics (GFP), Aug 2019, Singapore, Singapore. pp.1-2, ⟨10.1109/GROUP4.2019.8926115⟩

Communication dans un congrès hal-04743098v1

Metal/insulator/semiconductor contacts for ultimately scaled CMOS nodes: projected benefits and remaining challenges

Julien Borrel , Louis Hutin , Helen Grampeix , Emmanuel Nolot , Magali Tessaire et al.

IWJT 2016 - 16th International Workshop on Junction Technology, May 2016, Shanghai, China. pp.14-19

Communication dans un congrès hal-03325000v1

Considerations on Fermi-depinning, dipoles and oxide tunneling for oxygen-based dielectric insertions in advanced CMOS contacts

Julien Borrel , L. Hutin , H. Grampeix , E. Nolot , E. Ghegin et al.

IEEE Silicon Nanoelectronics Workshop (SNW), Jun 2016, Honolulu, United States. pp.140-141, ⟨10.1109/SNW.2016.7578022⟩

Communication dans un congrès hal-03325002v1

Nouvelle technologie de contact pour CMOS FD-SOI 10nm et en deçà le contact dipolaire

Julien Borrel , Louis Hutin , Magali Grégoire , Fabrice Nemouchi , Olivier Rozeau et al.

17es Journées Nationales du Réseau Doctoral en Micro-Nanoélectronique, JNRDM 2014, 2014, Villeneuve d'Ascq, France. 4 p

Communication dans un congrès hal-01020275v1

Comparison of Radio Frequency Physical Vapor Deposition target material used for LaOx cap layer deposition in 32nm

S. Baudot , P. Caubet , M. Grégoire , R. A. Bianchi , R. Pantel et al.

Int. Conf. materials for advanced metallization, MAM 2010, 2010, Malines, Belgium

Communication dans un congrès hal-00604574v1

Mechanical Properties and reliability of Copper thin films. Some aspects related to stress voiding and interconnections

M. Ignat , M. Swain , M. Gregoire

Quality and Reliability CCF 2006, 2006, Sinaia, Romania. pp.414-423

Communication dans un congrès hal-00149038v1

Microstructure and Mechanical Properties of ECD and PVD Cu thin films

M. Ignat , F. Robaud , M. Swain , M. Gregoire

Vth Institute of Materials International Conference(East Asia) –MP3, 2006, Singapore, pp.122-125

Communication dans un congrès hal-00149034v1

Microstructure and Mechanical Properties of ECD and PVD Cu thin films

M. Ignat , F. Robaud , M. Swain , M. Gregoire

Vth Institute of Materials International Conference(East Asia) –MP3, 2006, Singapore, Singapore

Communication dans un congrès hal-00140909v1

Mechanical Properties and reliability of Copper thin films

M. Ignat , M. Swain , M. Gregoire

Quality and Reliability CCF 2006, 2006, Sinaia, Romania

Communication dans un congrès hal-00140907v1

Microstructure and mechanical properties of PVD and ECD Cu thin films

M. Ignat , F. Robaud , M. Swain , M. Gregoire

K. A. Khor, R. V. Ramanujan, C. P. Ooi, J. H. Zhao, W. Zhou, L. G. Yu. Materials Processing for Properties and Performance, Materials Processing for Properties and Performance, pp.122-125, 2006

Chapitre d'ouvrage hal-00149047v1