
MD
Maxime Darnon
319
Documents
Affiliation actuelle
- Laboratoire Hubert Curien (LabHC)
Identifiants chercheurs
Présentation
Publications
97
68
64
63
61
54
53
53
46
36
35
31
28
27
26
25
22
22
21
21
18
18
17
16
16
16
16
15
15
14
14
14
13
12
12
12
11
11
11
10
10
10
9
9
9
9
8
8
8
8
8
8
8
8
7
7
7
7
7
7
7
7
7
7
7
7
6
6
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
14
6
5
5
3
3
3
3
3
3
3
3
3
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Publications
|
Micro fabrication of III-V based solar cells for weight reduction and performance improvementSpace Photovoltaics for Energy Conversion in extra-terrestrial environment Workshop, INES, Jul 2024, Palaiseau (Ecole Polytechnique), France
Communication dans un congrès
hal-04674987
v1
|
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, Orlando (FL), United States. pp.1369-1373, ⟨10.1109/ECTC51909.2023.00234⟩
Communication dans un congrès
hal-04654848
v1
|
|
Towards cost-effective and sustainable III-V solar cells fabricationIEEE 50th Photovoltaic Specialists Conference (PVSC 2023), 2023, San Juan, Puerto Rico
Communication dans un congrès
hal-04303548
v1
|
|
Development of a plasma etching process of copper for the microfabrication of high-density interconnects in advanced packagingIEEE 73rd Electronic Components and Technology Conference, 2023, Orlando (FL), United States
Communication dans un congrès
hal-04301212
v1
|
|
|
Low-temperature joining of semiconductor substrates and thin layers on solid and flexible wafers by solid-liquid inter-diffusion bonding using a low-thickness Ni-Sn systemDTIP Malta 2023, May 2023, La Valletta, Malta. ⟨10.1109/DTIP58682.2023.10267939⟩
Communication dans un congrès
hal-04566973
v1
|
|
A Novel Partial Power Cascaded DC/DC Topology for CPV Application: A Theoretical Study2023 IEEE 14th International Conference on Power Electronics and Drive Systems (PEDS), IEEE, Aug 2023, Montreal, Canada. pp.1-6, ⟨10.1109/PEDS57185.2023.10246548⟩
Communication dans un congrès
hal-04236853
v1
|
|
Optimization of Diesel Generator Usage for Multi-Source Nano-Grid2023 IEEE 14th International Conference on Power Electronics and Drive Systems (PEDS), Aug 2023, Montreal, Canada. pp.1-5, ⟨10.1109/PEDS57185.2023.10246652⟩
Communication dans un congrès
hal-04236828
v1
|
|
New Triple-Junction Solar Cell Assembly Process for Concentrator Photovoltaic Applications2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, Orlando (FL), United States. pp.2223-2229, ⟨10.1109/ECTC51909.2023.00385⟩
Communication dans un congrès
hal-04236794
v1
|
New Concentrated Photovoltaic (CPV) module architectureIEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, Orlando (FL), United States
Communication dans un congrès
hal-04303557
v1
|
|
Microfabrication of a detachable Ge epitaxial layer grown on porous germanium for PV application49th IEEE Photovoltaic Specialists Conference (IEEE-PVSC 49), Jun 2022, Philadelphia (PA), United States
Communication dans un congrès
hal-04303582
v1
|
|
Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced PackagingAVS 68th International Symposium & Exhibition, Nov 2022, Pittsburgh, United States
Communication dans un congrès
hal-03910308
v1
|
|
Development of low-damage plasma process using remote plasma source for the gate opening step in the AlGaN/GaN MOS HEMT integrationPlasma Etch and Strip in Microtechnologies, Sep 2022, Leuven, Belgium
Communication dans un congrès
hal-03831336
v1
|
|
Plasma etching of III-V materials for photo transducers fabricationPlasma Etch and Strip in Microelectronics, Sep 2022, Leuven, Belgium
Communication dans un congrès
hal-03831333
v1
|
|
Micro-Scale III-V/GeMultijunction Solar Cell with Through Cell Via Contacts49th IEEE Photovoltaic Specialists Conference, Jun 2022, Philadelphia, United States
Communication dans un congrès
hal-03821787
v1
|
|
Application of DC/DC Partial Power Conversion to Concentrator Photovoltaics48th Annual Conference of the Industrial Electronics Society (IECON), IEEE, Oct 2022, Bruxelles, Belgium. ⟨10.1109/IECON49645.2022.9968818⟩
Communication dans un congrès
hal-03831326
v1
|
|
A Comparative Study of Existing Approaches for Modeling the Incident Irradiance on Bifacial PanelsElectrimacs, May 2022, Nancy, France
Communication dans un congrès
hal-03831357
v1
|
|
Multi-Terminal Three-Junction Solar Cells for Sub-Cells Characterization18th Conference on Concentrated PhotoVoltaïcs System, Apr 2022, on line, Japan
Communication dans un congrès
hal-03831364
v1
|
|
|
Sub-millimeter-scale multijunction solar cells for concentrator photovoltaics (CPV)SPIE OPTO 2022 - Physics, Simulation, and Photonic Engineering of Photovoltaic, SPIE, Feb 2022, San Francisco, United States. ⟨10.1117/12.2613441⟩
Communication dans un congrès
hal-03781347
v1
|
Reuse of Ge substrates for cost-effective fabrication of III-V/Ge thin solar cells49th Photovoltaic Specialists Conference, IEEE, Jun 2022, Philadelphia, United States
Communication dans un congrès
hal-03831350
v1
|
|
Micro-Scale III-V/Ge Multijunction Solar Cell with Through Cell Via Contacts49th IEEE Photovoltaic Specialists Conference, Jun 2022, Philadelphia, United States
Communication dans un congrès
hal-03686951
v1
|
|
Miniaturization of high efficiency InGaP/InGaAs/Ge solar cells andpathways for further improvements8th World Conference on Photovoltaic Energy Conversion (WCPEC-8), Sep 2022, Milan, Italy
Communication dans un congrès
hal-04303561
v1
|
|
|
CPV Module to Rate Antireflective and Encapsulant Coating in Outdoor Conditions17th Conference on Concentrated PhotoVoltaïcs Systems (CPV17), Apr 2021, Denver (On line), United States. pp.030004, ⟨10.1063/5.0099255⟩
Communication dans un congrès
hal-03349748
v1
|
First Feedback from a CPV Plant in a Nordic Location, Québec, Canada18th Conference on Concentrated PhotoVoltaïcs System, Apr 2022, online, Japan
Communication dans un congrès
hal-03831362
v1
|
|
Multiple substrate reuse : straightforward reconditioning of Ge wafers after porous separation49th IEEE Photovoltaic Specialists Conference (IEEE-PVSC 49), Jun 2022, Philadelphia (PA), United States
Communication dans un congrès
hal-04303574
v1
|
|
Micro-fabrication and transfer of a detachable Ge epitaxial layer grown on porous germanium49th Photovoltaic Specialists Conference, Jun 2022, Philadelphia (PA), United States. ⟨10.1109/PVSC48317.2022.9938777⟩
Communication dans un congrès
hal-03831353
v1
|
|
Development of low-damage plasma etching processes for preserving AlGaN/GaN heterostructure integrity in MIS HEMTCompound Semiconductors weeks, May 2022, Ann Arbor, United States. ⟨10.1109/CSW55288.2022.9930445⟩
Communication dans un congrès
hal-03831356
v1
|
|
Miniaturization of High Efficiency InGaP/InGaAs/Ge Solar Cells and Pathways for Further ImprovementsWorld Conference on Photovoltaics and Energy Conversion, Sep 2022, Milan, Italy
Communication dans un congrès
hal-03831341
v1
|
|
|
III-V/Ge multijunction solar cell with through cell via contact fabrication and characterizationPVSC 2021 - 48th IEEE Photovoltaic Specialists Conference, IEEE, Jun 2021, Fort Lauderdale (virtual event), United States. pp.2231-2233, ⟨10.1109/PVSC43889.2021.9519047⟩
Communication dans un congrès
hal-03331595
v1
|
Unconventional triple junction solar cells based on micro technologies2020 47th IEEE Photovoltaic Specialists Conference (PVSC), Jun 2020, Online, Canada. ⟨10.1109/PVSC45281.2020.9300451⟩
Communication dans un congrès
hal-02991187
v1
|
|
Cu-based Metallization for Silicon Heterojunction Solar Cells4th International Workshop for Silicon Heterojunction Solar Cells, Nov 2021, Neuchatel, Switzerland
Communication dans un congrès
hal-03831367
v1
|
|
InGaP/InGaAs/Ge microcells robustness assessment17th Conference on Concentrated Photovoltaics Systems (CPV17), Apr 2021, Freiburg, Germany
Communication dans un congrès
hal-03349727
v1
|
|
Comparative Study of Low Damage Plasma Etching Processes on the Integrity of AlGaN Layers Integrated in GaN HEMT During Gate Opening,AVS 67 Virtual Symposium, Oct 2021, Virtual Symposium, United States
Communication dans un congrès
hal-03448993
v1
|
|
III-V/Ge Heterostructure Plasma Etching and Passivation With a Single Plasma Process for Low-Damage Multijunction Solar Cell Fabrication,AVS 67 Virtual Symposium, Oct 2021, Virtual Symposium, United States
Communication dans un congrès
hal-03448973
v1
|
|
|
Multijunction Solar Cell Mesa Isolation: A Comparative Study17th Conference on Concentrated PhotoVoltaïcs System, 2021, Denver (On line), United States
Communication dans un congrès
hal-03407487
v1
|
Plasma Etching: an Enabler to Better Concentrated Photovoltaics SystemsJoint International Conference on the 8th International Conference on Microelectronics and Plasma Technology (ICMAP) & 9th International Symposium n Functional Materials (ISFM), Jan 2021, Hwaseong, South Korea
Communication dans un congrès
hal-03349738
v1
|
|
Multijunction Solar Cell Electrical Isolation and Passivation with a Single Plasma Process.17th Conference on Concentrated PhotoVoltaïcs Systems (CPV17), Apr 2021, Freiburg (on line), Germany
Communication dans un congrès
hal-03349744
v1
|
|
|
Comparison of Various InGaAs-based Solar Cells for Concentrated Photovoltaics Applications17th Conference on Concentrated PhotoVoltaïcs System, 2021, Denver (On line), United States. ⟨10.1063/5.0103648⟩
Communication dans un congrès
hal-03407479
v1
|
|
Nanostructured surface for extended temperature operating range in concentrator photovoltaic modules16TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-16), May 2020, Denver, United States. pp.050002-1 -- 050002-6, ⟨10.1063/5.0032134⟩
Communication dans un congrès
hal-03029181
v1
|
Plasma Treatment For Fluxless Flip-chip Chip-Joining Process3S&Systems Summit, SEMI, Jan 2020, Dresden, Germany
Communication dans un congrès
hal-02463072
v1
|
|
Towards miniaturization of concentrated photovoltaics (CPV): impacts on fabrication, performance and robustness of solar cellsIEEE PVSC Virtual meeting, Jul 2020, Denver, United States
Communication dans un congrès
hal-03349761
v1
|
|
|
Towards miniaturization of concentrated photovoltaics (CPV): impact on fabrication, performance and robustness of solar cells2020 IEEE 47th Photovoltaic Specialists Conference (PVSC), IEEE, Jun 2020, Calgary (virtual), Canada. pp.1268-1273, ⟨10.1109/PVSC45281.2020.9300898⟩
Communication dans un congrès
hal-03109711
v1
|
Improving Short-Circuit Current of Concentrator Solar Cells Using a Deposited Microbead Layer16th Conference on Concentrated PhotoVoltaïcs Systems, May 2020, Denver, United States
Communication dans un congrès
hal-02991197
v1
|
|
|
Demonstration of Back Contacted III/Ge Triple Junction Solar Cells,16th Conference on Concentrated PhotoVoltaïcs Systems (CPV16), May 2020, Denver, United States. pp.020005-1 -- 020005-5, ⟨10.1063/5.0033094⟩
Communication dans un congrès
hal-02991189
v1
|
New architectures of Concentrated Photovoltacs (CPV) solar cellsPhotonics North, May 2020, Niagara Falls, Canada
Communication dans un congrès
hal-02991177
v1
|
|
|
PROJECT AMELIZ: PATTERNING TECHNIQUES FOR COPPER ELECTROPLATED METALLIZATION ON HETEROJUNCTION CELLSEuropean PV Solar Energy Conference & Exhibition, Sep 2020, Paris, France
Communication dans un congrès
hal-02991212
v1
|
Plasma-induced damage during III-V semiconductor patterning for photonic and photovoltaic applications: from characterization to minimization18th conference on defects recognition, imaging and physics in semiconductors (DRIP XVIII), Sep 2019, Berlin, Germany
Communication dans un congrès
hal-02324729
v1
|
|
Etch process cleaning to improve wafer to wafer reproducibilityENRIS 2019 (European Nanofabrication Research Infrastructure Symposium), 2019, UNIVERSITY OF TWENTE, Netherlands
Communication dans un congrès
hal-02624143
v1
|
|
Patterning Platinum using BEOL industrially compatible processes; Chemical Mechanical Polishing vs. ICP Plasma etching44th International Conference on Micro and Nanoengineering, Sep 2019, Copenhage, Denmark
Communication dans un congrès
hal-03178730
v1
|
|
Plasma processes for High Efficiency Multi-Junction Solar Cells Fabrication66th International AVS Symposium & Topical Conferences, Oct 2019, Columbus, Ohio, United States
Communication dans un congrès
hal-02336676
v1
|
|
Micro/nanotechnologies to improve concentrated photovoltaics systemsJournées nationales sur les technologies émergentes en micro-nano fabrication, (JNTE2019), Nov 2019, Grenoble, France
Communication dans un congrès
hal-02916153
v1
|
|
High-Voltage Low-Current Multijunction Monolithic Interconnected Microcells15th Conference on Concentrated PhotoVoltaics Systems, Mar 2019, Fes, Morocco
Communication dans un congrès
hal-02339963
v1
|
|
Improving Temperature-Dependent Energy Output of Concentrator Photovoltaic Systems using Nanotextured SurfacesNumerical Simulation of Optoelectronic Devices, Jul 2019, Ottawa, Canada
Communication dans un congrès
hal-02339961
v1
|
|
Nanostructured Surfaces in Concentrator Photovoltaic Systems To Improve Temperature-Dependent Energy OutputCanadian Semiconductor Science and Technology Conference, Jul 2019, Saskatoon, Canada
Communication dans un congrès
hal-02339959
v1
|
|
Passivating Antireflection Coating for Improving Optical Properties of Concentrated Photovoltaics Using PECVDNumerical Simulation of Optoelectronic Devices, Jul 2019, Ottawa, Canada
Communication dans un congrès
hal-02339960
v1
|
|
Area downsizing effects on electrical performance and robustness of triple junction solar cells for CPV applicationsInternational Symposium on Reliability of Optoelectronics System, Nov 2019, Toulouse, France
Communication dans un congrès
hal-02443117
v1
|
|
High Aspect Ratio and Low Damage III-V/Ge Heterostructure Via EtchingPlasma Etch and Strip in Microelectronics (PESM), 11th International Workshop, May 2019, Grenoble, France
Communication dans un congrès
hal-02324782
v1
|
|
Solar Cell with Light-Induced Plated Front Emitter Contact15th Conference on Concentrated PhotoVoltaics Systems, Mar 2019, Fes, Morocco
Communication dans un congrès
hal-02339964
v1
|
|
Impact of plasma etching process exposure on the integrity of AlN and AlGaN layers integrated in GaN heterojunction transistors (HEMTs)Journées nationales sur les technologies émergentes en micro-nano fabrication, (JNTE2019), Nov 2019, Grenoble, France
Communication dans un congrès
hal-02916150
v1
|
|
Modeling the Incorporation of Microbeads into Concentrator Photovoltaic SystemsIEEE Photonics North, May 2019, Quebec, Canada. ⟨10.1109/PN.2019.8819537⟩
Communication dans un congrès
hal-02339962
v1
|
|
Patterning Platinum using CMP and plasma etching industrially compatible processes45th International Conference on Micro and Nano Engineering MNE, Aug 2019, Rhodes, Greece
Communication dans un congrès
hal-02320605
v1
|
|
III-V/Ge Heterostructure Etching for Through Cell Via Contact Multijunction Solar Cellc65th International AVS Symposium & Topical Conferences, Oct 2018, Long Beach, California, USA, United States
Communication dans un congrès
hal-01959003
v1
|
|
Dual technological procedure for multijunction solar cell : InGaAs subcell Epitaxial Lift-Off combined with InP wafer recycling14th International Conference on Concentrator Photovoltaic Systems CPV'14, Apr 2018, Puertollano, Spain
Communication dans un congrès
hal-01963993
v1
|
|
III-V/Ge Heterostructure Etching for Through Cell Via Contact Multijunction Solar Cell65th International AVS Symposium & Topical Conferences, Oct 2018, Long Beach, United States
Communication dans un congrès
hal-02324762
v1
|
|
Interaction of humidity with plasma-damaged porous low-k28th Advanced Metallization Conference (ADMETA), Oct 2018, Beijing, China
Communication dans un congrès
hal-02338098
v1
|
|
Front-Contacted Multijunction Micro Solar Cells: Fabrication & Characterization14th International Conference on Concentrated PhotoVoltaics Systems, Apr 2018, 2018-04-01, Spain
Communication dans un congrès
hal-02339965
v1
|
|
|
Dense array CPV receivers: Impact of the cooling device on the net PV output for different illumination profiles14TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-14), Apr 2018, Puertollano, Spain. pp.080008, ⟨10.1063/1.5053536⟩
Communication dans un congrès
hal-01877143
v1
|
Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. ⟨10.1109/ECTC.2018.00069⟩
Communication dans un congrès
hal-01870584
v1
|
|
III-V/Ge multijunction solar cell with Through Cell Vias Contacts fabrication14th International Conference on Concentrated PhotoVoltaics Systems, Apr 2018, Puertollano, Spain
Communication dans un congrès
hal-02339966
v1
|
|
|
Permanent bonding process for III-V/Ge multijunction solar cell integration14TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-14), Apr 2018, Puertollano, Spain. pp.090004, ⟨10.1063/1.5053542⟩
Communication dans un congrès
hal-01877145
v1
|
Microfabrication of multi junction solar cells for concentrated photovoltaics applicationEuropean Advanced Energy Materials Congress, Mar 2018, Stockholm, Sweden
Communication dans un congrès
hal-02338105
v1
|
|
|
Via sidewall insulation for through cell via contacts13TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-13), May 2017, Ottawa, Canada. pp.040002, ⟨10.1063/1.5001424⟩
Communication dans un congrès
hal-02074429
v1
|
Epitaxial lift-off of low band gap subcells for multijunction solar cell devicesC’Nano meetings, Dec 2017, Lyon, France
Communication dans un congrès
hal-02097245
v1
|
|
Development and Validation of Key Microfabrication Processes for Through Cell Via Contacts Multi-Junction Solar Cell13th International Conference on Concentrator Photovoltaic Systems (CPV-13), May 2017, Ottawa, Canada
Communication dans un congrès
hal-02453664
v1
|
|
CPV Research at Universite de Sherbrooke: from materials to systems13th International Conference on Concentrated PhotoVoltaics Systems, May 2017, Ottawa, Canada
Communication dans un congrès
hal-02339968
v1
|
|
|
The handling of thin substrates and its potential for new architectures in multi-junction solar cells technology13TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-13), May 2017, Ottawa, Canada. pp.040001, ⟨10.1063/1.5001423⟩
Communication dans un congrès
hal-02074425
v1
|
Technological developments of epitaxial lift-off process over InP substratesJournées nationales sur les technologies émergentes en micro nanofabrication (JNTE 2017), Nov 2017, Orléans, France
Communication dans un congrès
hal-02073141
v1
|
|
Submillimeter Multijunction Solar Cells: Impact of Dimension, Design and Architecture on Electrical Performances13th International conference on Concentrator Photovoltaic Systems (CPV 13), May 2017, Otawa, Canada
Communication dans un congrès
hal-01716137
v1
|
|
Micro/Nanotechnologies for high efficiency solar cells fabricationEMN Meeting on Optoelectronics, Apr 2017, Victoria, Canada
Communication dans un congrès
hal-02097240
v1
|
|
Anisotropic and Low Damage III-V/Ge Heterostructures via Etching for Multijunction Photovoltaic Cell FabricationPlasma Etch and Strip in Microelectronics (PESM), 10th International Workshop, Oct 2017, leuven, Belgium
Communication dans un congrès
hal-01929191
v1
|
|
Plasma etching for III-V/Ge multijunction solar cells singulation12th International Conference on Concentrator Photovoltaic Systems (CPV-12) (25–27 April 2016,, Apr 2016, Freiburg, Germany
Communication dans un congrès
hal-02097315
v1
|
|
Can plasma etching be used in photovoltaics?Plasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France
Communication dans un congrès
hal-02339970
v1
|
|
Through Cell Via Contacts: Impact of Hole Integration on Multi-Junction Solar Cell and Associated Surface Treatments12th International Conference on Concentrator Photovoltaic Systems (CPV-12), Apr 2016, Freiburg, Germany
Communication dans un congrès
hal-02097309
v1
|
|
Substrate Handling Strategies Thinned Multi-junction Solar-cell Wafers.12th International Conference on Concentrator Photovoltaic Systems (CPV-12), Apr 2016, Freiburg, Germany
Communication dans un congrès
hal-02097312
v1
|
|
Plasma Etching for High Efficiency Solar Cells FabricationChina Semiconductor Technology International Conference (CSTIC) 2016, Mar 2016, Shanghai, China
Communication dans un congrès
hal-02338109
v1
|
|
|
Plasma etching applications in concentrated photovoltaic cell fabrication12th International Conference on Concentrator Photovoltaic Systems (CPV-12), May 2016, Freibourg, Germany. pp.060001, ⟨10.1063/1.4962091⟩
Communication dans un congrès
hal-02074637
v1
|
GaP/c-Si heterojunction solar cell processing: understanding and recovery of bulk degradation6th international conference on crystalline silicon PV, Mar 2016, Chambery, France
Communication dans un congrès
hal-02339973
v1
|
|
Plasma etching for high efficiency solar cells fabricationCMOS Emerging Technologies Research, May 2016, Montreal, Canada
Communication dans un congrès
hal-02339969
v1
|
|
Roughness generation during Si etching in Cl2 pulsed plasmasPlasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France
Communication dans un congrès
hal-02339971
v1
|
|
Velocity distribution function of ions through high-aspect ratio holes in Inductively-Coupled Plasma reactorPlasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France
Communication dans un congrès
hal-02339972
v1
|
|
Microtechnologies for high efficiency solar cells2016 Photonics North (PN), May 2016, Quebec City, Canada. pp.1-2, ⟨10.1109/PN.2016.7537907⟩
Communication dans un congrès
hal-02074627
v1
|
|
|
Spectral analysis of the line-width and line-edge roughness transfer during self-aligned double patterning approachSPIE Advanced Lithography, SPIE, 2015, San Jose, CA, United States. pp.94280B, ⟨10.1117/12.2085812⟩
Communication dans un congrès
hal-01869175
v1
|
Producing ion waves from acoustic pressure waves in pulsed ICP: Modelling vs. Experiments68th Gaseous Electronics Conference (GEC), Oct 2015, Honolulu, United States
Communication dans un congrès
hal-01878115
v1
|
|
GaP/Si heterojunction solar cells: an alternative to amorphous silicon?6th Photovoltaic Technical Conference (PVTC 2015), May 2015, Aix en Provence, France
Communication dans un congrès
hal-02339974
v1
|
|
Diagnostics in pulsed hydrogen plasmas11th Frontiers in low temperature plasma diagnostics, May 2015, Hyeres, France
Communication dans un congrès
hal-02339976
v1
|
|
Porous Materials Characterization by Infrared SpectroscopyCMOS Emerging Technologies Research, May 2015, Vancouver, Canada
Communication dans un congrès
hal-02338119
v1
|
|
Post-porosity Plasma protection (P4): a promising strategy against v-UV damage in porous, low-k materialsPlasma Etch and Strip in Microtechnologies conference, May 2015, Leuven, Belgium
Communication dans un congrès
hal-02339977
v1
|
|
Measuring IVDF through high−aspect holes in pulsed ICP plasmas68th GEC / ICRP−9, Oct 2015, Honolulu, United States
Communication dans un congrès
hal-01878113
v1
|
|
RFEA analyzers to measure IVDF through high−aspect holes in pulsed ICP plasmasFrontiers in Low Temperature Plasma Diagnostics XI, 2015, Porquerolles, France
Communication dans un congrès
hal-01878109
v1
|
|
Challenges of contact etching for 14FDSOI technologySPIE-AL, Feb 2015, San Jose, United States
Communication dans un congrès
hal-02339980
v1
|
|
Measuring IVDF through high-aspect holes in pulsed ICP plasma68th Gaseous Electronics Conference (GEC), Oct 2015, Honolulu, United States
Communication dans un congrès
hal-01878046
v1
|
|
Multi-junction Solar Cells with Through Substrate Vias ContactsNext Generation PhotoVoltaics Canada, May 2015, Toronto, Canada
Communication dans un congrès
hal-02339975
v1
|
|
Measuring IVDF through high−aspect holes in ICP plasmasPESM 2015 (Plasma Etch and Strip in Microtechnology), 2015, Louvain, Belgium
Communication dans un congrès
hal-01878112
v1
|
|
Solar Cell with Gallium Phosphide / Silicon HeterojunctionCMOS Emerging Technologies Research, May 2015, Vancouver, Canada
Communication dans un congrès
hal-02338111
v1
|
|
|
Evolution of Bulk c-Si Properties during the Processing of GaP/c-Si Heterojunction Cell5th International Conference on Silicon Photovoltaics (Silicon PV 2015), Mar 2015, Konstanz, Germany. pp.493-499, ⟨10.1016/j.egypro.2015.07.070⟩
Communication dans un congrès
hal-02339979
v1
|
|
Solar cells with gallium phosphide/silicon heterojunction11th International Conference on Concentrator Photovoltaic Systems (CPV-11), May 2015, Aix-les-Bains, France. pp.040003, ⟨10.1063/1.4931514⟩
Communication dans un congrès
hal-02338417
v1
|
Producing ion waves from acoustic pressure waves in pulsed inductive plasmasPlasma Etch and Strip in Microelectronics (PESM), May 2014, Grenoble, France
Communication dans un congrès
hal-01798411
v1
|
|
Optical and electrical diagnostics in chlorine based pulsed plasmas of an industrial silicon etching reactor1st International Middle-East Plasma Science, Turkey, Apr 2014, Istambul, Turkey
Communication dans un congrès
hal-02338122
v1
|
|
MD simulations of chlorine plasmas interaction with ultrathin Si films for advanced etch processes2014 Silicon Nanoelectronics Workshop (SNW), Jun 2014, Honolulu (USA), United States
Communication dans un congrès
hal-01798393
v1
|
|
Pulsed Cl2/Ar ICP plasmas processing : 0D Model vs. ExperimentsPlasma Etch and Strip in Microelectronics (PESM), May 2014, grenoble, France
Communication dans un congrès
hal-01798407
v1
|
|
Plasma Damage of Porous Low-k MaterialsMaterial Research Society Spring Meeting, Apr 2014, San Francisco, United States
Communication dans un congrès
hal-02338124
v1
|
|
Reactor wall plasma cleaning processes after InP etching in Cl2/CH4/Ar ICP dischargePlasma Etch and Strip in Microelectronics (PESM), 7th International Workshop, May 2014, grenoble, France
Communication dans un congrès
hal-01798099
v1
|
|
MD simulations of chlorine plasmas interaction with ultrathin silicon films for advanced etch processes.Plasma Etch and Strip in Microelectronics (PESM), 6th International Workshop, May 2014, grenoble, France
Communication dans un congrès
hal-01798524
v1
|
|
Prospects for dielectric constant reduction in integrated circuits interconnectsMaterials Research Society Spring Meeting, Jun 2014, San Francisco, United States. pp.Mrss14-1692-cc01-01, ⟨10.1557/opl.2014.609⟩
Communication dans un congrès
hal-02338418
v1
|
|
Silicon etching using CW, synchronized pulsed and bias pulsed Cl2 plasmaAVS 2014, , 2014, Baltimore, United States
Communication dans un congrès
hal-01798348
v1
|
|
Diagnostics in Pulsed Hydrogen PlasmasAVS 61st international symposium, Oct 2014, Baltimore, United States
Communication dans un congrès
hal-02339983
v1
|
|
Pulsed ICP plasmas processing: 0D Model vs. ExperimentsPlasma Etch and Strip in Microelectronics (PESM), 6th International Workshop, May 2014, grenoble, France
Communication dans un congrès
hal-01798532
v1
|
|
Selective dry etching of titanium nitride nanostructures with chlorine-based inductively coupled plasma40th Micro and Nano Engineering Conference, Sep 2014, Lausanne, Switzerland
Communication dans un congrès
hal-02339986
v1
|
|
MD simulations of Cl2 plasmas interaction with ultrathin Si films for advanced etch processes”Plasma Etch and Strip in Microelectronics (PESM), May 2014, Grenoble (France), France
Communication dans un congrès
hal-01798396
v1
|
|
Pulsed Plasmas for etching in micro and nanoelectronicsPlasma Nanoscience Conference, Mar 2014, Dublin, Ireland
Communication dans un congrès
hal-02338129
v1
|
|
Diagnostics of Pulsed Hydrogen Plasmas67th Gaseous Electronic Conference, Oct 2014, Raleigh, United States
Communication dans un congrès
hal-02339984
v1
|
|
Role of the mask on contact etching at the 20 nm nodePlasma Etch and Strip in Microtechnologies conference, May 2014, Grenoble, France
Communication dans un congrès
hal-02339987
v1
|
|
Inductively coupled plasma etching of ultra-shallow Si3N4 and SiO2 nanostructures40th Micro and Nano Engineering Conference, Sep 2014, Lausanne, Switzerland
Communication dans un congrès
hal-02339985
v1
|
|
Interaction between the plasma & mask materials during the contact etching for 14FDSOIAVS 61st international symposium, Oct 2014, Baltimore, United States
Communication dans un congrès
hal-02339981
v1
|
|
Pulsed ICP plasmas processing : A combined modelling and experimental study31st International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2013, Granada, Spain
Communication dans un congrès
hal-00925794
v1
|
|
Pulsed plasmas for etching in microelectronicsJournées du réseau plasma froids, 2013, La Rochelle, France
Communication dans un congrès
hal-00925769
v1
|
|
Time-resolved Optical and Electrical Diagnostics of Pulsed Plasmas EtchingAmerican Vacuum Society 60th International Symposium, Oct 2013, Long beach, United States
Communication dans un congrès
hal-00904432
v1
|
|
Optical and Electrical Diagnostics of Pulsed Plasmas Etching Processes11th Technological Plasma Workshop, Dec 2013, York, United Kingdom
Communication dans un congrès
hal-02338133
v1
|
|
Pulsed plasmas for etching at the nanoscaleJournées Nationales des Technologies Émergentes, May 2013, Evian les bains, France
Communication dans un congrès
hal-00860922
v1
|
|
Pulsed ICP chlorine plasmas : Numerical simulations versus Experiments4th Workshop on Radio Frequency Discharges, May 2013, giens, France
Communication dans un congrès
hal-00860934
v1
|
|
Pulsed plasma processing: A combined modelling and experimental study31st International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2013, Granada, Spain
Communication dans un congrès
hal-00904428
v1
|
|
MD simulations of chlorine plasmas interaction with ultrathin silicon films for advanced etch processesAVS 2013, Oct 2013, Long beach, United States
Communication dans un congrès
hal-00919179
v1
|
|
|
Characterization of silicon etching in synchronized pulsed plasmaSPIE Advanced Lithography, 2013, San Jose, United States. ⟨10.1117/12.2011462⟩
Communication dans un congrès
hal-00860917
v1
|
Si3N4 spacers etching in synchronized pulsed CH3F/O2/He/SiF4 plasmasAVS 60h international symposium, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-00925775
v1
|
|
Optical and Electrical Diagnostics of Pulsed Plasmas Etching ProcessesAVS 60h international symposium, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-00925763
v1
|
|
Pulsed plasmas: from plasma parameters to pattern transferPlasma Etch and Strip in Microtechnologies conference, 2013, leuven, Belgium
Communication dans un congrès
hal-00860925
v1
|
|
MD Simulations of Pulsed Chlorine Plasmas Interaction with Ultrathin Silicon Films for Advanced Etch ProcessesAmerican Vacuum Society 60th International Symposium, Oct 2013, Long beach, United States
Communication dans un congrès
hal-00904431
v1
|
|
Analysis of Passivation Layer Composition and Thickness on Silicon Patterns Etched by Synchronously Pulsed Plasmas5th Plasma Etch and Strip in Microelectronics Workshop (PESM), Mar 2012, Grenoble, France
Communication dans un congrès
hal-00755594
v1
|
|
Self-assembly patterning using block copolymer for advanced CMOS technology: optimisation of plasma etching processSPIE, 2012, United States. Volume: 8328 Pages: 83280M (6 pp.), ⟨10.1117/12.91639⟩
Communication dans un congrès
hal-00808850
v1
|
|
Towards new plasma technologies for 22 nm gate etch processes and beyondSPIE Advanced Lithography, 2012, San Jose, United States. pp.83280D, ⟨10.1117/12.920312⟩
Communication dans un congrès
hal-00808682
v1
|
|
Time resolved ion flux measurement in pulsed ICP plasmasTampa, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00762123
v1
|
|
Investigation of synchronized pulsed plasmas for highly selective etching of Si3N4 spacersPacific Rim Meeting of the Electrochemical and Solid State Society (PRiME), 2012, Hawai, United States
Communication dans un congrès
hal-00808854
v1
|
|
Self-assembly patterning using block copolymer for advanced CMOS technology: optimisation of plasma etching processSPIE-AL, 2012, San Jose, CA, United States
Communication dans un congrès
hal-00808863
v1
|
|
SiCl4/Cl2 plasmas: a new chemistry to etch high-k material selectively to Si-based AlloysPlasma Etch and Strip in Microelectronics conference, 2012, Grenoble, France
Communication dans un congrès
hal-00808860
v1
|
|
Challenges related to linewidth roughnessChina Semiconductor Technology International Conference (CSTIC), Mar 2012, Shanghai, China
Communication dans un congrès
hal-02338405
v1
|
|
Self assembly patterning using block copolymer for advanced CMOS technologyPlasma Etch and Strip in Microelectronics conference, 2012, Grenoble, France
Communication dans un congrès
hal-00808857
v1
|
|
Plasma Etching for Back End Of Line ApplicationsChina Semiconductor Technology International Conference (CSTIC), Mar 2012, Shanghaï, China
Communication dans un congrès
hal-00808862
v1
|
|
Time-resolved diagnostics of reactive pulsed plasmas by absorption spectroscopy, modulated beam Mass spectrometry, ion flux probes and RFEA analyzersFirst Pulsed Plasma Diagnostics Workshop (PPDW), 2012, dublin, Ireland
Communication dans un congrès
hal-00808856
v1
|
|
Plasmas Processes Challenges for Porous SiCOH Integration in Advanced InterconnectsMaterials Research Society spring meeting, Apr 2012, San francisco, United States
Communication dans un congrès
hal-00808861
v1
|
|
Towards new plasma technologies for 22nm gate etch processes and beyondSPIE-AL, 2012, San Jose, CA, United States
Communication dans un congrès
hal-00808670
v1
|
|
Self assembly patterning using block copolymer for advanced CMOS Technology : optimisation of plasma etching processesSPIE, 2012, United States. pp.83280M, ⟨10.1117/12.916399⟩
Communication dans un congrès
hal-00944979
v1
|
|
Low-k integration using metallic hard masksUCPSS, 2012, Ghent, Belgium. pp.195, 193-195, ⟨10.4028/www.scientific.net/SSP.187.193⟩
Communication dans un congrès
hal-00925747
v1
|
|
Time-resolved diagnostics of pulsed plasma etching processes1st pulsed plasma diagnostic workshop, Sep 2012, Dublin, Ireland
Communication dans un congrès
hal-00808669
v1
|
|
Characterization of Plasma-Induced Damages on low-k during Interconnection Integration by Scatterometric PorosimetryAVS 58h international symposium, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00647640
v1
|
|
Time-resolved diagnostics of pulsed plasmas by UV and VUV absorption spectroscopy and by modulated beam Mass spectrometry64th Gaseous Electronic Conference, 2011, Salt lake city, United States
Communication dans un congrès
hal-00647602
v1
|
|
Etch processes with pulsed plasmas for advanced CMOS technologies3rd International Conference on Microelectronics and Plasma Technology, Jul 2011, Dalian, China
Communication dans un congrès
hal-00647643
v1
|
|
Time-Modulation of High density Plasmas for Advanced Dry Etching Processes4th Plasma Etch and Strip in Microelectronics Workshop, May 2011, Mechelen, Belgium
Communication dans un congrès
hal-00647608
v1
|
|
Scatterometric Porosimetry for porous low-k patterns characterizationInterconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM), May 2011, Dresde, Germany
Communication dans un congrès
hal-00647417
v1
|
|
Porous SiOCH integration: Etch challenges with a trench first metal hard mask approachChinese Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China. pp.389-394, ⟨10.1149/1.3567609⟩
Communication dans un congrès
hal-00625347
v1
|
|
Interest of synchronized pulsed plasmas for next CMOS technologiesChina Semiconductor Technology International Conference (CSTIC) 2011, Mar 2011, Shanghaï, China
Communication dans un congrès
hal-00625345
v1
|
|
Angstrom Level Resolution EtchChina Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China
Communication dans un congrès
hal-00625350
v1
|
|
Porous SiCOH Patterning for Advanced Interconnects: Challenges and SolutionsElectrochem. 219th Soc. Meeting, 2011, Montreal, Canada
Communication dans un congrès
hal-00625357
v1
|
|
HfO2 etching by pulsed BCl3/Ar plasma4th PESM workshop, May 2011, Belgium
Communication dans un congrès
hal-00641438
v1
|
|
Low k Integration Using Metallic Hard MasksMaterials Research Society spring meeting (MRS) 2011, Apr 2011, San Francisco, United States
Communication dans un congrès
hal-00647612
v1
|
|
Time-resolved diagnostics of pulsed HBr and Cl2 plasmas64rd Gaseous Electronics Conference, Nov 2011, Salt Lake City, United States
Communication dans un congrès
hal-00944932
v1
|
|
Challenges of porous SiCOH dielectric material integration for advanced interconnect technology nodesCMOS Emerging Technologies, Jun 2011, Whistler, Canada
Communication dans un congrès
hal-00647646
v1
|
|
Impact of Synchronized Plasma Pulsing Technologies on Key Parameters Governing STI Etch ProcessesAVS 58h international symposium, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00647636
v1
|
|
Diagnostics of reactive pulsed plasmas by UV and VUV absorption spectroscopy and by modulated beam Mass spectrometryIX workshop on frontiers in low temperature plasma diagnostics, 2011, zinowitz, Germany
Communication dans un congrès
hal-00641436
v1
|
|
HfO2 Etching by Pulsed BCl3/Ar PlasmaAVS 58h international symposium, Oct 2011, Nashville, United States
Communication dans un congrès
hal-02339988
v1
|
|
Characterizing Plasma Induced Damage to Ultra Low-kChina Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China
Communication dans un congrès
hal-00625356
v1
|
|
Impact of ambient atmosphere on plasma-damaged porous low-k characterizationIEEE International Interconnect Technology Conference / Materials for Advanced Metallization, May 2011, Dresde, Germany
Communication dans un congrès
hal-00647635
v1
|
|
Improving Etch Processes by Using Pulsed PlasmasAVS 58h international symposium, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00647630
v1
|
|
Characterizing plasma-damaged porous low-k4th Plasma Etch and Strip in Microelectronics Workshop, May 2011, Mechelen, Belgium
Communication dans un congrès
hal-00647611
v1
|
|
|
Through cell vias contacts for multijunction solar cells11TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS: CPV-11, May 2011, Aix-les-Bains, France. pp.060003, ⟨10.1063/1.4931537⟩
Communication dans un congrès
hal-02338413
v1
|
Challenges and future prospects in plasma etching processes3rd International Conference on PLAsma NanoTechnology and Science, Mar 2010, Nagoya,, Japan
Communication dans un congrès
hal-00625378
v1
|
|
Challenges in sub-100 nm Dual Damascene Etch of Porous Oxycarbosilane Ultra Low-k Dielectrics for BEOL IntegrationAVS 57th international symposium, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00625371
v1
|
|
Sidewall Modification of Porous SiOCH Induced by Etching and Post Etching Plasma Treatments3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France
Communication dans un congrès
hal-00625382
v1
|
|
|
Etching Process Scalability and Challenges for ULK MaterialsInternational Interconnect Technology Conference, IITC, Jun 2010, Dresde, Germany. ⟨10.1109/IITC.2010.5510735⟩
Communication dans un congrès
hal-00625314
v1
|
Synchronous Plasma Pulsing for Etch ApplicationsChina Semiconductor Technology International Conference (CSTIC), Mar 2010, Shanghaï, China
Communication dans un congrès
hal-00647616
v1
|
|
Pulsed plasmas for nanoCMOS and nanoelectronics devices elaboration2nd International Conference on Plasma Nanoscience (iPlasma Nano-II), 2010, Bateman's Bay, Australia
Communication dans un congrès
hal-00944937
v1
|
|
Synchronized pulsed plasmas: potential process improvements for patterning technologies63rd Annual Gaseous Electronics Conference and 7th International Conference on Reactive Plasmas, Oct 2010, Paris, France
Communication dans un congrès
hal-02338411
v1
|
|
Plasma etching processes for nanoCMOS and nanoelectronics devicesMinatech upstream crossroad, 2010, Grenoble, France
Communication dans un congrès
hal-00643917
v1
|
|
Synchronous Plasma Pulsing for Etch Applications3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2019, Grenoble, France
Communication dans un congrès
hal-02339989
v1
|
|
Pulsed plasma for nanoCMOS and nanoelectronic device elaborationThe Second International Symposium on Plasma Nanoscience (iPlasmaNano-II), Dec 2010, Sydney, Australia
Communication dans un congrès
hal-00643911
v1
|
|
Plasma Etching Process Scalability and challenges for ULK MaterialsIITC 2010, Jun 2010, Burlingame USA., United States
Communication dans un congrès
hal-00623452
v1
|
|
Plasma Processes Challenges for Porous SiOCH Patterning in Advanced InterconnectsAVS 57th international symposium, 2010, Albuquerque, United States
Communication dans un congrès
hal-00625365
v1
|
|
Synchronous Plasma Pulsing for silicon Etch ApplicationsChina Semiconductor Technology International Conference (CSTIC), 2010, Shangai, China
Communication dans un congrès
hal-00643921
v1
|
|
Molecularly Reinforced Sol-gel Glasses: Preparation, Characterization and Integration StudiesMaterial Research Society Spring Meeting, Nov 2010, United States
Communication dans un congrès
hal-00625377
v1
|
|
Plasma Pulsing for Atomic Layer Etching Application3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France
Communication dans un congrès
hal-00625384
v1
|
|
Synchronous Plasma Pulsing For Etch ApplicationsAVS 57th international symposium, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00625368
v1
|
|
Synchronized pulsed plasmas: potential process improvements for patterning technologies63rd Gaseous Electronic Conference and 7th International Conference on Reactive Plasmas, Oct 2010, Paris, France
Communication dans un congrès
hal-00625370
v1
|
|
Reduction of Plasma Induced Silicon-Recess During Gate Over-Etch Using Synchronous Pulsed PlasmasAVS 57th international symposium, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00625366
v1
|
|
Inductively-Coupled Pulsed Plasmas in the Presence of Synchronous Pulsed Substrate Bias for Advanced Gate EtchingAVS 56th international symposium, Nov 2009, San José, United States
Communication dans un congrès
hal-00461590
v1
|
|
Trigate 6T SRAM scaling to 0.06 μm2Proceeding of 2009 International Electron Devices Meeting, IEDM 2009, Dec 2009, San Francisco, United States
Communication dans un congrès
hal-00625310
v1
|
|
Hydrogen Silsesquioxane-Based Hybrid Electron Beam And Optical Lithography For High Density CMOS Prototyping53rd Iinternational Conference on Electron, Ion, and Photon Beam Technology & Nanoffabrication, 2009, United States
Communication dans un congrès
hal-00461591
v1
|
|
Plasma Etching Challenges for Porous SiOCH Integration in Advanced Interconnect Levels30th Symposium on Dry Process (DPS), 2008, tokyo, Japan
Communication dans un congrès
hal-00397846
v1
|
|
Deposition and Etching of Hexagonal and Cubic Boron NitrideAVS 55th international symposium, October 2008, 2008, United States
Communication dans un congrès
hal-00461592
v1
|
|
Plasma challenges of porous SiOCH patterning for advanced interconnect levels55th American Vacuum Society Symposium, 2008, boston, United States
Communication dans un congrès
hal-00397847
v1
|
|
Porous SiOCH Modification by O2, NH3 and CH4 plasmas Used as ashing and Pore sealing StepsProceeding of PESM, Plasma Etch and Strip in Microelectronics (Workshop), 2007, leuven, Belgium
Communication dans un congrès
hal-00398871
v1
|
|
|
Chamber walls coating during patterning of dielectric damascene structures with a metal hard mask: consequence on cleaning strategiesPlasma Etch and Strip in Microelectronics Workshop, 2007, Detroit, United States
Communication dans un congrès
hal-00461598
v1
|
Ash Plasma Exposure of Hybrid Material (SiOCH and porogen): Comparisaon with Porous SiOCHAVS 54th, 2007, United States
Communication dans un congrès
hal-00461593
v1
|
|
Chamber Walls Coatings during hard mask patterning of Ultra Low-k Materials: Consequences on Cleaning StrategiesAVS 54th international symposium, 2007, United States
Communication dans un congrès
hal-00461594
v1
|
|
Metallic versus Organic Hard Mask Strategies for Advanced Dielectric Trenches PatterningProceeding of DPS, Symposium on Dry Process, 2007, tokyo, Japan
Communication dans un congrès
hal-00399993
v1
|
|
Dielectric Trenches Patterning: Metallic Vs Organic Hard MaskProceeding of MAM, Metal Advanced Metallization (Workshop), 2007, bruges, Belgium
Communication dans un congrès
hal-00398866
v1
|
|
Comprehensive study of metal-fluoride crystals issues with trench first hard mask back end architectureSurface Preparation and Cleaning Conference, 2007, United States
Communication dans un congrès
hal-00461607
v1
|
|
Chamber Walls Coatings During Patterning of Dielectric Damascene Structures With a Metallic Hard Mask: Consequences on Cleaning StrategiesProceeding of PESM, Plasma Etch and Strip in Microelectronics (Workshop), 2007, leuven, Belgium
Communication dans un congrès
hal-00398870
v1
|
|
Evaluation of ellipsometric porosimetry for in-line characterization of low- dielectricsISCE, 4th International Conference on Spectroscopic Ellipsometry, 2007, stockolm, Sweden
Communication dans un congrès
hal-00398872
v1
|
|
Ash plasma exposure of hybrid material (SiOCH and porogen)54th International AVS symposium, 2007, seattle, United States
Communication dans un congrès
hal-00400650
v1
|
|
Profile control and sidewall modifications of narrow porous ULK trenches after plasma etching and pore sealing treatments53rd International AVS Symposium, 2006, San Francisco, United States
Communication dans un congrès
hal-00400479
v1
|
|
Critical Dimensions Control of Narrow Low-k TrenchesMaterials for Advanced Metallization, 2006, grenoble, France
Communication dans un congrès
hal-00461614
v1
|
|
Patterning of narrow SiOCH trenches using the late porogen removal processAVS, 53rd International AVS Symposium, 2006, san francisco, United States
Communication dans un congrès
hal-00400477
v1
|
|
Material Modifications and Surface Roughness during Porous SiOCH Etching ProcessesAVS 53rd international symposium, 2006, United States
Communication dans un congrès
hal-00461612
v1
|
|
Emerging Application of Fluorocarbon Plasmas for Integrated Circuits Fabrication8th International workshop on fluorocarbon plasma, 2006, autrans, France
Communication dans un congrès
hal-00400476
v1
|
|
Challenges of Plasma Processes for Advanced ULK PatterningMaterials for Advanced Metallization 2006 Conference (MAM 2006), 2006, grenoble, France
Communication dans un congrès
hal-00397760
v1
|
|
Impact of Hard Mask Composition and Etching Chemistry on Porous Ultra Low-k Material Modification6th International Conference on Microelectronics and Interfaces, 2005, United States
Communication dans un congrès
hal-00649906
v1
|
|
Comparison Between Metallic and Inorganic Hard Masks Used for Advanced Porous Low-k Patterning15th International Colloquium on Plasma Processes, 2005, Autrans, France
Communication dans un congrès
hal-00461955
v1
|
|
Comparison between metallic and inorganic hard masks used for advanced porous low k patterning15th International Colloquium on Plasma Processes (CIP), 2005, autrans, France
Communication dans un congrès
hal-00398848
v1
|
|
A Study of Plasma Treatments Limiting Metal Barrier Diffusion into Porous Low-k MaterialsProceeding of ADMETA, Advanced Metallization Asian Session, 2005, tokyo, Japan
Communication dans un congrès
hal-00398855
v1
|
|
Etching Mechanisms of Low-k Materials with the Solid FirstTM ILD Process in Fluorocarbon Based PlasmaAVS 52nd international symposium, 2005, United States
Communication dans un congrès
hal-00461617
v1
|
|
Etching of Narrow Porous SiOCH Trenches Using a TiN Metallic Hard MaskAVS 52nd international symposium, Oct 2005, Boston, United States
Communication dans un congrès
hal-00647625
v1
|
|
Time−Modulation of High density Plasmas for Advanced Dry Etching Processes4th PESM workshop, May 2001, Belgium
Communication dans un congrès
hal-00944972
v1
|
|
Les Procédés par Plasmas Impliqués dans l'Intégration des Matériaux SiOCH Poreux pour les Interconnexions en MicroélectroniqueMicro et nanotechnologies/Microélectronique. Université Joseph-Fourier - Grenoble I, 2007. Français. ⟨NNT : ⟩
Thèse
tel-00181477
v2
|
Plasma Etch Challenges for Gate PatterningPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.95-118, 2017, ⟨10.1016/B978-1-78548-096-6.50004-3⟩
Chapitre d'ouvrage
hal-02338426
v1
|
|
Patterning Challenges in MicroelectronicsPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.59-94, 2017, ⟨10.1016/B978-1-78548-096-6.50003-1⟩
Chapitre d'ouvrage
hal-02338425
v1
|
|
Plasma Etching in MicroelectronicsPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.23-58, 2017, ⟨10.1016/B978-1-78548-096-6.50002-X⟩
Chapitre d'ouvrage
hal-02338424
v1
|
|
Interconnects for TomorrowPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.77-91, 2015, ⟨10.1016/B978-1-78548-015-7.50004-4⟩
Chapitre d'ouvrage
hal-02339235
v1
|
|
IntroductionPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.1-13, 2015, ⟨10.1016/B978-1-78548-015-7.50001-9⟩
Chapitre d'ouvrage
hal-02339199
v1
|
|
Interaction Plasma/DielectricPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.15-43, 2015, ⟨10.1016/B978-1-78548-015-7.50002-0⟩
Chapitre d'ouvrage
hal-02339227
v1
|
|
Porous SiOCH Film IntegrationPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.45-76, 2015, ⟨10.1016/B978-1-78548-015-7.50003-2⟩
Chapitre d'ouvrage
hal-02339231
v1
|
Chargement...
Chargement...