Maxime Darnon
- Laboratoire Hubert Curien (LabHC)
Présentation
Publications
Publications
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Micro fabrication of III-V based solar cells for weight reduction and performance improvementSpace Photovoltaics for Energy Conversion in extra-terrestrial environment Workshop, INES, Jul 2024, Palaiseau (Ecole Polytechnique), France |
New Concentrated Photovoltaic (CPV) module architectureIEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, Orlando (FL), United States |
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Towards cost-effective and sustainable III-V solar cells fabricationIEEE 50th Photovoltaic Specialists Conference (PVSC 2023), 2023, San Juan, Puerto Rico |
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Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, Orlando (FL), United States. pp.1369-1373, ⟨10.1109/ECTC51909.2023.00234⟩ |
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Development of a plasma etching process of copper for the microfabrication of high-density interconnects in advanced packagingIEEE 73rd Electronic Components and Technology Conference, 2023, Orlando (FL), United States |
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A Novel Partial Power Cascaded DC/DC Topology for CPV Application: A Theoretical Study2023 IEEE 14th International Conference on Power Electronics and Drive Systems (PEDS), IEEE, Aug 2023, Montreal, Canada. pp.1-6, ⟨10.1109/PEDS57185.2023.10246548⟩ |
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Low-temperature joining of semiconductor substrates and thin layers on solid and flexible wafers by solid-liquid inter-diffusion bonding using a low-thickness Ni-Sn systemDTIP Malta 2023, May 2023, La Valletta, Malta. ⟨10.1109/DTIP58682.2023.10267939⟩ |
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Optimization of Diesel Generator Usage for Multi-Source Nano-Grid2023 IEEE 14th International Conference on Power Electronics and Drive Systems (PEDS), Aug 2023, Montreal, Canada. pp.1-5, ⟨10.1109/PEDS57185.2023.10246652⟩ |
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New Triple-Junction Solar Cell Assembly Process for Concentrator Photovoltaic Applications2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May 2023, Orlando (FL), United States. pp.2223-2229, ⟨10.1109/ECTC51909.2023.00385⟩ |
Development of low-damage plasma etching processes for preserving AlGaN/GaN heterostructure integrity in MIS HEMTCompound Semiconductors weeks, May 2022, Ann Arbor, United States. ⟨10.1109/CSW55288.2022.9930445⟩ |
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Miniaturization of High Efficiency InGaP/InGaAs/Ge Solar Cells and Pathways for Further ImprovementsWorld Conference on Photovoltaics and Energy Conversion, Sep 2022, Milan, Italy |
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Micro-Scale III-V/Ge Multijunction Solar Cell with Through Cell Via Contacts49th IEEE Photovoltaic Specialists Conference, Jun 2022, Philadelphia, United States |
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Reuse of Ge substrates for cost-effective fabrication of III-V/Ge thin solar cells49th Photovoltaic Specialists Conference, IEEE, Jun 2022, Philadelphia, United States |
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Sub-millimeter-scale multijunction solar cells for concentrator photovoltaics (CPV)SPIE OPTO 2022 - Physics, Simulation, and Photonic Engineering of Photovoltaic, SPIE, Feb 2022, San Francisco, United States. ⟨10.1117/12.2613441⟩ |
Development of low-damage plasma process using remote plasma source for the gate opening step in the AlGaN/GaN MOS HEMT integrationPlasma Etch and Strip in Microtechnologies, Sep 2022, Leuven, Belgium |
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Plasma Etching of Copper for the Microfabrication of High-Density Interconnects in Advanced PackagingAVS 68th International Symposium & Exhibition, Nov 2022, Pittsburgh, United States |
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Plasma etching of III-V materials for photo transducers fabricationPlasma Etch and Strip in Microelectronics, Sep 2022, Leuven, Belgium |
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Microfabrication of a detachable Ge epitaxial layer grown on porous germanium for PV application49th IEEE Photovoltaic Specialists Conference (IEEE-PVSC 49), Jun 2022, Philadelphia (PA), United States |
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A Comparative Study of Existing Approaches for Modeling the Incident Irradiance on Bifacial PanelsElectrimacs, May 2022, Nancy, France |
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Application of DC/DC Partial Power Conversion to Concentrator Photovoltaics48th Annual Conference of the Industrial Electronics Society (IECON), IEEE, Oct 2022, Bruxelles, Belgium. ⟨10.1109/IECON49645.2022.9968818⟩ |
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Micro-Scale III-V/GeMultijunction Solar Cell with Through Cell Via Contacts49th IEEE Photovoltaic Specialists Conference, Jun 2022, Philadelphia, United States |
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Multi-Terminal Three-Junction Solar Cells for Sub-Cells Characterization18th Conference on Concentrated PhotoVoltaïcs System, Apr 2022, on line, Japan |
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CPV Module to Rate Antireflective and Encapsulant Coating in Outdoor Conditions17th Conference on Concentrated PhotoVoltaïcs Systems (CPV17), Apr 2021, Denver (On line), United States. pp.030004, ⟨10.1063/5.0099255⟩ |
First Feedback from a CPV Plant in a Nordic Location, Québec, Canada18th Conference on Concentrated PhotoVoltaïcs System, Apr 2022, online, Japan |
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Miniaturization of high efficiency InGaP/InGaAs/Ge solar cells andpathways for further improvements8th World Conference on Photovoltaic Energy Conversion (WCPEC-8), Sep 2022, Milan, Italy |
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Micro-fabrication and transfer of a detachable Ge epitaxial layer grown on porous germanium49th Photovoltaic Specialists Conference, Jun 2022, Philadelphia (PA), United States. ⟨10.1109/PVSC48317.2022.9938777⟩ |
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Multiple substrate reuse : straightforward reconditioning of Ge wafers after porous separation49th IEEE Photovoltaic Specialists Conference (IEEE-PVSC 49), Jun 2022, Philadelphia (PA), United States |
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Comparison of Various InGaAs-based Solar Cells for Concentrated Photovoltaics Applications17th Conference on Concentrated PhotoVoltaïcs System, 2021, Denver (On line), United States. ⟨10.1063/5.0103648⟩ |
Multijunction Solar Cell Electrical Isolation and Passivation with a Single Plasma Process.17th Conference on Concentrated PhotoVoltaïcs Systems (CPV17), Apr 2021, Freiburg (on line), Germany |
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Cu-based Metallization for Silicon Heterojunction Solar Cells4th International Workshop for Silicon Heterojunction Solar Cells, Nov 2021, Neuchatel, Switzerland |
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III-V/Ge multijunction solar cell with through cell via contact fabrication and characterizationPVSC 2021 - 48th IEEE Photovoltaic Specialists Conference, IEEE, Jun 2021, Fort Lauderdale (virtual event), United States. pp.2231-2233, ⟨10.1109/PVSC43889.2021.9519047⟩ |
Unconventional triple junction solar cells based on micro technologies2020 47th IEEE Photovoltaic Specialists Conference (PVSC), Jun 2020, Online, Canada. ⟨10.1109/PVSC45281.2020.9300451⟩ |
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Comparative Study of Low Damage Plasma Etching Processes on the Integrity of AlGaN Layers Integrated in GaN HEMT During Gate Opening,AVS 67 Virtual Symposium, Oct 2021, Virtual Symposium, United States |
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InGaP/InGaAs/Ge microcells robustness assessment17th Conference on Concentrated Photovoltaics Systems (CPV17), Apr 2021, Freiburg, Germany |
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Multijunction Solar Cell Mesa Isolation: A Comparative Study17th Conference on Concentrated PhotoVoltaïcs System, 2021, Denver (On line), United States |
III-V/Ge Heterostructure Plasma Etching and Passivation With a Single Plasma Process for Low-Damage Multijunction Solar Cell Fabrication,AVS 67 Virtual Symposium, Oct 2021, Virtual Symposium, United States |
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Plasma Etching: an Enabler to Better Concentrated Photovoltaics SystemsJoint International Conference on the 8th International Conference on Microelectronics and Plasma Technology (ICMAP) & 9th International Symposium n Functional Materials (ISFM), Jan 2021, Hwaseong, South Korea |
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Plasma Treatment For Fluxless Flip-chip Chip-Joining Process3S&Systems Summit, SEMI, Jan 2020, Dresden, Germany |
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Nanostructured surface for extended temperature operating range in concentrator photovoltaic modules16TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-16), May 2020, Denver, United States. pp.050002-1 -- 050002-6, ⟨10.1063/5.0032134⟩ |
Towards miniaturization of concentrated photovoltaics (CPV): impacts on fabrication, performance and robustness of solar cellsIEEE PVSC Virtual meeting, Jul 2020, Denver, United States |
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Towards miniaturization of concentrated photovoltaics (CPV): impact on fabrication, performance and robustness of solar cells2020 IEEE 47th Photovoltaic Specialists Conference (PVSC), IEEE, Jun 2020, Calgary (virtual), Canada. pp.1268-1273, ⟨10.1109/PVSC45281.2020.9300898⟩ |
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Demonstration of Back Contacted III/Ge Triple Junction Solar Cells,16th Conference on Concentrated PhotoVoltaïcs Systems (CPV16), May 2020, Denver, United States. pp.020005-1 -- 020005-5, ⟨10.1063/5.0033094⟩ |
Improving Short-Circuit Current of Concentrator Solar Cells Using a Deposited Microbead Layer16th Conference on Concentrated PhotoVoltaïcs Systems, May 2020, Denver, United States |
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New architectures of Concentrated Photovoltacs (CPV) solar cellsPhotonics North, May 2020, Niagara Falls, Canada |
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PROJECT AMELIZ: PATTERNING TECHNIQUES FOR COPPER ELECTROPLATED METALLIZATION ON HETEROJUNCTION CELLSEuropean PV Solar Energy Conference & Exhibition, Sep 2020, Paris, France |
High-Voltage Low-Current Multijunction Monolithic Interconnected Microcells15th Conference on Concentrated PhotoVoltaics Systems, Mar 2019, Fes, Morocco |
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Improving Temperature-Dependent Energy Output of Concentrator Photovoltaic Systems using Nanotextured SurfacesNumerical Simulation of Optoelectronic Devices, Jul 2019, Ottawa, Canada |
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Micro/nanotechnologies to improve concentrated photovoltaics systemsJournées nationales sur les technologies émergentes en micro-nano fabrication, (JNTE2019), Nov 2019, Grenoble, France |
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Etch process cleaning to improve wafer to wafer reproducibilityENRIS 2019 (European Nanofabrication Research Infrastructure Symposium), 2019, UNIVERSITY OF TWENTE, Netherlands |
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Plasma-induced damage during III-V semiconductor patterning for photonic and photovoltaic applications: from characterization to minimization18th conference on defects recognition, imaging and physics in semiconductors (DRIP XVIII), Sep 2019, Berlin, Germany |
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Patterning Platinum using BEOL industrially compatible processes; Chemical Mechanical Polishing vs. ICP Plasma etching44th International Conference on Micro and Nanoengineering, Sep 2019, Copenhage, Denmark |
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Plasma processes for High Efficiency Multi-Junction Solar Cells Fabrication66th International AVS Symposium & Topical Conferences, Oct 2019, Columbus, Ohio, United States |
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Area downsizing effects on electrical performance and robustness of triple junction solar cells for CPV applicationsInternational Symposium on Reliability of Optoelectronics System, Nov 2019, Toulouse, France |
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Passivating Antireflection Coating for Improving Optical Properties of Concentrated Photovoltaics Using PECVDNumerical Simulation of Optoelectronic Devices, Jul 2019, Ottawa, Canada |
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Nanostructured Surfaces in Concentrator Photovoltaic Systems To Improve Temperature-Dependent Energy OutputCanadian Semiconductor Science and Technology Conference, Jul 2019, Saskatoon, Canada |
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High Aspect Ratio and Low Damage III-V/Ge Heterostructure Via EtchingPlasma Etch and Strip in Microelectronics (PESM), 11th International Workshop, May 2019, Grenoble, France |
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Solar Cell with Light-Induced Plated Front Emitter Contact15th Conference on Concentrated PhotoVoltaics Systems, Mar 2019, Fes, Morocco |
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Impact of plasma etching process exposure on the integrity of AlN and AlGaN layers integrated in GaN heterojunction transistors (HEMTs)Journées nationales sur les technologies émergentes en micro-nano fabrication, (JNTE2019), Nov 2019, Grenoble, France |
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Modeling the Incorporation of Microbeads into Concentrator Photovoltaic SystemsIEEE Photonics North, May 2019, Quebec, Canada. ⟨10.1109/PN.2019.8819537⟩ |
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Patterning Platinum using CMP and plasma etching industrially compatible processes45th International Conference on Micro and Nano Engineering MNE, Aug 2019, Rhodes, Greece |
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Dual technological procedure for multijunction solar cell : InGaAs subcell Epitaxial Lift-Off combined with InP wafer recycling14th International Conference on Concentrator Photovoltaic Systems CPV'14, Apr 2018, Puertollano, Spain |
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III-V/Ge Heterostructure Etching for Through Cell Via Contact Multijunction Solar Cellc65th International AVS Symposium & Topical Conferences, Oct 2018, Long Beach, California, USA, United States |
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III-V/Ge Heterostructure Etching for Through Cell Via Contact Multijunction Solar Cell65th International AVS Symposium & Topical Conferences, Oct 2018, Long Beach, United States |
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Front-Contacted Multijunction Micro Solar Cells: Fabrication & Characterization14th International Conference on Concentrated PhotoVoltaics Systems, Apr 2018, 2018-04-01, Spain |
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Interaction of humidity with plasma-damaged porous low-k28th Advanced Metallization Conference (ADMETA), Oct 2018, Beijing, China |
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Dense array CPV receivers: Impact of the cooling device on the net PV output for different illumination profiles14TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-14), Apr 2018, Puertollano, Spain. pp.080008, ⟨10.1063/1.5053536⟩ |
Plasma Treatment for Fluxless Flip-Chip Chip-Joining Process2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. ⟨10.1109/ECTC.2018.00069⟩ |
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III-V/Ge multijunction solar cell with Through Cell Vias Contacts fabrication14th International Conference on Concentrated PhotoVoltaics Systems, Apr 2018, Puertollano, Spain |
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Microfabrication of multi junction solar cells for concentrated photovoltaics applicationEuropean Advanced Energy Materials Congress, Mar 2018, Stockholm, Sweden |
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Permanent bonding process for III-V/Ge multijunction solar cell integration14TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-14), Apr 2018, Puertollano, Spain. pp.090004, ⟨10.1063/1.5053542⟩ |
Anisotropic and Low Damage III-V/Ge Heterostructures via Etching for Multijunction Photovoltaic Cell FabricationPlasma Etch and Strip in Microelectronics (PESM), 10th International Workshop, Oct 2017, leuven, Belgium |
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Development and Validation of Key Microfabrication Processes for Through Cell Via Contacts Multi-Junction Solar Cell13th International Conference on Concentrator Photovoltaic Systems (CPV-13), May 2017, Ottawa, Canada |
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Via sidewall insulation for through cell via contacts13TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-13), May 2017, Ottawa, Canada. pp.040002, ⟨10.1063/1.5001424⟩ |
Epitaxial lift-off of low band gap subcells for multijunction solar cell devicesC’Nano meetings, Dec 2017, Lyon, France |
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The handling of thin substrates and its potential for new architectures in multi-junction solar cells technology13TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS (CPV-13), May 2017, Ottawa, Canada. pp.040001, ⟨10.1063/1.5001423⟩ |
Technological developments of epitaxial lift-off process over InP substratesJournées nationales sur les technologies émergentes en micro nanofabrication (JNTE 2017), Nov 2017, Orléans, France |
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CPV Research at Universite de Sherbrooke: from materials to systems13th International Conference on Concentrated PhotoVoltaics Systems, May 2017, Ottawa, Canada |
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Submillimeter Multijunction Solar Cells: Impact of Dimension, Design and Architecture on Electrical Performances13th International conference on Concentrator Photovoltaic Systems (CPV 13), May 2017, Otawa, Canada |
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Micro/Nanotechnologies for high efficiency solar cells fabricationEMN Meeting on Optoelectronics, Apr 2017, Victoria, Canada |
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Microtechnologies for high efficiency solar cells2016 Photonics North (PN), May 2016, Quebec City, Canada. pp.1-2, ⟨10.1109/PN.2016.7537907⟩ |
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Through Cell Via Contacts: Impact of Hole Integration on Multi-Junction Solar Cell and Associated Surface Treatments12th International Conference on Concentrator Photovoltaic Systems (CPV-12), Apr 2016, Freiburg, Germany |
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Substrate Handling Strategies Thinned Multi-junction Solar-cell Wafers.12th International Conference on Concentrator Photovoltaic Systems (CPV-12), Apr 2016, Freiburg, Germany |
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Plasma Etching for High Efficiency Solar Cells FabricationChina Semiconductor Technology International Conference (CSTIC) 2016, Mar 2016, Shanghai, China |
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Plasma etching for III-V/Ge multijunction solar cells singulation12th International Conference on Concentrator Photovoltaic Systems (CPV-12) (25–27 April 2016,, Apr 2016, Freiburg, Germany |
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Can plasma etching be used in photovoltaics?Plasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France |
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Plasma etching applications in concentrated photovoltaic cell fabrication12th International Conference on Concentrator Photovoltaic Systems (CPV-12), May 2016, Freibourg, Germany. pp.060001, ⟨10.1063/1.4962091⟩ |
GaP/c-Si heterojunction solar cell processing: understanding and recovery of bulk degradation6th international conference on crystalline silicon PV, Mar 2016, Chambery, France |
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Plasma etching for high efficiency solar cells fabricationCMOS Emerging Technologies Research, May 2016, Montreal, Canada |
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Velocity distribution function of ions through high-aspect ratio holes in Inductively-Coupled Plasma reactorPlasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France |
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Roughness generation during Si etching in Cl2 pulsed plasmasPlasma Etch and Strip in Microtechnologies conference, May 2016, Grenoble, France |
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Solar cells with gallium phosphide/silicon heterojunction11th International Conference on Concentrator Photovoltaic Systems (CPV-11), May 2015, Aix-les-Bains, France. pp.040003, ⟨10.1063/1.4931514⟩ |
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Evolution of Bulk c-Si Properties during the Processing of GaP/c-Si Heterojunction Cell5th International Conference on Silicon Photovoltaics (Silicon PV 2015), Mar 2015, Konstanz, Germany. pp.493-499, ⟨10.1016/j.egypro.2015.07.070⟩ |
Measuring IVDF through high−aspect holes in pulsed ICP plasmas68th GEC / ICRP−9, Oct 2015, Honolulu, United States |
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Post-porosity Plasma protection (P4): a promising strategy against v-UV damage in porous, low-k materialsPlasma Etch and Strip in Microtechnologies conference, May 2015, Leuven, Belgium |
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Spectral analysis of the line-width and line-edge roughness transfer during self-aligned double patterning approachSPIE Advanced Lithography, SPIE, 2015, San Jose, CA, United States. pp.94280B, ⟨10.1117/12.2085812⟩ |
GaP/Si heterojunction solar cells: an alternative to amorphous silicon?6th Photovoltaic Technical Conference (PVTC 2015), May 2015, Aix en Provence, France |
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Producing ion waves from acoustic pressure waves in pulsed ICP: Modelling vs. Experiments68th Gaseous Electronics Conference (GEC), Oct 2015, Honolulu, United States |
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Porous Materials Characterization by Infrared SpectroscopyCMOS Emerging Technologies Research, May 2015, Vancouver, Canada |
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Diagnostics in pulsed hydrogen plasmas11th Frontiers in low temperature plasma diagnostics, May 2015, Hyeres, France |
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Challenges of contact etching for 14FDSOI technologySPIE-AL, Feb 2015, San Jose, United States |
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RFEA analyzers to measure IVDF through high−aspect holes in pulsed ICP plasmasFrontiers in Low Temperature Plasma Diagnostics XI, 2015, Porquerolles, France |
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Measuring IVDF through high-aspect holes in pulsed ICP plasma68th Gaseous Electronics Conference (GEC), Oct 2015, Honolulu, United States |
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Multi-junction Solar Cells with Through Substrate Vias ContactsNext Generation PhotoVoltaics Canada, May 2015, Toronto, Canada |
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Measuring IVDF through high−aspect holes in ICP plasmasPESM 2015 (Plasma Etch and Strip in Microtechnology), 2015, Louvain, Belgium |
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Solar Cell with Gallium Phosphide / Silicon HeterojunctionCMOS Emerging Technologies Research, May 2015, Vancouver, Canada |
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Interaction between the plasma & mask materials during the contact etching for 14FDSOIAVS 61st international symposium, Oct 2014, Baltimore, United States |
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Plasma Damage of Porous Low-k MaterialsMaterial Research Society Spring Meeting, Apr 2014, San Francisco, United States |
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Reactor wall plasma cleaning processes after InP etching in Cl2/CH4/Ar ICP dischargePlasma Etch and Strip in Microelectronics (PESM), 7th International Workshop, May 2014, grenoble, France |
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Prospects for dielectric constant reduction in integrated circuits interconnectsMaterials Research Society Spring Meeting, Jun 2014, San Francisco, United States. pp.Mrss14-1692-cc01-01, ⟨10.1557/opl.2014.609⟩ |
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MD simulations of chlorine plasmas interaction with ultrathin silicon films for advanced etch processes.Plasma Etch and Strip in Microelectronics (PESM), 6th International Workshop, May 2014, grenoble, France |
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Producing ion waves from acoustic pressure waves in pulsed inductive plasmasPlasma Etch and Strip in Microelectronics (PESM), May 2014, Grenoble, France |
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Optical and electrical diagnostics in chlorine based pulsed plasmas of an industrial silicon etching reactor1st International Middle-East Plasma Science, Turkey, Apr 2014, Istambul, Turkey |
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MD simulations of chlorine plasmas interaction with ultrathin Si films for advanced etch processes2014 Silicon Nanoelectronics Workshop (SNW), Jun 2014, Honolulu (USA), United States |
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Pulsed Cl2/Ar ICP plasmas processing : 0D Model vs. ExperimentsPlasma Etch and Strip in Microelectronics (PESM), May 2014, grenoble, France |
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Selective dry etching of titanium nitride nanostructures with chlorine-based inductively coupled plasma40th Micro and Nano Engineering Conference, Sep 2014, Lausanne, Switzerland |
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Diagnostics in Pulsed Hydrogen PlasmasAVS 61st international symposium, Oct 2014, Baltimore, United States |
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Silicon etching using CW, synchronized pulsed and bias pulsed Cl2 plasmaAVS 2014, , 2014, Baltimore, United States |
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Pulsed ICP plasmas processing: 0D Model vs. ExperimentsPlasma Etch and Strip in Microelectronics (PESM), 6th International Workshop, May 2014, grenoble, France |
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MD simulations of Cl2 plasmas interaction with ultrathin Si films for advanced etch processes”Plasma Etch and Strip in Microelectronics (PESM), May 2014, Grenoble (France), France |
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Role of the mask on contact etching at the 20 nm nodePlasma Etch and Strip in Microtechnologies conference, May 2014, Grenoble, France |
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Diagnostics of Pulsed Hydrogen Plasmas67th Gaseous Electronic Conference, Oct 2014, Raleigh, United States |
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Pulsed Plasmas for etching in micro and nanoelectronicsPlasma Nanoscience Conference, Mar 2014, Dublin, Ireland |
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Inductively coupled plasma etching of ultra-shallow Si3N4 and SiO2 nanostructures40th Micro and Nano Engineering Conference, Sep 2014, Lausanne, Switzerland |
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MD Simulations of Pulsed Chlorine Plasmas Interaction with Ultrathin Silicon Films for Advanced Etch ProcessesAmerican Vacuum Society 60th International Symposium, Oct 2013, Long beach, United States |
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Pulsed plasmas: from plasma parameters to pattern transferPlasma Etch and Strip in Microtechnologies conference, 2013, leuven, Belgium |
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Pulsed plasma processing: A combined modelling and experimental study31st International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2013, Granada, Spain |
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Pulsed ICP chlorine plasmas : Numerical simulations versus Experiments4th Workshop on Radio Frequency Discharges, May 2013, giens, France |
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Pulsed plasmas for etching at the nanoscaleJournées Nationales des Technologies Émergentes, May 2013, Evian les bains, France |
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Pulsed ICP plasmas processing : A combined modelling and experimental study31st International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2013, Granada, Spain |
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Pulsed plasmas for etching in microelectronicsJournées du réseau plasma froids, 2013, La Rochelle, France |
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Optical and Electrical Diagnostics of Pulsed Plasmas Etching Processes11th Technological Plasma Workshop, Dec 2013, York, United Kingdom |
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Time-resolved Optical and Electrical Diagnostics of Pulsed Plasmas EtchingAmerican Vacuum Society 60th International Symposium, Oct 2013, Long beach, United States |
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MD simulations of chlorine plasmas interaction with ultrathin silicon films for advanced etch processesAVS 2013, Oct 2013, Long beach, United States |
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Characterization of silicon etching in synchronized pulsed plasmaSPIE Advanced Lithography, 2013, San Jose, United States. ⟨10.1117/12.2011462⟩ |
Si3N4 spacers etching in synchronized pulsed CH3F/O2/He/SiF4 plasmasAVS 60h international symposium, Oct 2013, Long Beach, United States |
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Optical and Electrical Diagnostics of Pulsed Plasmas Etching ProcessesAVS 60h international symposium, Oct 2013, Long Beach, United States |
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Low-k integration using metallic hard masksUCPSS, 2012, Ghent, Belgium. pp.195, 193-195, ⟨10.4028/www.scientific.net/SSP.187.193⟩ |
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Self assembly patterning using block copolymer for advanced CMOS Technology : optimisation of plasma etching processesSPIE, 2012, United States. pp.83280M, ⟨10.1117/12.916399⟩ |
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Towards new plasma technologies for 22nm gate etch processes and beyondSPIE-AL, 2012, San Jose, CA, United States |
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Time-resolved diagnostics of pulsed plasma etching processes1st pulsed plasma diagnostic workshop, Sep 2012, Dublin, Ireland |
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Towards new plasma technologies for 22 nm gate etch processes and beyondSPIE Advanced Lithography, 2012, San Jose, United States. pp.83280D, ⟨10.1117/12.920312⟩ |
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Analysis of Passivation Layer Composition and Thickness on Silicon Patterns Etched by Synchronously Pulsed Plasmas5th Plasma Etch and Strip in Microelectronics Workshop (PESM), Mar 2012, Grenoble, France |
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Self-assembly patterning using block copolymer for advanced CMOS technology: optimisation of plasma etching processSPIE, 2012, United States. Volume: 8328 Pages: 83280M (6 pp.), ⟨10.1117/12.91639⟩ |
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Time resolved ion flux measurement in pulsed ICP plasmasTampa, Oct 2012, Tampa, United States |
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Challenges related to linewidth roughnessChina Semiconductor Technology International Conference (CSTIC), Mar 2012, Shanghai, China |
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Investigation of synchronized pulsed plasmas for highly selective etching of Si3N4 spacersPacific Rim Meeting of the Electrochemical and Solid State Society (PRiME), 2012, Hawai, United States |
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Self assembly patterning using block copolymer for advanced CMOS technologyPlasma Etch and Strip in Microelectronics conference, 2012, Grenoble, France |
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Self-assembly patterning using block copolymer for advanced CMOS technology: optimisation of plasma etching processSPIE-AL, 2012, San Jose, CA, United States |
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Plasma Etching for Back End Of Line ApplicationsChina Semiconductor Technology International Conference (CSTIC), Mar 2012, Shanghaï, China |
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SiCl4/Cl2 plasmas: a new chemistry to etch high-k material selectively to Si-based AlloysPlasma Etch and Strip in Microelectronics conference, 2012, Grenoble, France |
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Time-resolved diagnostics of reactive pulsed plasmas by absorption spectroscopy, modulated beam Mass spectrometry, ion flux probes and RFEA analyzersFirst Pulsed Plasma Diagnostics Workshop (PPDW), 2012, dublin, Ireland |
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Plasmas Processes Challenges for Porous SiCOH Integration in Advanced InterconnectsMaterials Research Society spring meeting, Apr 2012, San francisco, United States |
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Improving Etch Processes by Using Pulsed PlasmasAVS 58h international symposium, Oct 2011, Nashville, United States |
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Characterizing plasma-damaged porous low-k4th Plasma Etch and Strip in Microelectronics Workshop, May 2011, Mechelen, Belgium |
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Through cell vias contacts for multijunction solar cells11TH INTERNATIONAL CONFERENCE ON CONCENTRATOR PHOTOVOLTAIC SYSTEMS: CPV-11, May 2011, Aix-les-Bains, France. pp.060003, ⟨10.1063/1.4931537⟩ |
Angstrom Level Resolution EtchChina Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China |
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Porous SiCOH Patterning for Advanced Interconnects: Challenges and SolutionsElectrochem. 219th Soc. Meeting, 2011, Montreal, Canada |
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Interest of synchronized pulsed plasmas for next CMOS technologiesChina Semiconductor Technology International Conference (CSTIC) 2011, Mar 2011, Shanghaï, China |
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Porous SiOCH integration: Etch challenges with a trench first metal hard mask approachChinese Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China. pp.389-394, ⟨10.1149/1.3567609⟩ |
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Characterization of Plasma-Induced Damages on low-k during Interconnection Integration by Scatterometric PorosimetryAVS 58h international symposium, Oct 2011, Nashville, United States |
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Time-Modulation of High density Plasmas for Advanced Dry Etching Processes4th Plasma Etch and Strip in Microelectronics Workshop, May 2011, Mechelen, Belgium |
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Time-resolved diagnostics of pulsed plasmas by UV and VUV absorption spectroscopy and by modulated beam Mass spectrometry64th Gaseous Electronic Conference, 2011, Salt lake city, United States |
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Scatterometric Porosimetry for porous low-k patterns characterizationInterconnect Technology Conference and Materials for Advanced Metallization (IITC/MAM), May 2011, Dresde, Germany |
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Etch processes with pulsed plasmas for advanced CMOS technologies3rd International Conference on Microelectronics and Plasma Technology, Jul 2011, Dalian, China |
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HfO2 etching by pulsed BCl3/Ar plasma4th PESM workshop, May 2011, Belgium |
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Low k Integration Using Metallic Hard MasksMaterials Research Society spring meeting (MRS) 2011, Apr 2011, San Francisco, United States |
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Time-resolved diagnostics of pulsed HBr and Cl2 plasmas64rd Gaseous Electronics Conference, Nov 2011, Salt Lake City, United States |
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HfO2 Etching by Pulsed BCl3/Ar PlasmaAVS 58h international symposium, Oct 2011, Nashville, United States |
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Impact of Synchronized Plasma Pulsing Technologies on Key Parameters Governing STI Etch ProcessesAVS 58h international symposium, Oct 2011, Nashville, United States |
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Impact of ambient atmosphere on plasma-damaged porous low-k characterizationIEEE International Interconnect Technology Conference / Materials for Advanced Metallization, May 2011, Dresde, Germany |
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Challenges of porous SiCOH dielectric material integration for advanced interconnect technology nodesCMOS Emerging Technologies, Jun 2011, Whistler, Canada |
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Diagnostics of reactive pulsed plasmas by UV and VUV absorption spectroscopy and by modulated beam Mass spectrometryIX workshop on frontiers in low temperature plasma diagnostics, 2011, zinowitz, Germany |
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Characterizing Plasma Induced Damage to Ultra Low-kChina Semiconductor Technology International Conference (CSTIC), Mar 2011, Shanghaï, China |
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Synchronized pulsed plasmas: potential process improvements for patterning technologies63rd Gaseous Electronic Conference and 7th International Conference on Reactive Plasmas, Oct 2010, Paris, France |
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Reduction of Plasma Induced Silicon-Recess During Gate Over-Etch Using Synchronous Pulsed PlasmasAVS 57th international symposium, Oct 2010, Albuquerque, United States |
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Challenges in sub-100 nm Dual Damascene Etch of Porous Oxycarbosilane Ultra Low-k Dielectrics for BEOL IntegrationAVS 57th international symposium, Oct 2010, Albuquerque, United States |
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Challenges and future prospects in plasma etching processes3rd International Conference on PLAsma NanoTechnology and Science, Mar 2010, Nagoya,, Japan |
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Etching Process Scalability and Challenges for ULK MaterialsInternational Interconnect Technology Conference, IITC, Jun 2010, Dresde, Germany. ⟨10.1109/IITC.2010.5510735⟩ |
Synchronous Plasma Pulsing for Etch ApplicationsChina Semiconductor Technology International Conference (CSTIC), Mar 2010, Shanghaï, China |
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Pulsed plasmas for nanoCMOS and nanoelectronics devices elaboration2nd International Conference on Plasma Nanoscience (iPlasma Nano-II), 2010, Bateman's Bay, Australia |
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Sidewall Modification of Porous SiOCH Induced by Etching and Post Etching Plasma Treatments3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France |
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Synchronous Plasma Pulsing for Etch Applications3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2019, Grenoble, France |
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Plasma etching processes for nanoCMOS and nanoelectronics devicesMinatech upstream crossroad, 2010, Grenoble, France |
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Synchronized pulsed plasmas: potential process improvements for patterning technologies63rd Annual Gaseous Electronics Conference and 7th International Conference on Reactive Plasmas, Oct 2010, Paris, France |
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Pulsed plasma for nanoCMOS and nanoelectronic device elaborationThe Second International Symposium on Plasma Nanoscience (iPlasmaNano-II), Dec 2010, Sydney, Australia |
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Plasma Etching Process Scalability and challenges for ULK MaterialsIITC 2010, Jun 2010, Burlingame USA., United States |
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Plasma Pulsing for Atomic Layer Etching Application3rd Plasma Etch and Strip in Microelectronics Workshop, Mar 2010, Grenoble, France |
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Molecularly Reinforced Sol-gel Glasses: Preparation, Characterization and Integration StudiesMaterial Research Society Spring Meeting, Nov 2010, United States |
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Plasma Processes Challenges for Porous SiOCH Patterning in Advanced InterconnectsAVS 57th international symposium, 2010, Albuquerque, United States |
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Synchronous Plasma Pulsing for silicon Etch ApplicationsChina Semiconductor Technology International Conference (CSTIC), 2010, Shangai, China |
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Synchronous Plasma Pulsing For Etch ApplicationsAVS 57th international symposium, Oct 2010, Albuquerque, United States |
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Hydrogen Silsesquioxane-Based Hybrid Electron Beam And Optical Lithography For High Density CMOS Prototyping53rd Iinternational Conference on Electron, Ion, and Photon Beam Technology & Nanoffabrication, 2009, United States |
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Inductively-Coupled Pulsed Plasmas in the Presence of Synchronous Pulsed Substrate Bias for Advanced Gate EtchingAVS 56th international symposium, Nov 2009, San José, United States |
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Trigate 6T SRAM scaling to 0.06 μm2Proceeding of 2009 International Electron Devices Meeting, IEDM 2009, Dec 2009, San Francisco, United States |
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Plasma challenges of porous SiOCH patterning for advanced interconnect levels55th American Vacuum Society Symposium, 2008, boston, United States |
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Plasma Etching Challenges for Porous SiOCH Integration in Advanced Interconnect Levels30th Symposium on Dry Process (DPS), 2008, tokyo, Japan |
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Deposition and Etching of Hexagonal and Cubic Boron NitrideAVS 55th international symposium, October 2008, 2008, United States |
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Ash plasma exposure of hybrid material (SiOCH and porogen)54th International AVS symposium, 2007, seattle, United States |
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Metallic versus Organic Hard Mask Strategies for Advanced Dielectric Trenches PatterningProceeding of DPS, Symposium on Dry Process, 2007, tokyo, Japan |
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Dielectric Trenches Patterning: Metallic Vs Organic Hard MaskProceeding of MAM, Metal Advanced Metallization (Workshop), 2007, bruges, Belgium |
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Chamber walls coating during patterning of dielectric damascene structures with a metal hard mask: consequence on cleaning strategiesPlasma Etch and Strip in Microelectronics Workshop, 2007, Detroit, United States |
Ash Plasma Exposure of Hybrid Material (SiOCH and porogen): Comparisaon with Porous SiOCHAVS 54th, 2007, United States |
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Porous SiOCH Modification by O2, NH3 and CH4 plasmas Used as ashing and Pore sealing StepsProceeding of PESM, Plasma Etch and Strip in Microelectronics (Workshop), 2007, leuven, Belgium |
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Chamber Walls Coatings during hard mask patterning of Ultra Low-k Materials: Consequences on Cleaning StrategiesAVS 54th international symposium, 2007, United States |
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Comprehensive study of metal-fluoride crystals issues with trench first hard mask back end architectureSurface Preparation and Cleaning Conference, 2007, United States |
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Evaluation of ellipsometric porosimetry for in-line characterization of low- dielectricsISCE, 4th International Conference on Spectroscopic Ellipsometry, 2007, stockolm, Sweden |
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Chamber Walls Coatings During Patterning of Dielectric Damascene Structures With a Metallic Hard Mask: Consequences on Cleaning StrategiesProceeding of PESM, Plasma Etch and Strip in Microelectronics (Workshop), 2007, leuven, Belgium |
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Emerging Application of Fluorocarbon Plasmas for Integrated Circuits Fabrication8th International workshop on fluorocarbon plasma, 2006, autrans, France |
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Profile control and sidewall modifications of narrow porous ULK trenches after plasma etching and pore sealing treatments53rd International AVS Symposium, 2006, San Francisco, United States |
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Critical Dimensions Control of Narrow Low-k TrenchesMaterials for Advanced Metallization, 2006, grenoble, France |
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Material Modifications and Surface Roughness during Porous SiOCH Etching ProcessesAVS 53rd international symposium, 2006, United States |
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Patterning of narrow SiOCH trenches using the late porogen removal processAVS, 53rd International AVS Symposium, 2006, san francisco, United States |
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Challenges of Plasma Processes for Advanced ULK PatterningMaterials for Advanced Metallization 2006 Conference (MAM 2006), 2006, grenoble, France |
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Etching of Narrow Porous SiOCH Trenches Using a TiN Metallic Hard MaskAVS 52nd international symposium, Oct 2005, Boston, United States |
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Etching Mechanisms of Low-k Materials with the Solid FirstTM ILD Process in Fluorocarbon Based PlasmaAVS 52nd international symposium, 2005, United States |
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Comparison Between Metallic and Inorganic Hard Masks Used for Advanced Porous Low-k Patterning15th International Colloquium on Plasma Processes, 2005, Autrans, France |
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Impact of Hard Mask Composition and Etching Chemistry on Porous Ultra Low-k Material Modification6th International Conference on Microelectronics and Interfaces, 2005, United States |
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Comparison between metallic and inorganic hard masks used for advanced porous low k patterning15th International Colloquium on Plasma Processes (CIP), 2005, autrans, France |
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A Study of Plasma Treatments Limiting Metal Barrier Diffusion into Porous Low-k MaterialsProceeding of ADMETA, Advanced Metallization Asian Session, 2005, tokyo, Japan |
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Time−Modulation of High density Plasmas for Advanced Dry Etching Processes4th PESM workshop, May 2001, Belgium |
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Les Procédés par Plasmas Impliqués dans l'Intégration des Matériaux SiOCH Poreux pour les Interconnexions en MicroélectroniqueMicro et nanotechnologies/Microélectronique. Université Joseph-Fourier - Grenoble I, 2007. Français. ⟨NNT : ⟩ |
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Copper’s Encore: (Dry)Etching a Path from Stardom to Survival in Next-Gen InterconnectsCopper - History, Properties and Applications [Working Title], IntechOpen, 2025, ⟨10.5772/intechopen.1011377⟩ |
Plasma Etching in MicroelectronicsPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.23-58, 2017, ⟨10.1016/B978-1-78548-096-6.50002-X⟩ |
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Patterning Challenges in MicroelectronicsPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.59-94, 2017, ⟨10.1016/B978-1-78548-096-6.50003-1⟩ |
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Plasma Etch Challenges for Gate PatterningPlasma Etching Processes for CMOS Devices Realization, Elsevier, pp.95-118, 2017, ⟨10.1016/B978-1-78548-096-6.50004-3⟩ |
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Interconnects for TomorrowPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.77-91, 2015, ⟨10.1016/B978-1-78548-015-7.50004-4⟩ |
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Porous SiOCH Film IntegrationPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.45-76, 2015, ⟨10.1016/B978-1-78548-015-7.50003-2⟩ |
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Interaction Plasma/DielectricPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.15-43, 2015, ⟨10.1016/B978-1-78548-015-7.50002-0⟩ |
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IntroductionPlasma Etching Processes for Interconnect Realization in VLSI, Elsevier, pp.1-13, 2015, ⟨10.1016/B978-1-78548-015-7.50001-9⟩ |