pierre-olivier jeannin

107
Documents

Publications

Publications

Deposit thumbnail

Power Electronics Solar Inverter on a Biosourced and Biodegradable Substrate -Thermal Study

Vincent Grennerat , Pascal Xavier , Pierre-Olivier Jeannin , Attila Géczy

48th International Spring Seminar on Electronics Technology (ISSE 2025): “Sustainable electronics for a circular economy”, May 2025, Budapest, Hungary. ⟨10.1109/ISSE65583.2025.11120895⟩

Communication dans un congrès hal-05257307v1
Deposit thumbnail

Contribution à la définition des enjeux et verrous de la soutenabilité en électronique de puissance

Adrien Voldoire , Guillaume Vine , Luiz Fernando Lavado Villa , Paul-Etienne Vidal , Ulrich Soupremanien et al.

Symposium de Génie Electrique (SGE 2025), Jul 2025, Toulouse, France

Communication dans un congrès hal-05284240v1
Deposit thumbnail

État de l'art de la recherche vers une électronique de puissance soutenable

Bruno Allard , Morgan Almanza , Matthieu Beley , H. Ben Ahmed , Daniel Chatroux et al.

Symposium de Génie Electrique (SGE2023), Jul 2023, Lille, France

Communication dans un congrès hal-04244521v1
Deposit thumbnail

Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET Switches

Cédric Mathieu de Vienne , Besar Asllani , Hugo Reynes , Martin Guillet , Amin Salim Obaid Al-Hinaai et al.

Power Electronics, Intelligent Motion, Renewable Energy and Energy Management ( PCIM ) Europe, May 2023, Nuremberg, Germany

Communication dans un congrès hal-04147021v1
Deposit thumbnail

High-Speed Digital Electronics Board on a Novel Biobased and Biodegradable Substrate

Vincent Grennerat , Pascal Xavier , Pierre-Olivier Jeannin , Attila Géczy , Nicolas Corrao

2023 46th International Spring Seminar on Electronics Technology (ISSE), May 2023, Timisoara, Romania. pp.1-5, ⟨10.1109/ISSE57496.2023.10168477⟩

Communication dans un congrès hal-04194566v1

Packaging design for low EMI generation of power modules

Pierre-Olivier Jeannin , Jean-Luc Schanen

International Workshop on Integrated Power Packaging (IWIPP) 2022, Aug 2022, GRENOBLE, France

Communication dans un congrès hal-03795727v1
Deposit thumbnail

Model parameter extraction tool for the analysis of seriesconnected SiC-MOSFETs

Cédric Mathieu de Vienne , Pierre Lefranc , Besar Asllani , Pierre-Olivier Jeannin , Bruno Lefebvre

PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2021, Nuremberg (on line), Germany

Communication dans un congrès hal-03506812v1

Towards the implementation of diamond power devices in power converters and measurements of their switching losses

Nicolas C. Rouger , Damien Risaletto , Pierre Lefranc , Pierre-Olivier Jeannin , Hugo Cagnol et al.

MRS Spring Meeting 2021, Apr 2021, Seattle WA, United States

Communication dans un congrès hal-03289135v1

Design of an Integrated Power Module for Silicon Carbide MOSFET with Self-Compensation of the Magnetic Field

Fatme Abed Ali , Yvan Avenas , Pierre Lefranc , Pierre-Olivier Jeannin , Toni Youssef et al.

The 13th European Conference on Silicon Carbide and Related Materials (ECSCRM 2020·2021), Oct 2021, Tours, France

Communication dans un congrès hal-03615995v1
Deposit thumbnail

Experimental investigation of a 10 kV-70A switch with six SiC-MOSFETs in a series-connection configuration

Cédric Mathieu de Vienne , Pierre Lefranc , Besar Asllani , Pierre-Olivier Jeannin , Bruno Lefebvre

European Conference on Silicon Carbide and Related Materials, Oct 2021, Tours, France

Communication dans un congrès hal-03470255v1

3D PCB package for GaN inverter leg with low EMC feature

Pawel Derkacz , Jean-Luc Schanen , Pierre-Olivier Jeannin , Piotr Musznicki , Piotr Chrzan et al.

2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), Sep 2020, Lyon, France. pp.1-10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215641⟩

Communication dans un congrès hal-03052046v1

Full 3D advanced packaging concepts for Wide Bandgap Power Electronics

Jean-Luc Schanen , Yvan Avenas , Pierre-Olivier Jeannin

APEC 2020 – Industry session, Mar 2020, New Orleans, Louisiana, United States

Communication dans un congrès hal-03051992v1

A Comprehensive Sensitivity Evaluation of a GaN Based Class (phi)2 Inverter at Very High Frequency (VHF)

Rawad Makhoul , Xavier Maynard , Pierre Perichon , David Frey , Pierre-Olivier Jeannin et al.

2019 Ieee International Conference on Industrial Technology (icit), Feb 2019, Melbourne, Australia. pp.331--337

Communication dans un congrès hal-03113655v1

EMC Improvement with New Architectures of Gate Drivers for SiC MOSFET Devices

Luciano Francisco Sousa Alves , Pierre Lefranc , Pierre-Olivier Jeannin , Benoît Sarrazin , Van-Sang Nguyen

PCIM Europe 2019, May 2019, Nuremberg, Germany

Communication dans un congrès hal-02130965v1

A DC/DC Converter Based on a Very High Frequency Tuned Power Oscillator

Rawad Makhoul , Charley Lanneluc , Xavier Maynard , Pierre Perichon , Pierre-Olivier Jeannin et al.

PCIM Europe 2019; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2019, Nuremberg, Germany. pp.1--6

Communication dans un congrès hal-02277151v1

A predictive model to investigate the effects of gate driver on dv/dt in series-connected SiC-MOSFETs

Pierre Lefranc , Luciano Francisco Sousa Alves , Pierre-Olivier Jeannin , Benoît Sarrazin , Van-Sang Nguyen et al.

PCIM 2019, May 2019, Nuremberg, Germany

Communication dans un congrès hal-02125170v1

Multi-Step Packaging Concept for Series-Connected SiC MOSFETs

Luciano Francisco Sousa Alves , Pierre Lefranc , Pierre-Olivier Jeannin , Benoît Sarrazin , Jean-Christophe Crébier

EPE'19 ECCE Europe Conference, Sep 2019, Gênes, Italy

Communication dans un congrès hal-02281510v1

Diamond Schottky barrier diodes for power electronics applications

Gaëtan Perez , Juliette Letellier , Aurélien Maréchal , David Eon , Gauthier Chicot et al.

ECCE 2018, Sep 2018, Portland, United States

Communication dans un congrès hal-01885530v1

Gate Driver Architectures Impacts on Voltage Balancing of SiC MOSFETs in Series Connection

Luciano Francisco Sousa Alves , Van-Sang Nguyen , Pierre Lefranc , Benoit Sarrazin , Pierre-Olivier Jeannin et al.

EPE-2018 ECCE 2018, Sep 2018, Riga, Latvia

Communication dans un congrès hal-01883779v1

Determining the minimal decoupling capacitor in a high speed switching cell using optimization

Andressa Nakahata Medrado , Jean-Luc Schanen , Pierre-Olivier Jeannin , Jean-Michel Guichon , Guillaume Desportes et al.

ecce 2018, Sep 2018, Portland, United States

Communication dans un congrès hal-01885534v1
Deposit thumbnail

Etude de deux structures d'onduleurs Hautes Fréquences (HF) et Très Hautes Fréquences (THF) à transistor GaN

Rawad Makhoul , Xavier Maynard , Pierre Perichon , Davide Frey , Pierre-Olivier Jeannin et al.

Symposium de Génie Electrique, Université de Lorraine [UL], Jul 2018, Nancy, France

Communication dans un congrès hal-02981856v1

Analyses of the unbalanced paralleled GaN HEMT transistors

Nguyen Sang , Pierre-Olivier Jeannin , Pierre Lefranc

2018 20th European Conference on Power Electronics and Applications (epe'18 Ecce Europe), 2018, Riga, Latvia

Communication dans un congrès hal-02331198v1

Analyses of the unbalanced paralleled GaN HEMT transistors

Sang N. Nguyen , Pierre-Olivier Jeannin , Pierre Lefranc

EPE - ECCE europe 2018, Sep 2018, Riga, Latvia

Communication dans un congrès hal-01880068v1
Deposit thumbnail

Diodes Schottky en Diamant : augmentation du calibre en courant et parallélisation

Gaetan Perez , Juliette Letellier , Aurélien Maréchal , David Eon , Gauthier Chicot et al.

Symposium de Génie Electrique, Université de Lorraine [UL], Jul 2018, Nancy, France

Communication dans un congrès hal-02981846v1

Review on SiC-MOSFET Devices and Associated Gate Drivers

Luciano Francisco Sousa Alves , Pierre Lefranc , Pierre-Olivier Jeannin , Benoit Sarrazin

IEEE International Conference on Industrial Technology (ICIT), Feb 2018, Lyon, France

Communication dans un congrès hal-01720421v1

Etude et réalisation de deux structures d’onduleurs Hautes Fréquences (HF) et Très Hautes Fréquences (VHF) à transistor GaN

Rawad Makhoul , Xavier Maynard , Pierre Perichon , David Frey , Pierre-Olivier Jeannin et al.

SGE 2018, Jul 2018, Nancy, France

Communication dans un congrès hal-01845189v1

Diamond Devices for Power Electronics

Nicolas Clément, Jean-Paul Rouger , Thanh-Toan Pham , Gaetan Perez , Masante Cédric , Pierre Lefranc et al.

11th Conference on New Diamond and Nano Carbons, May 2017, Cairns, Australia

Communication dans un congrès hal-01590457v1

SIC power devices in power electronics: An overview

Luciano Fs Alves , Ruan Cm Gomes , Pierre Lefranc , Raoni de A Pegado , Pierre-Olivier Jeannin et al.

Power Electronics Conference (COBEP), 2017 Brazilian, 2017, Juiz de Fora, Brazil

Communication dans un congrès hal-02330510v1

SIC Power Devices in Power Electronics: An Overview

Luciano Francisco Sousa Alves , Ruan Cm Gomes , Pierre Lefranc , Pierre-Olivier Jeannin , Raoni de A Pegado et al.

Brazilian Power Electronics Conference (COBEP), Nov 2017, Minas Gerais, Brazil

Communication dans un congrès hal-02445586v1

Diamond Schottky diodes interactions in power electronics application

Gaetan Perez , Jacques Letellier , Aurélien Maréchal , Pierre-Olivier Jeannin , Pierre Lefranc et al.

MRS 2017 Fall Meeting, Nov 2017, Boston, United States

Communication dans un congrès hal-01655900v1

Parallel and interleaved structures for diamond Schottky diodes

Gaëtan Perez , Pierre Lefranc , Pierre-Olivier Jeannin , David Eon , Nicolas Clément, Jean-Paul Rouger

EPE 2017 (ECCE Europe), Sep 2017, Varsovie, Poland

Communication dans un congrès hal-01590604v1

Packaging 3D pour MOSFET en carbure de silicium

Guillaume Régnat , Pierre-Olivier Jeannin , Jeffrey Ewanchuk , David Frey , Stefan Mollov et al.

Symposium de Génie Electrique (SGE) 2016, Jun 2016, Grenoble, France

Communication dans un congrès hal-01332909v1

Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter

Gaëtan Perez , Nicolas Clément, Jean-Paul Rouger , Pierre Lefranc , Pierre-Olivier Jeannin , Yvan Avenas et al.

ICDCM2016 - International Conference on Diamond and Carbon Materials, Sep 2016, Montpellier, France

Communication dans un congrès hal-01366471v1
Deposit thumbnail

Simulation numérique et caractérisation de composants de puissance en diamant

Nicolas Clément, Jean-Paul Rouger , Aurélien Maréchal , Gauthier Chicot , Gaetan Perez , Thanh-Toan Pham et al.

Symposium de Genie Electrique, Jun 2016, Grenoble, France

Communication dans un congrès hal-01361596v1

Perturbations électromagnétiques conduites d’un bras d’onduleur à base de transistors en Nitrure de Galium: Structure « 3D » pour composants horizontaux

Clément Fita , Pierre-Olivier Jeannin , Pierre Lefranc , Edith Clavel , Johan Delaine

Symposium de Genie Electrique 2016 (SGE 2016), Jun 2016, Grenoble, France

Communication dans un congrès hal-01332707v1
Deposit thumbnail

Packaging 3D pour MOSFET en carbure de silicium

Guillaume Regnat , Pierre-Olivier Jeannin , Jeffrey Ewsanchuk , David Frey , Stefan Mollov et al.

Symposium de Genie Electrique, Jun 2016, Grenoble, France

Communication dans un congrès hal-01361591v1

A Novel 3D Structure for Synchronous Buck Converter Based on Nitride Gallium Transistors

Clément Fita , Pierre-Olivier Jeannin , Pierre Lefranc , Edith Clavel , Johan Delaine

Energy Conversion Congress & Exposition (ECCE 2016), Sep 2016, Milwaukee, United States

Communication dans un congrès hal-01373687v1
Deposit thumbnail

Perturbations électromagnétiques conduites d'un bras d'onduleur à base de transistors en Nitrure de Galium: Structure « 3D » pour composants horizontaux

Clement Fita , Pierre Lefranc , Pierre-Olivier Jeannin , Edith Clavel , Johan Delaine

Symposium de Genie Electrique, Jun 2016, Grenoble, France

Communication dans un congrès hal-01361586v1

Optimized Power Modules for Silicon Carbide MOSFET

Guillaume Régnat , Pierre-Olivier Jeannin , Jeffrey Ewanchuk , David Frey , Stefan Mollov et al.

Energy Conversion Congress & Exposition (ECCE 2016), Sep 2016, Milwaukee, United States

Communication dans un congrès hal-01373737v1

Design of a GaN HEMT based inverter leg power module for aeronautic applications

Benoit Thollin , Fadi Zaki , Zoubir Khatir , Regis Meuret , Donatien Martineau et al.

2016 6th Electronic System-Integration Technology Conference (ESTC), Sep 2016, Grenoble, France. pp.1-6, ⟨10.1109/ESTC.2016.7764473⟩

Communication dans un congrès hal-04156066v1

Monolithic integration in CVD diamond: Schottky power diodes and integrated temperature sensor

Nicolas Clément, Jean-Paul Rouger , David Eon , Gaëtan Perez , Pierre-Olivier Jeannin , Pierre Lefranc et al.

2016 MRS Spring Meeting and Exhibit - Diamond Power Electronic Devices symposium, Mar 2016, Phoenix, United States

Communication dans un congrès hal-01306775v1

Silicon carbide Power Chip On Chip Module Based On Embedded Die Technology With Paralleled Dies

Guillaume Régnat , Pierre-Olivier Jeannin , Guillaume Lefèvre , Jeffrey Ewanchuk , David Frey et al.

ECCE 2015, Sep 2015, Montréal, Canada

Communication dans un congrès hal-01212763v1

Silicon Carbide Power Chip On Chip Module Based On Embedded Die Technology With Paralleled Dies

Guillaume Régnat , Pierre-Olivier Jeannin , Guillaume Lefèvre , Jeffrey Ewanchuk , David Frey et al.

Energy Conversion Congress and Exposition (ECCE 2015), Sep 2015, Montréal, Canada

Communication dans un congrès hal-01380606v1

Insulated Gate Driver for eGaN Fet

Johan Delaine , Pierre-Olivier Jeannin , David Frey , Kevin Guépratte

ECCE 2014, Sep 2014, Pittsburgh, PA, United States

Communication dans un congrès hal-01067186v1

Realization and Characterization of an IGBT Module Based on the Power Chip-on-Chip 3D Concept

Jean-Louis Marchesini , Pierre-Olivier Jeannin , Yvan Avenas , Leonardo Ruffeil de Oliveira , Cyril Buttay et al.

ECCE, Sep 2014, Pittsburgh, PA, United States. ⟨10.1109/ECCE.2014.6954043⟩

Communication dans un congrès hal-01067144v1

Improvement Of GaN Transistors Working Conditions To Increase Efficiency Of A 100W DC-DC Converter

Johan Delaine , David Frey , Pierre-Olivier Jeannin , Kevin Guépratte

APEC 2013, Mar 2013, Long Beach, United States

Communication dans un congrès hal-00811816v1

Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve Technique

Benoît Thollin , Laurent Dupont , Zoubir Khatir , Yvan Avenas , Jean-Christophe Crébier et al.

EPE'13 ECCE Europe, 2013, Lille, France

Communication dans un congrès hal-00988257v1

Design and control of a demagnetization circuit for permanent ON OFF operation in pulse transformer gate driver

The Van Nguyen , Jean-Christophe Crébier , Pierre-Olivier Jeannin

Applied Power Electronics Conference and Exposition APEC 2012, Feb 2012, Orlando, United States

Communication dans un congrès hal-00673365v1

Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters

Laurent Dupont , Yvan Avenas , Pierre-Olivier Jeannin

Applied Power Electronics Conference and Exposition APEC 2012, Feb 2012, Orlando, United States. p 182 à 189

Communication dans un congrès hal-00673411v1

High Frequency DC-DC Converter Using GaN Device

Johan Delaine , Pierre-Olivier Jeannin , David Frey , Kevin Guépratte

Applied Power Electronics Conference and Exposition APEC 2012, Feb 2012, Orlando, United States. p1754 à 1761

Communication dans un congrès hal-00673384v1

Reduction of the Stray Inductance in a Switching Cell using the Power Chip-on-Chip 3D Integration Concept

Jean-Louis Marchesini , Yvan Avenas , Pierre-Olivier Jeannin , Salim Boulahrouz

ECCE2012, Sep 2012, Raleigh, United States

Communication dans un congrès hal-00736000v1

Fault Tolerant 24 KVA Interleaved Inverter

Pierre-Olivier Jeannin , David Frey , Yvan Avenas , Kevin Guépratte , Hervé Stephan

ECCE 2012, Sep 2012, Raleigh, United States

Communication dans un congrès hal-00736009v1

A new compact, isolated and integrated gate driver using high frequency transformer for interleaved Boost converter

The Van Nguyen , Pierre-Olivier Jeannin , Jean-Christophe Crébier , Jean-Luc Schanen

ECCE 2011, Sep 2011, Phoenix, United States

Communication dans un congrès hal-00626992v1

Reversing the power flow in the looped electrical distribution network by using a cascaded H-bridge D-SSSC

M. Saradarzadeh , Shahrokh Farhangi , Jean-Luc Schanen , Pierre-Olivier Jeannin , David Frey

IEEE PEDSTC 2011, Feb 2011, Téhéran, Iran

Communication dans un congrès hal-00741672v1

Compact, isolated and simple to implement gate driver using high frequency transformer

The Van Nguyen , Jean-Christophe Crébier , Pierre-Olivier Jeannin

APEC 2011, Mar 2011, United States

Communication dans un congrès hal-00577026v1

Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)

Benoit Thollin , Jean-Christophe Crebier , Yvan Avenas , Pierre-Olivier Jeannin , Zoubir Khatir et al.

ECCE 2011 - IEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, Sep 2011, PHOENIX, United States. pp.60-67, ⟨10.1109/ECCE.2011.6063749⟩

Communication dans un congrès hal-00881531v1
Deposit thumbnail

Series connection of IGBT

The Van Nguyen , Pierre-Olivier Jeannin , Eric Vagnon , David Frey , Jean-Christophe Crébier

APEC 2010, Feb 2010, Palm Springs, United States. pp 2238 à 2244

Communication dans un congrès hal-00461367v1
Deposit thumbnail

Implementation and operational investigations of bipolar gate drivers

Jean-Christophe Crébier , Manh Hung Tran , Jean Barbaroux , Pierre-Olivier Jeannin

APEC 2010, Feb 2010, Palm Springs, United States. pp.248 à 255

Communication dans un congrès hal-00461409v1

Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM

Jean-Christophe Crébier , Yvan Avenas , Kremena Vladimirova , Pierre-Olivier Jeannin , Christian Schaeffer et al.

Electronique de Puissance du Futur EPF 2010, Jun 2010, Saint-Nazaire, France

Communication dans un congrès hal-00514401v1

A Novel Fuzzy Logic DC Bus Voltage Balancing Controller for a D-SSSC Cascaded H-bridge Converter

M. Saradarzadeh , Shahrokh Farhangi , Jean-Luc Schanen , Pierre-Olivier Jeannin

PEDSTC 2010, Feb 2010, Téhéran, Iran. pp.141-146

Communication dans un congrès hal-00608439v1
Deposit thumbnail

Fault Tolerance on Interleaved inverter with Magnetic couplers

Kevin Guépratte , David Frey , Pierre-Olivier Jeannin , H. Stephan , Jean-Paul Ferrieux

APEC 2010, Feb 2010, Palm Springs, United States. pp.1817 à 1824

Communication dans un congrès hal-00461380v1

The benefits of looping a radial distribution system with a power flow controller

M. Saradarzadeh , Shahrokh Farhangi , Jean-Luc Schanen , Pierre-Olivier Jeannin , David Frey

PECON 2010, Nov 2010, Kuala Lampur, Malaysia

Communication dans un congrès hal-00608226v1
Deposit thumbnail

High Efficiency Interleaved Power Electronics Converter for wide operating power range

Kevin Guépratte , Pierre-Olivier Jeannin , David Frey , H. Stephan

APEC 2009, 2009, Washingon, United States

Communication dans un congrès hal-00364103v1
Deposit thumbnail

Electrical Characterization of a Pressed Contact Between a Power Chip and a Metal Electrode

Eric Vagnon , Yvan Avenas , Jean-Christophe Crébier , Pierre-Olivier Jeannin , I. Al Batta et al.

I2MTC 2009, 2009, Singapour, Singapore

Communication dans un congrès hal-00384063v1
Deposit thumbnail

Short-circuit limitation thanks to a series connected VSC

Seddik Bacha , David Frey , Jean-Luc Schanen , Erwan Le Pelleter , Pierre-Olivier Jeannin et al.

APEC'08, Feb 2008, Austin, United States

Communication dans un congrès hal-00355342v1

Driver numérique avec commande en courant des MOSFET et IGBT

Kevin Guépratte , Pierre-Olivier Jeannin , David Frey

EPF 2008 XIIème colloque Electronique de Puissance du Futur, Jul 2008, Tours, France. pp.255-258

Communication dans un congrès hal-00294015v1

Study and Realization of a Low Force 3D Press-Pack Power Module

Eric Vagnon , Jean-Christophe Crébier , Yvan Avenas , Pierre-Olivier Jeannin

Power Electronics Specialists Conference PESC 08, Jun 2008, Rhodes, Greece. IEEE pesc conference, pp 1048-1054

Communication dans un congrès hal-00292635v1

Multi-level Converter Dimensioning with Structure and Losses Consideration for DFACTS Applications

Erwan Le Pelleter , Pierre-Olivier Jeannin , D. Frey , Jean-Luc Schanen

EPE'2007, Sep 2007, Aalborg, Denmark

Communication dans un congrès hal-00288820v1

Modélisation avancée de module de puissance

Patrick Austin , Rodolphe de Maglie , Jean-Louis Sanchez , Jean-Luc Schanen , Patrick Tounsi et al.

Journées GdR, Oct 2005, Lyon, France

Communication dans un congrès hal-00187678v1

Active voltage balancing by turn‐off delays regulation for multiple series‐connected SiC MOSFETs

Cédric Mathieu de Vienne , Pierre Lefranc , Pierre‐olivier Jeannin , Bruno Lefebvre , Besar Asllani

IET Power Electronics, 2025, 18 (1), ⟨10.1049/pel2.70001⟩

Article dans une revue hal-04909527v1
Deposit thumbnail

Advanced voltage balancing techniques for series-connected SiC-MOSFET devices: A comprehensive survey

Luciano F.S. Alves , Pierre Lefranc , Pierre-Olivier Jeannin , Benoit Sarrazin

Power Electronic Devices and Components, 2024, 7, pp.100055. ⟨10.1016/j.pedc.2023.100055⟩

Article dans une revue (article de synthèse) hal-05289882v1
Deposit thumbnail

EMI Mitigation of GaN Power Inverter Leg by Local Shielding Techniques

Pawel B Derkacz , Jean-Luc Schanen , Pierre-Olivier Jeannin , Piotr J Chrzan , Piotr Musznicki et al.

IEEE Transactions on Power Electronics, 2022, 37 (10), pp.11996-12004. ⟨10.1109/TPEL.2022.3176943⟩

Article dans une revue hal-03816337v1
Deposit thumbnail

Optimization of a Gate Distribution Layout to Compensate the Current Imbalance Generated by the 3D Geometry of a Railway Inverter

Andressa Nakahata-Medrado , Jean-Luc Schanen , Jean-Michel Guichon , Pierre-Olivier Jeannin , Emmanuel Batista et al.

Energies, 2021, 14 (7), pp.1891. ⟨10.3390/en14071891⟩

Article dans une revue hal-03564739v1
Deposit thumbnail

A Cascaded Gate Driver Architecture to Increase the Switching Speed of Power Devices in Series Connection

Luciano F S Alves , Van-Sang Nguyen , Pierre Lefranc , Jean-Christophe Crebier , Pierre-Olivier Jeannin et al.

IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021, 9 (2), ⟨10.1109/JESTPE.2020.3006748⟩

Article dans une revue hal-03030290v1
Deposit thumbnail

A New Gate Drive Power Supply Configuration for Common Mode Conducted EMI Reduction in Phase-Shifted Full-Bridge Converter

Luciano F.S. Alves , Pierre Lefranc , Pierre-Olivier Jeannin , Benoit Sarrazin

IEEE Transactions on Power Electronics, 2021, 36 (4), pp.4081-4090. ⟨10.1109/TPEL.2020.3023638⟩

Article dans une revue hal-05289883v1
Deposit thumbnail

A New Gate Drive Power Supply Configuration for Common Mode Conducted EMI Reduction in Phase-Shifted Full-Bridge Converter

Luciano F. S. Alves , Pierre Lefranc , Pierre-Olivier Jeannin , Benoit Sarrazin

IEEE Transactions on Power Electronics, 2021, 36 (4), pp.4081--4090. ⟨10.1109/TPEL.2020.3023638⟩

Article dans une revue hal-03651462v1
Deposit thumbnail

A Cascaded Gate Driver Architecture to Increase the Switching Speed of Power Devices in Series Connection

Luciano F.S. Alves , Van-Sang Nguyen , Pierre Lefranc , Jean-Christophe Crebier , Pierre Olivier Jeannin et al.

IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021, 9 (2), pp.2285-2294. ⟨10.1109/JESTPE.2020.3006748⟩

Article dans une revue hal-05289893v1
Deposit thumbnail

Determining the minimal decoupling capacitor in a railway traction inverter using optimization

Andressa Nakahata Nakahata Medrado , Jean-Michel Guichon , Pierre-Olivier O Jeannin , Jean-Luc Schanen , Emmanuel Batista et al.

IEEE Transactions on Industry Applications, 2021, 57 (6), pp.6318-6326. ⟨10.1109/TIA.2021.3114128⟩

Article dans une revue hal-03564746v1
Deposit thumbnail

Analysis of the Multi-Steps Package (MSP) for Series-Connected SiC-MOSFETs

Luciano F S Alves , Pierre Lefranc , Pierre-Olivier Jeannin , Benoit Sarrazin , Jean-Christophe Crebier

Electronics, 2020, 9 (9), pp.1341. ⟨10.3390/electronics9091341⟩

Article dans une revue hal-03030289v1
Deposit thumbnail

Analysis of the Multi-Steps Package (MSP) for Series-Connected SiC-MOSFETs

Luciano F.S. Alves , Pierre Lefranc , Pierre-Olivier Jeannin , Benoit Sarrazin , Jean-Christophe Crebier

Electronics, 2020, 9 (9), pp.1341. ⟨10.3390/electronics9091341⟩

Article dans une revue hal-05289887v1
Deposit thumbnail

Diamond semiconductor performances in power electronics applications

Gaëtan Perez , Aurélien Maréchal , Gauthier Chicot , Pierre Lefranc , Pierre-Olivier Jeannin et al.

Diamond and Related Materials, 2020, 110, pp.108154. ⟨10.1016/j.diamond.2020.108154⟩

Article dans une revue hal-02988340v1
Deposit thumbnail

A Very High Frequency Self-Oscillating Inverter Based on a Novel Free-Running Oscillator

Rawad Makhoul , Jia Zhuang , Xavier Maynard , Pierre Perichon , David Frey et al.

IEEE Transactions on Power Electronics, 2019, 34 (9), pp.8289--8292. ⟨10.1109/TPEL.2019.2904886⟩

Article dans une revue hal-02350894v1

Optimized Power Modules for Silicon Carbide MOSFET

Guillaume Regnat , Pierre-Olivier Jeannin , David Frey , Jeffrey Ewanchuk , Stefan V. Mollov et al.

IEEE Transactions on Industry Applications, 2018, 54 (2), pp.1634--1644. ⟨10.1109/TIA.2017.2784802⟩

Article dans une revue hal-02278145v1

Giant Magneto-Impedance Sensor for Gate Driver Insulated Signal Transmission Functions

Yohan Wanderoild , Aktham Asfour , Pierre Lefranc , Pierre-Olivier Jeannin , Jean-Paul Yonnet

IEEE Transactions on Power Electronics, 2017, 32 (4), pp.2493-2497. ⟨10.1109/tpel.2016.2625045⟩

Article dans une revue hal-02057070v1
Deposit thumbnail

Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter

Gaëtan Perez , Gauthier Chicot , Yvan Avenas , Pierre Lefranc , Pierre-Olivier Jeannin et al.

Diamond and Related Materials, 2017, 78, pp.83-87. ⟨10.1016/j.diamond.2017.08.008⟩

Article dans une revue hal-01590613v1

Above 2000 V breakdown voltage at 600 K GaN-on-silicon high electron mobility transistors

Nicolas Herbecq , Isabelle Roch-Jeune , Astrid Linge , Malek Zegaoui , Pierre-Olivier Jeannin et al.

Physica Status Solidi A (applications and materials science), 2016, 213 (4), pp.873--877. ⟨10.1002/pssa.201532572⟩

Article dans une revue istex hal-02277752v1
Deposit thumbnail

Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3D Concept

Jean-Louis Marchesini , Pierre-Olivier Jeannin , Yvan Avenas , Johan Delaine , Cyril Buttay et al.

IEEE Transactions on Industry Applications, 2016, PP (99), ⟨10.1109/TIA.2016.2604379⟩

Article dans une revue hal-01373011v1

Design and Investigation of an Isolated Gate Driver Using CMOS Integrated Circuit and HF Transformer for Interleaved DC/DC Converter

The Van Nguyen , Jean-Christophe Crébier , Pierre-Olivier Jeannin

IEEE Transactions on Industry Applications, 2013, 49 (1), ⟨10.1109/tia.2012.2229254⟩

Article dans une revue hal-00988250v1

A Novel DC Bus Voltage Balancing of Cascaded H-bridge Converters in D-SSSC Application

M. Saradarzadeh , Shahrokh Farhangi , Jean-Luc Schanen , Pierre-Olivier Jeannin , David Frey

Journal of Power Electronic, 2012, 12 (4), pp.567-577. ⟨10.6113/jpe.2012.12.4.567⟩

Article dans une revue hal-00741779v1

Combination of power flow controller and short-circuit limiter in distribution electrical network using a cascaded H-bridge distribution-static synchronous series compensator

M. Saradarzadeh , Shahrokh Farhangi , Jean-Luc Schanen , Pierre-Olivier Jeannin , David Frey

IET Generation, Transmission & Distribution, 2012, 6 (11), pp.1121 - 1131. ⟨10.1049/iet-gtd.2012.0199⟩

Article dans une revue hal-00807505v1

Application of cascaded H-bridge distribution-static synchronous series compensator in electrical distribution system power flow control

M. Saradarzadeh , Shahrokh Farhangi , Jean-Luc Schanen , Pierre-Olivier Jeannin , David Frey

IET Journal of Power Electronics, 2012, pp.1660-1675. ⟨10.1049/iet-pel.2012.0087⟩

Article dans une revue hal-00815984v1

Indexage statique et électromécanique au démarrage pour moteur synchrone à aimants permanents

Cédric Milleret , Pierre-Olivier Jeannin , Hervé Stephan , Emmanuel Toutain Article dans une revue istex hal-00790024v1

Les puces de puissance forcent boîtiers et modules à évoluer

Yvan Avenas , Jean-Louis Marchesini , Pierre-Olivier Jeannin

ElectroniqueS, 2011, pp.58-63

Article dans une revue hal-00790399v1

Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM

Jean-Christophe Crébier , Yvan Avenas , Kremena Vladimirova , Pierre-Olivier Jeannin , Christian Schaeffer et al.

Revue Internanationale de Génie Electrique, 2011, pp.617-633. ⟨10.3166/ejee.14.617-633⟩

Article dans une revue istex hal-00790044v1

A Bus-Bar-Like Power Module Based on Three-Dimensional Power-Chip-on-Chip Hybrid Integration

Eric Vagnon , Pierre-Olivier Jeannin , Jean-Christophe Crébier , Yvan Avenas

IEEE Transactions on Industry Applications, 2010, 46 (5), pp.2046-2055. ⟨10.1109/tia.2010.2057401⟩

Article dans une revue hal-00608445v1

Complete Analytical Calculation of Static Leakage Parameters: A Step Toward HF Transformer Optimization

Xavier Margueron , Abdelhadi Besri , Pierre-Olivier Jeannin , Jean-Pierre Kéradec , Guillaume Parent

IEEE Transactions on Industry Applications, 2010, 46 (3), pp.1055-1063. ⟨10.1109/tia.2010.2045327⟩

Article dans une revue hal-00608447v1

A Busbar Like Power Module Based on 3D Power Chip on Chip Hybrid Integration

Eric Vagnon , Pierre-Olivier Jeannin , Jean-Christophe Crébier , Yvan Avenas

IEEE Transactions on Industry Applications, 2010, 46 (5), pp.2046-2055

Article dans une revue hal-00608496v1
Deposit thumbnail

Stratégies multiéchelles de recyclage de déchets riches en métaux: du réacteur de laboratoire au pilote de terrain

Elia Laroche , Lorenzo Spadini , L Oxarango , Paula Morais , R Branco et al.

AFEM 2025 : 12ème colloque de l'Association Francophone d'Écologie Microbienne, Nov 2025, Beaune, France

Poster de conférence hal-05458646v1