Remi Dussart
251
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Optical emission spectroscopy analysis of Hydrogen Hβ spectral line in confined plasmaInternational Workshop on Microplasmas (IWM 12), Jun 2024, Orléans (Auditorium du Musée des Beaux Arts), France
Communication dans un congrès
hal-04606149v1
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Optical emission spectroscopy spatial characterization of a silicon based Micro Hollow Cathode Discharge operating in Helium in DC regime76th Annual Gaseous Electronics Conference, Oct 2023, Ann Arbor, United States
Communication dans un congrès
hal-04134203v1
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Fabrication process and first charactesisation of novel silicon-based microplasma reactorsInternational Workshop on Microplasmas (IWM 11), Jun 2022, Raleigh, United States
Communication dans un congrès
hal-03698719v1
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Atmospheric Plasma DC Source in the Micro Scale Elaborated by Micro-NanotechnologiesXXV Europhysics Conference on Atomic and Molecular Physics of Ionized Gases (ESCAMPIG XXII), Jul 2022, Paris, France
Communication dans un congrès
hal-03049315v1
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Advances in optical diagnostics of Microplasmas: imaging and spectroscopyInternational Workshop on Microplasmas (IWM 11), Jun 2022, Raleigh, United States
Communication dans un congrès
hal-03633854v1
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Atomic layer etching of Gallium Nitride (GaN) using SF6 and Ar plasmasPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03539383v1
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Plasma cryogenic etching : benefits of cooling the substrate at a low temperature in etching process technologies42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès
hal-03539474v1
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SiOxFy layer deposition for cryogenic nanoscale etchingPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03539368v1
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Physical mechanisms involved in silicon based plasma microreactors operating in DC5th Asia Pacific Conference on Plasma Physics (AAPPS-DPP2021), Association of Asia-Pacific Physical Societies and Division of Plasma Physics, Sep 2021, online - Kyushu University, Japan
Communication dans un congrès
hal-03355293v1
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Atomic Layer Etching of Gallium Nitride (GaN) using fluorinated chemistry42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès
hal-03539418v1
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Recent advances in micro-discharges ‒ sources and diagnosticsMGK Colloquium - Transient Atmospheric Plasmas: from plasmas to liquids to solids, Apr 2021, Bochum, Germany
Communication dans un congrès
hal-03218025v1
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Resonance broadening as a valuable diagnostic to study atmospheric pressure plasma – application to micro-plasmas9th International Workshop and Summer School on Plasma Spectroscopy (IPS 2020), Jun 2020, Greifswald, Germany
Communication dans un congrès
hal-03374037v1
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Resonance Broadening as a Valuable Diagnostic to Study Atmospheric Pressure Plasma \textendash ~Application to Micro-Plasmas9th International Workshop and Summer School on Plasma Spectroscopy (IPS 2020), Jun 2020, Greifswald, Germany
Communication dans un congrès
hal-03049314v1
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Études Spectroscopiques Aux Petites Échelles de Décharges à Haute Pression~: Intérêt Des Transitions RésonantesEcole Technologique Du Reseau Des Plasmas Froids, Sep 2020, Saint-Dié-des-Voges, France
Communication dans un congrès
hal-03049312v1
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Atomic Layer Etching at low substrate temperature19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, United States
Communication dans un congrès
hal-02311308v1
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Intérêt des transitions résonnantes en spectroscopie pour les plasmas froids atmosphériques: diagnostic des ondes d’ionisations et de micro-cavités25e Congrès Général de la Société Française de Physique, Jul 2019, Nantes, France
Communication dans un congrès
hal-02189144v1
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Intérêt des transitions résonnantes en spectroscopie pour les plasmas froids à haute pression: diagnostic des ondes d’ionisations et de micro-cavités1e Rencontres Scientifiques Plasmas Froids et Lasers, Nov 2019, Toulouse, France
Communication dans un congrès
hal-02189173v1
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Cryogenic process for Atomic Layer EtchingPlasma Etch and Strip in Microtechnology, May 2019, Grenoble, France
Communication dans un congrès
hal-02311291v1
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Plasma processes applied to SiO2 cryo-atomic layer etchingXXXIV International Conference on Phenomena in Ionized Gases - 10th International Conference on Reactive Plasmas, Jul 2019, Sapporo, Japan
Communication dans un congrès
hal-02311288v1
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Atomic Layer Etching at cryogenic temperaturePlasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Communication dans un congrès
hal-02311323v1
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Cryo-etching mechanism characterization by in-situ spectroscopic ellipsometrySurface Fest 2018, Jun 2018, Bordeaux, France
Communication dans un congrès
hal-02311254v1
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Titanium-based MEMS: Application for a novel implantable feedthrough using TTV (Through Titanium Vias) technologies6th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD 2018), May 2018, Grenoble, France
Communication dans un congrès
hal-02306370v1
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Plasma properties of DC silicon based micro hollow cavity discharge (MHCD) operating in various gases - a spectroscopic study71st Annual Gaseous Electronics Conference, Nov 2018, Portland, United States
Communication dans un congrès
hal-02131687v1
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Étude par spectroscopie d'émission de la température du gaz à l'intérieur et au voisinage d'une micro-cavité plasma (MHCD)14e Journées du Réseau Plasmas Froids, Oct 2018, La Rochelle, France
Communication dans un congrès
hal-01974867v1
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Electro-optical probe for dielectric barrier discharge analysis45th IEEE International Conference on Plasma Science (ICOPS 2018), Jun 2018, Denver, United States
Communication dans un congrès
hal-02017951v1
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The role of SiF4 physisorption in the cryogenic etching process of silicon40th International Symposium on Dry Process, Nov 2018, Nagoya, Japan
Communication dans un congrès
hal-02311267v1
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Vectorial Electric Field Characterization Of Plasmas Using An Optical Probe71st Annual Gaseous Electronics Conference, Nov 2018, Portland, United States
Communication dans un congrès
hal-02018204v1
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Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage40th International Symposium on Dry Process, Nov 2018, Nagoya, France
Communication dans un congrès
hal-02311275v1
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Bulk micromachined Titanium MEMS16th NAMIS Workshop (NAMIS 2018), Jun 2018, Oulu, Finland
Communication dans un congrès
hal-02306373v1
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Microdischarge integration on silicon based devices70th Gaseous Electronics Conference, Nov 2017, Pittsburgh, United States
Communication dans un congrès
hal-01686038v1
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CRYOGENIC ETCHING APPLIED TO THE REALIZATION OF HIGH DENSITY CAPACITOR WITH A HOMOPOLYMER MASKInternational Conference on Plasma Processes 2017 (CIP2017), Jun 2017, Nice, France
Communication dans un congrès
hal-01561252v1
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Microstructuration of titanium for implantable componentsJournées Nationales sur les Technologies Emergentes en micro-nanofabrication, Nov 2017, Orléans, France
Communication dans un congrès
hal-02306063v1
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Enhanced lifetime for thin-dielectric microdischarge-arrays operating in DC69th Gaseous Electronic Conference, Oct 2016, Bochum, Germany
Communication dans un congrès
hal-01379698v1
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Numerical and experimental investigation of cryogenic etching of silicon and porous low-dielectricInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561212v1
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Low-Damage etching of highly porous OSG low-k dielectricsSPIE Advanced Lithography 2016, Feb 2016, San José, United States
Communication dans un congrès
hal-01280267v1
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Cryoetching mechanisms and STiGer process evaluationInternational Symposium on Dry Process 2016 (DPS 2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561210v1
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Effects of gas and surface temperatures during cryogenic etching of silicon with SF6/O269th Gaseous Electronic Conference, Oct 2016, Bochum, France
Communication dans un congrès
hal-01379701v1
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Cryogenic processes for advanced material plasma etchingQuo vadis : Complex plasmas - TR 24, Aug 2016, Hambourg, Germany
Communication dans un congrès
hal-01374747v1
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Cryogenic etching of porous organosilicate low-k materials: Reduction of plasma induced damageAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228458v1
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Performances and limitations of DC microdischarges on silicon platforms20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France
Communication dans un congrès
hal-01166022v1
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Performances and instabilities of silicon based microdischargesInternational workshop on microplasmas, May 2015, Newark, United States
Communication dans un congrès
hal-01166019v1
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DRY DEEP ETCHING OF BULK TITANIUM BY PLASMA PROCESSESAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228465v1
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Submicronic etched features of silicon with high aspect ratio obtained by cryogenic plasma deep-etching through perforated polymer thin films2015 MRS Spring Meeting & Exhibit, Apr 2015, San francisco, United States
Communication dans un congrès
hal-01151542v1
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Low damage cryoetching of low-K materialsSPIE Advanced Lithography 2015, Feb 2015, San José, United States
Communication dans un congrès
hal-01151543v1
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Cryogenic Etching of Silicon with SF6/O2/SiF4 plasmas: a modeling and experimental studyPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151530v1
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Reduction of plasma induced damage in cryogenic etching of low-k materials4th French Symposium on Emerging Technologies for micro-nanofabrication, Nov 2015, Ecully, France
Communication dans un congrès
hal-01277115v1
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Limitation of surface defects in deep GaN etchingAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228462v1
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A novel low temperature etch approach to reduce ULK plasma damagePlasma Etch and Strip in Microtecnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151524v1
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Cryoetching processes applied to ULK material37th International Symposium on Dry process , Nov 2015, Awaji, Japan
Communication dans un congrès
hal-01287233v1
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DC and AC microplasmas on silicon : performances and limitationsAsian-European Plasma Surface Engineering, Masaru Hori, Sep 2015, Jeju, South Korea
Communication dans un congrès
hal-01217651v1
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Energy flux diagnostics in thin film deposition by magnetron sputteringXXXII International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2015, Iasi, Romania
Communication dans un congrès
hal-01290726v1
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Plasma Cryogenic Etching: from 3D Integration to Low-k MaterialsChina Semiconductor Technology International Conference, Mar 2015, Shanghai, China
Communication dans un congrès
hal-01151533v1
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Surface state improvement in GaN deep etching for power electronics applications37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès
hal-01228470v1
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Cryogenic Etching of Porous Organosilicate Low-k Materials: Fluorine based plasma analysisPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151528v1
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Bulk titanium deep etching by plasma processes, 20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France
Communication dans un congrès
hal-01166023v1
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Cryogenic etching of silicon with SF6/O2/SiF4 plasmas: a modelling and experimental study22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228451v1
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Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228448v1
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Ignition phase of a silicon-based microdischarge array with excitation by burst waveformsInternational workshop on microplasmas, May 2015, Newark, United States
Communication dans un congrès
hal-01166021v1
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Cryoetching processes applied to ULK material37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès
hal-01228477v1
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Plasma cryoetching processes for silicon and advanced materialsInternational Conference on Microelectronics and Plasma Technology, Jul 2014, Gunsan, South Korea
Communication dans un congrès
hal-01057585v1
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Cryoetching of Silicon and Advanced Materials for 3D Interconnects226th meeting of the Electroschemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151844v1
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Cryogenic etching of submicronic features in silicon using masks based on porous polymer films226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151839v1
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Study of energy transfers at the substrate during “transition steps” in magnetron sputter deposition14th International Conference on Plasma Surface Engineering PSE 2014 , Sep 2014, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-01289446v1
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Improvement of GaN Deep Etched Surface State by Fluorination Dedicated to Power Devices226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151851v1
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Spectroscopic investigations of transient processes in micro-cavity discharge reactorsInternational Symposium on Non-equilibrium Plasmas and Complex Systems, Feb 2014, Osaka, Japan
Communication dans un congrès
hal-01006368v1
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Effect of surface fluorination on GaN deep dry etching defectsPlasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès
hal-01057239v1
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Submicrometric structured silicon surfaces obtained from polymer blend film by silica replication and cryogenic plasma etchingPlasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès
hal-01057586v1
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Low damage cryogenic etching of low-K materials for advanced interconnectsMaterials for Advanced Metallization, Mar 2014, Dresden, Germany
Communication dans un congrès
hal-01006369v1
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Multiscale etching of holes by cryogenic silicon etchingPlasma Etch and Strip in Microtechnology, May 2014, Gernoble, France
Communication dans un congrès
hal-01057242v1
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Deep etching of gallium nitride by chlorine based plasmaJournées Nationales des Technologies Emergentes, May 2013, Evian, France
Communication dans un congrès
hal-00831346v1
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Radio Frequency Diagnostics of MicroplasmasFrontiers in Low Temperature Plasma Diagnostics, Apr 2013, Kerkrade, Netherlands
Communication dans un congrès
hal-00831368v1
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RF diagnostics performed on DC Microplasmas19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056614v1
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Dry deep etching of GaN wide band-gap SemiconductorAVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-01057235v1
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Dry deep etching of GaN wide-bandgap semiconductor19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056606v1
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Energy flux measurements at the substrate deposition during reactive and non-reactive magnetron sputter deposition processes19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01166024v1
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RF Diagnostics of MicroplasmasInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831362v1
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On Causes of the Destruction of MHCD Sources During OperationInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831363v1
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Integrated microplasmas on silicon: performances and limitations19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056618v1
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Plasma deep etching of silicon, titanium and gallium nitride for microtechnologyAVS 60th International Symposium & Exhibition, Oct 2013, United States
Communication dans un congrès
hal-01006364v1
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Titanium deep etching for medical applicationsAVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-01057236v1
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Damage Free Cryogenic Etching of Ultra Low-k MaterialsInternational Interconnect Technology Conference, Jun 2013, Kyoto, Japan
Communication dans un congrès
hal-01056603v1
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Plasma surface interactions in deep dry etchingWorkshop on particle - surface interactions : from surface analysis to materials processing, Jun 2013, Luxembourg, Luxembourg
Communication dans un congrès
hal-00831337v1
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Spectroscopic Diagnostics of Ceramic MHCDsInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831354v1
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Reproducible process for Titanium deep etchingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831358v1
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Deep etching processes for silicon micro- and nano-machiningLe Studium workshop : Bottom-up approaches to nanotechnology, May 2013, Orléans, France
Communication dans un congrès
hal-00831360v1
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Reproducible process for titanium deep etching19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01057233v1
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Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831344v1
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Advantages of energy influx measurements in low pressure plasma processesInternational Conference on Plasma Surface Engineering, Sep 2012, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-00831371v1
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Optimization of STiGer process used to etch high aspect ratio silicon microstructuresAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747743v1
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Deep GaN Etching : Role of SiCl4 in Plasma ChemistryAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747746v1
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Caractérisation de matrices de micro plasmas sur siliciumXIIeme congrès de la division Plasmas de la Société Française de Physique, May 2012, Orléans, France
Communication dans un congrès
hal-00707935v1
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Development of microdicharge arrays in silicon operating in DC and ACEuropean Physical Society/International Conference on Plasma Physics, Jul 2012, Stockholm, Sweden
Communication dans un congrès
hal-00831351v1
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Formation of black silicon by cryogenic plasma etching processesMicro- and Nano-Engineering (MNE), Sep 2012, Toulouse, France
Communication dans un congrès
hal-00831357v1
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Integrated microplasmas on silicon: a new tool for lab-on-a-chip applicationsCancer Cells On Chip, Jun 2012, Lyon, France
Communication dans un congrès
hal-00707933v1
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Balanced/unbalanced planar magnetron plasma behaviour. Microscopic analysis by PIC-MCC modelling of the ion flux on thermal probes13th International Conference on Plasma Surface Engineering PSE 2012, Sep 2012, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-01288936v1
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Development of microdicharges in silicon operating in DC for medical applications4th International Conference on Plasma Medecine, Jun 2012, Orléans, France
Communication dans un congrès
hal-00831349v1
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Development and characterization of microplasma arrays on SiliconInternational Workshop on Physics of Microplasmas, May 2012, Bochum, Germany
Communication dans un congrès
hal-00707932v1
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Investigations in SF6 and Cl2/Ar plasmas used for titanium deep etching by means of mass spectrometryESCAMPIG 2012, Jul 2012, Viana do Castelo, Portugal
Communication dans un congrès
hal-00831352v1
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Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect applicationAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747749v1
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Development and limitations of microplasma arrays on silicon operating in DCAVS 59th International Symposium and Exhibition, Oct 2012, United States
Communication dans un congrès
hal-00747741v1
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Direct energy influx measurements in high power impulse sputtering2nd International Conference on HiPIMS, HiPIMS2011 , Jun 2011, Braunschweig, Germany
Communication dans un congrès
hal-01288780v1
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Characterization of the ignition and the extinction of a Micro Hollow Cathode Discharge6th International Workshop on Microplasmas, Apr 2011, Paris, France
Communication dans un congrès
hal-00707924v1
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Deep GaN Etching by Inductively Coupled PlasmaHeteroSiC-WASMPE 2011, Jun 2011, Tours, France
Communication dans un congrès
hal-00696418v1
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Obtaining a smooth surface after deep GaN etching18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696419v1
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Deep etching of bulk titanium by plasma18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696425v1
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STiGer process for silicon deep etching: extended scalloping reduction on submicron trenches18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696422v1
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Deep silicon etching of 0.8 µm to hundreds of microns wide trenches with the STiGer processAVS 58th International Symposium & Exhibition, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00696428v1
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Micro plasma reactor arrays made in silicon18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707927v1
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Direct energy influx measurements between a biased substrate and a low pressure plasma18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707930v1
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Microcathode sustained discharges using Si integrated micro-discharges arrays6th International Workshop on Microplasmas, Apr 2011, France, France
Communication dans un congrès
hal-00707926v1
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Microcathode sustained discharges using Si integrated micro-reactors18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707929v1
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Energy influx measurements in low pressure plasmas for material processingInnovations in Thin Film Processing and Characterisation, and Magnetron, Ion Processing and Arc Technologies European Conference, ITFPC-MIATEC 2011 , Nov 2011, Nancy, France
Communication dans un congrès
hal-01289043v1
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Characterisation of Silicon based micro discharge plasma arrays in Direct Current (DC) at atmospheric pressure6th International Workshop on Microplasmas, Apr 2011, Paris, France
Communication dans un congrès
hal-00707925v1
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Deep Gallium Nitride Etching: ways to avoid etching defects3rd International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, Mar 2011, Nagoya, Japan
Communication dans un congrès
hal-00696396v1
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Optimization of STiGer process for silicon deep etching63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00696366v1
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Deep Inductively Coupled Plasma Etching of GaNAVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès
hal-00696393v1
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Study of an MHCD operating in He using optical and electrical diagnosticsDiagnostics Microplasmas, Mar 2010, Germany
Communication dans un congrès
hal-00487365v1
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Gravure du GaN pour la prochaine génération de diodes SchottkyWorkshop MNTS 12-20, Minatec, Mar 2010, Grenoble, France
Communication dans un congrès
hal-00487358v1
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Ignition and extinction of a Micro Hollow Cathode Discharge operating in DC regimeAVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès
hal-00696390v1
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Silicon deep cryoetching with the STiGer process3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès
hal-00487360v1
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RF Diagnostics of Atmospheric Pressure Micro-PlasmasDiagnostics Microplasmas, Mar 2010, Germany
Communication dans un congrès
hal-00487366v1
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Micro Hollow Cathode Discharge Arrays in silicon devices63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00681902v1
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Deep GaN Etching by Inductively Coupled Plasma3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès
hal-00487363v1
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Comparaison d'une sonde calorimétrique et d'un capteur à thermopile pour la mesure des transferts d'énergie plasma basse pression/surface'Congrès Français de Thermique, May 2010, Le Touquet, France. pp.755-760
Communication dans un congrès
hal-00504417v1
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Micro-discharge plasma using silicon platformAVS 57th International Symposium & Exhibition, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00707922v1
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Les Microdécharges en FranceJournées Plasma Québec du Réseau Plasma Froid, Jun 2010, France
Communication dans un congrès
hal-00503123v1
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Deep Gallium Nitride Etching63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00696376v1
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Experiment and simulation results of limited cathode area MHCDs operating in HeAVS 56th International Symposium & Exhibition, Nov 2009, San Jose, United States
Communication dans un congrès
hal-00444491v1
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Formation of Columnar MicroStructures of silicon (CMS) in SF6/O2 plasma in cryogenic conditions17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444402v1
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GaN Etching by Inductively Coupled Plasma17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444471v1
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A comparative study on O2 and SO2 passivating chemistry for silicon deep cryogenic etchingAVS 53rd International Symposium & Exhibition, Nov 2009, San Francisco, United States
Communication dans un congrès
hal-00442683v1
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STiGer cryoetching process of silicon: passivation mechanisms, enhanced robustness and performancesPlasma Etch and Strip in Microelectronics 2nd International Workshop, Feb 2009, Louvain, Belgium
Communication dans un congrès
hal-00444370v1
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Inductively Coupled Plasma Etching of GaN and Induced DefectsAVS 56th International Symposium & Exhibition, Nov 2009, San Jose, United States
Communication dans un congrès
hal-00444488v1
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Ignition and characterization of Micro Hollow Cathode Discharges in Helium17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444380v1
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Electrical Characterization of Direct Current Atmospheric Pressure Micro-Discharges Using Radio Frequency Signals in Argon62nd Gaseous Electronics Conference, Oct 2009, Saratoga Springs, United States
Communication dans un congrès
hal-00444482v1
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STiGer cryoetching process on silicon : results on performances for 0.8 um trenches17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444466v1
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Direct measurement of energy transfers during deposition of sputtered metal atoms17th International Colloquium on Plasma Processes, CIP 09, Jun 2009, Marseille, France
Communication dans un congrès
hal-00445581v1
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Study of SiOxFy passivation layer deposited in SiF4/O2 ICP dischargeAVS 55th International Symposium & Exhibition, Oct 2008, Boston, United States
Communication dans un congrès
hal-00444361v1
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Direct measurements of the energy transfers in deposition or etching low pressure plasma processes11th International Conference on Plasma Surface Engineering, PSE2008, Sep 2008, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-00445589v1
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Ignition of parallel Micro Hollow Cathode Discharges in He without ballasts61st Gaseous Electronics Conference, Oct 2008, Dallas, United States
Communication dans un congrès
hal-00444346v1
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Micro transfert d'énergie dans un solide mince : effet de la résistance thermique de contactCongrès Français de Thermique, SFT 2008, Jun 2008, Toulouse, France. pp.385-390
Communication dans un congrès
hal-00443715v1
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New Approach of Heat Transfer Characterization on Thin Si and Cu Solids.-Effects of Thermal Contact Resistance5th European Thermal-Sciences Conference, Eutrotherm 2008, May 2008, Netherlands. pp.101-106
Communication dans un congrès
hal-00443101v1
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A direct measurement of the energy flux density in plasma surface interaction61st Gaseous Electronics Conference, 2008, United States
Communication dans un congrès
hal-00448760v1
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Direct current parallel microdischarges in heliumInternational Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.27A-a3
Communication dans un congrès
hal-00444228v1
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Fabrication process and electrical characterization of direct current parallel microdischarges in helium60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00444259v1
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SiOxFy film deposited by SiF4/O2 plasma on silicon at low temperature16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France
Communication dans un congrès
hal-00444198v1
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Neutral production in SF6/SiCl4 inductively coupled plasmas60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00444252v1
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Direct current parallel microdischarges in heliumISPC-18, Aug 2007, Kyoto, Japan
Communication dans un congrès
hal-01303260v2
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A robust passivation-enhanced cryogenic process used for deep silicon etchingAVS 54th International Symposium & Exhibition, Oct 2007, Seattle, United States
Communication dans un congrès
hal-00444264v1
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A new generation of cryogenic processes for silicon deep etching60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00442668v1
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A new generation of cryogenic processes for silicon deep etching60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00365911v1
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SiOxFy film growth in SiF4/O2 plasma at cryogenic temperature18th International Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.30P-105
Communication dans un congrès
hal-00444241v1
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Enhanced robustness of the cryogenic process for silicon deep etchingMicro- and Nano-Engineering, Sep 2007, Copenhague, Denmark
Communication dans un congrès
hal-00444248v1
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Limitation of the cathode area for direct current MHCD in Helium4th International Workshop on Microplasmas, Oct 2007, Tainan, Taiwan
Communication dans un congrès
hal-00444267v1
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Global evaluation of the energy transfer between an ICP argon plasma and a surfaceInternatinal Symposium on Plasma Chemistry, ISPC-18, Aug 2007, Kyoto, Japan. 28p-5
Communication dans un congrès
hal-00443518v1
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A study on SF6/SiCl4 inductively coupled plasma by mass spectrometry and optical emission spectroscopy16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00444208v1
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Control of the ignition of direct current parallel microdischarges in helium16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00442687v1
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Cryoetching of silicon for MEMS and microelectronic components16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00442662v1
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Submicronic Etching in the Cryogenic Process16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France
Communication dans un congrès
hal-00442684v1
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Diagnostic des plasma par micro-fluxmètreCongrès de la division plasma de la SFP, 2006, May 2006, Pont-à-Mousson, France
Communication dans un congrès
hal-00448844v1
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SiOxFy passivation layer characterization in the silicon cryoetchingEighth International Conference on Advanced Surface Engineering (8th ICASE), Apr 2006, Japan
Communication dans un congrès
hal-00442663v1
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Mechanisms and optimization in the cryogenic etching plasma processWorkshop on Silicon dry processing, Sep 2006, Aix-La-Chapelle, Germany
Communication dans un congrès
hal-00442676v1
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Electrical and spectroscopic study of DC microdischarges made in alumina3rd International Workshop on Microplasmas, May 2006, Greifswald, Germany
Communication dans un congrès
hal-00442675v1
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Mise au point d'un micro-fluxmètre pour la caractérisation des transferts d'énergie dans un plasma d'argonCongrès Français de Thermique, SFT 2006, May 2006, Île de Ré, France. pp.727-732
Communication dans un congrès
hal-00443914v1
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Experimental study of the gas breakdown in a controlled nanometer scale electrode gapInternational Workshop on Microplasmas (IWM 12), Jun 2024, Orléans (Auditorium du Musée des Beaux Arts), France.
Poster de conférence
hal-04606154v1
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MHCD in N2-H2 mixtures: towards a localized plasma nitriding process?International Workshop on Microplasmas (IWM 12), Jun 2024, Orléans (Auditorium du Musée des Beaux Arts), France.
Poster de conférence
hal-04607581v1
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Self-Pulsing and instabilities in silicon-based Micro Hollow Cathode Discharge operating in DC excitationInternational Workshop on Microplasmas (IWM 12), Jun 2024, Orléans (Auditorium du Musée des Beaux Arts), France.
Poster de conférence
hal-04607593v1
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Profils de raies en spectroscopie d'émission optique appliqués au diagnostic de micro-plasmasJournées 2023 Groupement de Recherche (GdR) étude des milieux ionisés Plasmas froids créés par décharge et laser (EMILI), Oct 2023, Nancy, France
Poster de conférence
hal-04194636v1
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Micro-fabricated silicon-based microplasma reactorsJournées Nationales sur les Technologies Emergentes (JNTE22), Nov 2022, Besançon (France), France
Poster de conférence
hal-03881662v1
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Cryo-ALE of Si based on SF6 physisorptionPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Poster de conférence
hal-03539330v1
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Spectroscopic study of the neutral gas temperature of silicon based DC MHCD in various gases close to atmospheric pressure13th Frontiers in Low-Temperature Plasma Diagnostics, May 2019, Baf Honnef, Germany. 2019
Poster de conférence
hal-02131666v1
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The role of SiF4 physisorption in silicon cryoetchingPlasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Poster de conférence
hal-02311339v1
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Robust atmospheric pressure plasma source fabricated by microfabrication techniquesJournées Nationales sur les Technologies Emergentes (JNTE19), Nov 2019, Grenoble, France
Poster de conférence
hal-02291720v1
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MEMS based nanofluidics device for the study of the nonlinear dynamics associate with the geochemical processesFrench symposium on Emerging Technologies for Micronanofabrication, Nov 2019, Grenoble, France
Poster de conférence
hal-02479390v1
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Analysis of mechanisms involved in cryogenic ALE19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, France
Poster de conférence
hal-02311314v1
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Neutral gas temperature in silicon based DC MHCD operated in various gases near atmospheric pressureInternational Workshop on Microplasmas - IWM 10, May 2019, Kyoto, Japan
Poster de conférence
hal-02189151v1
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Optimisation et packaging de microplasmas sur siliciumColloque de l'UMI-LN2, Jul 2018, Autrans, France
Poster de conférence
hal-01903397v1
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INTRODUCTION AU PROCÉDÉ DE GRAVURE CRYOGÉNIQUE DU SILICIUM15e Congrès de la Société Française de Physique Division Plasmas, Jun 2018, Bordeaux, France
Poster de conférence
hal-02311219v1
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Titanium microstructuring for implantable componentsDesign, Test, Integration and Packaging of MEMS/MOEMS, May 2017, Bordeaux, France
Poster de conférence
hal-01561245v1
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Time resolved investigation of rotational temperature of molecular nitrogen in micro-plasma arrays9th International Worksop on Microplasmas, Jun 2017, Garmisch Partenkirchen, Germany
Poster de conférence
hal-01577608v1
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Cryogenic ALE of silicon oxidePlasma Etch and Strip in Microtechnology, Oct 2017, Leuven, Belgium
Poster de conférence
hal-02306057v1
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Silicon micromachining at cryogenic temperatureDesign, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), May 2017, Bordeaux, France
Poster de conférence
hal-01561233v1
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Enhanced reproducibility of SiO2 atomic layer etching by addition of O2 stepsInternational Symposium of Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence
hal-01561230v1
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Chlorine-based plasma deep etching of bulk titaniumInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence
hal-01561222v1
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Deep silicon etching: STiGer vs. BOSCHPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344704v1
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Advance in low-k cryogenic etching of porous organoscilicate : Investigation of a new gas with higher boiling point Organic (HBPO) and comparison with C4F8Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344722v1
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Cryogenic etching of silicon with SF6/O2: a computational and experimental studyPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344725v1
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Near Atmospheric Pressure Etching of Silicon by MicroplasmaInternational workshop on microplasmas, May 2015, Newark, France
Poster de conférence
hal-01166020v1
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On the relationship between the energy flux at the substrate surface and the phase constitution of reactively magnetron sputtered titanium dioxide thin films14th International Conference on Plasma Surface Engineering PSE 2014 , Sep 2014, Garmisch-Partenkirchen, Germany
Poster de conférence
hal-01289438v1
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Détermination de l'énergie transférée aux surfaces lors de la modification de matériaux par procédés plasmas basse pression12ème congrès de la division plasma de la SFP , May 2012, Orléans, France
Poster de conférence
hal-01288927v1
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Direct energy influx measurement in reactive magnetron sputteringReactive sputter deposition RSD 2011, Dec 2011, Linköping, Sweden
Poster de conférence
hal-01288906v1
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A Heat Flux Microsensor for Direct Measurements in Plasma Surface InteractionsIgor Minin. Microsensors, Intech, pp.87, 2011, 978-953-307-170-1
Chapitre d'ouvrage
hal-00707968v1
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Un capteur de flux d'énergie dans les plasmasMRCT CNRS. Plasmas Froids : Systèmes d'analyse, Modélisation et Rayonnement, Presses imprimerie Saint-Etienne, pp.97-120, 2009
Chapitre d'ouvrage
hal-00443857v1
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