
Remi Dussart
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Publications
Cryogenic etching of SiOxFy and SiO2 in SF6/H2 plasmaDry Process Symposium, Nov 2024, New Chitose, Japan
Communication dans un congrès
hal-04824284
v1
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SiC plasma etching technology processes for power and optoelectronic devicesPESM 2024, IMEC Belgium, Jun 2024, Leuven (BE), Belgium
Communication dans un congrès
hal-04797018
v1
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La gravure plasma, une étape critique dans la technologie SiC. Mécanismes physico-chimiques et applicationsJournées Renatech Litho/Gravure 2024, Jun 2024, Valbonne, France
Communication dans un congrès
hal-04799422
v1
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Optical emission spectroscopy analysis of Hydrogen Hβ spectral line in confined plasmaInternational Workshop on Microplasmas (IWM 12), Jun 2024, Orléans (Auditorium du Musée des Beaux Arts), France
Communication dans un congrès
hal-04606149
v1
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Optical emission spectroscopy spatial characterization of a silicon based Micro Hollow Cathode Discharge operating in Helium in DC regime76th Annual Gaseous Electronics Conference, Oct 2023, Ann Arbor, United States
Communication dans un congrès
hal-04134203
v1
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Advances in optical diagnostics of Microplasmas: imaging and spectroscopyInternational Workshop on Microplasmas (IWM 11), Jun 2022, Raleigh, United States
Communication dans un congrès
hal-03633854
v1
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Fabrication process and first charactesisation of novel silicon-based microplasma reactorsInternational Workshop on Microplasmas (IWM 11), Jun 2022, Raleigh, United States
Communication dans un congrès
hal-03698719
v1
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Recent advances in micro-discharges ‒ sources and diagnosticsMGK Colloquium - Transient Atmospheric Plasmas: from plasmas to liquids to solids, Apr 2021, Bochum, Germany
Communication dans un congrès
hal-03218025
v1
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Atomic Layer Etching of Gallium Nitride (GaN) using fluorinated chemistry42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès
hal-03539418
v1
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Plasma cryogenic etching : benefits of cooling the substrate at a low temperature in etching process technologies42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès
hal-03539474
v1
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SiOxFy layer deposition for cryogenic nanoscale etchingPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03539368
v1
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Atomic layer etching of Gallium Nitride (GaN) using SF6 and Ar plasmasPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03539383
v1
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Physical mechanisms involved in silicon based plasma microreactors operating in DC5th Asia Pacific Conference on Plasma Physics (AAPPS-DPP2021), Association of Asia-Pacific Physical Societies and Division of Plasma Physics, Sep 2021, online - Kyushu University, Japan
Communication dans un congrès
hal-03355293
v1
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Études Spectroscopiques Aux Petites Échelles de Décharges à Haute Pression~: Intérêt Des Transitions RésonantesEcole Technologique Du Reseau Des Plasmas Froids, Sep 2020, Saint-Dié-des-Voges, France
Communication dans un congrès
hal-03049312
v1
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Resonance Broadening as a Valuable Diagnostic to Study Atmospheric Pressure Plasma \textendash ~Application to Micro-Plasmas9th International Workshop and Summer School on Plasma Spectroscopy (IPS 2020), Jun 2020, Greifswald, Germany
Communication dans un congrès
hal-03049314
v1
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Atmospheric Plasma DC Source in the Micro Scale Elaborated by Micro-NanotechnologiesXXV Europhysics Conference on Atomic and Molecular Physics of Ionized Gases (ESCAMPIG XXII), Jul 2022, Paris, France
Communication dans un congrès
hal-03049315
v1
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Resonance broadening as a valuable diagnostic to study atmospheric pressure plasma – application to micro-plasmas9th International Workshop and Summer School on Plasma Spectroscopy (IPS 2020), Jun 2020, Greifswald, Germany
Communication dans un congrès
hal-03374037
v1
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Cryogenic process for Atomic Layer EtchingPlasma Etch and Strip in Microtechnology, May 2019, Grenoble, France
Communication dans un congrès
hal-02311291
v1
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Atomic Layer Etching at cryogenic temperaturePlasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Communication dans un congrès
hal-02311323
v1
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Plasma processes applied to SiO2 cryo-atomic layer etchingXXXIV International Conference on Phenomena in Ionized Gases - 10th International Conference on Reactive Plasmas, Jul 2019, Sapporo, Japan
Communication dans un congrès
hal-02311288
v1
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Intérêt des transitions résonnantes en spectroscopie pour les plasmas froids à haute pression: diagnostic des ondes d’ionisations et de micro-cavités1e Rencontres Scientifiques Plasmas Froids et Lasers, Nov 2019, Toulouse, France
Communication dans un congrès
hal-02189173
v1
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Intérêt des transitions résonnantes en spectroscopie pour les plasmas froids atmosphériques: diagnostic des ondes d’ionisations et de micro-cavités25e Congrès Général de la Société Française de Physique, Jul 2019, Nantes, France
Communication dans un congrès
hal-02189144
v1
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Atomic Layer Etching at low substrate temperature19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, United States
Communication dans un congrès
hal-02311308
v1
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Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage40th International Symposium on Dry Process, Nov 2018, Nagoya, France
Communication dans un congrès
hal-02311275
v1
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Bulk micromachined Titanium MEMS16th NAMIS Workshop (NAMIS 2018), Jun 2018, Oulu, Finland
Communication dans un congrès
hal-02306373
v1
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Vectorial Electric Field Characterization Of Plasmas Using An Optical Probe71st Annual Gaseous Electronics Conference, Nov 2018, Portland, United States
Communication dans un congrès
hal-02018204
v1
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Electro-optical probe for dielectric barrier discharge analysis45th IEEE International Conference on Plasma Science (ICOPS 2018), Jun 2018, Denver, United States
Communication dans un congrès
hal-02017951
v1
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The role of SiF4 physisorption in the cryogenic etching process of silicon40th International Symposium on Dry Process, Nov 2018, Nagoya, Japan
Communication dans un congrès
hal-02311267
v1
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Titanium-based MEMS: Application for a novel implantable feedthrough using TTV (Through Titanium Vias) technologies6th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD 2018), May 2018, Grenoble, France
Communication dans un congrès
hal-02306370
v1
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Plasma properties of DC silicon based micro hollow cavity discharge (MHCD) operating in various gases - a spectroscopic study71st Annual Gaseous Electronics Conference, Nov 2018, Portland, United States
Communication dans un congrès
hal-02131687
v1
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Cryo-etching mechanism characterization by in-situ spectroscopic ellipsometrySurface Fest 2018, Jun 2018, Bordeaux, France
Communication dans un congrès
hal-02311254
v1
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Étude par spectroscopie d'émission de la température du gaz à l'intérieur et au voisinage d'une micro-cavité plasma (MHCD)14e Journées du Réseau Plasmas Froids, Oct 2018, La Rochelle, France
Communication dans un congrès
hal-01974867
v1
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Microstructuration of titanium for implantable componentsJournées Nationales sur les Technologies Emergentes en micro-nanofabrication, Nov 2017, Orléans, France
Communication dans un congrès
hal-02306063
v1
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Microdischarge integration on silicon based devices70th Gaseous Electronics Conference, Nov 2017, Pittsburgh, United States
Communication dans un congrès
hal-01686038
v1
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Low-Damage etching of highly porous OSG low-k dielectricsSPIE Advanced Lithography 2016, Feb 2016, San José, United States
Communication dans un congrès
hal-01280267
v1
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Cryoetching mechanisms and STiGer process evaluationInternational Symposium on Dry Process 2016 (DPS 2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561210
v1
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Cryogenic processes for advanced material plasma etchingQuo vadis : Complex plasmas - TR 24, Aug 2016, Hambourg, Germany
Communication dans un congrès
hal-01374747
v1
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Effects of gas and surface temperatures during cryogenic etching of silicon with SF6/O269th Gaseous Electronic Conference, Oct 2016, Bochum, France
Communication dans un congrès
hal-01379701
v1
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Numerical and experimental investigation of cryogenic etching of silicon and porous low-dielectricInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561212
v1
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Enhanced lifetime for thin-dielectric microdischarge-arrays operating in DC69th Gaseous Electronic Conference, Oct 2016, Bochum, Germany
Communication dans un congrès
hal-01379698
v1
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Bulk titanium deep etching by plasma processes, 20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France
Communication dans un congrès
hal-01166023
v1
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Cryoetching processes applied to ULK material37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès
hal-01228477
v1
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DC and AC microplasmas on silicon : performances and limitationsAsian-European Plasma Surface Engineering, Masaru Hori, Sep 2015, Jeju, South Korea
Communication dans un congrès
hal-01217651
v1
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Cryoetching processes applied to ULK material37th International Symposium on Dry process , Nov 2015, Awaji, Japan
Communication dans un congrès
hal-01287233
v1
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Ignition phase of a silicon-based microdischarge array with excitation by burst waveformsInternational workshop on microplasmas, May 2015, Newark, United States
Communication dans un congrès
hal-01166021
v1
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Cryogenic etching of silicon with SF6/O2/SiF4 plasmas: a modelling and experimental study22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228451
v1
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Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228448
v1
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Energy flux diagnostics in thin film deposition by magnetron sputteringXXXII International Conference on Phenomena in Ionized Gases (ICPIG), Jul 2015, Iasi, Romania
Communication dans un congrès
hal-01290726
v1
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Plasma Cryogenic Etching: from 3D Integration to Low-k MaterialsChina Semiconductor Technology International Conference, Mar 2015, Shanghai, China
Communication dans un congrès
hal-01151533
v1
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Surface state improvement in GaN deep etching for power electronics applications37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès
hal-01228470
v1
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Cryogenic Etching of Porous Organosilicate Low-k Materials: Fluorine based plasma analysisPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151528
v1
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Performances and limitations of DC microdischarges on silicon platforms20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France
Communication dans un congrès
hal-01166022
v1
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Performances and instabilities of silicon based microdischargesInternational workshop on microplasmas, May 2015, Newark, United States
Communication dans un congrès
hal-01166019
v1
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DRY DEEP ETCHING OF BULK TITANIUM BY PLASMA PROCESSESAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228465
v1
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Submicronic etched features of silicon with high aspect ratio obtained by cryogenic plasma deep-etching through perforated polymer thin films2015 MRS Spring Meeting & Exhibit, Apr 2015, San francisco, United States
Communication dans un congrès
hal-01151542
v1
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Cryogenic etching of porous organosilicate low-k materials: Reduction of plasma induced damageAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228458
v1
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Reduction of plasma induced damage in cryogenic etching of low-k materials4th French Symposium on Emerging Technologies for micro-nanofabrication, Nov 2015, Ecully, France
Communication dans un congrès
hal-01277115
v1
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Low damage cryoetching of low-K materialsSPIE Advanced Lithography 2015, Feb 2015, San José, United States
Communication dans un congrès
hal-01151543
v1
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Limitation of surface defects in deep GaN etchingAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228462
v1
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A novel low temperature etch approach to reduce ULK plasma damagePlasma Etch and Strip in Microtecnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151524
v1
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Cryogenic Etching of Silicon with SF6/O2/SiF4 plasmas: a modeling and experimental studyPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151530
v1
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Low damage cryogenic etching of low-K materials for advanced interconnectsMaterials for Advanced Metallization, Mar 2014, Dresden, Germany
Communication dans un congrès
hal-01006369
v1
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Multiscale etching of holes by cryogenic silicon etchingPlasma Etch and Strip in Microtechnology, May 2014, Gernoble, France
Communication dans un congrès
hal-01057242
v1
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Study of energy transfers at the substrate during “transition steps” in magnetron sputter deposition14th International Conference on Plasma Surface Engineering PSE 2014 , Sep 2014, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-01289446
v1
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Spectroscopic investigations of transient processes in micro-cavity discharge reactorsInternational Symposium on Non-equilibrium Plasmas and Complex Systems, Feb 2014, Osaka, Japan
Communication dans un congrès
hal-01006368
v1
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Cryogenic etching of submicronic features in silicon using masks based on porous polymer films226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151839
v1
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Improvement of GaN Deep Etched Surface State by Fluorination Dedicated to Power Devices226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151851
v1
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Submicrometric structured silicon surfaces obtained from polymer blend film by silica replication and cryogenic plasma etchingPlasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès
hal-01057586
v1
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Effect of surface fluorination on GaN deep dry etching defectsPlasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès
hal-01057239
v1
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Plasma cryoetching processes for silicon and advanced materialsInternational Conference on Microelectronics and Plasma Technology, Jul 2014, Gunsan, South Korea
Communication dans un congrès
hal-01057585
v1
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Cryoetching of Silicon and Advanced Materials for 3D Interconnects226th meeting of the Electroschemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151844
v1
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Integrated microplasmas on silicon: performances and limitations19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056618
v1
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Plasma deep etching of silicon, titanium and gallium nitride for microtechnologyAVS 60th International Symposium & Exhibition, Oct 2013, United States
Communication dans un congrès
hal-01006364
v1
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Titanium deep etching for medical applicationsAVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-01057236
v1
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Damage Free Cryogenic Etching of Ultra Low-k MaterialsInternational Interconnect Technology Conference, Jun 2013, Kyoto, Japan
Communication dans un congrès
hal-01056603
v1
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Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831344
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Reproducible process for titanium deep etching19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01057233
v1
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Reproducible process for Titanium deep etchingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831358
v1
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Deep etching processes for silicon micro- and nano-machiningLe Studium workshop : Bottom-up approaches to nanotechnology, May 2013, Orléans, France
Communication dans un congrès
hal-00831360
v1
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Spectroscopic Diagnostics of Ceramic MHCDsInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831354
v1
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Plasma surface interactions in deep dry etchingWorkshop on particle - surface interactions : from surface analysis to materials processing, Jun 2013, Luxembourg, Luxembourg
Communication dans un congrès
hal-00831337
v1
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Energy flux measurements at the substrate deposition during reactive and non-reactive magnetron sputter deposition processes19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01166024
v1
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On Causes of the Destruction of MHCD Sources During OperationInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831363
v1
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RF Diagnostics of MicroplasmasInternational Workshop on Microplasmas, May 2013, Pékin, China
Communication dans un congrès
hal-00831362
v1
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Dry deep etching of GaN wide band-gap SemiconductorAVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-01057235
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Dry deep etching of GaN wide-bandgap semiconductor19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056606
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Deep etching of gallium nitride by chlorine based plasmaJournées Nationales des Technologies Emergentes, May 2013, Evian, France
Communication dans un congrès
hal-00831346
v1
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Radio Frequency Diagnostics of MicroplasmasFrontiers in Low Temperature Plasma Diagnostics, Apr 2013, Kerkrade, Netherlands
Communication dans un congrès
hal-00831368
v1
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RF diagnostics performed on DC Microplasmas19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056614
v1
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Development and limitations of microplasma arrays on silicon operating in DCAVS 59th International Symposium and Exhibition, Oct 2012, United States
Communication dans un congrès
hal-00747741
v1
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Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect applicationAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747749
v1
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Deep GaN Etching : Role of SiCl4 in Plasma ChemistryAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747746
v1
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Investigations in SF6 and Cl2/Ar plasmas used for titanium deep etching by means of mass spectrometryESCAMPIG 2012, Jul 2012, Viana do Castelo, Portugal
Communication dans un congrès
hal-00831352
v1
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Development and characterization of microplasma arrays on SiliconInternational Workshop on Physics of Microplasmas, May 2012, Bochum, Germany
Communication dans un congrès
hal-00707932
v1
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Development of microdicharges in silicon operating in DC for medical applications4th International Conference on Plasma Medecine, Jun 2012, Orléans, France
Communication dans un congrès
hal-00831349
v1
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Balanced/unbalanced planar magnetron plasma behaviour. Microscopic analysis by PIC-MCC modelling of the ion flux on thermal probes13th International Conference on Plasma Surface Engineering PSE 2012, Sep 2012, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-01288936
v1
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Development of microdicharge arrays in silicon operating in DC and ACEuropean Physical Society/International Conference on Plasma Physics, Jul 2012, Stockholm, Sweden
Communication dans un congrès
hal-00831351
v1
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Integrated microplasmas on silicon: a new tool for lab-on-a-chip applicationsCancer Cells On Chip, Jun 2012, Lyon, France
Communication dans un congrès
hal-00707933
v1
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Caractérisation de matrices de micro plasmas sur siliciumXIIeme congrès de la division Plasmas de la Société Française de Physique, May 2012, Orléans, France
Communication dans un congrès
hal-00707935
v1
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Formation of black silicon by cryogenic plasma etching processesMicro- and Nano-Engineering (MNE), Sep 2012, Toulouse, France
Communication dans un congrès
hal-00831357
v1
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Optimization of STiGer process used to etch high aspect ratio silicon microstructuresAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747743
v1
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Advantages of energy influx measurements in low pressure plasma processesInternational Conference on Plasma Surface Engineering, Sep 2012, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-00831371
v1
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Micro plasma reactor arrays made in silicon18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707927
v1
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Direct energy influx measurements between a biased substrate and a low pressure plasma18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707930
v1
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Deep Gallium Nitride Etching: ways to avoid etching defects3rd International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, Mar 2011, Nagoya, Japan
Communication dans un congrès
hal-00696396
v1
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Characterization of the ignition and the extinction of a Micro Hollow Cathode Discharge6th International Workshop on Microplasmas, Apr 2011, Paris, France
Communication dans un congrès
hal-00707924
v1
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Deep GaN Etching by Inductively Coupled PlasmaHeteroSiC-WASMPE 2011, Jun 2011, Tours, France
Communication dans un congrès
hal-00696418
v1
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Obtaining a smooth surface after deep GaN etching18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696419
v1
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Energy influx measurements in low pressure plasmas for material processingInnovations in Thin Film Processing and Characterisation, and Magnetron, Ion Processing and Arc Technologies European Conference, ITFPC-MIATEC 2011 , Nov 2011, Nancy, France
Communication dans un congrès
hal-01289043
v1
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Characterisation of Silicon based micro discharge plasma arrays in Direct Current (DC) at atmospheric pressure6th International Workshop on Microplasmas, Apr 2011, Paris, France
Communication dans un congrès
hal-00707925
v1
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Microcathode sustained discharges using Si integrated micro-reactors18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00707929
v1
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Microcathode sustained discharges using Si integrated micro-discharges arrays6th International Workshop on Microplasmas, Apr 2011, France, France
Communication dans un congrès
hal-00707926
v1
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Deep etching of bulk titanium by plasma18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696425
v1
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STiGer process for silicon deep etching: extended scalloping reduction on submicron trenches18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696422
v1
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Deep silicon etching of 0.8 µm to hundreds of microns wide trenches with the STiGer processAVS 58th International Symposium & Exhibition, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00696428
v1
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Direct energy influx measurements in high power impulse sputtering2nd International Conference on HiPIMS, HiPIMS2011 , Jun 2011, Braunschweig, Germany
Communication dans un congrès
hal-01288780
v1
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Micro Hollow Cathode Discharge Arrays in silicon devices63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00681902
v1
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Deep GaN Etching by Inductively Coupled Plasma3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès
hal-00487363
v1
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RF Diagnostics of Atmospheric Pressure Micro-PlasmasDiagnostics Microplasmas, Mar 2010, Germany
Communication dans un congrès
hal-00487366
v1
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Comparaison d'une sonde calorimétrique et d'un capteur à thermopile pour la mesure des transferts d'énergie plasma basse pression/surfaceCongrès Français de Thermique, May 2010, Le Touquet, France. pp.755-760
Communication dans un congrès
hal-00504417
v1
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Les Microdécharges en FranceJournées Plasma Québec du Réseau Plasma Froid, Jun 2010, France
Communication dans un congrès
hal-00503123
v1
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Micro-discharge plasma using silicon platformAVS 57th International Symposium & Exhibition, Oct 2010, Albuquerque, United States
Communication dans un congrès
hal-00707922
v1
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Deep Gallium Nitride Etching63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00696376
v1
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Ignition and extinction of a Micro Hollow Cathode Discharge operating in DC regimeAVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès
hal-00696390
v1
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Gravure du GaN pour la prochaine génération de diodes SchottkyWorkshop MNTS 12-20, Minatec, Mar 2010, Grenoble, France
Communication dans un congrès
hal-00487358
v1
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Silicon deep cryoetching with the STiGer process3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès
hal-00487360
v1
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Deep Inductively Coupled Plasma Etching of GaNAVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès
hal-00696393
v1
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Optimization of STiGer process for silicon deep etching63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00696366
v1
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Study of an MHCD operating in He using optical and electrical diagnosticsDiagnostics Microplasmas, Mar 2010, Germany
Communication dans un congrès
hal-00487365
v1
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STiGer cryoetching process of silicon: passivation mechanisms, enhanced robustness and performancesPlasma Etch and Strip in Microelectronics 2nd International Workshop, Feb 2009, Louvain, Belgium
Communication dans un congrès
hal-00444370
v1
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Electrical Characterization of Direct Current Atmospheric Pressure Micro-Discharges Using Radio Frequency Signals in Argon62nd Gaseous Electronics Conference, Oct 2009, Saratoga Springs, United States
Communication dans un congrès
hal-00444482
v1
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STiGer cryoetching process on silicon : results on performances for 0.8 um trenches17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444466
v1
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Direct measurement of energy transfers during deposition of sputtered metal atoms17th International Colloquium on Plasma Processes, CIP 09, Jun 2009, Marseille, France
Communication dans un congrès
hal-00445581
v1
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Inductively Coupled Plasma Etching of GaN and Induced DefectsAVS 56th International Symposium & Exhibition, Nov 2009, San Jose, United States
Communication dans un congrès
hal-00444488
v1
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Ignition and characterization of Micro Hollow Cathode Discharges in Helium17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444380
v1
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GaN Etching by Inductively Coupled Plasma17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444471
v1
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A comparative study on O2 and SO2 passivating chemistry for silicon deep cryogenic etchingAVS 53rd International Symposium & Exhibition, Nov 2009, San Francisco, United States
Communication dans un congrès
hal-00442683
v1
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Experiment and simulation results of limited cathode area MHCDs operating in HeAVS 56th International Symposium & Exhibition, Nov 2009, San Jose, United States
Communication dans un congrès
hal-00444491
v1
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Formation of Columnar MicroStructures of silicon (CMS) in SF6/O2 plasma in cryogenic conditions17th International Colloquium on Plasma Processes, Jun 2009, Marseille, France
Communication dans un congrès
hal-00444402
v1
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A direct measurement of the energy flux density in plasma surface interaction61st Gaseous Electronics Conference, 2008, United States
Communication dans un congrès
hal-00448760
v1
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Study of SiOxFy passivation layer deposited in SiF4/O2 ICP dischargeAVS 55th International Symposium & Exhibition, Oct 2008, Boston, United States
Communication dans un congrès
hal-00444361
v1
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New Approach of Heat Transfer Characterization on Thin Si and Cu Solids.-Effects of Thermal Contact Resistance5th European Thermal-Sciences Conference, Eutrotherm 2008, May 2008, Netherlands. pp.101-106
Communication dans un congrès
hal-00443101
v1
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Direct measurements of the energy transfers in deposition or etching low pressure plasma processes11th International Conference on Plasma Surface Engineering, PSE2008, Sep 2008, Garmisch-Partenkirchen, Germany
Communication dans un congrès
hal-00445589
v1
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Micro transfert d'énergie dans un solide mince : effet de la résistance thermique de contactCongrès Français de Thermique, SFT 2008, Jun 2008, Toulouse, France. pp.385-390
Communication dans un congrès
hal-00443715
v1
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Ignition of parallel Micro Hollow Cathode Discharges in He without ballasts61st Gaseous Electronics Conference, Oct 2008, Dallas, United States
Communication dans un congrès
hal-00444346
v1
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SiOxFy film growth in SiF4/O2 plasma at cryogenic temperature18th International Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.30P-105
Communication dans un congrès
hal-00444241
v1
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Limitation of the cathode area for direct current MHCD in Helium4th International Workshop on Microplasmas, Oct 2007, Tainan, Taiwan
Communication dans un congrès
hal-00444267
v1
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Enhanced robustness of the cryogenic process for silicon deep etchingMicro- and Nano-Engineering, Sep 2007, Copenhague, Denmark
Communication dans un congrès
hal-00444248
v1
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Submicronic Etching in the Cryogenic Process16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France
Communication dans un congrès
hal-00442684
v1
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A robust passivation-enhanced cryogenic process used for deep silicon etchingAVS 54th International Symposium & Exhibition, Oct 2007, Seattle, United States
Communication dans un congrès
hal-00444264
v1
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Cryoetching of silicon for MEMS and microelectronic components16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00442662
v1
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Global evaluation of the energy transfer between an ICP argon plasma and a surfaceInternatinal Symposium on Plasma Chemistry, ISPC-18, Aug 2007, Kyoto, Japan. 28p-5
Communication dans un congrès
hal-00443518
v1
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A study on SF6/SiCl4 inductively coupled plasma by mass spectrometry and optical emission spectroscopy16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00444208
v1
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Control of the ignition of direct current parallel microdischarges in helium16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00442687
v1
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A new generation of cryogenic processes for silicon deep etching60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00365911
v1
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A new generation of cryogenic processes for silicon deep etching60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00442668
v1
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Fabrication process and electrical characterization of direct current parallel microdischarges in helium60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00444259
v1
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Neutral production in SF6/SiCl4 inductively coupled plasmas60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00444252
v1
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Direct current parallel microdischarges in heliumInternational Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.27A-a3
Communication dans un congrès
hal-00444228
v1
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SiOxFy film deposited by SiF4/O2 plasma on silicon at low temperature16th International Colloquium on Plasma Processes, Jun 2007, Toulouse, France
Communication dans un congrès
hal-00444198
v1
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Direct current parallel microdischarges in heliumISPC-18, Aug 2007, Kyoto, Japan
Communication dans un congrès
hal-01303260
v2
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Electrical and spectroscopic study of DC microdischarges made in alumina3rd International Workshop on Microplasmas, May 2006, Greifswald, Germany
Communication dans un congrès
hal-00442675
v1
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Mise au point d'un micro-fluxmètre pour la caractérisation des transferts d'énergie dans un plasma d'argonCongrès Français de Thermique, SFT 2006, May 2006, Île de Ré, France. pp.727-732
Communication dans un congrès
hal-00443914
v1
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SiOxFy passivation layer characterization in the silicon cryoetchingEighth International Conference on Advanced Surface Engineering (8th ICASE), Apr 2006, Japan
Communication dans un congrès
hal-00442663
v1
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Mechanisms and optimization in the cryogenic etching plasma processWorkshop on Silicon dry processing, Sep 2006, Aix-La-Chapelle, Germany
Communication dans un congrès
hal-00442676
v1
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Diagnostic des plasma par micro-fluxmètreCongrès de la division plasma de la SFP, 2006, May 2006, Pont-à-Mousson, France
Communication dans un congrès
hal-00448844
v1
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Experimental study of the gas breakdown in a controlled nanometer scale electrode gapInternational Workshop on Microplasmas (IWM 12), Jun 2024, Orléans (Auditorium du Musée des Beaux Arts), France.
Poster de conférence
hal-04606154
v1
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Self-Pulsing and instabilities in silicon-based Micro Hollow Cathode Discharge operating in DC excitationInternational Workshop on Microplasmas (IWM 12), Jun 2024, Orléans (Auditorium du Musée des Beaux Arts), France.
Poster de conférence
hal-04607593
v1
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MHCD in N2-H2 mixtures: towards a localized plasma nitriding process?International Workshop on Microplasmas (IWM 12), Jun 2024, Orléans (Auditorium du Musée des Beaux Arts), France.
Poster de conférence
hal-04607581
v1
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Experimental study of argon breakdown in a nanometer scale electrode gap27th International School on "Low Temperature Plasma Physics: Basics and Applications", Oct 2024, Orléans (Auditorium du Musée des Beaux Arts), Germany.
Poster de conférence
hal-04728032
v1
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Profils de raies en spectroscopie d'émission optique appliqués au diagnostic de micro-plasmasJournées 2023 Groupement de Recherche (GdR) étude des milieux ionisés Plasmas froids créés par décharge et laser (EMILI), Oct 2023, Nancy, France
Poster de conférence
hal-04194636
v1
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Micro-fabricated silicon-based microplasma reactorsJournées Nationales sur les Technologies Emergentes (JNTE22), Nov 2022, Besançon (France), France
Poster de conférence
hal-03881662
v1
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Cryo-ALE of Si based on SF6 physisorptionPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Poster de conférence
hal-03539330
v1
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MEMS based nanofluidics device for the study of the nonlinear dynamics associate with the geochemical processesFrench symposium on Emerging Technologies for Micronanofabrication, Nov 2019, Grenoble, France
Poster de conférence
hal-02479390
v1
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Neutral gas temperature in silicon based DC MHCD operated in various gases near atmospheric pressureInternational Workshop on Microplasmas - IWM 10, May 2019, Kyoto, Japan
Poster de conférence
hal-02189151
v1
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The role of SiF4 physisorption in silicon cryoetchingPlasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Poster de conférence
hal-02311339
v1
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Robust atmospheric pressure plasma source fabricated by microfabrication techniquesJournées Nationales sur les Technologies Emergentes (JNTE19), Nov 2019, Grenoble, France
Poster de conférence
hal-02291720
v1
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Analysis of mechanisms involved in cryogenic ALE19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, France
Poster de conférence
hal-02311314
v1
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Spectroscopic study of the neutral gas temperature of silicon based DC MHCD in various gases close to atmospheric pressure13th Frontiers in Low-Temperature Plasma Diagnostics, May 2019, Baf Honnef, Germany. 2019
Poster de conférence
hal-02131666
v1
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Optimisation et packaging de microplasmas sur siliciumColloque de l'UMI-LN2, Jul 2018, Autrans, France
Poster de conférence
hal-01903397
v1
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INTRODUCTION AU PROCÉDÉ DE GRAVURE CRYOGÉNIQUE DU SILICIUM15e Congrès de la Société Française de Physique Division Plasmas, Jun 2018, Bordeaux, France
Poster de conférence
hal-02311219
v1
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Cryogenic ALE of silicon oxidePlasma Etch and Strip in Microtechnology, Oct 2017, Leuven, Belgium
Poster de conférence
hal-02306057
v1
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Silicon micromachining at cryogenic temperatureDesign, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), May 2017, Bordeaux, France
Poster de conférence
hal-01561233
v1
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Titanium microstructuring for implantable componentsDesign, Test, Integration and Packaging of MEMS/MOEMS, May 2017, Bordeaux, France
Poster de conférence
hal-01561245
v1
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Time resolved investigation of rotational temperature of molecular nitrogen in micro-plasma arrays9th International Worksop on Microplasmas, Jun 2017, Garmisch Partenkirchen, Germany
Poster de conférence
hal-01577608
v1
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Advance in low-k cryogenic etching of porous organoscilicate : Investigation of a new gas with higher boiling point Organic (HBPO) and comparison with C4F8Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344722
v1
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Cryogenic etching of silicon with SF6/O2: a computational and experimental studyPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344725
v1
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Deep silicon etching: STiGer vs. BOSCHPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344704
v1
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Enhanced reproducibility of SiO2 atomic layer etching by addition of O2 stepsInternational Symposium of Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence
hal-01561230
v1
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Chlorine-based plasma deep etching of bulk titaniumInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence
hal-01561222
v1
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Near Atmospheric Pressure Etching of Silicon by MicroplasmaInternational workshop on microplasmas, May 2015, Newark, France
Poster de conférence
hal-01166020
v1
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On the relationship between the energy flux at the substrate surface and the phase constitution of reactively magnetron sputtered titanium dioxide thin films14th International Conference on Plasma Surface Engineering PSE 2014 , Sep 2014, Garmisch-Partenkirchen, Germany
Poster de conférence
hal-01289438
v1
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Détermination de l'énergie transférée aux surfaces lors de la modification de matériaux par procédés plasmas basse pression12ème congrès de la division plasma de la SFP , May 2012, Orléans, France
Poster de conférence
hal-01288927
v1
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Direct energy influx measurement in reactive magnetron sputteringReactive sputter deposition RSD 2011, Dec 2011, Linköping, Sweden
Poster de conférence
hal-01288906
v1
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A Heat Flux Microsensor for Direct Measurements in Plasma Surface InteractionsIgor Minin. Microsensors, Intech, pp.87, 2011, 978-953-307-170-1
Chapitre d'ouvrage
hal-00707968
v1
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Un capteur de flux d'énergie dans les plasmasMRCT CNRS. Plasmas Froids : Systèmes d'analyse, Modélisation et Rayonnement, Presses imprimerie Saint-Etienne, pp.97-120, 2009
Chapitre d'ouvrage
hal-00443857
v1
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