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Thierry LACREVAZ

142
Documents

Publications

Permittivity Characterization of Conductive and Corrosive LiBr Water Solutions, Method Validation up to 9 GHz Using a Low-Cost SMA Probe

Anne-Laure Perrier , Gregory Houzet , J. Outin , Édouard Rochefeuille , Benoit Stutz
Sensors, 2025, 25 (3), pp.789. ⟨10.3390/s25030789⟩
Journal articles hal-04917664v1

High gain Vivaldi antenna from 26 up to 40 GHz for 5G applications

Thi‐hong‐le Dam , Gregory Houzet , Thierry Lacrevaz , Tan‐phu Vuong
Microwave and Optical Technology Letters, 2022, 64 (7), pp.1267-1271. ⟨10.1002/mop.33271⟩
Journal articles hal-04906508v1
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In-situ characterization up to 100 ​GHz of insulators used in new 3D “System in Package on board” (SiPoB) technologies

Gregory Houzet , Thierry Lacrevaz , Cedric Bermond , Philippe Artillan , David Auchère
Microelectronics Journal, 2021, 108, pp.104990. ⟨10.1016/j.mejo.2021.104990⟩
Journal articles hal-04712770v1
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Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers

Khadim Dieng , Philippe Artillan , Cédric Bermond , Olivier Guiller , Thierry Lacrevaz
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2017, 7 (4), pp.477 - 484. ⟨10.1109/TCPMT.2017.2655939⟩
Journal articles hal-01819186v1

Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results

Thierry Lacrevaz , Cédric Bermond , Ossama El Bouayadi , Grégory Houzet , Philippe Artillan
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2014, 4 (9), pp.1515-1522. ⟨10.1109/TCPMT.2014.2337511⟩
Journal articles hal-01988717v1
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Intercomparison of Permittivity Measurement Techniques for Ferroelectric Thin Layers

Patrick Queffelec , Vincent Laur , Alexis Chevalier , Jean-Michel Le Floch , Damien Passerieux
Journal of Applied Physics, 2014, 115 (2), pp.024103. ⟨10.1063/1.4858388⟩
Journal articles hal-00929884v1

RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits

Cédric Bermond , M. Brocard , T. Lacrevaz , A. Farcy , P. Le Maître
Microelectronic Engineering, 2014, 130, pp.74-81. ⟨10.1016/j.mee.2014.09.025⟩
Journal articles hal-02003828v1
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"Characterization in a Wide Frequency Range (40 MHz - 67 GHz) of a KTa0.65Nb0.35O3 Thin Film for Tunable Applications"

Grégory Houzet , Thierry Lacrevaz , Cédric Bermond , Bernard Flechet , Arnaud Le Febvrier
Integrated Ferroelectrics, 2014, 158 (1), pp. 52-61. ⟨10.1080/10584587.2014.957091⟩
Journal articles hal-01122383v1

Refined Characterization Up to Millimeter Waves of Ferroelectric KTN Thin Film for Efficient Integrated Tunable Devices

Gregory Houzet , T. Lacrevaz , C. Bermond , A. Le Febvrier , S. Deputier
ECS Transactions, 2013, 58, pp.237-242
Journal articles hal-01122418v1

"Refined characterization up to millimeter waves of ferroelectric KTN thin film for efficient integrated tunable devices"

G. Houzet , T. Lacrevaz , C. Bermond , A. Le Febvrier , S. Deputier
ECS Trans., 2013, 58 (7), pp.237-242
Journal articles hal-00994445v1

Electrical characterization of advanced MIM capacitors with ZrO2 Insulator for high-density packaging and RF applications

T. Bertaud , C. Bermond , S. Blonkowski , Corentin Vallée , T. Lacrevaz
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, pp.2 (2012) 502-509
Journal articles hal-00777838v1

DC to Radio-Frequency Characterization of ZrO2 Dielectric for "Metal-Insulator-Metal" Integrated Capacitors"

T. Bertaud , C. Bermond , S. Blonkowski , Corentin Vallée , T. Lacrevaz
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2 (3), pp.502-509
Journal articles hal-01025008v1

"Wideband frequency and in-situ characterization of Aluminium Nitride (AlN) in a Metal/Insulator/Metal (MIM) configuration"

T. Bertaud , E. Defay , C. Bermond , T. Lacrevaz , J. Abergel
Microelectronic Engineering, 2011, 88 (5), pp.564-568
Journal articles hal-01068836v1
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Characteristic impedance extraction of embedded and integrated interconnects

J. Roullard , S. Capraro , T. Lacrevaz , M. Gallitre , C. Bermond
European Physical Journal: Applied Physics, 2011, 53 (3), ⟨10.1051/epjap/2010100066⟩
Journal articles hal-00672782v1

"Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking"

E. Eid , T. Lacrevaz , C. Bermond , S. de Rivaz , S. Capraro
Microelectronic Engineering, 2011, 88 (5), pp.729-733
Journal articles hal-01068838v1

Quality Factor and Frequency Bandwidth of 2D Self Inductors in 3D Integration Stack"

J. Roullard , S. Capraro , E. Eid , L. Cadix , C. Bermond
Microelectronic Engineering, 2011, 88 (5), pp.734-738
Journal articles hal-01068827v1

"Characteristic Impedance Extraction of Embedded and Integrated Interconnects"

J. Roullard , S. Capraro , T. Lacrevaz , M. Gallitre , C. Bermond
European Physical Journal: Applied Physics, 2011, Vol. 53 (No. 3,), pp. 1-6
Journal articles hal-01068736v1

"Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node"

B. Blampey , M. Gallitre , A. Farcy , T. Lacrevaz , S. de Rivaz
Microelectronic Engineering, 2010, 87 (issue 3), pp.329-332
Journal articles hal-01073580v1

Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node

B. Blampey , M. Gallitre , A. Farcy , T. Lacrevaz , S. de Rivaz
Microelectronic Engineering, 2010, 87 (3), pp.329-332. ⟨10.1016/j.mee.2009.07.023⟩
Journal articles hal-00602049v1

Wideband frequency and in-situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

T. Bertaud , C. Bermond , T. Lacrevaz , Corentin Vallée , Y. Morand
Microelectronic Engineering, 2010, 87 (3), pp.301-305. ⟨10.1016/j.mee.2009.06.016⟩
Journal articles hal-00602043v1

Ferroelectric properties of PZT thin films until 40 GHz

Defaÿ E. , Lacrevaz T. , Vo T.T. , Sbrugnera V. , Bermond C.
Applied Physics Letters, 2009, 94 (5), pp.052901-052901-3
Journal articles hal-01075060v1

High Frequency Characterization of Advanced MIM Capacitors Using SiN Dielectic Layers

J. Piquet , C. Bermond , M. Thomas , A. Farcy , T. Lacrevaz
IEEE Transactions on Components and Packaging Technologies, 2008, 31 (3), pp.546 - 551
Journal articles hal-00397514v1

Characterization of porous ULK SiOCH and impact on signal propagation for on-chip interconnects of the 45 nm node

M. Gallitre , B. Blampey , B. Fléchet , A. Farcy , V. Arnal
Proc. of the European Microwave Association, 2008, 4, pp.131-138
Journal articles hal-00397420v1

In-situ Microwave Characterization of Medium-k HfO2 and High-k STO Dielectrics for MIM Capacitors Integrated in Back-End of Line of IC

T.T. Vo , T. Lacrevaz , C. Bermond , T. Bertaud , B. Fléchet
IET Microwave, Antennas & Propagation, 2008, 2 (8), pp.781 - 788
Journal articles hal-00397565v1
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Characterization of Corrosive Lithium-Bromide/Water Solutions up to 6 GHz Using a Low Cost SMA Connector

Anne-Laure Perrier , Gregory Houzet , Jonathan Outin , Édouard Rochefeuille , Benoit Stutz
International Conference on Electrical, Computer, Communications and Mechatronics Engineering, Nov 2024, Male, Maldives
Conference papers hal-04705591v1
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2024 -Antibes Juan-Les-Pins Résonateur en anneau pour la détermination de la glycémie

Z Liermann , Nicolas Corrao , Thierry Lacrevaz , O Lavastre , E Rochefeuille
23èmes Journées Nationales Microondes, Jun 2024, Antibes (06), France
Conference papers hal-04769781v1
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Exploring PLA/Flax Substrates for Antenna Applications: Assessing Moisture, Temperature and Dielectric Constant Homogeneity

Vincent Grennerat , Georges Zakka El Nashef , Ahmad Sabra , Pascal Xavier , Thierry Lacrevaz
18TH EUROPEAN CONFERENCE ON ANTENNAS & PROPAGATION, Mar 2024, Glasgow (Ecosse), United Kingdom
Conference papers hal-04553059v1

Switchable FSS-based 3D Printed Radome using Diodes at 3.6 GHz

Thi-Hong-Le Dam , Alejandro Niembro-Martin , Thierry Lacrevaz , Gregory Houzet , Damien Paulet
2023 53rd European Microwave Conference (EuMC), Sep 2023, Berlin, Germany. pp.416-419, ⟨10.23919/EuMC58039.2023.10290381⟩
Conference papers hal-04908315v1

Diode-based Switchable Frequency Selective Surface at 3.6 GHz

Thi-Hong-Le Dam , Gregory Houzet , Thierry Lacrevaz , Tan-Phu Vuong
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Jul 2023, Portland, United States. pp.139-140, ⟨10.1109/USNC-URSI52151.2023.10237484⟩
Conference papers hal-04908301v1
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Caractérisation jusqu'à 9 GHz de solutions corrosives eau/bromure de lithium à l'aide d'un connecteur SMA faible coût

A-L Perrier , Gregory Houzet , Jonathan Outin , Edouard Rochefeuille , B. Fléchet
17èmes Journées de Caractérisation Microondes et Matériaux (JCMM 2023), Apr 2023, Tours, France
Conference papers hal-04063071v1
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Conception et caractérisation d'une antenne reconfigurable réalisée par impression d'encre sur papier pour des applications 4G et 5G

Thi-Hong-Le Dam , Victor Thenot , Gaël Depres , Thierry Lacrevaz , Gregory Houzet
17èmes Journées de Caractérisation Microondes et Matériaux (JCMM 2023), Apr 2023, Tours, France
Conference papers hal-04063076v1

Reconfiguration du diagramme de rayonnement d’une antenne dédiée à la 5G à l’aide d’un radôme imprimé en 3D

Thi-Hong-Le Dam , Camille Delfaut , Gregory Houzet , Thierry Lacrevaz , B. Fléchet
22ème Journées Nationales Microondes (JNM 2022), Jun 2022, Limoges, France
Conference papers hal-03677994v1

Investigation of phase compensation lens to improve the gain of Vivaldi antenna in Ka-band

Thi-Hong-Le Dam , Gregory Houzet , Thierry Lacrevaz , Gwenaël Gaborit , Tan-Phu Vuong
2022 IEEE 9th International Conference on Communications and Electronics (ICCE), Jul 2022, Nha Trang, Vietnam. pp.265-268, ⟨10.1109/ICCE55644.2022.9852039⟩
Conference papers hal-04908288v1

Study of a 3D FSS-Based Printed Radome Demonstrator for a Patch Antenna at 3.6 GHz

Thi-Hong-Le Dam , Alejandro Niembro-Martin , Thierry Lacrevaz , Gregory Houzet , Camille Delfaut
2022 52nd European Microwave Conference (EuMC), Sep 2022, Milan, Italy. pp.664-667, ⟨10.23919/EuMC54642.2022.9924470⟩
Conference papers hal-04112357v1

Reconfigurable Screen-Printed Patch Antenna on Paper for 4G and 5G Applications

Thi-Hong-Le Dam , Victor Thenot , Gaël Depres , Thierry Lacrevaz , Gregory Houzet
European Microwave Conference, Sep 2022, Milan, Italy
Conference papers hal-03727448v1

Printed radome for reconfigurable antenna radiation pattern in 5G applications

Camille Delfaut , Gregory Houzet , Thierry Lacrevaz , Alejandro Niembro-Martin , Quoc-Bao Duong
2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI), Dec 2021, Singapour, Singapour. pp.309-310, ⟨10.1109/APS/URSI47566.2021.9704084⟩
Conference papers hal-03033086v1

Caractérisation in-situ jusqu'à 100 GHz d'isolants utilisés dans les nouvelles technologies 3D de type System in Package on Board (SiPoB)

Thierry Lacrevaz , Gregory Houzet , Cédric Bermond , Philippe Artillan , David Auchère
16èmes Journées de Caractérisation Microondes et Matériaux (JCMM 2020), Nov 2020, Toulouse, France
Conference papers hal-04907491v1
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Méthode de caractérisation large bande de fréquence de matériaux isolants par contact direct « sonde de mesure / échantillon »

Thierry Lacrevaz , David Auchère , Grégory Houzet , Philippe Artillan , Bernard Flechet
Journées de Caractérisation Microondes et Matériaux (JCMM), Mar 2018, Paris, France
Conference papers hal-01939115v1

RF Characterization, Analysis and Miniaturization Impact of RDL Interconnects

Helene Jacquinot , Alexis Farcy , Thierry Lacrevaz , Kevin Morot , Bernard Flechet
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. pp.2000-2006, ⟨10.1109/ECTC.2018.00300⟩
Conference papers hal-02015694v1

Modélisation et caractérisation de capacités 3D : application au découplage de réseaux d’alimentation

Khadim Dieng , Cedric Bermond , Philippe Artillan , Olivier Guiller , Thierry Lacrevaz
10èmes Journées Franco-Maghrébines des Microondes et Applications (JFMMA’17), May 2017, Rabbat, Maroc, Maroc
Conference papers hal-04712890v1

InP composite substrate for low-cost high-end RF applications

Catherine Cadieux , Marc Rabarot , Olivier Ledoux , Muriel Martinez , Eric Guiot
International Conference on Materials for Advanced Technologies (ICMAT), Jun 2017, Singapore, Singapore
Conference papers hal-01939049v1

A Versatile Platform towards High Reliability Compact Package for Digital Chips

C. Ferrandon , L. Castagne , B. Kholti , G. Waltener , R. Lemaire
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), May 2017, Orlando, United States. pp.623-630, ⟨10.1109/ECTC.2017.331⟩
Conference papers hal-02017756v1

Modélisation et caractérisation hyperfréquences de capacités 3D « Through Silicon Capacitors » pour le découplage des réseaux d’alimentation de circuits intégrés

Khadim Dieng , Cédric Bermond , Philippe Artillan , Olivier Guiller , Thierry Lacrevaz
20èmes Journées Nationales Microondes JNM'17, May 2017, Saint-Malo, France
Conference papers hal-01988731v1

Wide-band simulations of differential 3D interconnect propagation performances in a photonic interposer

Kevin Morot , Helene Jacquinot , Thierry Lacrevaz , Cédric Bermond , Alexis Farcy
2016 6th Electronic System-Integration Technology Conference (ESTC), Sep 2016, Grenoble, France. pp.1-6, ⟨10.1109/ESTC.2016.7764483⟩
Conference papers hal-02003969v1

Modélisation haute fréquence de « Through Silicon Via » en fonction des matériaux, des architectures last et middle et des modes de transmission

Kevin Morot , Helene Jacquinot , Thierry Lacrevaz , Cédric Bermond , Alexis Farcy
14èmes Journées de Caractérisation Microondes et Matériaux (JCMM'16), Mar 2016, Calais, France
Conference papers hal-02003962v1

Modèle électrique et caractérisation à haute fréquence de condensateurs intégrés dans l’épaisseur d’un interposeur silicium

Khadim Dieng , Philippe Artillan , Cédric Bermond , Olivier Guiller , Thierry Lacrevaz
14èmes Journées de Caractérisation Microondes et Matériaux (JCMM'16), Mar 2016, Calais, France
Conference papers hal-01990005v1

Modèle électrique et caractérisation à haute fréquence de condensateurs intégrés sur interposeur silicium

Philippe Artillan , Khadim Dieng , Cédric Bermond , Olivier Guiller , Thierry Lacrevaz
XIXe Journées Nationales Microondes (JNM'15), Jun 2015, Bordeaux, France
Conference papers hal-01989995v1

Modélisation et caractérisation de capacités 3D dans un interposeur silicium

Khadim Dieng , Philippe Artillan , Cédric Bermond , Olivier Guiller , Thierry Lacrevaz
JFMMA, 9èmes Journées Franco-Maghrébines des Microondes et Applications, May 2015, Meknes, Maroc
Conference papers hal-02009674v1

Caractérisation et modélisation HF des couplages électromagnétiques par les substrats entre interconnexions verticales et transistors MOSFET dans les empilements 3D de circuits intégrés

M. Brocard , C. Bermond , P. Le Maître , A. Farcy , P. Scheer
13èmes Journées de Caractérisation Microondes et Matériaux, JCMM2014, Mar 2014, Nantes, France. pp.1-4
Conference papers hal-01021543v1

Méthode robuste d’extraction de paramètres de ligne de transmission en vue d’application à la caractérisation de matériaux

Gregory Houzet , Philippe Artillan , Cédric Bermond , Thierry Lacrevaz , Khadim Dieng
13èmes Journées de Caractérisation Microondes et Matériaux, JCMM2014, Mar 2014, Nantes, France
Conference papers hal-01990033v1

High Frequency Model of Through Silicon Capacitors in Silicon Interposer for Power Distribution Network

Khadim Dieng , Philippe Artillan , Cedric Bermond , Thierry Lacrevaz , Gregory Houzet
Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Conference (MiNaPAD’14), May 2014, Grenoble, France
Conference papers hal-04712891v1

Méthodologie et résultats de caractérisation large bande d'une couche diélectrique enfouie dans un empilement de circuits intégrés 3D

C. Bermond , T. Lacrevaz , O. El Bouayadi , Philippe Artillan , G. Houzet
13èmes Journées de Caractérisation Microondes et Matériaux, JCMM2014, Mar 2014, Nantes, France. pp.1-4
Conference papers hal-01021517v1

MmW devices: from WLCSP to smart interposers

Y. Lamy , O. El Bouayadi , C. Ferrandon , S. Joblot , A. Jouve
9th IMAPS International Conference and Exhibition on Device Packaging, Mar 2013, Scottsdale, United States. pp.1-4
Conference papers hal-01021029v1

Electrical Performance Modeling of Unbalanced Comb Tree Networks on Advanced PCB Interconnects for High-Rate Clock Signal Distribution

T. Eudes , B. Ravelo , T. Lacrevaz , B. Fléchet
IEEE 63rd Electronic Components and Technology Conf., May 2013, Las Vegas, United States. pp.2024-2034
Conference papers hal-01018036v1

3D Integration of CMOS Image Sensor with Coprocessor Using TSV last and Micro-Bumps Technologies

P. Coudrain , Dominique Henry , A. Berthelot , J. Charbonnier , S. Verrun
IEEE 63rd Electronic Components and Technology Conf., May 2013, Las Vegas, United States. pp.674-682
Conference papers hal-01018405v1

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits

M. Brocard , C. Bermond , T. Lacrevaz , A. Farcy , P. Le Maître
IEEE Int. Conf. on 3D System Integration (3DIC), Oct 2013, San Francisco, United States. pp.1-8
Conference papers hal-01018442v1

Refined Characterization Up to Millimeter Waves of Ferroelectric KTN Thin Film for Efficient Integrated Tunable Devices

Grégory Houzet , Thierry Lacrevaz , C. Bermond , A. Le Febvrier , S. Deputier
224th Electrochemical Society (ECS) Meeting, Oct 2013, San Francisco, United States
Conference papers hal-01301899v1

Experimental validation of balanced tree interconnection model for high speed signal integrity

T. Eudes , B. Ravelo , T. Lacrevaz , B. Fléchet
8e Journées Franco-Maghrébines des Microondes et Applications, Mar 2013, Marrakech, Maroc. pp.Telecom 2013
Conference papers hal-01021027v1

Caractérisation et modélisation du couplage induit par les TSV dans les architectures 3D

C. Bermond , M. Brocard , A. Farcy , T. Lacrevaz , P. Leduc
18èmes journées nationales micro-ondes, May 2013, Paris, France. pp.JNM'13
Conference papers hal-01021024v1

Module intégré 3D sur silicium pour les transmissions sans fil haut-débit WiGig et WiHD à 60 GHz

O. El Bouayadi , L. Dussopt , Y. Lamy , C. Ferrandon , S. Joblot
18èmes journées nationales micro-ondes, May 2013, Paris, France. pp.JNM'13
Conference papers hal-01020903v1

Performance of Molding Materials and Interconnections Integrated in Interposers Dedicated to RF or Microwave 3DIC applications

T. Lacrevaz , C. Bermond , B. Fléchet , Y. Lamy , O. El Bouayadi
European Microelectronics Packaging Conference (EMPC), Sep 2013, Grenoble, France. pp.1-7
Conference papers hal-01018432v1

Distributed Model of Two-Level Asymmetrical PCB Interconnect Tree

T. Eudes , B. Ravelo , T. Lacrevaz , B. Fléchet
2013 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Sep 2013, Brugge, Belgium. pp.132-137
Conference papers hal-01018417v1

Fast Estimation of High-Speed Signal Integrity for Coupled PCB Interconnects

T. Eudes , B. Ravelo , T. Lacrevaz , B. Fléchet
17th IEEE Workshop on Signal and Power Integrity (SPI), May 2013, PARIS, France. pp.1-4
Conference papers hal-01018028v1

MmW characterization of wafer level passivation for 3D silicon interposer

Y. Lamy , O. El Bouayadi , C. Ferrandon , A. Schreiner , T. Lacrevaz
IEEE 63rd Electronic Components and Technology Conf., May 2013, Las Vegas, United States. pp.1887-1891
Conference papers hal-01018396v1

Impact des effets de couplage par les substrats sur l'intégrité de signaux numériques rapides dans les empilements 3D de circuits intégrés

E. Eid , T. Lacrevaz , G. Houzet , C. Bermond , Philippe Artillan
8e Journées Franco-Maghrébines des Microondes et Applications, Mar 2013, Marrakech, Maroc. pp.Telecom 2013
Conference papers hal-01021025v1

" Inter comparaison de caractérisations électromagnétiques de couches minces ferroélectriques "

Patrick Queffelec , Vincent Laur , F. Rasoanoavy , Jean-Michel Le Floch , Damien Passerieux
12e Journées Caractérisation Microondes et Matériaux, Mar 2012, Chambéry, France
Conference papers hal-01068647v1

Focus on Links between High Frequency Substrate Noise and High Speed Signal Transmission in Interconnection Channels of 3D-IC

M. Brocard , E. Eid , T. Lacrevaz , C. Bermond , G. Houzet
Micro-Nano-Electronics Packaging & Assembly, Design and Manufacturing,, Apr 2012, grenoble, France
Conference papers hal-01062178v1

Extraction entre 40 MHz et 67 GHz de la permittivité complexe du KTa0.65Nb0.3503 déposé en couche mince

G. Houzet , T. Lacrevaz , C. Bermond , A. Le Febvrier , S. Deputier
12èmes Journées de Caractérisation Microondes et Matériaux, JCMM 2012, 2012, Chambéry, France. session S1, papier ID52, 1-4
Conference papers hal-00806607v1

Extraction entre 40 MHz et 67 GHz de la permittivité complexe du KTa 0.65Nb0.35O3 déposé en couche mince

Gregory Houzet , Thierry Lacrevaz , Cédric Bermond , Arnaud Le Febvrier , Stephanie Deputier
12e Journées Caractérisation Microondes et Matériaux,, Mar 2012, Chambéry, France
Conference papers hal-01068623v1

Inter-comparaisons de caractérisations électromagnétiques de couches minces ferroélectriques

Patrick Queffelec , Vincent Laur , Faly Rasoanoavy , Jean-Michel Le Floch , Damien Passerieux
12èmes Journées de Caractérisation Micro-ondes et Matériaux, Mar 2012, Chambéry, France
Conference papers hal-01301748v1

Intercomparaisons de caractérisations électromagnétiques de couches minces ferroélectriques

Faliniaina Rasoanoavy , Vincent Laur , Patrick Queffelec , Jean-Michel Le Floch , Damien Passerieux
12èmes Journées de Caractérisation Microondes et Matériaux, Mar 2012, Chambéry, France. pp.Inconnu
Conference papers hal-00734812v1

Evaluation of 3D Interconnect Routing and Stacking Strategy to Optimize High Speed Signal Transmission for Memory on Logic",

Jj. Roullard , A. Farcy , S. Capraro , T. Lacrevaz , C. Bermond
IEEE 62nd Electronic Components and Technology Conf.,, May 2012, San Diego, United States
Conference papers hal-01062192v1

"Effects of silicon substrate coupling phenomena on signal integrity for RF or high speed communications in 3D-IC."

E. Eid , T. Lacrevaz , G. Houzet , C. Bermond , B. Fléchet
IEEE 62nd Electronic Components and Technology Conf.,, May 2012, San Diego, United States
Conference papers hal-01062188v1

" Influence de la température sur l'intégrité des signaux haut débit véhiculés dans les interconnexions de PCB "

T. Eudes , B. Ravelo , T. Lacrevaz , B. Fléchet
12e Journées Caractérisation Microondes et Matériaux, Mar 2012, Chambéry, France
Conference papers hal-01068643v1

"Refined but Handy Electrical Models of TSV Useable from Low to High Density and for RF or Fast Digital Signals in 3D-IC"

L. Fourneaud , T. Lacrevaz , C. Bermond , J. Charbonnier , C. Fuchs
IEEE 62nd Electronic Components and Technology Conf., May 2012, San Diego, United States
Conference papers hal-01062183v1

" Etude jusqu'à 60 GHz d'une capacité ferroélectrique de PbZrO0.52TiO0.48O3 "

C. Bermond , J. Abergel , G. Le Rhun , E. Defay , G. Houzet
12e Journées Caractérisation Microondes et Matériaux, Mar 2012, Chambéry, France
Conference papers hal-01068640v1

Règles de conception de réseaux d'interconnexions de circuits intégrés CMOS 45NM en vue de la réduction conjointe de la diaphonie et des délais pour la transmission de signaux numériques très rapides

Sébastien de Rivaz , Alexis Farcy , Denis Deschacht , Thierry Lacrevaz , Bernard Flechet
Colloque International Télécom'2011 - 7èmes Journées JFMMA, Tanger, Morocco. pp.N/A
Conference papers lirmm-00585032v1

" Caractérisation très large bande des oxydes ZrO2 et TiTaO à permittivité élevée pour la réalisation de capacités MIM RF intégrées "

T. Bertaud , C. Bermond , S. Blonkowski , Antoine Goullet , Corentin Vallée
JNM'11, May 2011, Brest, France
Conference papers hal-01073531v1

"Electrical Characterization of Millimeter-Wave Interconnects on Low-k and Low-loss Oxides for Advanced 3D Silicon Interposers"

B. Reig , P. Renaux , D. Mercier , C. Mounet , H. Sibuet
European Microwave Conference (EuMC 2011), Oct 2011, Manchester, United Kingdom
Conference papers hal-01072987v1

" Caractérisation des couplages électriques RF par les substrats de silicium en intégration 3D de circuits "

E. Eid , T. Lacrevaz , C. Bermond , S. Capraro , A. Farcy
JNM'11, May 2011, Brest, France
Conference papers hal-01073528v1

"Electrical Characterization and Impact on Signal Integrity of New Basic Interconnection Elements Inside 3D Integrated Circuits",

J. Roullard , S. Capraro , T. Lacrevaz , C. Bermond , A. Farcy
(ECTC2011), Jun 2011, Lake Buena Vista, United States
Conference papers hal-01069258v1

"Lateral Field Excitation of thickness shear modes in an AlN membrane"

M. Gorisse , T. Bertaud , A. Reinhardt , M. Borel , C. Billard
IEEE International Frequency Control Symposium and European Frequency and Time Forum (IFCS 2011),, May 2011, San Francisco, United States
Conference papers hal-01068868v1

" Règles de conception des réseaux d'interconnexions de circuits CMOS-45 nm en vue de la réduction conjointe de la diaphonie et des délais pour la transmission de signaux numériques très rapides "

S. de Rivaz , A. Farcy , Denis Deschacht , T. Lacrevaz , B. Flechet
7e Journées Franco-Maghrébines des Microondes et Applications, Mar 2011, Tanger, Maroc
Conference papers hal-01073524v1

Caractérisation très large bande des oxydes ZrO2 et TiTaO à permittivité élevée pour la réalisation de capacités MIM RF intégrées

Thomas Bertaud , Cédric Bermond , Serge Blonkowski , Antoine Goullet , Christophe Vallée
XVIIes Journées Nationales Microondes, 2011, Brest, France
Conference papers hal-00650167v1

"Extraction of Equivalent High Frequency Models for TSV and RDL Interconnects Embedded in Stacks of the 3D Integration Technology" Naples, Italy.

L. Fourneaud , T. Lacrevaz , J. Charbonnier , C. Fuchs , A. Farcy
IEEE Signal Propagation on Interconnects, May 2011, Naples, Italy
Conference papers hal-01068872v1
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Effective Interconnect Networks Design in CMOS 45 nm Circuits to Joint Reductions of XT and Delay for Transmission of Very High Speed Signals

Sébastien de Rivaz , Alexis Farcy , Denis Deschacht , Thierry Lacrevaz , Bernard Flechet
EDAPS'10: Electrical Design of Advanced Package and Systems Symposium, Singapore. pp.N/A
Conference papers lirmm-00546304v1

"Characterization and Modeling of RF Substrate Coupling Effects due to Vertical Interconnects in 3D Integrated Circuit Stacking "

E. Eid , T. Lacrevaz , C. Bermond , S. de Rivaz , S. Capraro
IEEE Signal Propagation on Interconnects,, May 2010, Hidelsheim, Germany
Conference papers hal-00604327v1

“Quality Factor and Frequency Bandwidth of 2D Self Inductors in 3D Integration Stack”

Roullard J. , Capraro S. , Eid E. , Cadix L. , Bermond C.
Materials for Advanced Metallization, Mar 2010, Mechelen, Belgium
Conference papers hal-01074519v1

“Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking” Materials for Advanced Metallization, March 7-10, 2010, Mechelen, Belgium.

Eid E. , Lacrevaz T. , Bermond C. , Rivaz S. De , Capraro S.
Materials for Advanced Metallization, Mechelen, Belgium., Mar 2010, Mechelen, Belgium
Conference papers hal-01074511v1

"Keep on shrinking interconnect size: is it still the best solution ?"

Denis Deschacht , S. de Rivaz , A. Farcy , T. Lacrevaz , B. Flechet
IEEE Int. Electronics Manufacturing Technology Conf.,, Dec 2010, Melaka, Malaysia
Conference papers hal-00604337v1

"HF Performance Characterization and Prediction of 2D Redistribution Layer Interconnects in a 3D-Integrated Circuit Stack"

J. Roullard , S. Capraro , T. Lacrevaz , L. Cadix , E. Eid
IEEE Signal Propagation on Interconnects, May 2010, Hidelsheim, Germany
Conference papers hal-00604328v1

"Wideband frequency and in-situ characterization of Aluminum Nitride (AlN) in a Metal/Insulator/Metal (MIM) configuration"

T. Bertaud , E. Defay , C. Bermond , T. Lacrevaz , J. Abergel
Materials for Advanced Metallization, Mar 2010, Mechelen, Belgium
Conference papers hal-00604324v1

Frequency and Time Domain Characterization of Substrate Coupling Effects in 3D Integration Stack

E. Eid , T. Lacrevaz , C. Bermond , S. Capraro , J. Roullard
IEEE Int. Electronics Manufacturing Technology Conf.,, Dec 2010, Melaka, Malaysia
Conference papers hal-00604338v1

" Effets de couplage RF par les substrats de silicium dans les empilements de circuits intégrés 3D "

E. Eid , T. Lacrevaz , C. Bermond , S. de Rivaz , S. Capraro
11e Journées Caractérisation Microondes et Matériaux, Apr 2010, Brest, France
Conference papers hal-00604503v1

" Caractérisation microondes et in-situ du Nitrure d'Aluminium (AlN) en configuration Métal/Isolant/Métal "

T. Bertaud , E. Defay , C. Bermond , T. Lacrevaz , J. Abergel
11e Journées Caractérisation Microondes et Matériaux,, Apr 2010, Brest, France
Conference papers hal-00604505v1
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Keep on Shrinking Interconnect Size: is it Still the Best Solution?

Denis Deschacht , Sébastien de Rivaz , Alexis Farcy , Thierry Lacrevaz , Bernard Flechet
IEMT'10: 34th IEEE International Electronics Manufacturing Technology Conference, Melaka, Malaysia. pp.N/A
Conference papers lirmm-00546320v1

Modélisation RLCG de lignes coplanaires sur un substrat Silicium pour applications CMOS

O. Valorge , F. Calmon , M. Le Berre , C. Gontrand , E. Eid
15e Compatibilité Electromagnétique CEM 2010, Apr 2010, Limoges, France
Conference papers hal-00604508v1

Benefit on Interconnect Performance of a Relaxed Wire Density in a 45 nm Node of the Back End of Line

Sébastien de Rivaz , Alexis Farcy , Denis Deschacht , Thierry Lacrevaz , Bernard Flechet
IEEE 14th Workshop on Signal Propagation on Interconnects, Germany. pp.9
Conference papers lirmm-00485629v1

“Keep on shrinking interconnect size: is it still the best solution ?”

Denis Deschacht , Rivaz S. De , Farcy A. , Lacrevaz T. , Fléchet B.
IEEE Int. Electronics Manufacturing Technology Conf., Nov 2010, Melaka, Malaysia
Conference papers hal-01074798v1

“Benefit on Interconnect Performance of a Relaxed Wire Density in a 45 nm Node of the Back End of Line”

Rivaz S. De , Farcy A. , Denis Deschacht , Lacrevaz T. , Fléchet B.
IIEEE Signal Propagation on Interconnects,, May 2010, Hidelsheim, Germany
Conference papers hal-01074760v1

Investigation on TSV impact on 65nm CMOS devices and circuits

H. Chaabouni , M. Rousseau , P. Leduc , A. Farcy , R. El Farhane
IEEE International Electron Devices Meeting,, Dec 2010, San Francisco, United States
Conference papers hal-00604339v1

" Influence des substrats de silicium sur les performances des inductances planaires 2D lors d'une intégration 3D ",

J. Roullard , S. Capraro , E. Eid , L. Cadix , T. Lacrevaz
11e Journées Caractérisation Microondes et Matériaux, Apr 2010, Brest, France
Conference papers hal-00604501v1

« Investigation on TSV impact on 65nm CMOS devices and circuits »

Henda Chaabouni , Rousseau M. , Leduc P. , Farcy A. , Farhane R. El
, IEEE International Electron Devices Meeting,, Dec 2010, San Francisco, United States
Conference papers hal-01074810v1

"Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking"

E. Eid , T. Lacrevaz , C. Bermond , S. de Rivaz , S. Capraro
Materials for Advanced Metallization, Mar 2010, Mechelen, Belgium
Conference papers hal-00604323v1

Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking

E. Eid , T. Lacrevaz , S. de Rivaz , C. Bermond , B. Fléchet
Predictive High Frequency Effects of Substrate Coupling in 3D Integrated Circuits Stacking, Sep 2009, San Francisco, United States
Conference papers hal-00602866v1

Wideband frequency and in-situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

T. Bertaud , C. Bermond , T. Lacrevaz , Corentin Vallée , Y. Morand
18th Materials for Advanced Metallization Conference, Mar 2009, Grenoble, France
Conference papers hal-00602814v1

Méthode d'extraction de l'impédance caractéristique d'interconnexions de circuits intégrés avancés et application à la caractérisation des isolants poreux ULK

J. Roullard , S. Capraro , T. Lacrevaz , M. Gallitre , C. Bermond
6e Journées Franco-Maghrébines des Microondes et leurs Applications, Mar 2009, Grenoble, France
Conference papers hal-00399531v1

Caractérisation large bande et in-situ de couches minces de ZrO2 et HfO2 intégrées dans des capacités MIM

T. Bertaud , C. Bermond , T. Lacrevaz , C. Vallee , Y. Morand
16èmes Journées Nationales Microondes,, May 2009, Grenoble, France
Conference papers hal-00399525v1

Influence of 3D Integration on 2D Interconnections and 2D Self Inductors HF Properties

Roullard J. , Capraro S. , Lacrevaz T. , Cadix L. , Eid E.
IEEE Int. Conference on 3D System Integration (3D-IC), Sep 2009, San Francisco, United States
Conference papers hal-01075312v1

DC to Radio-Frequency Characterization of ZrO2 Dielectric for "Metal-Insulator-Metal" Integrated Capacitors

T. Bertaud , Corentin Vallée , C. Bermond , T. Lacrevaz , B. Fléchet
" DC to Radio-Frequency Characterization of ZrO2 Dielectric for "Metal-Insulator-Metal" Integrated Capacitors, Dec 2009, Singapore
Conference papers hal-00602878v1

Prédiction des performances HF de réseaux d'interconnexions pour les générations CMOS avancées

M. Gallitre , A. Farcy , B. Blampey , C. Bermond , B. Flechet
16èmes Journées Nationales Microondes, May 2009, Grenoble, France
Conference papers hal-00399925v1

Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node

B. Blampey , M. Gallitre , A. Farcy , T. Lacrevaz , S. de Rivaz
Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node, Mar 2009, Grenoble, France
Conference papers hal-00602820v1

Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node

B. Blampey , M. Gallitre , A. Farcy , T. Lacrevaz , S. de Rivaz
18th Materials for Advanced Metallization Conf.,, Mar 2009, Grenoble, France
Conference papers hal-00399048v1

Caractérisation large bande et in-situ de couches minces de ZrO2 et HfO2 intégrées dans des capacités MIM

T. Bertaud , C. Bermond , T. Lacrevaz , Corentin Vallée , Y. Morand
Caractérisation large bande et in-situ de couches minces de ZrO2 et HfO2 intégrées dans des capacités MIM, May 2009, Grenoble, France
Conference papers hal-00603027v1

Wideband frequency and in-situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

T. Bertaud , C. Bermond , T. Lacrevaz , Corentin Vallée , Y. Morand
MAM2009 (Grenoble), 2009, grenoble, France
Conference papers hal-00461102v1

Caractérisation hyperfréquences de condensateurs MIM intégrés et incluant le diélectrique ZrO2 comme isolant,

T. Bertaud , T.T. Vo , C. Bermond , T. Lacrevaz , C. Vallee
6e Journées Franco-Maghrébines des Microondes et leurs Applications, Mar 2009, France
Conference papers hal-00399517v1

Extraction de l'impédance caractéristique d'interconnexions

J. Roullard , S. Capraro , T. Lacrevaz , C. Bermond , A. Farcy
Extraction de l'impédance caractéristique d'interconnexions, May 2009, Grenoble, France
Conference papers hal-00603050v1

Caractérisation microondes de la permittivité du SiOCH poreux pour la génération CMOS 32 nm

B. Blampey , M. Gallitre , A. Farcy , T. Lacrevaz , S. de Rivaz
Caractérisation microondes de la permittivité du SiOCH poreux pour la génération CMOS 32 nm, May 2009, Grenoble, France
Conference papers hal-00603088v1

Prédiction des performances HF de réseaux d'interconnexions pour les générations CMOS avancées

M. Gallitre , A. Farcy , B. Blampey , C. Bermond , B. Fléchet
Prédiction des performances HF de réseaux d'interconnexions pour les générations CMOS avancées, May 2009, Grenoble, France
Conference papers hal-00603062v1

Impact of ULK Dielectric Loss on Interconnect Response for 45 nm Node Integrated Circuits

S. de Rivaz , T. Lacrevaz , M. Gallitre , A. Farcy , B. Blampey
Impact of ULK Dielectric Loss on Interconnect Response for 45 nm Node Integrated Circuits, Feb 2009, Guadalajara, Mexico, Mexico
Conference papers hal-00602810v1

Extraction de l'impédance caractéristique d'interconnexions

J. Roullard , S. Capraro , T. Lacrevaz , C. Bermond , A. Farcy
16èmes Journées Nationales Microondes, May 2009, Grenoble, France
Conference papers hal-00399912v1

High Frequency Characterization and Modeling of High Density TSV in 3D Integrated Circuits

C. Bermond , L. Cadix , A. Farcy , T. Lacrevaz , P. Leduc
13th IEEE Signal Propagation on Interconnects, May 2009, Grenoble, France
Conference papers hal-00399076v1

High Frequency Characterization and Modeling of High Density TSV in 3D Integrated Circuits

C. Bermond , L. Cadix , A. Farcy , T. Lacrevaz , P. Leduc
High Frequency Characterization and Modeling of High Density TSV in 3D Integrated Circuits, May 2009, Strasbourg, France
Conference papers hal-00602841v1

Rise Time Reduction of High Speed Digital Signals on Interconnects of the CMOS 45 nm Node by Optimizing Interconnect Inductance

S. de Rivaz , T. Lacrevaz , C. Bermond , A. Farcy , B. Fléchet
"Rise Time Reduction of High Speed Digital Signals on Interconnects of the CMOS 45 nm Node by Optimizing Interconnect Inductance, Nov 2009, Belem, Brazil
Conference papers hal-00602870v1

Caractérisation hyperfréquences de condensateurs MIM intégrés et incluant le diélectrique ZrO2 comme isolant

T. Bertaud , T.T. Vo , C. Bermond , T. Lacrevaz , Corentin Vallée
Caractérisation hyperfréquences de condensateurs MIM intégrés et incluant le diélectrique ZrO2 comme isolant, Mar 2009, Agadir, Maroc
Conference papers hal-00603001v1

Méthode d'extraction de l'impédance caractéristique d'interconnexions de circuits intégrés avancés et application à la caractérisation des isolants poreux ULK

J. Roullard , S. Capraro , T. Lacrevaz , M. Gallitre , C. Bermond
Méthode d'extraction de l'impédance caractéristique d'interconnexions de circuits intégrés avancés et application à la caractérisation des isolants poreux ULK, Mar 2009, Agadir, Maroc
Conference papers hal-00603005v1

Wideband frequency and in-situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

Bertaud T. , Bermond C. , Lacrevaz T. , Vallée C. , Morand Y.
18th Materials for Advanced Metallization Conf.,, Mar 2009, Grenoble, France
Conference papers hal-01075272v1

Caractérisation microondes de la permittivité du SiOCH poreux pour la génération CMOS 32 nm

B. Blampey , M. Gallitre , A. Farcy , T. Lacrevaz , S. de Rivaz
16èmes Journées Nationales Microondes, May 2009, Grenoble, France
Conference papers hal-00399929v1

Capacités MIM accordables pour circuits intégrés et caractérisation HF du SrTiO3

T.T. Vo , C. Bermond , T. Lacrevaz , T. Bertaud , S. Capraro
10èmes Journées de Caractérisation Microondes et Matériaux, Apr 2008, France, France
Conference papers hal-00398487v1

Impact of ULK restoration techniques on propagation performance for interconnects of the 45 nm technology node and below

M. Gallitre , B. Blampey , H. Chaabouni , A. Farcy , P. Grosgeorges
12th IEEE Signal Propagation on Interconnects, May 2008, -, France
Conference papers hal-00397907v1

First evidence of dielectric loss effects with ultra low-k materials and impact on interconnect propagation performance

M. Gallitre , B. Blampey , B. Fléchet , A. Farcy , V. Arnal
Materials for Advanced Metallization Conf, Mar 2008, -, France
Conference papers hal-00397857v1

Impact of direct CMP on porous ULK properties and interconnect propagation performance on a wide frequency bandwidth

M. Gallitre , S. Gall , A. Farcy , B. Blampey , B. Icard
25th Advanced Metallization Conference, AMC 2008, Sep 2008, -, France
Conference papers hal-00397928v1

Impact des pertes diélectriques de matériaux à très faible permittivité sur les performances des interconnexions de circuits intégrés

M. Gallitre , B. Blampey , T. Lacrevaz , A. Farcy , C. Bermond
10èmes Journées de Caractérisation Microondes et Matériaux, Apr 2008, Limoges, France
Conference papers hal-00398597v1

Wideband frequency in situ characterization of ultra thin ZrO2 for integrated MIM capacitors

T. Bertaud , T.T. Vo , C. Bermond , T. Lacrevaz , C. Vallee
AMC 2008, 2008, san diego, United States
Conference papers hal-00397026v1
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Turnkey Methodology for Characteristic Impedance Extraction of Embedded Transmission Lines

Gregory Houzet , Philippe Artillan , Cedric Bermond , Thierry Lacrevaz , B. Fléchet
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI), IEEE, pp.1-4, 2019, ⟨10.1109/SaPIW.2019.8781663⟩
Proceedings hal-04712811v1

Fast and robust RF characterization method of insulators used in high speed interconnects networks

Thierry Lacrevaz , Grégory Houzet , David Auchère , Philippe Artillan , Cédric Bermond
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), IEEE; IEEE, pp.1-4, 2018, ⟨10.1109/SaPIW.2018.8401670⟩
Proceedings hal-01988726v1

3D interconnect optimization for single channel 100-GBps transmission in a photonic interposer

Kevin Morot , Alexis Farcy , Thierry Lacrevaz , Cédric Bermond , Philippe Artillan
2017 IEEE 21st Workshop on Signal and Power Integrity (SPI), IEEE, pp.1-4, 2017, ⟨10.1109/SaPIW.2017.7944026⟩
Proceedings hal-01988728v1

Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations

Khadim Dieng , Cédric Bermond , Philippe Artillan , Olivier Guiller , Thierry Lacrevaz
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), IEEE, pp.74-81, 2016, ⟨10.1109/ECTC.2016.335⟩
Proceedings hal-01992682v1

High frequency modeling of Through Silicon Capacitors (TSC) architectures in silicon interposer

Khadim Dieng , Cédric Bermond , Philippe Artillan , Olivier Guiller , Thierry Lacrevaz
2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), IEEE; IEEE, pp.1-4, 2016, ⟨10.1109/SaPIW.2016.7496285⟩
Proceedings hal-01992951v1

Through Silicon Capacitors (TSC) for noise reduction in Power Distribution Network

Khadim Dieng , Philippe Artillan , Cédric Bermond , Olivier Guiller , Thierry Lacrevaz
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), IEEE, pp.247-253, 2015, ⟨10.1109/ECTC.2015.7159600⟩
Proceedings hal-01992912v1
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Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer

Khadim Dieng , Philippe Artillan , Cédric Bermond , Olivier Guiller , Thierry Lacrevaz
2014 International 3D Systems Integration Conference (3DIC), IEEE, pp.1-8, 2014, 2014 International 3D Systems Integration Conference (3DIC), ⟨10.1109/3DIC.2014.7152152⟩
Proceedings hal-01992256v1

Some strategic tracks to optimize routing of high speed signal transmission between memory and logic in 3D–IC stacks

Julie Roullard , Alexis Farcy , Stéphane Capraro , Thierry Lacrevaz , Cédric Bermond
224th Electrochemical Society Meetings, ECS Meeting Abstracts, MA2013-02 (29), pp.2052-2052, 2013, ⟨10.1149/MA2013-02/29/2052⟩
Proceedings hal-01989975v1