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Thomas Tillocher

164
Documents

Publications

Atomic layer etching of gallium nitride using fluorine-based chemistry

Lamiae Hamraoui , Tinghui Zhang , Angela Crespi , Philippe Lefaucheux , Thomas Tillocher
Journal of Vacuum Science & Technology A, 2023, 41 (3), pp.032602. ⟨10.1116/6.0002452⟩
Article dans une revue hal-04075309v1
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Quasi In Situ XPS on a SiO x F y Layer Deposited on Silicon by a Cryogenic Process

G. Antoun , A. Girard , T. Tillocher , P. Lefaucheux , J. Faguet
ECS Journal of Solid State Science and Technology, 2022, 11 (1), pp.013013. ⟨10.1149/2162-8777/ac4c7d⟩
Article dans une revue hal-03565995v1
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Cryogenic nanoscale etching of silicon nitride selectively to silicon by alternating SiF 4 /O 2 and Ar plasmas

Gaelle Antoun , Thomas Tillocher , Aurélie Girard , Philippe Lefaucheux , J. Faguet
Journal of Vacuum Science & Technology A, 2022, 40 (5), pp.052601. ⟨10.1116/6.0001885⟩
Article dans une revue hal-03772077v1
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Combined analysis methods for investigating titanium and nickel surface contamination after plasma deep etching

Rim Ettouri , Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Vincent Fernandez
Surface and Interface Analysis, 2022, 54 (2), pp.134-147. ⟨10.1002/sia.7030⟩
Article dans une revue hal-03434304v1

Mechanism understanding in cryo atomic layer etching of SiO2 based upon C4F8 physisorption

Gaelle Antoun , Thomas Tillocher , Philippe Lefaucheux , Jacques Faguet , Kaoru Maekawa
Scientific Reports, 2021, 11 (1), pp.357. ⟨10.1038/s41598-020-79560-z⟩
Article dans une revue hal-03118852v1

Comparison between Bosch and STiGer Processes for Deep Silicon Etching

Thomas Tillocher , Jack Nos , Gaëlle Antoun , Philippe Lefaucheux , Mohamed Boufnichel
Micromachines, 2021, 12 (10), pp.1143. ⟨10.3390/mi12101143⟩
Article dans une revue hal-03359000v1

Cryo atomic layer etching of SiO 2 by C F8 physisorption followed by Ar plasma

Gaelle Antoun , Philippe Lefaucheux , Thomas Tillocher , Rémi Dussart , Kumiko Yamazaki
Applied Physics Letters, 2019, 115 (15), pp.153109. ⟨10.1063/1.5119033⟩
Article dans une revue hal-02311503v1

The role of physisorption in the cryogenic etching process of silicon

Gaelle Antoun , Rémi Dussart , Thomas Tillocher , Philippe Lefaucheux , Christophe Cardinaud
Japanese Journal of Applied Physics, 2019, 58 (SE), pp.SEEB03. ⟨10.7567/1347-4065/ab1639⟩
Article dans une revue hal-02139391v1

Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above −50 °C

Romain Chanson , Liping Zhang , Sergej Naumov , Yuri Mankelevich , Thomas Tillocher
Scientific Reports, 2018, 8, pp.1886. ⟨10.1038/s41598-018-20099-5⟩
Article dans une revue hal-01696587v1

The effect of SF 6 addition in a Cl 2 /Ar inductively coupled plasma for deep titanium etching

Edouard Laudrel , Thomas Tillocher , Yannick Meric , Philippe Lefaucheux , Bertrand Boutaud
Journal of Micromechanics and Microengineering, 2018, 28 (5), ⟨10.1088/1361-6439/aaafe7⟩
Article dans une revue hal-01735469v1

High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films

Mukesh Kulsreshath , Alexane Vital , Philippe Lefaucheux , Christophe Sinturel , Thomas Tillocher
Micro and Nano Engineering, 2018, 1, pp.42-48. ⟨10.1016/j.mne.2018.10.007⟩
Article dans une revue hal-02267745v1

Novel Method Based on Spin-Coating for the Preparation of 2D and 3D Si-Based Anodes for Lithium Ion Batteries

Marie Gabard , Mustapha Zaghrioui , David Chouteau , Virginie Grimal , Thomas Tillocher
ChemEngineering, 2017, 1 (1), pp.5. ⟨10.3390/chemengineering1010005⟩
Article dans une revue hal-01862635v1

Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF6/O2 plasmas

Stefan Tinck , Thomas Tillocher , Violetta Georgieva , Rémi Dussart , Erik Neyts
Plasma Processes and Polymers, 2017, 14 (9), pp.1700018. ⟨10.1002/ppap.201700018⟩
Article dans une revue hal-01577605v1
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Morphology control in thin films of PS: PLA homopolymer blends by dip-coating deposition

Alexane Vital , Marylène Vayer , Thomas Tillocher , Remi Dussart , Mohamed Boufnichel
Applied Surface Science, 2017, 393, pp.127-133. ⟨10.1016/j.apsusc.2016.09.151⟩
Article dans une revue hal-01561189v1
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Cryogenic plasma-processed silicon microspikes as a high-performance anode material for lithium ion-batteries

Joe Sakai , Erwann Luais , Jérôme Wolfman , Thomas Tillocher , Remi Dussart
Journal of Applied Physics, 2017, 122 (15), pp.155103. ⟨10.1063/1.4997713⟩
Article dans une revue hal-01686032v1

Elucidating the effects of gas flow rate on an SF6 inductively coupled plasma and on the silicon etch rate, by a combined experimental and theoretical investigation

Stefan Tinck , Thomas Tillocher , Remi Dussart , Erik Neyts , Annemie Bogaerts
Journal of Physics D: Applied Physics, 2016, 49 (38), pp.385201. ⟨10.1088/0022-3727/49/38/385201⟩
Article dans une revue hal-01374746v1

Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation

Liping Zhang , Jean-Francois de Marneffe , Floriane Leroy , Philippe Lefaucheux , Thomas Tillocher
Journal of Physics D: Applied Physics, 2016, 49 (17), pp.175203. ⟨10.1088/0022-3727/49/17/175203⟩
Article dans une revue hal-01324407v1

Parametric study of STiGer etching process in order to reduce extended formation of scalloping defects on the sidewalls of silicon submicron trenches

Wassim Kafrouni , Thomas Tillocher , Julien Ladroue , Philippe Lefaucheux , Mohamed Boufnichel
Vacuum, 2016, 133, pp.90. ⟨10.1016/j.vacuum.2016.08.019⟩
Article dans une revue hal-01577601v1

Cryogenic etching of silicon with SF6 inductively coupled plasmas: a combined modelling and experimental study

Stefan Tinck , Thomas Tillocher , Rémi Dussart , Annemie Bogaerts
Journal of Physics D: Applied Physics, 2015, 48, pp.155204. ⟨10.1088/0022-3727/48/15/155204⟩
Article dans une revue hal-01135854v1

Polymer masks for structured surface and plasma etching

Alexane Vital , Marylène Vayer , Christophe Sinturel , Thomas Tillocher , Philippe Lefaucheux
Applied Surface Science, 2015, 332, pp.237. ⟨10.1016/j.apsusc.2015.01.040⟩
Article dans une revue hal-01219273v1

Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas

Floriane Leroy , Liping Zhang , Thomas Tillocher , Koichi Yatsuda , Kaoru Maekawa
Journal of Physics D: Applied Physics, 2015, 48, pp.435202. ⟨10.1088/0022-3727/48/43/435202⟩
Article dans une revue hal-01217648v1

Modification of poly(styrene) thin films and enhancement of cryogenic plasma etching resistance by ruthenium tetroxide vapor staining

Alexane Vital , Marylène Vayer , Christophe Sinturel , Thomas Tillocher , Philippe Lefaucheux
Polymer, 2015, 76, pp.123-130. ⟨10.1016/j.polymer.2015.08.062⟩
Article dans une revue hal-01228427v1

Plasma cryogenic etching of silicon: from the early days to today's advanced technologies

Remi Dussart , Thomas Tillocher , Philippe Lefaucheux , Mohamed Boufnichel
Journal of Physics D: Applied Physics, 2014, pp.123001. ⟨10.1088/0022-3727/47/12/123001⟩
Article dans une revue hal-00959819v1

Alternated process for the deep etching of titanium

Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Remi Dussart
Journal of Micromechanics and Microengineering, 2014, 24, pp.075021. ⟨10.1088/0960-1317/24/7/075021⟩
Article dans une revue hal-01015146v1

A novel amorphization-etch alternating process for Si(100)

Nasreddine Mekkakia Maaza , Remi Dussart , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
Journal of Micromechanics and Microengineering, 2013, 23, pp.045023. ⟨10.1088/0960-1317/23/4/045023⟩
Article dans une revue hal-00831302v1

Low Damage Cryogenic Etching of Porous Organosilicate Low-k Materials Using SF6/O2/SiF4

Liping Zhang , Rami Ljazouli , Philippe Lefaucheux , Thomas Tillocher , Remi Dussart
ECS Journal of Solid State Science and Technology, 2013, 2 (6), pp.N131. ⟨10.1149/2.001306jss⟩
Article dans une revue hal-00831339v1

Elaboration of high aspect ratio monocrystalline silicon suspended nanobridges by low temperature alkaline treatment of dry etched trenches

Thomas Defforge , Gaël Gautier , Thomas Tillocher , Remi Dussart , François Tran-Van
Journal of Vacuum Science & Technology A, 2012, 30 (1), pp.010601. ⟨10.1116/1.3665217⟩
Article dans une revue hal-00655000v1

Damage Free Cryogenic Etching of a Porous Organosilica Ultralow-k Film

Liping Zhang , Rami Ljazouli , Philippe Lefaucheux , Thomas Tillocher , Remi Dussart
Electrochemical and Solid-State Letters, 2012, 2 (2), pp.N5. ⟨10.1149/2.007302ssl⟩
Article dans une revue hal-00831289v1
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Breakdown study of dc silicon micro-discharge devices

Laurent Schwaederlé , Mukesh Kulsreshath , Lawrence J. Overzet , Philippe Lefaucheux , Thomas Tillocher
Journal of Physics D: Applied Physics, 2012, 45, pp.065201. ⟨10.1088/0022-3727/45/6/065201⟩
Article dans une revue hal-00667649v1

Study of dc micro-discharge arrays made in silicon using CMOS compatible technology

Mukesh Kulsreshath , Laurent Schwaederlé , Lawrence J. Overzet , Philippe Lefaucheux , Julien Ladroue
Journal of Physics D: Applied Physics, 2012, 45, pp.285202. ⟨10.1088/0022-3727/45/28/285202⟩
Article dans une revue hal-00713105v1

Scalloping removal on DRIE via using low concentrated alkaline solutions at low temperature

Thomas Defforge , Xi Song , Gaël Gautier , Thomas Tillocher , Remi Dussart
Sensors and Actuators A: Physical , 2011, 170 (1-2), pp.114. ⟨10.1016/j.sna.2011.05.028⟩
Article dans une revue hal-00655001v1

Optimization of submicron deep trench profiles with the STiGer cryoetching process: reduction of defects

Thomas Tillocher , Wassim Kafrouni , Julien Ladroue , Philippe Lefaucheux , Mohamed Boufnichel
Journal of Micromechanics and Microengineering, 2011, 21, pp.085005. ⟨10.1088/0960-1317/21/8/085005⟩
Article dans une revue hal-00655002v1

Boron acceptor concentration in diamond from excitonic recombination intensities

J. Barjon , T. Tillocher , N. Habka , O. Brinza , J. Achard
Physical Review B, 2011, 83 (7), pp.073201. ⟨10.1103/PhysRevB.83.073201⟩
Article dans une revue hal-03575962v1

n-Type CVD diamond: Epitaxy and doping

Marie-Amandine Pinault-Thaury , T. Tillocher , N. Habka , D. Kobor , F. Jomard
Materials Science and Engineering: B, 2011, 176 (17), pp.1401-1408. ⟨10.1016/j.mseb.2011.02.015⟩
Article dans une revue hal-02442430v1

Phosphorus donor incorporation in (100) homoepitaxial diamond: Role of the lateral growth

Marie-Amandine Pinault-Thaury , T. Tillocher , D. Kobor , N. Habka , F. Jomard
Journal of Crystal Growth, 2011, 335 (1), pp.31-36. ⟨10.1016/j.jcrysgro.2011.06.007⟩
Article dans une revue hal-02441128v1

Integrated micro-plasmas in silicon operating in helium

Remi Dussart , Lawrence J. Overzet , Philippe Lefaucheux , Thierry Dufour , Mukesh Kulsreshath
The European Physical Journal D : Atomic, molecular, optical and plasma physics, 2010, 60, pp.601. ⟨10.1140/epjd/e2010-00272-7⟩
Article dans une revue hal-00655009v1
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Integrated micro-plasmas in silicon operating in helium

Remi Dussart , Lawrence J. Overzet , P Lefaucheux , Thierry Dufour , M Kulsreshath
The European Physical Journal D : Atomic, molecular, optical and plasma physics, 2010, 60, pp.601-608. ⟨10.1140/epjd/e2010-00272-7⟩
Article dans une revue hal-01303160v2
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Phosphorus incorporation and activity in (100)-oriented homoepitaxial diamond layers

Georges Frangieh , Marie-Amandine Pinault-Thaury , Julien Barjon , Thomas Tillocher , François Jomard
physica status solidi (a), 2009, Special Issue : Hasselt Diamond Workshop 2009 - SBDD XIV, 206 (9), pp.2000-2003. ⟨10.1002/pssa.200982223⟩
Article dans une revue hal-02442483v1

Two Cryogenic Processes Involving SF6, O2, and SiF4 for Silicon Deep Etching

Thomas Tillocher , Remi Dussart , Lawrence J. Overzet , Xavier Mellhaoui , Philippe Lefaucheux
Journal of The Electrochemical Society, 2008, 155 (3), pp.D187. ⟨10.1149/1.2826280⟩
Article dans une revue hal-00349343v1

SO2 passivating chemistry for silicon cryogenic deep etching

Corinne Y. Duluard , Remi Dussart , Thomas Tillocher , Laurianne E. Pichon , Philippe Lefaucheux
Plasma Sources Science and Technology, 2008, 17, pp.045008. ⟨10.1088/0963-0252/17/4/045008⟩
Article dans une revue hal-00349344v1

The passivation layer formation in the cryo-etching plasma process

Remi Dussart , Xavier Mellhaoui , Thomas Tillocher , Philippe Lefaucheux , Mohamed Boufnichel
Microelectronic Engineering, 2007, 84, pp.1128. ⟨10.1016/j.mee.2007.01.048⟩
Article dans une revue hal-00365894v1

Silicon cryo-etching of deep holes

Thomas Tillocher , Remi Dussart , Xavier Mellhaoui , Philippe Lefaucheux , Mohamed Boufnichel
Microelectronic Engineering, 2007, 84, pp.1120. ⟨10.1016/j.mee.2007.01.148⟩
Article dans une revue hal-00365907v1
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Oxidation threshold in silicon etching at cryogenic temperatures

Thomas Tillocher , Philippe Lefaucheux , Xavier Mellhaoui , Remi Dussart , Pierre Ranson
Journal of Vacuum Science & Technology A, 2006, 24 (4), pp.1073. ⟨10.1116/1.2210946⟩
Article dans une revue hal-00365909v1

SiOxFy passivation layer in silicon cryoetching

Xavier Mellhaoui , Rémi Dussart , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
Journal of Applied Physics, 2005, 98, pp.104901-10
Article dans une revue hal-00098638v1
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Plasma cryogenic etching processes: what are the mechanisms involved at very low temperature ?

Rémi Dussart , Thomas Tillocher , Gaelle Antoun , Jack Nos , Philippe Lefaucheux
14th EU-Japan Joint Symposium on Plasma Processing (JSPP) 2023, Satoshi Hamaguchi, Apr 2023, Okinawa, Japan, Japan
Communication dans un congrès hal-04072312v1

Evaluation of Bosch processing at cryogenic temperatures

Jack Nos , T. Tillocher , Philippe Lefaucheux , Rémi Dussart , Aurélie Girard
Plasma Etch and Strip in Microelectronics, Jun 2023, Grenoble, France
Communication dans un congrès hal-04138955v1
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Passivation mechanisms involved in cryo-etching processes

Rémi Dussart , Thomas Tillocher , Philippe Lefaucheux , Jack Nos , Gaelle Antoun
ISPLASMA 2023 / ICPLANTS 2023, Mar 2023, Gifu, Japan
Communication dans un congrès hal-04038995v1

Cryo-ALE of Si and SiO2 using SF6 Physisorption

Jack Nos , Gaelle Antoun , T. Tillocher , Philippe Lefaucheux , Rémi Dussart
Plasma Cryogenic Etching Processing (PlaCEP), May 2022, Orleans, France
Communication dans un congrès hal-04138936v1

SF6 Physisorption based cryo-ALE of silicon

Jack Nos , Gaelle Antoun , Thomas Tillocher , Philippe Lefaucheux , Aurélie Girard
ALD-ALE, Jun 2022, Ghent, Belgium
Communication dans un congrès hal-04138943v1

SF6 and Ar plasma based atomic layer etching of Gallium Nitride (GaN)

Lamiae Hamraoui , Philippe Lefaucheux , Thomas Tillocher , Mohamed Boufnichel , Rémi Dussart
ALD/ALE 2022, Jun 2022, Ghent, Belgium
Communication dans un congrès hal-04511533v1

Titanium isotropic and anisotropic etching for MEMS applications

Rim Ettouri , Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Jodie Phung
Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2021), Aug 2021, Paris, France
Communication dans un congrès hal-03388707v1

Cryogenic etching applied to next generation interconnects

Rémi Dussart , Thomas Tillocher , Philippe Lefaucheux
2021 Virtual MRS spring meeting, MRS, Apr 2021, Seattle (Virtual meeting), United States
Communication dans un congrès hal-03280129v1

Atomic Layer Etching of Gallium Nitride (GaN) using fluorinated chemistry

Lamiae Hamraoui , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart , Mohamed Boufnichel
42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès hal-03539418v1

Nanoscale cryogenic process for highly selective etch of Si3N4 over Si

Gaelle Antoun , Thomas Tillocher , Philippe Lefaucheux , Aurélie Girard , Christophe Cardinaud
ALD/ALE 2021, Jun 2021, Virtual meeting, United States
Communication dans un congrès hal-03280162v1

SiOxFy layer deposition for cryogenic nanoscale etching

Gaelle Antoun , Thomas Tillocher , Philippe Lefaucheux , Jack Nos , Aurélie Girard
PLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès hal-03539368v1

Plasma cryogenic etching : benefits of cooling the substrate at a low temperature in etching process technologies

Remi Dussart , Thomas Tillocher , Gaelle Antoun , Jack Nos , Philippe Lefaucheux
42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès hal-03539474v1

Atomic layer etching of Gallium Nitride (GaN) using SF6 and Ar plasmas

Lamiae Hamraoui , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart , Mohamed Boufnichel
PLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès hal-03539383v1

Aspect-Ratio-Dependent Etch effects in Titanium Deep Reactive Ion Etching

Rim Ettouri , Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Jodie Phung
PLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès hal-03389062v1

Anisotropic Reactive Ion Etching of Titanium Using SF6/O2/Ar plasma

Rim Ettouri , Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Hadrien Philippe
47th International Conference on Micro and Nano Engineering (MNE), Sep 2021, Turin, Italy
Communication dans un congrès hal-03389072v1

Atomic layer etching of Gallium nitride (GaN) using SF6/Ar plasmas

Lamiae Hamraoui , Gaëlle Antoun , Thomas Tillocher , Philippe Lefaucheux , Rémi Dussart
ALD/ALE 2021, Jun 2021, Virtual meeting, United States
Communication dans un congrès hal-03280147v1

Atomic Layer Etching at low substrate temperature

Gaëlle Antoun , Philippe Lefaucheux , Thomas Tillocher , Remi Dussart , Kumiko Yamazaki
19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, United States
Communication dans un congrès hal-02311308v1

Atomic Layer Etching at cryogenic temperature

Gaëlle Antoun , Gaelle Antoun , Philippe Lefaucheux , Thomas Tillocher , Remi Dussart
Plasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Communication dans un congrès hal-02311323v1

Cryogenic process for Atomic Layer Etching

Gaëlle Antoun , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart , Kumiko Yamazaki
Plasma Etch and Strip in Microtechnology, May 2019, Grenoble, France
Communication dans un congrès hal-02311291v1

Plasma processes applied to SiO2 cryo-atomic layer etching

Gaëlle Antoun , Remi Dussart , Philippe Lefaucheux , Thomas Tillocher , Tahara Shigeru
XXXIV International Conference on Phenomena in Ionized Gases - 10th International Conference on Reactive Plasmas, Jul 2019, Sapporo, Japan
Communication dans un congrès hal-02311288v1

Cryo-etching mechanism characterization by in-situ spectroscopic ellipsometry

Remi Dussart , Gaëlle Antoun , Thomas Tillocher , Philippe Lefaucheux
Surface Fest 2018, Jun 2018, Bordeaux, France
Communication dans un congrès hal-02311254v1

Titanium-based MEMS: Application for a novel implantable feedthrough using TTV (Through Titanium Vias) technologies

Bertrand Boutaud , Edouard Laudrel , Marion Woytasik , Elie Lefeuvre , Thomas Tillocher
6th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD 2018), May 2018, Grenoble, France
Communication dans un congrès hal-02306370v1

Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage

Romain Chanson , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart , Liping Zhang
40th International Symposium on Dry Process, Nov 2018, Nagoya, France
Communication dans un congrès hal-02311275v1

Bulk micromachined Titanium MEMS

Gwenaël Bécan , Baptiste Rousset , Samson Edmond , Nathalie Isac , Maïté Do Vale
16th NAMIS Workshop (NAMIS 2018), Jun 2018, Oulu, Finland
Communication dans un congrès hal-02306373v1

Cryogenic processes for silicon deep etching, low-K materials and atomic layer etching

Rémi Dussart , Thomas Tillocher , Philippe Lefaucheux , Koichi Yatsuda , Kaoru Maekawa
International Symposium on Advanced Plasma Science, Mar 2018, Nagoya, Japan
Communication dans un congrès hal-01735471v1

The role of SiF4 physisorption in the cryogenic etching process of silicon

Gaëlle Antoun , Philippe Lefaucheux , Thomas Tillocher , Remi Dussart , Tahara Shigeru
40th International Symposium on Dry Process, Nov 2018, Nagoya, Japan
Communication dans un congrès hal-02311267v1

Cryogenic etching applied to the realization of high density capacitor with a homopolymer mask

Mukesh Kulsreshath , Christophe Sinturel , Philippe Lefaucheux , Marylène Vayer , Thomas Tillocher
21th International Colloquium on Plasma Processes, Jun 2017, Nice, France
Communication dans un congrès hal-01577611v1

CRYOGENIC ETCHING APPLIED TO THE REALIZATION OF HIGH DENSITY CAPACITOR WITH A HOMOPOLYMER MASK

Mukesh Kulsreshath , Christophe Sinturel , Philippe Lefaucheux , Marylène Vayer , Thomas Tillocher
International Conference on Plasma Processes 2017 (CIP2017), Jun 2017, Nice, France
Communication dans un congrès hal-01561252v1

Microstructuration of titanium for implantable components

Edouard Laudrel , Thomas Tillocher , Philippe Lefaucheux , Marion Woytasik , Fabrice Michel
Journées Nationales sur les Technologies Emergentes en micro-nanofabrication, Nov 2017, Orléans, France
Communication dans un congrès hal-02306063v1

Cryoetching mechanisms and STiGer process evaluation

Rémi Dussart , Thomas Tillocher , Philippe Lefaucheux
38th dry process symposium, Nov 2016, Sapporo, Japan
Communication dans un congrès hal-01577607v1

Effects of gas and surface temperatures during cryogenic etching of silicon with SF6/O2

Stefan Tinck , Erik Neyts , Thomas Tillocher , Remi Dussart , Annemie Bogaerts
69th Gaseous Electronic Conference, Oct 2016, Bochum, France
Communication dans un congrès hal-01379701v1

Cryoetching mechanisms and STiGer process evaluation

Remi Dussart , Philippe Lefaucheux , Thomas Tillocher
International Symposium on Dry Process 2016 (DPS 2016), Nov 2016, Sapporo, Japan
Communication dans un congrès hal-01561210v1

Cryogenic processes for advanced material plasma etching

Remi Dussart , Thomas Tillocher , Philippe Lefaucheux
Quo vadis : Complex plasmas - TR 24, Aug 2016, Hambourg, Germany
Communication dans un congrès hal-01374747v1

Low-Damage etching of highly porous OSG low-k dielectrics

Jean-Francois de Marneffe , Liping Zhang , Mikhail Baklanov , Koichi Yatsuda , Kaoru Maekawa
SPIE Advanced Lithography 2016, Feb 2016, San José, United States
Communication dans un congrès hal-01280267v1

Numerical and experimental investigation of cryogenic etching of silicon and porous low-dielectric

Stefan Tinck , Thomas Tillocher , Remi Dussart , Erik Neyts , Annemie Bogaerts
International Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Communication dans un congrès hal-01561212v1

Cryogenic Etching of Silicon with SF6/O2/SiF4 plasmas: a modeling and experimental study

Stefan Tinck , Erik Neyts , Thomas Tillocher , Remi Dussart , Annemie Bogaerts
Plasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès hal-01151530v1

Reduction of plasma induced damage in cryogenic etching of low-k materials

Thomas Tillocher , Floriane Leroy , Liping Zhang , Philippe Lefaucheux , Christian Dussarat
4th French Symposium on Emerging Technologies for micro-nanofabrication, Nov 2015, Ecully, France
Communication dans un congrès hal-01277115v1

Limitation of surface defects in deep GaN etching

Nicolas Gosset , Thomas Tillocher , Floriane Leroy , Julien Ladroue , Philippe Lefaucheux
AVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès hal-01228462v1

Low damage cryoetching of low-K materials

Remi Dussart , Thomas Tillocher , Floriane Leroy , Philippe Lefaucheux , Koichi Yatsuda
SPIE Advanced Lithography 2015, Feb 2015, San José, United States
Communication dans un congrès hal-01151543v1

A novel low temperature etch approach to reduce ULK plasma damage

Liping Zhang , Jean-Francois de Marneffe , Floriane Leroy , Rami Ljazouli , Philippe Lefaucheux
Plasma Etch and Strip in Microtecnology, Apr 2015, Leuven, Belgium
Communication dans un congrès hal-01151524v1
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Cryoetching processes applied to ULK material

Floriane Leroy , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart , Christian Dussarat
37th International Symposium on Dry process , Nov 2015, Awaji, Japan
Communication dans un congrès hal-01287233v1

Cryoetching processes applied to ULK material

Floriane Leroy , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart , Koichi Yatsuda
37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès hal-01228477v1

Submicronic etched features of silicon with high aspect ratio obtained by cryogenic plasma deep-etching through perforated polymer thin films

Alexane Vital , Mohamed Boufnichel , Remi Dussart , Nicolas Gosset , Philippe Lefaucheux
2015 MRS Spring Meeting & Exhibit, Apr 2015, San francisco, United States
Communication dans un congrès hal-01151542v1

DRY DEEP ETCHING OF BULK TITANIUM BY PLASMA PROCESSES

Edouard Laudrel , Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Remi Dussart
AVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès hal-01228465v1

Cryogenic etching of porous organosilicate low-k materials: Reduction of plasma induced damage

Floriane Leroy , Thomas Tillocher , Liping Zhang , Philippe Lefaucheux , Koichi Yatsuda
AVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès hal-01228458v1

Bulk titanium deep etching by plasma processes

Edouard Laudrel , Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Remi Dussart
, 20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France
Communication dans un congrès hal-01166023v1

Cryogenic etching of silicon with SF6/O2/SiF4 plasmas: a modelling and experimental study

Stefan Tinck , E.C. Neyts , Thomas Tillocher , Remi Dussart , Annemie Bogaerts
22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès hal-01228451v1

Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process

Thomas Tillocher , Floriane Leroy , Liping Zhang , Philippe Lefaucheux , Koichi Yatsuda
22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès hal-01228448v1

Surface state improvement in GaN deep etching for power electronics applications

Nicolas Gosset , Floriane Leroy , Thomas Tillocher , Julien Ladroue , Philippe Lefaucheux
37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès hal-01228470v1

Plasma Cryogenic Etching: from 3D Integration to Low-k Materials

Thomas Tillocher , Remi Dussart , Floriane Leroy , Philippe Lefaucheux , Mohamed Boufnichel
China Semiconductor Technology International Conference, Mar 2015, Shanghai, China
Communication dans un congrès hal-01151533v1

Cryogenic Etching of Porous Organosilicate Low-k Materials: Fluorine based plasma analysis

Floriane Leroy , Thomas Tillocher , Liping Zhang , A. Girard , Christophe Cardinaud
Plasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès hal-01151528v1

Cryoetching of Silicon and Advanced Materials for 3D Interconnects

Remi Dussart , Thomas Tillocher , Nicolas Gosset , Philippe Lefaucheux , Mohamed Boufnichel
226th meeting of the Electroschemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès hal-01151844v1

Cryogenic etching of submicronic features in silicon using masks based on porous polymer films

Thomas Tillocher , Alexane Vital , Marylène Vayer , Nicolas Gosset , Philippe Lefaucheux
226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès hal-01151839v1

Improvement of GaN Deep Etched Surface State by Fluorination Dedicated to Power Devices

Nicolas Gosset , Julien Ladroue , Thomas Tillocher , Philippe Lefaucheux , Mohamed Boufnichel
226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès hal-01151851v1

Multiscale etching of holes by cryogenic silicon etching

Thomas Tillocher , Xiao Liu , Alexane Vital , Nicolas Gosset , Philippe Lefaucheux
Plasma Etch and Strip in Microtechnology, May 2014, Gernoble, France
Communication dans un congrès hal-01057242v1

Plasma cryoetching processes for silicon and advanced materials

Remi Dussart , Thomas Tillocher , Nicolas Gosset , Alexane Vital , Philippe Lefaucheux
International Conference on Microelectronics and Plasma Technology, Jul 2014, Gunsan, South Korea
Communication dans un congrès hal-01057585v1

Submicrometric structured silicon surfaces obtained from polymer blend film by silica replication and cryogenic plasma etching

Alexane Vital , Thomas Tillocher , Remi Dussart , Marylène Vayer , Christophe Sinturel
Plasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès hal-01057586v1

Effect of surface fluorination on GaN deep dry etching defects

Nicolas Gosset , Julien Ladroue , Thomas Tillocher , Philippe Lefaucheux , Mohamed Boufnichel
Plasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès hal-01057239v1

Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturing

Remi Dussart , Philippe Lefaucheux , Thomas Tillocher , Pierre Ranson , Mohamed Boufnichel
Plasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès hal-00831344v1

Deep etching of gallium nitride by chlorine based plasma

Remi Dussart , Julien Ladroue , Thomas Tillocher , Mohamed Boufnichel , Nicolas Gosset
Journées Nationales des Technologies Emergentes, May 2013, Evian, France
Communication dans un congrès hal-00831346v1

Reproducible process for titanium deep etching

Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Remi Dussart
19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès hal-01057233v1

Reproducible process for Titanium deep etching

Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Remi Dussart
Plasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès hal-00831358v1

Deep etching processes for silicon micro- and nano-machining

Thomas Tillocher , Philippe Lefaucheux , Remi Dussart
Le Studium workshop : Bottom-up approaches to nanotechnology, May 2013, Orléans, France
Communication dans un congrès hal-00831360v1

Integrated microplasmas on silicon: performances and limitations

Remi Dussart , Mukesh Kulsreshath , Valentin Félix , Lawrence J. Overzet , Judith Golda
19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès hal-01056618v1

Plasma deep etching of silicon, titanium and gallium nitride for microtechnology

Remi Dussart , Philippe Lefaucheux , Thomas Tillocher , Nicolas Gosset , Julien Ladroue
AVS 60th International Symposium & Exhibition, Oct 2013, United States
Communication dans un congrès hal-01006364v1

Titanium deep etching for medical applications

Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Remi Dussart
AVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès hal-01057236v1

Plasma surface interactions in deep dry etching

Thomas Tillocher , Julien Ladroue , Philippe Lefaucheux , Mohamed Boufnichel , Remi Dussart
Workshop on particle - surface interactions : from surface analysis to materials processing, Jun 2013, Luxembourg, Luxembourg
Communication dans un congrès hal-00831337v1

Dry deep etching of GaN wide band-gap Semiconductor

Nicolas Gosset , Julien Ladroue , Thomas Tillocher , Philippe Lefaucheux , Mohamed Boufnichel
AVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès hal-01057235v1

Dry deep etching of GaN wide-bandgap semiconductor

Nicolas Gosset , Julien Ladroue , Thomas Tillocher , Philippe Lefaucheux , Mohamed Boufnichel
19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès hal-01056606v1

Optimization of STiGer process used to etch high aspect ratio silicon microstructures

Thomas Tillocher , Philippe Lefaucheux , Julien Ladroue , Mohamed Boufnichel , Pierre Ranson
AVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès hal-00747743v1

Deep GaN Etching : Role of SiCl4 in Plasma Chemistry

Julien Ladroue , Mohamed Boufnichel , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
AVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès hal-00747746v1

Development and limitations of microplasma arrays on silicon operating in DC

Remi Dussart , Mukesh Kulsreshath , Laurent Schwaederlé , Valentin Felix , Philippe Lefaucheux
AVS 59th International Symposium and Exhibition, Oct 2012, United States
Communication dans un congrès hal-00747741v1

Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect application

Liping Zhang , Rami Ljazouli , Philippe Lefaucheux , Thomas Tillocher , Remi Dussart
AVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès hal-00747749v1

Investigations in SF6 and Cl2/Ar plasmas used for titanium deep etching by means of mass spectrometry

Thomas Tillocher , Judith Golda , Philippe Lefaucheux , Bertrand Boutaud , Pierre Ranson
ESCAMPIG 2012, Jul 2012, Viana do Castelo, Portugal
Communication dans un congrès hal-00831352v1

Development of microdicharges in silicon operating in DC for medical applications

Mukesh Kulsreshath , Laurent Schwaederlé , Lawrence J. Overzet , Thomas Tillocher , Sébastien Dozias
4th International Conference on Plasma Medecine, Jun 2012, Orléans, France
Communication dans un congrès hal-00831349v1

Development and characterization of microplasma arrays on Silicon

Remi Dussart , Thierry Dufour , Mukesh Kulsreshath , Valentin Felix , Laurent Schwaederlé
International Workshop on Physics of Microplasmas, May 2012, Bochum, Germany
Communication dans un congrès hal-00707932v1

Integrated microplasmas on silicon: a new tool for lab-on-a-chip applications

Remi Dussart , Mukesh Kulsreshath , Valentin Felix , Lawrence J. Overzet , Thomas Tillocher
Cancer Cells On Chip, Jun 2012, Lyon, France
Communication dans un congrès hal-00707933v1

Formation of black silicon by cryogenic plasma etching processes

Thomas Tillocher , Jérémy Pereira , Nasreddine Mekkakia Maaza , Philippe Lefaucheux , Pierre Ranson
Micro- and Nano-Engineering (MNE), Sep 2012, Toulouse, France
Communication dans un congrès hal-00831357v1

Caractérisation de matrices de micro plasmas sur silicium

Mukesh Kulsreshath , Laurent Schwaederlé , Valentin Felix , Philippe Lefaucheux , Thomas Tillocher
XIIeme congrès de la division Plasmas de la Société Française de Physique, May 2012, Orléans, France
Communication dans un congrès hal-00707935v1

Development of microdicharge arrays in silicon operating in DC and AC

Mukesh Kulsreshath , Laurent Schwaederlé , Lawrence J. Overzet , Thomas Tillocher , Sébastien Dozias
European Physical Society/International Conference on Plasma Physics, Jul 2012, Stockholm, Sweden
Communication dans un congrès hal-00831351v1

Deep GaN Etching by Inductively Coupled Plasma

Julien Ladroue , Mohamed Boufnichel , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
HeteroSiC-WASMPE 2011, Jun 2011, Tours, France
Communication dans un congrès hal-00696418v1

Obtaining a smooth surface after deep GaN etching

Julien Ladroue , Mohamed Boufnichel , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès hal-00696419v1

Deep Gallium Nitride Etching: ways to avoid etching defects

Julien Ladroue , Mohamed Boufnichel , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
3rd International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, Mar 2011, Nagoya, Japan
Communication dans un congrès hal-00696396v1

Characterisation of Silicon based micro discharge plasma arrays in Direct Current (DC) at atmospheric pressure

Mukesh Kulsreshath , Laurent Schwaederlé , Philippe Lefaucheux , Thomas Tillocher , Julien Ladroue
6th International Workshop on Microplasmas, Apr 2011, Paris, France
Communication dans un congrès hal-00707925v1

STiGer process for silicon deep etching: extended scalloping reduction on submicron trenches

Wassim Kafrouni , Thomas Tillocher , Julien Ladroue , Philippe Lefaucheux , Mohamed Boufnichel
18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès hal-00696422v1

Deep etching of bulk titanium by plasma

Thomas Tillocher , Julien Ladroue , Wassim Kafrouni , Mukesh Kulsreshath , Philippe Lefaucheux
18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès hal-00696425v1

Deep silicon etching of 0.8 µm to hundreds of microns wide trenches with the STiGer process

Thomas Tillocher , Wassim Kafrouni , Julien Ladroue , Philippe Lefaucheux , Pierre Ranson
AVS 58th International Symposium & Exhibition, Oct 2011, Nashville, United States
Communication dans un congrès hal-00696428v1

Study of an MHCD operating in He using optical and electrical diagnostics

Remi Dussart , Thierry Dufour , Thomas Tillocher , Mukesh Kulsreshath , Olivier Aubry
Diagnostics Microplasmas, Mar 2010, Germany
Communication dans un congrès hal-00487365v1

Gravure du GaN pour la prochaine génération de diodes Schottky

Julien Ladroue , Remi Dussart , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
Workshop MNTS 12-20, Minatec, Mar 2010, Grenoble, France
Communication dans un congrès hal-00487358v1

Ignition and extinction of a Micro Hollow Cathode Discharge operating in DC regime

Remi Dussart , Mukesh Kulsreshath , Thierry Dufour , Lawrence J. Overzet , Philippe Lefaucheux
AVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès hal-00696390v1

Deep Gallium Nitride Etching

Julien Ladroue , Mohamed Boufnichel , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès hal-00696376v1

Optimization of STiGer process for silicon deep etching

Thomas Tillocher , Wassim Kafrouni , Vincent Girault , Julien Ladroue , Philippe Lefaucheux
63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès hal-00696366v1

Deep Inductively Coupled Plasma Etching of GaN

Julien Ladroue , Mohamed Boufnichel , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
AVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès hal-00696393v1

Micro Hollow Cathode Discharge Arrays in silicon devices

Remi Dussart , Mukesh Kulsreshath , Lawrence J. Overzet , Laurent Schwaederlé , Thomas Tillocher
63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès hal-00681902v1

Deep GaN Etching by Inductively Coupled Plasma

Julien Ladroue , Mohamed Boufnichel , Thomas Tillocher , Philippe Lefaucheux , Pierre Ranson
3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès hal-00487363v1

Silicon deep cryoetching with the STiGer process

Thomas Tillocher , Vincent L. Girault , Guillaume Gomme , Franck Moro , Laurianne E. Pichon
3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès hal-00487360v1

A comparative study on O2 and SO2 passivating chemistry for silicon deep cryogenic etching

Corinne Y. Duluard , Thomas Tillocher , Laurianne E. Pichon , Remi Dussart , Philippe Lefaucheux
AVS 53rd International Symposium & Exhibition, Nov 2009, San Francisco, United States
Communication dans un congrès hal-00442683v1

Cryoetching of silicon for MEMS and microelectronic components

Remi Dussart , Philippe Lefaucheux , Pierre Ranson , Laurianne E. Pichon , Corinne Y. Duluard
16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès hal-00442662v1

SiOxFy film growth in SiF4/O2 plasma at cryogenic temperature

Laurianne E. Pichon , Corinne Y. Duluard , Thomas Tillocher , Remi Dussart , Philippe Lefaucheux
18th International Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.30P-105
Communication dans un congrès hal-00444241v1

Enhanced robustness of the cryogenic process for silicon deep etching

Remi Dussart , Thomas Tillocher , El-Houcine Oubensaid , Philippe Lefaucheux , Pierre Ranson
Micro- and Nano-Engineering, Sep 2007, Copenhague, Denmark
Communication dans un congrès hal-00444248v1

A new generation of cryogenic processes for silicon deep etching

Remi Dussart , Philippe Lefaucheux , Pierre Ranson , Laurianne E. Pichon , Corinne Y. Duluard
60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès hal-00442668v1

SiOxFy passivation layer characterization in the silicon cryoetching

Xavier Mellhaoui , Remi Dussart , Thomas Tillocher , Philippe Lefaucheux , Lawrence J. Overzet
Eighth International Conference on Advanced Surface Engineering (8th ICASE), Apr 2006, Japan
Communication dans un congrès hal-00442663v1

Mechanisms and optimization in the cryogenic etching plasma process

Thomas Tillocher , Remi Dussart
Workshop on Silicon dry processing, Sep 2006, Aix-La-Chapelle, Germany
Communication dans un congrès hal-00442676v1

Cryo-ALE of Si based on SF6 Physisorption

Jack Nos , Gaelle Antoun , Thomas Tillocher , Philippe Lefaucheux , Rémi Dussart
Journées Jeunes Chercheurs, Mar 2021, Orleans, France, France
Poster de conférence hal-04138885v1

Cryo-ALE of Si based on SF6 physisorption

Jack Nos , Thomas Tillocher , Philippe Lefaucheux , Jacques Faguet , Kaoru Maekawa
PLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Poster de conférence hal-03539330v1
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Cryo-ALE of Silicon based on SF6 physisorption

Jack Nos , Gaelle Antoun , Thomas Tillocher , Philippe Lefaucheux , Jacques Faguet
PLATHINIUM 2021, Sep 2021, Visioconférence, France
Poster de conférence hal-04138918v1

Bulk Titanium Micromachining using Deep Reactive Ion Etching

Rim Ettouri , Thomas Tillocher , Philippe Lefaucheux , Bertrand Boutaud , Rémi Dussart
15e Journées du Réseau des Plasmas Froids, Sep 2020, Saint-Dié-des-Vosges, France
Poster de conférence hal-03388672v1

The role of SiF4 physisorption in silicon cryoetching

Gaëlle Antoun , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart , Christophe Cardinaud
Plasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Poster de conférence hal-02311339v1

Analysis of mechanisms involved in cryogenic ALE

Gaëlle Antoun , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart , Kumiko Yamazaki
19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, France
Poster de conférence hal-02311314v1

INTRODUCTION AU PROCÉDÉ DE GRAVURE CRYOGÉNIQUE DU SILICIUM

Gaëlle Antoun , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart
15e Congrès de la Société Française de Physique Division Plasmas, Jun 2018, Bordeaux, France
Poster de conférence hal-02311219v1

Cryogenic Atomic Layer Etching of SiO2

Nicolas Holtzer , Thomas Tillocher , Philippe Lefaucheux , Rémi Dussart
17th International Conference on Atomic Layer Deposition, Jul 2017, Denver, United States
Poster de conférence hal-01577612v1

Titanium microstructuring for implantable components

Edouard Laudrel , Thomas Tillocher , Yannick Méric , Philippe Lefaucheux , Marion Woytasik
Design, Test, Integration and Packaging of MEMS/MOEMS, May 2017, Bordeaux, France
Poster de conférence hal-01561245v1

Cryogenic ALE of silicon oxide

Nicolas Holtzer , Thomas Tillocher , Philippe Lefaucheux , Remi Dussart
Plasma Etch and Strip in Microtechnology, Oct 2017, Leuven, Belgium
Poster de conférence hal-02306057v1

Silicon micromachining at cryogenic temperature

Thomas Tillocher , Philippe Lefaucheux , Mohamed Boufnichel , Remi Dussart
Design, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), May 2017, Bordeaux, France
Poster de conférence hal-01561233v1

Chlorine-based plasma deep etching of bulk titanium

Edouard Laudrel , Thomas Tillocher , Yannick Méric , Philippe Lefaucheux , Bertrand Boutaud
International Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence hal-01561222v1

Enhanced reproducibility of SiO2 atomic layer etching by addition of O2 steps

Thomas Tillocher , Remi Dussart , Nicolas Holtzer , Philippe Lefaucheux
International Symposium of Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence hal-01561230v1

Cryogenic etching of silicon with SF6/O2: a computational and experimental study

Stefan Tinck , Erik Neyts , Thomas Tillocher , Remi Dussart , Annemie Bogaerts
Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence hal-01344725v1

Advance in low-k cryogenic etching of porous organoscilicate : Investigation of a new gas with higher boiling point Organic (HBPO) and comparison with C4F8

Floriane Leroy , Nataniel Brochu , Romain Chanson , Remi Dussart , Thomas Tillocher
Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence hal-01344722v1

Deep silicon etching: STiGer vs. BOSCH

Chengkun Tu , Ying Cui , Remi Dussart , Thomas Tillocher , Philippe Lefaucheux
Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence hal-01344704v1

Near Atmospheric Pressure Etching of Silicon by Microplasma

Valentin Felix , Vincent Ah-Leung , Judith Golda , Philippe Lefaucheux , Olivier Aubry
International workshop on microplasmas, May 2015, Newark, France
Poster de conférence hal-01166020v1