Thomas Tillocher
164
Documents
Publications
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Plasma cryogenic etching processes: what are the mechanisms involved at very low temperature ?14th EU-Japan Joint Symposium on Plasma Processing (JSPP) 2023, Satoshi Hamaguchi, Apr 2023, Okinawa, Japan, Japan
Communication dans un congrès
hal-04072312v1
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Evaluation of Bosch processing at cryogenic temperaturesPlasma Etch and Strip in Microelectronics, Jun 2023, Grenoble, France
Communication dans un congrès
hal-04138955v1
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Passivation mechanisms involved in cryo-etching processesISPLASMA 2023 / ICPLANTS 2023, Mar 2023, Gifu, Japan
Communication dans un congrès
hal-04038995v1
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Cryo-ALE of Si and SiO2 using SF6 PhysisorptionPlasma Cryogenic Etching Processing (PlaCEP), May 2022, Orleans, France
Communication dans un congrès
hal-04138936v1
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SF6 Physisorption based cryo-ALE of siliconALD-ALE, Jun 2022, Ghent, Belgium
Communication dans un congrès
hal-04138943v1
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SF6 and Ar plasma based atomic layer etching of Gallium Nitride (GaN)ALD/ALE 2022, Jun 2022, Ghent, Belgium
Communication dans un congrès
hal-04511533v1
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Titanium isotropic and anisotropic etching for MEMS applicationsDesign, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2021), Aug 2021, Paris, France
Communication dans un congrès
hal-03388707v1
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Cryogenic etching applied to next generation interconnects2021 Virtual MRS spring meeting, MRS, Apr 2021, Seattle (Virtual meeting), United States
Communication dans un congrès
hal-03280129v1
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Atomic Layer Etching of Gallium Nitride (GaN) using fluorinated chemistry42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès
hal-03539418v1
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Nanoscale cryogenic process for highly selective etch of Si3N4 over SiALD/ALE 2021, Jun 2021, Virtual meeting, United States
Communication dans un congrès
hal-03280162v1
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SiOxFy layer deposition for cryogenic nanoscale etchingPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03539368v1
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Plasma cryogenic etching : benefits of cooling the substrate at a low temperature in etching process technologies42nd International Symposium on Dry Process, Nov 2021, Online, Japan
Communication dans un congrès
hal-03539474v1
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Atomic layer etching of Gallium Nitride (GaN) using SF6 and Ar plasmasPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03539383v1
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Aspect-Ratio-Dependent Etch effects in Titanium Deep Reactive Ion EtchingPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Communication dans un congrès
hal-03389062v1
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Anisotropic Reactive Ion Etching of Titanium Using SF6/O2/Ar plasma47th International Conference on Micro and Nano Engineering (MNE), Sep 2021, Turin, Italy
Communication dans un congrès
hal-03389072v1
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Atomic layer etching of Gallium nitride (GaN) using SF6/Ar plasmasALD/ALE 2021, Jun 2021, Virtual meeting, United States
Communication dans un congrès
hal-03280147v1
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Atomic Layer Etching at low substrate temperature19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, United States
Communication dans un congrès
hal-02311308v1
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Atomic Layer Etching at cryogenic temperaturePlasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Communication dans un congrès
hal-02311323v1
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Cryogenic process for Atomic Layer EtchingPlasma Etch and Strip in Microtechnology, May 2019, Grenoble, France
Communication dans un congrès
hal-02311291v1
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Plasma processes applied to SiO2 cryo-atomic layer etchingXXXIV International Conference on Phenomena in Ionized Gases - 10th International Conference on Reactive Plasmas, Jul 2019, Sapporo, Japan
Communication dans un congrès
hal-02311288v1
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Cryo-etching mechanism characterization by in-situ spectroscopic ellipsometrySurface Fest 2018, Jun 2018, Bordeaux, France
Communication dans un congrès
hal-02311254v1
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Titanium-based MEMS: Application for a novel implantable feedthrough using TTV (Through Titanium Vias) technologies6th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD 2018), May 2018, Grenoble, France
Communication dans un congrès
hal-02306370v1
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Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage40th International Symposium on Dry Process, Nov 2018, Nagoya, France
Communication dans un congrès
hal-02311275v1
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Bulk micromachined Titanium MEMS16th NAMIS Workshop (NAMIS 2018), Jun 2018, Oulu, Finland
Communication dans un congrès
hal-02306373v1
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Cryogenic processes for silicon deep etching, low-K materials and atomic layer etchingInternational Symposium on Advanced Plasma Science, Mar 2018, Nagoya, Japan
Communication dans un congrès
hal-01735471v1
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The role of SiF4 physisorption in the cryogenic etching process of silicon40th International Symposium on Dry Process, Nov 2018, Nagoya, Japan
Communication dans un congrès
hal-02311267v1
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Cryogenic etching applied to the realization of high density capacitor with a homopolymer mask21th International Colloquium on Plasma Processes, Jun 2017, Nice, France
Communication dans un congrès
hal-01577611v1
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CRYOGENIC ETCHING APPLIED TO THE REALIZATION OF HIGH DENSITY CAPACITOR WITH A HOMOPOLYMER MASKInternational Conference on Plasma Processes 2017 (CIP2017), Jun 2017, Nice, France
Communication dans un congrès
hal-01561252v1
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Microstructuration of titanium for implantable componentsJournées Nationales sur les Technologies Emergentes en micro-nanofabrication, Nov 2017, Orléans, France
Communication dans un congrès
hal-02306063v1
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Cryoetching mechanisms and STiGer process evaluation38th dry process symposium, Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01577607v1
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Effects of gas and surface temperatures during cryogenic etching of silicon with SF6/O269th Gaseous Electronic Conference, Oct 2016, Bochum, France
Communication dans un congrès
hal-01379701v1
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Cryoetching mechanisms and STiGer process evaluationInternational Symposium on Dry Process 2016 (DPS 2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561210v1
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Cryogenic processes for advanced material plasma etchingQuo vadis : Complex plasmas - TR 24, Aug 2016, Hambourg, Germany
Communication dans un congrès
hal-01374747v1
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Low-Damage etching of highly porous OSG low-k dielectricsSPIE Advanced Lithography 2016, Feb 2016, San José, United States
Communication dans un congrès
hal-01280267v1
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Numerical and experimental investigation of cryogenic etching of silicon and porous low-dielectricInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Communication dans un congrès
hal-01561212v1
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Cryogenic Etching of Silicon with SF6/O2/SiF4 plasmas: a modeling and experimental studyPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151530v1
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Reduction of plasma induced damage in cryogenic etching of low-k materials4th French Symposium on Emerging Technologies for micro-nanofabrication, Nov 2015, Ecully, France
Communication dans un congrès
hal-01277115v1
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Limitation of surface defects in deep GaN etchingAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228462v1
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Low damage cryoetching of low-K materialsSPIE Advanced Lithography 2015, Feb 2015, San José, United States
Communication dans un congrès
hal-01151543v1
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A novel low temperature etch approach to reduce ULK plasma damagePlasma Etch and Strip in Microtecnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151524v1
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Cryoetching processes applied to ULK material37th International Symposium on Dry process , Nov 2015, Awaji, Japan
Communication dans un congrès
hal-01287233v1
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Cryoetching processes applied to ULK material37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès
hal-01228477v1
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Submicronic etched features of silicon with high aspect ratio obtained by cryogenic plasma deep-etching through perforated polymer thin films2015 MRS Spring Meeting & Exhibit, Apr 2015, San francisco, United States
Communication dans un congrès
hal-01151542v1
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DRY DEEP ETCHING OF BULK TITANIUM BY PLASMA PROCESSESAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228465v1
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Cryogenic etching of porous organosilicate low-k materials: Reduction of plasma induced damageAVS 62nd International Symposium & Exhibition, Oct 2015, San Jose, United States
Communication dans un congrès
hal-01228458v1
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Bulk titanium deep etching by plasma processes, 20th International Colloquium on Plasma Processes (CIP), Jun 2015, Saint-Etienne, France
Communication dans un congrès
hal-01166023v1
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Cryogenic etching of silicon with SF6/O2/SiF4 plasmas: a modelling and experimental study22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228451v1
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Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process22nd International Symposium on Plasma Chemistry (ISPC 2015), Jul 2015, Antwerp, Belgium
Communication dans un congrès
hal-01228448v1
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Surface state improvement in GaN deep etching for power electronics applications37th International Symposium on Dry Process (DPS 2015), Nov 2015, Awaji Island, Japan
Communication dans un congrès
hal-01228470v1
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Plasma Cryogenic Etching: from 3D Integration to Low-k MaterialsChina Semiconductor Technology International Conference, Mar 2015, Shanghai, China
Communication dans un congrès
hal-01151533v1
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Cryogenic Etching of Porous Organosilicate Low-k Materials: Fluorine based plasma analysisPlasma Etch and Strip in Microtechnology, Apr 2015, Leuven, Belgium
Communication dans un congrès
hal-01151528v1
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Cryoetching of Silicon and Advanced Materials for 3D Interconnects226th meeting of the Electroschemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151844v1
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Cryogenic etching of submicronic features in silicon using masks based on porous polymer films226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151839v1
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Improvement of GaN Deep Etched Surface State by Fluorination Dedicated to Power Devices226th meeting of the Electrochemical Society, Oct 2014, Cancun, Mexico
Communication dans un congrès
hal-01151851v1
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Multiscale etching of holes by cryogenic silicon etchingPlasma Etch and Strip in Microtechnology, May 2014, Gernoble, France
Communication dans un congrès
hal-01057242v1
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Plasma cryoetching processes for silicon and advanced materialsInternational Conference on Microelectronics and Plasma Technology, Jul 2014, Gunsan, South Korea
Communication dans un congrès
hal-01057585v1
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Submicrometric structured silicon surfaces obtained from polymer blend film by silica replication and cryogenic plasma etchingPlasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès
hal-01057586v1
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Effect of surface fluorination on GaN deep dry etching defectsPlasma Etch and Strip in Microtechnology, May 2014, Grenoble, France
Communication dans un congrès
hal-01057239v1
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Applications of cryogenic plasma etching for microtechnology and advanced CMOS manufacturingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831344v1
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Deep etching of gallium nitride by chlorine based plasmaJournées Nationales des Technologies Emergentes, May 2013, Evian, France
Communication dans un congrès
hal-00831346v1
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Reproducible process for titanium deep etching19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01057233v1
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Reproducible process for Titanium deep etchingPlasma Etch and Strip in Microtechnology, Mar 2013, Louvain, Belgium
Communication dans un congrès
hal-00831358v1
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Deep etching processes for silicon micro- and nano-machiningLe Studium workshop : Bottom-up approaches to nanotechnology, May 2013, Orléans, France
Communication dans un congrès
hal-00831360v1
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Integrated microplasmas on silicon: performances and limitations19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056618v1
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Plasma deep etching of silicon, titanium and gallium nitride for microtechnologyAVS 60th International Symposium & Exhibition, Oct 2013, United States
Communication dans un congrès
hal-01006364v1
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Titanium deep etching for medical applicationsAVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-01057236v1
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Plasma surface interactions in deep dry etchingWorkshop on particle - surface interactions : from surface analysis to materials processing, Jun 2013, Luxembourg, Luxembourg
Communication dans un congrès
hal-00831337v1
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Dry deep etching of GaN wide band-gap SemiconductorAVS 60th International Symposium & Exhibition, Oct 2013, Long Beach, United States
Communication dans un congrès
hal-01057235v1
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Dry deep etching of GaN wide-bandgap semiconductor19th International Vacuum Conference, Sep 2013, Paris, France
Communication dans un congrès
hal-01056606v1
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Optimization of STiGer process used to etch high aspect ratio silicon microstructuresAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747743v1
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Deep GaN Etching : Role of SiCl4 in Plasma ChemistryAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747746v1
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Development and limitations of microplasma arrays on silicon operating in DCAVS 59th International Symposium and Exhibition, Oct 2012, United States
Communication dans un congrès
hal-00747741v1
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Damage free cryogenic etching of porous organosilicate low-k films for advanced interconnect applicationAVS 59th International Symposium and Exhibition, Oct 2012, Tampa, United States
Communication dans un congrès
hal-00747749v1
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Investigations in SF6 and Cl2/Ar plasmas used for titanium deep etching by means of mass spectrometryESCAMPIG 2012, Jul 2012, Viana do Castelo, Portugal
Communication dans un congrès
hal-00831352v1
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Development of microdicharges in silicon operating in DC for medical applications4th International Conference on Plasma Medecine, Jun 2012, Orléans, France
Communication dans un congrès
hal-00831349v1
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Development and characterization of microplasma arrays on SiliconInternational Workshop on Physics of Microplasmas, May 2012, Bochum, Germany
Communication dans un congrès
hal-00707932v1
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Integrated microplasmas on silicon: a new tool for lab-on-a-chip applicationsCancer Cells On Chip, Jun 2012, Lyon, France
Communication dans un congrès
hal-00707933v1
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Formation of black silicon by cryogenic plasma etching processesMicro- and Nano-Engineering (MNE), Sep 2012, Toulouse, France
Communication dans un congrès
hal-00831357v1
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Caractérisation de matrices de micro plasmas sur siliciumXIIeme congrès de la division Plasmas de la Société Française de Physique, May 2012, Orléans, France
Communication dans un congrès
hal-00707935v1
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Development of microdicharge arrays in silicon operating in DC and ACEuropean Physical Society/International Conference on Plasma Physics, Jul 2012, Stockholm, Sweden
Communication dans un congrès
hal-00831351v1
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Deep GaN Etching by Inductively Coupled PlasmaHeteroSiC-WASMPE 2011, Jun 2011, Tours, France
Communication dans un congrès
hal-00696418v1
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Obtaining a smooth surface after deep GaN etching18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696419v1
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Deep Gallium Nitride Etching: ways to avoid etching defects3rd International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, Mar 2011, Nagoya, Japan
Communication dans un congrès
hal-00696396v1
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Characterisation of Silicon based micro discharge plasma arrays in Direct Current (DC) at atmospheric pressure6th International Workshop on Microplasmas, Apr 2011, Paris, France
Communication dans un congrès
hal-00707925v1
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STiGer process for silicon deep etching: extended scalloping reduction on submicron trenches18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696422v1
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Deep etching of bulk titanium by plasma18th International Colloquium on Plasma Processes (CIP), Jul 2011, Nantes, France
Communication dans un congrès
hal-00696425v1
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Deep silicon etching of 0.8 µm to hundreds of microns wide trenches with the STiGer processAVS 58th International Symposium & Exhibition, Oct 2011, Nashville, United States
Communication dans un congrès
hal-00696428v1
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Study of an MHCD operating in He using optical and electrical diagnosticsDiagnostics Microplasmas, Mar 2010, Germany
Communication dans un congrès
hal-00487365v1
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Gravure du GaN pour la prochaine génération de diodes SchottkyWorkshop MNTS 12-20, Minatec, Mar 2010, Grenoble, France
Communication dans un congrès
hal-00487358v1
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Ignition and extinction of a Micro Hollow Cathode Discharge operating in DC regimeAVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès
hal-00696390v1
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Deep Gallium Nitride Etching63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00696376v1
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Optimization of STiGer process for silicon deep etching63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00696366v1
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Deep Inductively Coupled Plasma Etching of GaNAVS 57th International Symposium & Exhibition, Nov 2010, Albuquerque, United States
Communication dans un congrès
hal-00696393v1
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Micro Hollow Cathode Discharge Arrays in silicon devices63rd Gaseous Electronics Conference, Oct 2010, Paris, France
Communication dans un congrès
hal-00681902v1
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Deep GaN Etching by Inductively Coupled Plasma3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès
hal-00487363v1
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Silicon deep cryoetching with the STiGer process3RD WORKSHOP ON PLASMA ETCH AND STRIP IN MICROELECTRONICS, Mar 2010, France
Communication dans un congrès
hal-00487360v1
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A comparative study on O2 and SO2 passivating chemistry for silicon deep cryogenic etchingAVS 53rd International Symposium & Exhibition, Nov 2009, San Francisco, United States
Communication dans un congrès
hal-00442683v1
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Cryoetching of silicon for MEMS and microelectronic components16th International Colloquium on Plasma Processes, Jun 2007, France
Communication dans un congrès
hal-00442662v1
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SiOxFy film growth in SiF4/O2 plasma at cryogenic temperature18th International Symposium on Plasma Chemistry, Aug 2007, Kyoto, Japan. pp.30P-105
Communication dans un congrès
hal-00444241v1
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Enhanced robustness of the cryogenic process for silicon deep etchingMicro- and Nano-Engineering, Sep 2007, Copenhague, Denmark
Communication dans un congrès
hal-00444248v1
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A new generation of cryogenic processes for silicon deep etching60th Gaseous Electronics Conference, Oct 2007, Arlington, United States
Communication dans un congrès
hal-00442668v1
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SiOxFy passivation layer characterization in the silicon cryoetchingEighth International Conference on Advanced Surface Engineering (8th ICASE), Apr 2006, Japan
Communication dans un congrès
hal-00442663v1
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Mechanisms and optimization in the cryogenic etching plasma processWorkshop on Silicon dry processing, Sep 2006, Aix-La-Chapelle, Germany
Communication dans un congrès
hal-00442676v1
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Cryo-ALE of Si based on SF6 PhysisorptionJournées Jeunes Chercheurs, Mar 2021, Orleans, France, France
Poster de conférence
hal-04138885v1
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Cryo-ALE of Si based on SF6 physisorptionPLATHINIUM (Plasma Thin film International Union Meeting) 2021, Sep 2021, Antibes, France
Poster de conférence
hal-03539330v1
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Cryo-ALE of Silicon based on SF6 physisorptionPLATHINIUM 2021, Sep 2021, Visioconférence, France
Poster de conférence
hal-04138918v1
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Bulk Titanium Micromachining using Deep Reactive Ion Etching15e Journées du Réseau des Plasmas Froids, Sep 2020, Saint-Dié-des-Vosges, France
Poster de conférence
hal-03388672v1
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The role of SiF4 physisorption in silicon cryoetchingPlasma Thin Film International Union Meeting, Sep 2019, Antibes, France
Poster de conférence
hal-02311339v1
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Analysis of mechanisms involved in cryogenic ALE19th International Conference on Atomic Layer Deposition - 6th International Atomic Layer Etching Workshop, Jul 2019, Seattle, France
Poster de conférence
hal-02311314v1
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INTRODUCTION AU PROCÉDÉ DE GRAVURE CRYOGÉNIQUE DU SILICIUM15e Congrès de la Société Française de Physique Division Plasmas, Jun 2018, Bordeaux, France
Poster de conférence
hal-02311219v1
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Cryogenic Atomic Layer Etching of SiO217th International Conference on Atomic Layer Deposition, Jul 2017, Denver, United States
Poster de conférence
hal-01577612v1
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Titanium microstructuring for implantable componentsDesign, Test, Integration and Packaging of MEMS/MOEMS, May 2017, Bordeaux, France
Poster de conférence
hal-01561245v1
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Cryogenic ALE of silicon oxidePlasma Etch and Strip in Microtechnology, Oct 2017, Leuven, Belgium
Poster de conférence
hal-02306057v1
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Silicon micromachining at cryogenic temperatureDesign, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), May 2017, Bordeaux, France
Poster de conférence
hal-01561233v1
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Chlorine-based plasma deep etching of bulk titaniumInternational Symposium on Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence
hal-01561222v1
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Enhanced reproducibility of SiO2 atomic layer etching by addition of O2 stepsInternational Symposium of Dry Process 2016 (DPS2016), Nov 2016, Sapporo, Japan
Poster de conférence
hal-01561230v1
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Cryogenic etching of silicon with SF6/O2: a computational and experimental studyPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344725v1
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Advance in low-k cryogenic etching of porous organoscilicate : Investigation of a new gas with higher boiling point Organic (HBPO) and comparison with C4F8Plasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344722v1
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Deep silicon etching: STiGer vs. BOSCHPlasma Etch and Strip in Microtechnology, May 2016, Grenoble, France
Poster de conférence
hal-01344704v1
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Near Atmospheric Pressure Etching of Silicon by MicroplasmaInternational workshop on microplasmas, May 2015, Newark, France
Poster de conférence
hal-01166020v1
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