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Wenxiang DING
8
Documents
Researcher identifiers
wenxiang-ding
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0000-0002-8020-4665
Presentation

Publications
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Influence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Multi-element Piezoelectric Transducer16ème Congrès Français d'Acoustique, CFA2022, Société Française d'Acoustique; Laboratoire de Mécanique et d'Acoustique, Apr 2022, Marseille, France
Conference papers
hal-03848328v1
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Influence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Single-element Piezoelectric TransducerForum Acusticum, Dec 2020, Lyon, France. pp.2857-2862, ⟨10.48465/fa.2020.0479⟩
Conference papers
hal-03240269v1
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