Wenxiang DING

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Publications

Dynamic stiffness formulation for a piezoelectric array element

Wenxiang Ding , Maxime Bavencoffe , Marc Lethiecq
Journal of Sound and Vibration, 2023, 561, pp.117843. ⟨10.1016/j.jsv.2023.117843⟩
Article dans une revue hal-04612381 v1
Image document

Accurate coupled vibration analysis of a piezoelectric array element by the superposition method

Wenxiang Ding , Maxime Bavencoffe , Marc Lethiecq
Journal of Sound and Vibration, 2021, 514, pp.116438. ⟨10.1016/j.jsv.2021.116438⟩
Article dans une revue hal-03379804 v1

Health Monitoring of Single-element Piezoelectric Transducer Using Its Electromechanical Admittance

Wenxiang Ding , Maxime Bavencoffe , Marc Lethiecq
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2021, 68 (5), pp.1819 - 1827. ⟨10.1109/TUFFC.2020.3047944⟩
Article dans une revue hal-03201645 v1
Image document

Accurate coupled vibration analysis of a piezoelectric ceramic cylinder by the superposition method

Wenxiang Ding , Maxime Bavencoffe , Marc Lethiecq
Ultrasonics, 2021, 115, pp.106474. ⟨10.1016/j.ultras.2021.106474⟩
Article dans une revue hal-03379809 v1

An Original Two-Dimensional Analytical Model for Investigating Coupled Vibrations of Finite Piezoelectric Resonators

Wenxiang Ding , Maxime Bavencoffe , Marc Lethiecq
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2021, pp.1-1. ⟨10.1109/TUFFC.2021.3125271⟩
Article dans une revue hal-03413906 v1

Modeling and Experimental Characterization of Bonding Delaminations in Single-Element Ultrasonic Transducer

Wenxiang Ding , Maxime Bavencoffe , Marc Lethiecq
Materials, 2021, 14 (9), pp.2269. ⟨10.3390/ma14092269⟩
Article dans une revue hal-03379798 v1

Influence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Multi-element Piezoelectric Transducer

Wenxiang Ding , Maxime Bavencoffe , Marc Lethiecq
16ème Congrès Français d'Acoustique, CFA2022, Société Française d'Acoustique; Laboratoire de Mécanique et d'Acoustique, Apr 2022, Marseille, France
Communication dans un congrès hal-03848328 v1
Image document

Influence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Single-element Piezoelectric Transducer

Wenxiang Ding , Maxime Bavencoffe , Marc Lethiecq
Forum Acusticum, Dec 2020, Lyon, France. pp.2857-2862, ⟨10.48465/fa.2020.0479⟩
Communication dans un congrès hal-03240269 v1