Cyril Buttay
Publications
Publications
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Comparison of 2-Level and Quasi-2-Level Topologies in a Bidirectional Isolated DC-DC Converter for MVDC NetworksIEEE Applied Power Electronics Conference and Exposition (APEC 2025), Mar 2025, Atlanta, GA, United States. pp.2051-2058, ⟨10.1109/APEC48143.2025.10977191⟩ |
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Development of Microbial Fuel Cell-Based Sensor for In-Situ Water MonitoringInternational MEEP Symposium (Microbial/Enzymatic Electrochemistry Platform), Jul 2025, Lucerne, Switzerland |
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Power Losses Measurement Method for High Efficiency MV Oil-Insulated DC-DC ConverterPCIM 2025, May 2025, Nuremberg, Germany |
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Stress and doping analysis of low n-doped GaN layers grown on GaN, silicon and sapphire substrates by micro-Raman 2. Physics and characterizationICNS-15 - the 15th International Conference on Nitride Semiconductors, Jul 2025, Malmö, Sweden |
Dielectric cooling of a medium-voltage power moduleThermal 2025, IMAPS France, Mar 2025, La Rochelle, France |
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Design Guidelines for a DAB Converter Incorporating a Multilevel Bridge with Quasi-2-Level OperationThe 26th European Conference on Power Electronics and Applications, GDR SEEDS France & EPE Association, Mar 2025, Paris, France. ⟨10.34746/epe2025-0186⟩ |
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Analysis of GaN-HEMT switching current overshoot in a half-bridge circuit2024 IEEE 9th Southern Power Electronics Conference (SPEC), IEEE, Dec 2024, Brisbane, Australia |
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Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreaderConference on Integrated Power Systems (CIPS 2024), VDE, Mar 2024, Dusseldorf, Germany |
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Characterization and modeling protocol for GaN-on-Si power transistorsThe 11th IEEE Workshop on Wide Bandgap Power Devices & Applications (WIPDA), IEEE, Nov 2024, Dayton, OH, United States. pp.1-6, ⟨10.1109/WiPDA62103.2024.10773354⟩ |
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Carrier density analysis in stressed n-doped GaN layers on sapphireGaN Marathon, Jun 2024, Vérone, Italy |
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Investigation of mutual inductance on GaN-HEMT switching in a half-bridge circuitDesign Methodologies Conference 2024, Nov 2024, Grenoble, France. ⟨10.1109/DMC62632.2024.10812133⟩ |
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Automatic Model Generation of Power Printed Circuit Boards Based on Open StandardsDesign Methodologies Conference 2024, Nov 2024, Grenoble, France. ⟨10.1109/DMC62632.2024.10812161⟩ |
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Automatic Generation of Thermal Models for PCB-based Power ElectronicsConference on Integrated Power Systems (CIPS 2024), VDE, Mar 2024, Dusseldorf, Germany |
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Fault Ride Through of DC Solid State Transformer in Medium Voltage DC SystemsInternational Conference & Exhibition on Electricity Distribution (CIRED 2023), Jun 2023, Rome, Italy. ⟨10.1049/icp.2023.0443⟩ |
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Graphite Heat Spreader Embedded in a PCB Package for Improved SiC Die RthJC2023 IEEE Energy Conversion Congress and Exposition (ECCE), Oct 2023, Nashville, United States. pp.5543-5550, ⟨10.1109/ECCE53617.2023.10362229⟩ |
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Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET SwitchesPower Electronics, Intelligent Motion, Renewable Energy and Energy Management ( PCIM ) Europe, May 2023, Nuremberg, Germany |
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Design of Oil Insulated SiC Diode Rectifier for an MVDC SSTInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe 2023 ), May 2023, Nuremberg, Germany. pp.566091039, ⟨10.30420/566091039⟩ |
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An Advanced Integrated Cooling Solution for High Voltage and Power Density ModulesTherminic 2023 - 29th International Workshop Thermal Investigations on ICs and Systems, Sep 2023, Budapest, Hungary. à paraître, ⟨10.1109/THERMINIC60375.2023.10325867⟩ |
Modelling and Simulation of PCB Embedded Power Electronic LayoutsECPE Workshop "Embedding and Advanced Integration Technologies in Power Electronics", ECPE - European Center for Power Electronics, Nov 2022, Graz, Austria |
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Improvement of the thermal performance of printed circuit boards by embedding of graphite heat spreaders16th European Advanced Technology Workshop on Micropackaging and Thermal management (THERMAL 2023), IMAPS, Mar 2023, Poitiers, France |
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Design of a test package for high voltage SiC diodesProceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894223⟩ |
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A novel integrated cooling packaging for high power density semiconductors28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2022), Sep 2022, Dublin, Ireland. ⟨10.1109/THERMINIC57263.2022.9950643⟩ |
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Assessment of Partial Discharge Phenomenon in AC and Fast-rising Square Voltage Using Optical Detection Technique in Needle-Plane Configuration With Pressboard in Mineral Oil2022 IEEE 21st International Conference on Dielectric Liquids (ICDL), May 2022, Sevilla, Spain. pp.1-4, ⟨10.1109/ICDL49583.2022.9830959⟩ |
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Enhancing voltage rating of standard power modules for harsh environment applicationsProceedings of the Power Conversion Intelligent Motion conference (PCIM) 2022, May 2022, Nuremberg, Germany. ⟨10.30420/565822083⟩ |
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Automatic Model Generation for PCB-based Power ElectronicsConference on Integrated Power Electronics Systems (CIPS), Mar 2022, Berlin, Germany |
Intégration hybride en électronique de puissanceJournée Electronique de Puissance, Mar 2022, Grenoble, France |
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Graphite heat spreader for power component embedded in printed circuit boards (PCB)Journée technique IEEE Electronics Packaging Society France, Chapitre français de l'IEEE Electronics Packaging Society, Dec 2022, Palaiseau, France |
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Medium Voltage Diode Rectifier Design for High Step-Up DC-DC ConverterEuropean Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany |
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A Guide for Accurate and Repeatable Measurement of the R TH,JC of SiC Packages2022 IEEE Energy Conversion Congress and Exposition (ECCE), Oct 2022, Detroit, United States. pp.1-7, ⟨10.1109/ECCE50734.2022.9947814⟩ |
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A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power ElectronicsProceedings of the International Workshop on Integrated Power Packaging (IWIPP 2022), Aug 2022, Grenoble, France. ⟨10.1109/IWIPP50752.2022.9894055⟩ |
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Unidirectional step-up isolated DC-DC converter for MVDC electrical networksCIGRE Session 2022, Aug 2022, Paris, France |
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Experimental study of the reduction and removal of turn-on snubber for IGCT based MMC submodule using fast silicon diodesProceedings of the European Power Electronics conference (EPE ECCE 2022), Sep 2022, Hannovre, Germany |
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High Power Density Design of Power Electronic Interrupter in Hybrid DC Circuit BreakerAPEC, Jun 2021, Phoenix, United States. pp.33-38, ⟨10.1109/APEC42165.2021.9487241⟩ |
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Characterization of 4 kV Charge-Balanced SiC MOSFETsAPEC, Jun 2021, Phoenix, AZ, United States. ⟨10.1109/APEC42165.2021.9487454⟩ |
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Break-even distance for MVDC electricity networks according to power loss criteriaEPE'21 ECCE Europe, Sep 2021, Ghent, Belgium. https://ieeexplore.ieee.org/document/9570416, ⟨10.23919/EPE21ECCEEurope50061.2021.9570416⟩ |
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Electrical and optical partial discharge assessment of dielectric barriers in mineral oil and synthetic esterEIC, Jun 2021, Denver, United States. pp.602-605, ⟨10.1109/EIC49891.2021.9612267⟩ |
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Surge Current Capability of IGBT Based Power Electronic Interrupter Modules for Hybrid DC Circuit Breaker ApplicationsIEEE Applied Power Electronics Conference and Exposition (APEC 2021), Jun 2021, Phoenix, AZ, United States. pp.395-400, ⟨10.1109/APEC42165.2021.9487086⟩ |
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Surge Current Capability of Ga2O3 Schottky DiodesCPES Annual Conference, Aug 2020, Blacksburg, VA, United States |
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Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel ConvertersEPE’20 ECCE Europe, Sep 2020, Lyon, France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215711⟩ |
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Figures-of-Merit and current metric for the comparison of IGCTs and IGBTs in Modular Multilevel Converters2020 CPES Annual conference, Center for Power Electronic Systems, Aug 2020, Blacksburg, VA, United States |
Thermosiphon for passive cooling of a MVDC converter iMaps-ATW on Micropackaging and Thermal Management15th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2020, La Rochelle, France |
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Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic ConvertersCIPS 2020, Mar 2020, Berlin, Germany |
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How Good are the Design Tools in Power Electronics?EPE’20 ECCE Europe, Sep 2020, Lyon (Virtual conference), France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215942⟩ |
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Experimental validation and comparison of a SiC MOSFET based 100 kW 1.2 kV 20 kHz three-phase dual active bridge converter using two vector groupsEPE’20 ECCE Europe, Sep 2020, Lyon ( virtual ), France. ⟨10.23919/EPE20ECCEEurope43536.2020.9215631⟩ |
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Benefits of GaN transistors and embedding in PCB laminatesSIA Power Train & Electronics, Jun 2019, Paris, France |
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Packaging Solution for SiC Power Modules with a Fail-to-Short CapabilityAPEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722126⟩ |
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Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB ConverterAPEC, Mar 2019, Anaheim, Californie, United States. pp.18720757, ⟨10.1109/APEC.2019.8722279⟩ |
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A 3D Folded Power Inductor with PCB based technology for applications in the kW rangeAPEC, Mar 2019, Anaheim, Californie, United States. ⟨10.1109/APEC.2019.8722295⟩ |
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An investigation of current distribution over four GaN HEMTs in parallel configurationsThe 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2019), Oct 2019, Raleigh, United States. ⟨10.1109/WiPDA46397.2019.8998816⟩ |
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Evaluation of the PCB-embedding technology for a 3.3 kW converterIEEE IWIPP, Apr 2019, Toulouse, France. ⟨10.1109/IWIPP.2019.8799080⟩ |
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A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices45th IEEE IECON, Oct 2019, Lisbonne, Portugal. ⟨10.1109/IECON.2019.8927490⟩ |
Die Interconnection for Power Module 3.0ECPE Workshop "Power Module 2.0", Oct 2019, Hambourg, Germany |
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Study of convective condensation in a thermosiphon loop14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019), Jul 2019, Wicklow, Ireland |
Application of the PCB-Embedding Technology to a 3.3 kW Power Factor CorrectorAPEC, Mar 2019, Anaheim, Californie, United States |
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Packaging of 10 kV SiC MOSFETs: Trade-Off Between Electrical and Thermal PerformancesInternational Forum on Wide Bandgap Semiconductors China (IFWS), Oct 2018, Shenzhen, China |
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Optimisation of an Integrated Bidirectional Interleaved Single-Phase Power Factor CorrectorPCIM Europe 2018, Jun 2018, Nuremberg, Germany |
Characterization of Materials and their Interfaces in a DBC Substrate for Power Electronics ApplicationsECPE Workshop "Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany |
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Design considerations for the 2-phase cooling system of a 5 MW MVDC converterTroisième ATW Européen Micropackaging et management thermique, Jan 2018, La Rochelle, France |
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Design of a 3kW power converter using PCB-embedding technologyFrom Nano to Micro Power Electronics And Packaging Workshop (IMAPS), Nov 2018, Tours, France |
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A 100 kW 1.2 kV 20 kHz DC-DC converter prototype based on the Dual Active Bridge topology2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352238⟩ |
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Procédé de microfabrication de transformateurs intégrésSymposium de Génie Electrique (SGE'18), Université de Lorraine [UL], Jul 2018, Nancy, France |
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Packaging with double-side cooling capability for SiC devices, based on silver sintering44th IEEE IECON, IEEE, Oct 2018, Washington DC, United States. ⟨10.1109/IECON.2018.8591117⟩ |
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High-Temperature Coplanar Transformer2018 IEEE ICIT, A. Sari, Laboratoire Ampère, Feb 2018, Lyon, France. pp.730 - 735, ⟨10.1109/ICIT.2018.8352268⟩ |
Design of a 1200 V, 100 kW Power Converter: How Good are the Design and Modelling Tools?ECPE Workshop "The Future of Simulation in Power Electronics Packaging for Thermal and Stress Management", Nov 2018, Nuremberg, Germany |
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Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development3D-PEIM, Jun 2018, College Park, Maryland, United States. ⟨10.1109/3DPEIM.2018.8525236⟩ |
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Optimum Design of a Single-Phase Power Pulsating Buffer (PPB) with PCB-integrated Inductor Technologies2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352277⟩ |
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Design, manufacturing and characterization of printed circuit board embedded inductors for power applications2018 IEEE ICIT, Feb 2018, Lyon, France. ⟨10.1109/ICIT.2018.8352262⟩ |
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Protruding Ceramic Substrates for High Voltage Packaging Of Wide Bandgap SemiconductorsWiPDA, Oct 2017, Albuquerque, United States. ⟨10.1109/WiPDA.2017.8170581⟩ |
Thermal Management Optimization of a 5 MW Power Electronic Converter12th european advanced technology workshop on micropackaging and thermal management (iMaps), IMAPS, Feb 2017, La Rochelle, France |
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Etat de l’art de l’intégration en électronique de puissance et axes de recherches associésISP3D, Mar 2017, Toulouse, France |
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Evaluation of printed-circuit boards materials for high temperature operationHiTEN, IMAPS, Jul 2017, Cambridge, United Kingdom |
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Robustness of SiC MOSFET under avalanche conditionsAPEC, Mar 2017, Tampa, FL, United States. pp.2263-2268, ⟨10.1109/APEC.2017.7931015⟩ |
High power PCB-embedded inductors based on ferrite powder5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, IMAPS, May 2017, Grenoble, France |
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Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC2017 IEEE IWIPP, Apr 2017, Delft, Netherlands. ⟨10.1109/IWIPP.2017.7936757⟩ |
Étude de la robustesse de l’oxyde de grille pour des applications aéronautiquesJCGE, May 2017, Arras, France. pp.146345 |
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Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principlesECCE, Oct 2017, Cincinnati, OH, United States. ⟨10.1109/ECCE.2017.8096889⟩ |
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Design of a SiC based triple active bridge ceil for a multi-megawatt DC-DC converterEPE'17 ECCE Europe, Sep 2017, Warsaw, Poland. ⟨10.23919/EPE17ECCEEurope.2017.8099005⟩ |
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Integrated High-Temperature Isolation barrier with Coreless Transformer9th CIPS, Mar 2016, Nuremberg, Germany |
EDT for Power DevicesEmbedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom |
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Two Comparison-Alternative High Temperature PCB-Embedded Transformer Designs for a 2 W Gate Driver Power SupplyECCE, IEEE, Sep 2016, Milwaukee, WI, United States. ⟨10.1109/ECCE.2016.7855537⟩ |
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2 MHz high-density integrated power supply for gate driver in high-temperature applicationsAPEC, Mar 2016, Long Beach, CA, United States. ⟨10.1109/APEC.2016.7467922⟩ |
Utilisation d’un modèle CEM pour l’estimation des pertes dans un module de puissanceCEM, Jul 2016, Rennes, France |
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GaN Active-Clamp Flyback Converter with Resonant Operation Over a Wide Input Voltage RangePCIM Europe 2016, May 2016, Nuremberg, Germany. pp.CD |
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Analyse de la robustesse des MOSFET SiC pour les applications diode-lessSymposium de Génie Electrique (SGE'16), Jun 2016, Grenoble, France |
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Comparison of topside contact layouts for power dies embedded in PCBESTC, IMAPS, Sep 2016, Grenoble, France. ⟨10.1109/ESTC.2016.7764707⟩ |
Layout modelling to predict compliance with EMC standards of power electronic convertersEMC, Aug 2015, Dresden, Germany. pp.779-784, ⟨10.1109/ISEMC.2015.7256262⟩ |
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Robustness of SiC MOSFETs in short-circuit modePCIM Europe 2015, May 2015, Nuremberg, Germany |
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Highly integrated power electronic converters using active devices embedded in printed-circuit board4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France |
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Considerations for High Temperature Power Electronics18th International Symposium on Power Electronics Ee2015, Oct 2015, Novi Sad, Serbia |
High temperature operation of SiC transistorsAdvanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2015, Los Gatos, CA, United States |
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Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTsESREF, Oct 2015, Toulouse, France. pp.1708-1713 |
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Improving the thermal management of power GaN devicesAdvanced Technology Workshop (ATW) on Thermal Management, IMAPS, Sep 2016, Los Gatos, CA, United States |
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Thermal management of lateral GaN power devices2015 IEEE IWIPP, May 2015, Chicago, IL, United States. ⟨10.1109/IWIPP.2015.7295973⟩ |
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Silver sintering for power electronics integrationICEP- IAAC, IMAPS, Apr 2015, Kyoto, Japan. ⟨10.1109/ICEP-IAAC.2015.7111076⟩ |
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Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter LegHiTEC 2014, May 2014, Albuquerque, United States. pp.THA27 |
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Integrated packaging allows for improvement in switching characteristics of silicon carbide devicesPCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p |
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Estimation des pertes dans les transistors bipolaires SiCSymposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France |
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Power Loss Estimation in SiC Power BJTsPCIM Europe 2014, May 2014, Nuremberg, Germany. 8 p |
Planar, Double-Layer Magnetic Inductors for Low Power, High Frequency DC-DC Converters8th CIPS, Feb 2014, Nuremberg, Germany. CD (5 p.) |
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Mesure précise des pertes dans un module d'électronique de puissance par une méthode calorimétriqueSymposium de Génie Electrique (SGE'14), Jul 2014, Cachan, France |
3D Packaging Structure for High Temperature Power electronicsFrom Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France |
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Realization and Characterization of an IGBT Module Based on the Power Chip-on-Chip 3D ConceptECCE, Sep 2014, Pittsburgh, PA, United States. ⟨10.1109/ECCE.2014.6954043⟩ |
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High Temperature Operation of SiC ConvertersECPE SiC and GaN user forum, May 2013, Munich, Germany |
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Thermal stability of SiC JFETs in conduction modeEPE, Sep 2013, Lille, France. paper 223, ⟨10.1109/EPE.2013.6631881⟩ |
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Full densification of molybdenum powders and multilayer materials obtained by Spark Plasma SinteringISIEM 2013, Society of Inorganic Materials, Japan (SIMJ) et Université Rennes 1, France (UR1)., Oct 2013, Rennes, France |
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High Temperature, High Frequency Micro-Inductors for Low Power DC-DC ConvertersEPE, Sep 2013, Lille, France. paper 390, ⟨10.1109/EPE.2013.6631994⟩ |
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High temperature, Smart Power Module for aircraft actuatorsHiTEN'13, Jul 2013, Oxford, United Kingdom |
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Analysis of the SiC VJFET gate punch-through and its dependence with the temperatureEPE, Sep 2013, Lille, France. Paper 344, ⟨10.1109/EPE.2013.6631963⟩ |
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Predicting Static Losses in an Inverter-Leg built with SiC Normally-Off JFETs and SiC diodesAPEC, Mar 2013, Long Beach, CA, United States. pp.2636-2642, ⟨10.1109/APEC.2013.6520668⟩ |
High Temperature Ageing of Fe-based Nanocrystalline RibbonsHiTEC 2012, May 2012, Albuquerque, United States. 6p |
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High temperature anti short circuit function for normally-on SiC JFET in an inverter leg configurationHiTEC 2012, May 2012, Albuquerque, United States. 6p |
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Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applicationsISPSD, Jun 2012, Bruges, Belgium. pp.295-298, ⟨10.1109/ISPSD.2012.6229081⟩ |
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Pressureless Silver Sintering Die-Attach for SiC Power DevicesCSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p |
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3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules7th CIPS, Mar 2012, Nuremberg, Germany. pp.433-438 |
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Elaboration of Architectured Materials by Spark Plasma SinteringTHERMEC, Aug 2011, Québec, Canada. pp.1885-1892, ⟨10.4028/www.scientific.net/MSF.706-709.1885⟩ |
An Airborne High Temperature SiC Power Converter for Medium Power Smart Electro Mechanical ActuatorsHiTEC 2012, May 2012, Albuquerque, United States. 6p |
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Evaluation of silver-sintering die attach7th CIPS, Mar 2012, Nuremberg, Germany. pp.237-243 |
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Report de puce par frittage d'argent - mise en oeuvre et analyse14ème EPF, Jul 2012, Bordeaux, France. pp.CD (ref 61) |
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Thermal Runaway Robustness of SiC VJFETsCSCRM, Sep 2012, Saint-Pétersbourg, Russia. 2p |
Active protections for normally-on SiC JFETsEPE, Aug 2011, Birmingham, United Kingdom. pp.CD |
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Thermal requirements of SiC Power Devices6th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb 2011, La Rochelle, France |
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Higher temperature power electronics for larger-scale mechatronic integrationAutomotive Power Electronics, Apr 2011, Paris, France. Actes sur CD (pas de pagination) |
Modeling, Fabrication, and Characterization of Planar Inductors on YIG SubstratesCIMA, Mar 2011, Beyrouth, Lebanon. pp.Tu-P9 |
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High-temperature die-attaches for SiC power devicesEPE, Aug 2011, Birmingham, United Kingdom. pp.Article number 6020161 |
A multi-physics model of the VJFET with a lateral channelEPE, Aug 2011, Birmingham, United Kingdom. pp.CD |
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High-temperature behavior of SiC power diodesEPE, Aug 2011, Birmingham, United Kingdom. pp.CD |
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Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering ProcessCIMA, Mar 2011, Beyrouth, Lebanon. pp.CD |
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Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and CharacterizationHiTEN 2011, Jul 2011, Oxford, United Kingdom. pp.1-7 |
Caractérisation des non-linéarités dans les condensateurs céramiques haute température13ème EPF, Jun 2010, Saint-Nazaire, France |
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Design of High Temperature EMI Input Filter for a 2 kW HVDC-Fed InverterHiTEC 2010, May 2010, Albuquerque, United States. pp.000236 |
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Effect of High Temperature Ageing on Active and Passive Power DevicesHiTEC 2010, May 2010, Albuquerque, United States. pp.000228 |
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Electro-thermal behaviour of a SiC JFET stressed by lightning-induced overvoltagesEPE, Sep 2009, Barcelone, France. pp.1--8 |
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State of the art of High Temperature Power ElectronicsMicrotherm, Jun 2009, Lodz, Poland. pp.8-17 |
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Bond Graph Modeling of Current Diffusion in Magnetic CoresICBGM, Jan 2005, New Orleans, LA, United States. pp 87-91 |
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Paralleling of Low-Voltage MOSFETs Operating in Avalanche ConditionsEPE, Sep 2005, Dresden, Germany. ⟨10.1109/EPE.2005.219271⟩ |
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Towards a Sensorless Current and Temperature Monitoring in MOSFET-Based H-BridgeIEEE PESC, Jun 2003, Accapulco, Mexico. pp.901 - 906, ⟨10.1109/PESC.2003.1218175⟩ |
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A Voltage-Measurement Based Estimator for Current and Temperature in MOSFET H-BridgeEPE, Sep 2003, Toulouse, France. pp.1-10 |
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Carrier density analysis in stressed n-doped GaN on sapphire layersGaN Marathon 2024, Jun 2024, Verona, Italy. 2024 |
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Pre-packaging of power components using photosensitive resinJournées Nationales sur les Technologies Emergentes en micro-nanofabrication (JNTE), Nov 2024, Saint-Etienne, France. |
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L’électronique pour la conversion - Projet ciblé VERTIGO: Vertical GaN for High VoltageLancement et première journée scientifique annuelle du PEPR Électronique, Mar 2023, Poitier, France |
Module électronique de puissance comportant un support diélectriqueFrance, N° de brevet: EP3577685B1. 2020 |
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Système incluant un module électrique de puissance et une gaine contre les arcs électriquesFrance, N° de brevet: WO2020109138A1. 2020 |
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Power electronic package having two substrates with multiple semiconductor chips and electronic componentsUnited States, Patent n° : US8432030B2. 2013 |
Tour d'horizon des modules de puissance intelligents (Smart Power Modules) Webinaire IEEE EPS2021 |
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Review on Intelligent Power Modules2021 |
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Contribution à la conception par la simulation en électronique de puissance : application à l'onduleur basse tensionSciences de l'ingénieur [physics]. INSA de Lyon, 2004. Français. ⟨NNT : ⟩ |
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Le Packaging en électronique de puissanceSciences de l'ingénieur [physics]. INSA de lyon, 2015 |
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Technologie des composants actifs et leur assemblage - Packaging - École Thématique CNRS 2019 Fiabilité et Sûreté de FonctionnementDoctorat. France. 2019 |
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Packaging and Integration Activities at Laboratoire Ampère -- CPES SeminarDoctoral. United States. 2019 |
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Électronique haute température -- Contraintes sur la puce et le packagingDoctorat. France. 2018 |
Introduction au packaging en électronique de puissanceÉcole d'ingénieur. France. 2017 |
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Composants Actifs pour l'Électronique de puissance Master M1Master. France. 2017 |
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Électronique de puissance embarquée et packaging Master M2Master. France. 2016 |